A tray for chip testing

Abstract

The embodiment of the present disclosure provides a tray for chip testing, which comprises a tray body and a pressure-sensitive sticker, and the pressure-sensitive sticker is arranged on the outer side wall of the tray body; wherein, during the chip testing process, when the tray body interferes with a mechanism, the pressure-sensitive sticker can change color under the action of pressure. Through the pressure-sensitive sticker, the quick and intuitive positioning of the contact position when the tray interferes with the mechanism is realized, the abnormal troubleshooting time of the interference point is reduced from 4h to 0.5h, and the problems of low interference point troubleshooting efficiency and high labor cost in the prior art are solved; zero size increment, suitable for existing mechanisms (track gap >=0.5mm), and the blocking problem of the sensor scheme is solved.

Description

Technical Field

[0001] This disclosure pertains to the field of semiconductor chip testing technology, specifically relating to a tray for chip testing. Background Technology

[0002] In the chip testing process, trays play a crucial role in transporting and carrying chips, frequently moving between the transfer tracks and positioning devices at various testing stations. In existing technologies, when interference occurs between the tray and the mechanism, the contact point is primarily identified through segment-by-segment testing. Some invisible interferences, such as hidden interferences (micro-collisions at track corners), even require disassembling the mechanism for investigation. Structurally, conventional trays only possess the basic framework for carrying chips. Due to the complex trajectory of the tray, it is difficult to quickly determine the contact point manually after interference occurs, and existing trays lack visual interference markers, leading to a high rate of misjudgment based on experience. This results in a significant waste of time and manpower for troubleshooting, leading to low efficiency.

[0003] If sensors are installed on the tray, the thickness of the tray will increase by at least 2mm to 5mm because pressure sensors (such as strain gauges and piezoelectric sensors) require integrated circuits, power modules and signal processing units. The clearance of the chip testing mechanism usually only allows the tray size error to be ≤0.5mm. After the sensor is installed, the tray may not be able to fit the space of the mechanism.

[0004] In summary, conventional pallets lack interference detection capabilities, and manual troubleshooting requires disassembling the equipment, which is time-consuming and labor-intensive; while sensor solutions are difficult to apply in practice due to size and cost issues.

[0005] To address the aforementioned issues, it is necessary to propose a reasonably designed tray for chip testing that can effectively improve these problems. Utility Model Content

[0006] The present disclosure aims to at least address one of the technical problems existing in the prior art, and to provide a tray for chip testing.

[0007] This disclosure provides a tray for chip testing, including a tray body and a pressure-sensitive sticker, wherein the pressure-sensitive sticker is disposed on the outer side wall of the tray body; wherein,

[0008] During chip testing, when the tray body interferes with the mechanism, the pressure-sensitive sticker can change color under pressure.

[0009] Optionally, the pressure-sensitive sticker includes an adhesive backing layer, a color developing layer, and a protective layer that are stacked together in sequence;

[0010] The adhesive backing layer is adhered to the outer wall of the tray body, and the protective layer is used to contact the mechanism.

[0011] Optionally, the adhesive layer, the color developing layer, and the protective layer are integrally formed using a hot-pressing composite process.

[0012] Optionally, the roughness range of the outer wall of the tray body is Ra = 1.6 μm ± 0.2 μm.

[0013] Optionally, the outer wall of the tray body is provided with multiple micro-dimpled structures.

[0014] Optionally, the depth range of the micro-pit structure is 2μm to 3μm.

[0015] Optionally, the spacing between two adjacent micro-pit structures can range from 5 μm to 10 μm.

[0016] Optionally, the pressure-sensitive sticker has multiple cuts at the chamfer of the corresponding tray body to match the chamfered surface.

[0017] Optionally, the pressure-sensitive sticker can be heated by hot air at 65°C to 70°C to pre-bend and fix the pressure-sensitive sticker onto the chamfered curved surface.

[0018] Optionally, the length of the cutting groove ranges from 1 mm to 1.5 mm, and the spacing between adjacent cutting grooves ranges from 0.2 mm to 0.5 mm.

[0019] The tray for chip testing according to this embodiment includes a tray body and a pressure-sensitive sticker, which is disposed on the outer wall of the tray body. During chip testing, when interference occurs between the tray body and a mechanism, the pressure-sensitive sticker changes color under pressure. By utilizing the pressure-sensitive sticker's color-changing characteristic, the contact point when the tray interferes with the mechanism can be quickly and intuitively located, reducing the time for troubleshooting interference points from 4 hours to 0.5 hours. This solves the problems of low efficiency and high labor costs in interference point troubleshooting in the prior art. It also features zero dimensional increment, adapting to existing mechanisms (track gap ≥ 0.5mm), and solving the jamming problem of sensor solutions. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a tray for chip testing according to one embodiment of the present disclosure.

[0021] Figure 2 This is a schematic diagram of the structure of a pressure-sensitive sticker according to another embodiment of the present disclosure. Detailed Implementation

[0022] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, the embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0023] like Figure 1 As shown, this embodiment of the present disclosure provides a tray 100 for chip testing, including a tray body 110 and a pressure-sensitive sticker 120, wherein the pressure-sensitive sticker 120 is disposed on the outer side wall of the tray body 110; wherein, during chip testing, when the tray body 110 interferes with the mechanism, the pressure-sensitive sticker 120 can change color under pressure.

[0024] Specifically, after the chip is loaded onto the tray 100 used for chip testing, it enters the testing station. Its running trajectory covers multiple points prone to interference, such as the transmission track and positioning blocks. If a point on the periphery of the tray body 110 is pressed, the corresponding area of ​​the pressure-sensitive sticker 120 will change color, and the darkest point is the core interference point (e.g., the pressure-sensitive sticker 120 will appear dark red at the corner of the track). After the chip monitoring is completed, the old pressure-sensitive sticker 120 is removed, and a new pressure-sensitive sticker 120 is pasted on the outer wall of the tray body 110 to continue checking the next station / next mechanism.

[0025] The tray for chip testing according to this embodiment includes a tray body and a pressure-sensitive sticker, which is disposed on the outer wall of the tray body. During chip testing, when interference occurs between the tray body and a mechanism, the pressure-sensitive sticker changes color under pressure. By utilizing the pressure-sensitive sticker's color-changing characteristic, the contact point when the tray interferes with the mechanism can be quickly and intuitively located, reducing the time for troubleshooting interference points from 4 hours to 0.5 hours. This solves the problems of low efficiency and high labor costs in interference point troubleshooting in the prior art. It also features zero dimensional increment, adapting to existing mechanisms (track gap ≥ 0.5mm), and solving the jamming problem of sensor solutions.

[0026] It should be noted that in this embodiment, the tray body 110 is made of ABS engineering plastic and has a rectangular frame structure. Pressure-sensitive stickers 120 are affixed to the outer walls (including right angles and curved corners) of the tray body 110.

[0027] For example, such as Figure 2 As shown, the pressure-sensitive sticker 120 includes an adhesive backing layer 121, a color developing layer 122, and a protective layer 123 stacked sequentially. The adhesive backing layer 121 is adhered to the outer wall of the tray body 110, and the protective layer 123 is used for contact with the mechanism. The color developing layer 122 is centrally located to achieve pressure-color conversion. In other words, the pressure-sensitive sticker 120 has a three-layer composite structure.

[0028] Specifically, in this embodiment, the adhesive backing layer 121 can be an acrylic adhesive backing layer (20μm, 3M). TM 467MP substrate-free adhesive: peel strength ≥15N / 25mm at 25℃, ensuring continuous adhesion to the outer wall of the tray body 110.

[0029] The color development layer 122 can be a microcapsule color development layer (30μm, FUJIPrescale LLW-S special coating): containing crystal violet lactone microcapsules with a diameter of 5μm to 10μm, and acidic clay color developer uniformly dispersed in an acrylic resin matrix.

[0030] The protective layer 123 can be a transparent PET protective layer (50μm, Toray A4100 model from Japan): light transmittance is 92%, surface hardness is 3H, friction resistance coefficient is 0.2 (when in contact with rail steel), and it can withstand pressure transmission of 2MPa.

[0031] The pressure detection principle of the pressure-sensitive sticker 120 is as follows: when the periphery of the tray body 110 interferes with the mechanism (pressure ≥ 0.2 MPa), the protective layer 123 transmits the pressure to the microcapsule color layer 122; the microcapsules rupture and release colorless dye (crystal violet lactone), which reacts with acidic clay to generate a red quinone structure; the color depth is positively correlated with the pressure (0.2 MPa shows light red, 1.0 MPa shows dark red), the reaction is irreversible but the pressure value can be quantified through image analysis.

[0032] For example, in this embodiment, the adhesive layer 121, the color development layer 122 and the protective layer 123 are integrally formed by hot pressing composite process (120℃×0.5MPa×30s) to ensure uniform pressure transmission.

[0033] Among them, the pressure-sensitive sticker 120 is only 0.1mm thick. After being pasted, the size of the tray body 110 is consistent with the original design, which can be well adapted to existing mechanisms (such as transmission track width tolerance ±0.5mm), solving the jamming problem caused by the increase in size of the sensor solution; it is suitable for various standard trays (such as JEDEC standard trays and customized carriers) without changing the original load-bearing function, while the sensor solution requires separate circuit design for different trays.

[0034] According to JEDEC standards, the surface roughness of non-functional trays is typically Ra ≤ 3.2 μm, and their micro-pitted structure can easily lead to insufficient adhesive penetration. Therefore, in this embodiment, the roughness range of the outer wall of the tray body 110 is Ra = 1.6 μm ± 0.2 μm. Specifically, the roughness of the outer wall of the tray body 110 is controlled to Ra = 1.6 μm ± 0.2 μm through a precision sandblasting process (50 μm alumina particles / 0.4 MPa pressure / 100 mm blasting distance), ensuring that the pressure-sensitive sticker 120 is permanently adhered to the outer wall of the tray body 110.

[0035] For example, in this embodiment, the outer wall of the tray body 110 is provided with multiple micro-dimples. The depth of the micro-dimples ranges from 2μm to 3μm. The spacing between two adjacent micro-dimples ranges from 5μm to 10μm. Compared with the outer wall of a conventional tray: in this embodiment, the depth of the micro-dimples is reduced by 50%, reducing the resistance to adhesive penetration; the spacing between the micro-dimples is reduced by 50%, increasing the effective contact area and improving the adhesive penetration rate, thereby ensuring that the pressure-sensitive sticker 120 is permanently attached to the outer wall of the tray body 110 and improving the reliability of the pressure-sensitive sticker 120 interference pressure detection.

[0036] It should be noted that in this embodiment, the depth of the micro-pit structure and the spacing between two adjacent micro-pit structures are not specifically limited and can be selected according to actual needs.

[0037] For example, the pressure-sensitive sticker 120 has multiple cuts at the chamfer of the corresponding tray body 110 to match the chamfered surface. The pressure-sensitive sticker is heated by hot air at 65°C to 70°C, pre-bending and fixing it to the chamfered surface. The length of the cuts ranges from 1mm to 1.5mm, and the spacing between adjacent cuts ranges from 0.2mm to 0.5mm. Preferably, in this embodiment, the length of the cuts is 1mm, and the spacing between adjacent cuts is 0.5mm.

[0038] Specifically, considering the curvature characteristic of the chamfer R=2.5mm of the tray body 110, parallel grid cuts with a line length of L=1mm and a spacing of 0.5mm are made in the corresponding area of ​​the pressure-sensitive sticker 120 to form multiple cuts. The pressure-sensitive sticker 120 is pre-bent and shaped to the chamfered curved surface by heating with 65℃ hot air. This design is based on the curvature adaptation principle to ensure that the pressure-sensitive sticker 120 and the arc surface of the chamfer of the tray body 110 are tightly fitted without wrinkles, maintain the effective adhesion of the adhesive, and ensure that the bonding coverage meets the requirements of the pressure-sensitive color rendering function, thus ensuring the reliability of interference pressure detection.

[0039] It should be noted that in this embodiment, the specific size of the cutting channel is not specifically limited and can be selected according to actual needs, as long as the pressure-sensitive sticker 120 and the chamfered curved surface of the tray body 110 are tightly fitted.

[0040] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the embodiments of this disclosure, and the embodiments of this disclosure are not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of this disclosure, and these modifications and improvements are also considered to be within the protection scope of the embodiments of this disclosure.

Claims

1. A tray for chip testing, characterized in that, It includes a tray body and a pressure-sensitive sticker, the pressure-sensitive sticker being disposed on the outer side wall of the tray body; wherein, During chip testing, when the tray body interferes with the mechanism, the pressure-sensitive sticker can change color under pressure.

2. The pallet according to claim 1, characterized in that, The pressure-sensitive sticker comprises an adhesive backing layer, a color developing layer, and a protective layer that are stacked and connected in sequence. The adhesive backing layer is adhered to the outer wall of the tray body, and the protective layer is used to contact the mechanism.

3. The pallet according to claim 2, characterized in that, The adhesive layer, the color developing layer, and the protective layer are integrally formed using a hot-pressing composite process.

4. The tray according to any one of claims 1 to 3, characterized in that, The roughness range of the outer wall of the tray body is Ra = 1.6 μm ± 0.2 μm.

5. The tray according to claim 4, characterized in that, The outer wall of the tray body is provided with multiple micro-dimpled structures.

6. The tray according to claim 5, characterized in that, The depth range of the micro-pit structure is 2μm to 3μm.

7. The tray according to claim 5, characterized in that, The spacing between two adjacent micro-pit structures ranges from 5 μm to 10 μm.

8. The tray according to any one of claims 1 to 3, characterized in that, The pressure-sensitive sticker has multiple cuts at the chamfer of the tray body to match the chamfered surface.

9. The tray according to claim 8, characterized in that, The pressure-sensitive sticker is heated by hot air at 65℃~70℃, so that the pressure-sensitive sticker is pre-bent and fixed on the chamfered curved surface.

10. The tray according to claim 8, characterized in that, The length of the cutting groove ranges from 1 mm to 1.5 mm, and the spacing between adjacent cutting grooves ranges from 0.2 mm to 0.5 mm.

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