A double-sided chip test fixture

CN224906873UActive Publication Date: 2026-10-27NINGBO JIPIN TECH CO LTD
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Patent Information

Application Number
CN202521888418.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-02
Publication Date
2026-10-27
Estimated Expiration
2035-09-02

AI Technical Summary

Technical Problem

[0003]而在测试的过程中,探针需保持上下各0.4mm、总计0.8mm的压缩行程以确保接触有效性,但过长的行程使得探针状态极易受夹具加工精度波动影响,无论是定位基准的微小偏差,还是部件装配间隙的累积误差,都可能导致探针接触压力不均、位置偏移等问题,进而引发测试信号失真、数据跳变等现象,严重影响测试精准度

Benefits of technology

[0018]本实用新型通过采用导电胶接触界面减少压缩量并配合弹力式压紧,降低了夹具加工精度对测试的影响,显著降低复测率,提升测试稳定性。将拉杆结构设于下模块,优化操作便捷性,避免倾倒及线缆干涉,同时结合销钉对位、防呆设计及对被测件厚度变化的兼容能力,实现了精准对位、操作安全省力及更强的兼容性,有效解决了传统测试夹具的问题。

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Abstract

The utility model discloses a double -sided chip test fixture, including test module one, the one side hinged of base has test module two, wherein test module one and test module two's test end face all are equipped with conductive glue, test module one is provided with pivot support, and the side of test module one is penetrated to the sliding positioning pin of pivot support both sides and is connected with pull rod mechanism sliding, and the state of pull rod mechanism is switched, is used to make pivot support upward motion, makes test module one and test module separate, the utility model discloses through adopting conductive glue contact interface reduces compression and cooperates elastic type pressure, has reduced the influence of test of fixture machining precision, has reduced the retest rate significantly, has promoted test stability, and has combined the pin alignment, fool -proof design and the compatible ability to the thickness change of the measured piece simultaneously, has realized accurate alignment, safe and labor -saving operation and stronger compatibility, has solved the problem of traditional test fixture effectively.
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Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, specifically to a double-sided chip testing fixture. Background Technology

[0002] In chip testing scenarios with test ports on both sides (such as RF, low frequency, ground, and other types of interfaces), the relevant technologies mainly rely on probe contact testing.

[0003] During testing, the probe needs to maintain a compression stroke of 0.4mm vertically and 0.8mm vertically, totaling 0.8mm, to ensure effective contact. However, this excessive stroke makes the probe's state highly susceptible to fluctuations in the fixture's machining accuracy. Even minute deviations in the positioning reference or cumulative errors in component assembly gaps can lead to uneven probe contact pressure and positional shifts, resulting in test signal distortion, data jumps, and other phenomena that severely impact test accuracy. To verify the reliability of the results, repeated testing is often necessary in practice, leading to a high retest rate. This reduces testing efficiency and increases the risk of chip damage due to repeated contact. Utility Model Content

[0004] The purpose of this utility model is to provide a double-sided chip testing fixture in order to solve the above problems.

[0005] To achieve the above objectives, this utility model specifically adopts the following technical solution:

[0006] A double-sided chip test fixture includes: a test module one, a test module two hinged to one side of the base, and in the test state, the test end of the test module one and the test end of the test module two are respectively located on the two sides of the chip under test, wherein the test end faces of the test module one and the test module two are provided with conductive adhesive.

[0007] The test module 1 is equipped with a rotating shaft bracket. Sliding positioning pins on both sides of the rotating shaft bracket pass through the side of the test module 1 and are slidably connected to the pull rod mechanism. Switching the state of the pull rod mechanism is used to make the rotating shaft bracket move upward, so that the test module 1 is separated from the test module.

[0008] As a further description of the above technical solution, the test module includes a base, a housing is provided on the base, the housing is provided with a horizontal sliding groove, and a vertical sliding groove is provided on the outer side of the test module.

[0009] As a further description of the above technical solution, the upper surface of the base is provided with a plurality of countersunk holes 1, the rotating shaft bracket is sleeved on the outside of the test module 1, and the side of the rotating shaft bracket opposite to the base body is provided with a countersunk hole 2 corresponding to the countersunk hole 1, and a spring is provided between the countersunk hole 1 and the countersunk hole 2.

[0010] As a further description of the above technical solution, the test module one includes a support bracket one, and a test end one is provided on the support bracket one. The test end one includes conductive adhesive one and a test interface one. Both the support bracket one and the conductive adhesive one are provided with multiple positioning holes one, and the conductive adhesive one is provided with multiple positioning pins one.

[0011] As a further description of the above technical solution, the second test module includes a second support bracket, the second support bracket is provided with a second test end, the second test end includes a second conductive adhesive and a second test interface; the second conductive adhesive is provided with a plurality of second positioning holes and a plurality of second positioning pins.

[0012] As a further description of the above technical solution, a latch is provided on one side of the second test module, and a latching groove is provided on the first test module corresponding to the position of the latch.

[0013] As a further description of the above technical solution, the outer shell has an opening corresponding to the position of the fastening groove, and the fastening groove is disposed in the opening.

[0014] As a further description of the above technical solution, the pull rod mechanism includes a side pull rod, one end of which is provided with a hinge hole and a waist hole. The side pull rod is hinged to the base, and the waist hole of the side pull rod is connected to one end of a sliding plate. The sliding plate is disposed in the horizontal sliding groove.

[0015] As a further description of the above technical solution, the sliding positioning pins are provided on both sides of the rotating shaft bracket, and a sliding groove is opened on the side of the sliding plate near the rotating shaft bracket, and the sliding positioning pins are disposed in the sliding groove.

[0016] As a further description of the above technical solution, there is a height difference between one end of the contact edge of the groove and the sliding positioning pin and the other end.

[0017] The beneficial effects of this utility model are as follows:

[0018] This invention reduces compression by using conductive adhesive at the contact interface and employs elastic clamping, thereby mitigating the impact of fixture machining accuracy on testing, significantly reducing retest rates, and improving testing stability. The pull rod structure is located in the lower module, optimizing operational convenience, preventing tipping and cable interference. Combined with pin alignment, foolproof design, and compatibility with variations in the thickness of the test piece, it achieves precise alignment, safe and labor-saving operation, and enhanced compatibility, effectively solving the problems of traditional test fixtures.

[0019] To more clearly illustrate the structural features and functions of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the test fixture of this utility model in the test state.

[0021] Figure 2 This is a schematic diagram of the pull rod mechanism of the test fixture of this utility model when it is open.

[0022] Figure 3 This is a schematic diagram of the second test module of the test fixture of this utility model when it is opened.

[0023] Figure 4 This is an exploded view of the test fixture of this utility model.

[0024] Figure 5 This is an exploded view of test module two of this utility model.

[0025] Figure 6 This is a schematic diagram of the inverted rotating shaft bracket of this utility model.

[0026] Figure 7 This is a schematic diagram of the skateboard of this utility model.

[0027] Reference numerals: 1. Bracket; 2. Test module one; 201. Base; 202. Outer shell; 203. Horizontal slide groove; 204. Vertical slide groove; 205. Countersunk hole one; 206. Countersunk hole two; 207. Spring; 208. Bearing bracket one; 209. Conductive adhesive one; 210. Test interface one; 211. Positioning hole one; 212. Positioning pin one; 213. Opening; 214. Rotating shaft bracket; 215. Fastening groove; 216. Sliding positioning pin; 3. Test module two; 301. Bearing bracket two; 302. Conductive adhesive two; 303. Test interface two; 304. Positioning hole two; 305. Positioning pin two; 306. Claw; 4. Pull rod mechanism; 401. Side pull rod; 402. Hinge hole; 403. Waist hole; 404. Connecting rod; 405. Slide plate; 406. Slide groove. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0029] like Figures 1-7 As shown, in one embodiment, a double-sided chip test fixture includes: a test module 2, and a test module 3 hinged to one side of a base 201. In the test state, the test ends of the test module 2 and the test ends of the test module 3 are respectively located on the two sides of the chip under test. The test end faces of the test modules 2 and 3 are provided with conductive adhesive. By using conductive adhesive as the contact interface for testing, compared with the prior art of testing by probes, the compression amount can be strictly controlled. Combined with the elastic clamping in the test modules 2 and 3, the instability of the test state caused by the processing accuracy of the test fixture during chip testing can be effectively reduced, thereby improving the retest rate.

[0030] In one embodiment, a support 1 is provided at the bottom of the test module 2. The support 1 has four legs, which can effectively support the entire test fixture.

[0031] Meanwhile, the double-sided chip can be tested simultaneously through test module 1 (2) and test module 2 (3), which effectively improves the efficiency and accuracy of the test.

[0032] Test module 1 (2) is equipped with a rotating shaft bracket 214. Sliding positioning pins 216 on both sides of the rotating shaft bracket 214 pass through the sides of test module 1 (2) and are slidably connected to the pull rod mechanism 4. Switching the state of the pull rod mechanism 4 allows the rotating shaft bracket 214 to move upwards, separating test module 1 (2) from the test module. When the pull rod is pushed to make the rotating shaft bracket 214 move vertically upwards, the upward movement of the rotating shaft bracket 214 causes test module 2 (3) to spring back to its original position, facilitating subsequent separation of test module 1 (2) from test module 2 (3).

[0033] like Figure 1-7As shown, in one embodiment, test module 2 includes a base 201, on which a housing 202 is provided. The housing 202 is provided with a horizontal slide groove 203, and a vertical slide groove 204 is provided on the outer side of the test module. The horizontal slide groove 203 is connected to the slide plate 405 of the pull rod mechanism 4. At the same time, a slide groove 406 is provided on the side of the slide plate 405 that is connected to the horizontal slide groove 203. A sliding positioning pin 216 is provided on the side of the rotating shaft bracket 214. The sliding positioning pin 216 passes through the vertical slide groove 204. The vertical slide groove 204 can restrict the sliding positioning pin 216 and the rotating shaft bracket 214 to move only in the vertical direction. There is a height difference between one end of the slide groove 406 of the slide plate 405 and the other end. When the slide groove 406 moves within the horizontal slide groove 203, the sliding positioning pin 216 slides within the slide groove 406. When the pull rod mechanism 4 is pressed down, the slide plate 405 moves from the right to the left, causing the sliding positioning pin 216 to contact the lower edge of the slide groove 406, thereby moving the rotating shaft bracket 214 downward, allowing the test module 2 3 to approach the test module 1 2, enabling the test module 1 2 and the test module 2 3 to perform testing on the double-sided chip. When the pull rod mechanism 4 is opened, the slide plate 405 moves from the left to the right, causing the sliding positioning pin 216 to contact the higher edge of the slide groove 406, causing the rotating shaft bracket 214 to move upward, thereby resetting the test module 2 3.

[0034] like Figure 1-7 As shown, in one embodiment, the upper surface of the base 201 has multiple countersunk holes 205. The rotating shaft bracket 214 is sleeved on the outside of the test module 2, and the side of the rotating shaft bracket 214 opposite to the base 201 has a countersunk hole 206 corresponding to the countersunk hole 205. A spring 207 is provided between the countersunk hole 205 and the countersunk hole 206. For example, five countersunk holes are provided on both sides of the base 201, corresponding to the ten countersunk holes on the rotating shaft bracket 214. A return spring 207 is placed between the upper and lower countersunk holes. The push rod moves, causing the sliding plate to move horizontally, thereby causing the rotating shaft bracket 214 to move vertically. When the rotating shaft bracket 214 moves upward, the spring 207 can lift the rotating shaft bracket 214. Due to the height-adjustable rotating shaft bracket 214 and the cooperation of the return spring 207, the change in the thickness of the chip under test within a certain range (±0.3mm) does not affect the normal test and no adjustment is required, resulting in stronger compatibility.

[0035] like Figure 1-7As shown, in one embodiment, test module 2 includes a support bracket 208, on which a test end 1 is provided. The test end 1 includes conductive adhesive 209 and a test interface 210. Both the support bracket 208 and the conductive adhesive 209 have multiple positioning holes 211, and the conductive adhesive has multiple positioning pins 212. Test module 3 includes a support bracket 301, on which a test end 2 is provided. The test end 2 includes conductive adhesive 302 and a test interface 303. The conductive adhesive 302 has multiple positioning holes 304 and multiple positioning pins 305. Through the precise cooperation of the positioning holes 211 and positioning pins 305, and the precise cooperation of the positioning holes 304 and positioning pins 212, precise docking of test module 2 and test module 3 can be achieved. During use, due to the cooperation between the pin and the positioning hole, the pin is precisely aligned and engaged after being pressed by the push rod, ensuring accurate alignment and smooth, effortless pressing during operation. In one embodiment, test module 2 3 also includes a pressing base 201, in which a spring 207 is installed. A pressing body is provided on the surface of the pressing base 201 and around the bearing bracket 2 301, with a structure similar to the rotating shaft bracket 214. A return spring 207 is also provided in the countersunk hole of the pressing base 201 and connected to the countersunk hole of the pressing body. When the upper module of test module 2 3 is pressed down, the upper module pressing body and the upper test component are lifted by the test piece, while the spring 207 applies reverse pressure to the test piece, pressing the test piece by the spring 207 to ensure full contact and improve test accuracy.

[0036] like Figure 1-7 As shown, in one embodiment, a latch 306 is provided on one side of test module 2 3, and a latching groove 215 is provided on test module 1 2 corresponding to the position of the latch 306. An opening 213 is provided on the outer shell 202 corresponding to the position of the latching groove 215, and the latching groove 215 is disposed within the opening 213. When the rotating shaft support 214 descends, the latch 306 engages with the latching groove 215 and is retracted into the opening 213. Only when the rotating shaft support 214 rises, and the latching groove 215 is fully exposed in the opening 213, can the latch 306 be opened by pressing it, thus separating test module 1 2 from test module 2 3. This foolproof design prevents damage to the fixture and the test piece due to operational errors.

[0037] like Figure 1-7As shown, the pull rod mechanism 4 includes a side pull rod 401. One end of the side pull rod 401 has a hinge hole 402 and a waist hole 403. The side pull rod 401 is hinged to the base 201. The waist hole 403 of the side pull rod 401 is connected to one end of the sliding plate. The sliding plate is set in the horizontal slide groove 203. Sliding positioning pins 216 are provided on both sides of the rotating shaft bracket 214. A slide groove 406 is provided on the side of the sliding plate near the rotating shaft bracket 214. The sliding positioning pin 216 is set in the slide groove 406. There is a height difference between the contact edge of the slide groove 406 and the sliding positioning pin 216 from one end to the other. At the same time, this application sets the pull rod structure to be connected to the test module 2, i.e., the lower module, which can avoid the entire test fixture from tipping over when the pull rod mechanism 4 is opened, interfering with the test cable, and damaging the chip under test.

[0038] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A double-sided chip testing fixture, characterized in that, include: Test module one, and test module two are hinged to one side of the base. In the test state, the test end of test module one and the test end of test module two are respectively located on the two sides of the chip under test. The test end surfaces of test module one and test module two are provided with conductive adhesive. The test module 1 is equipped with a rotating shaft bracket. Sliding positioning pins on both sides of the rotating shaft bracket pass through the side of the test module 1 and are slidably connected to the pull rod mechanism. Switching the state of the pull rod mechanism is used to make the rotating shaft bracket move upward, so that the test module 1 is separated from the test module.

2. The double-sided chip testing fixture according to claim 1, characterized in that, The test module includes a base, on which a housing is provided. The housing is provided with a horizontal sliding groove, and a vertical sliding groove is provided on the outer side of the test module.

3. The double-sided chip testing fixture according to claim 2, characterized in that, The upper surface of the base has multiple countersunk holes 1. The rotating shaft bracket is sleeved on the outside of the test module 1. The side of the rotating shaft bracket opposite to the base body has a countersunk hole 2 corresponding to the countersunk hole 1. A spring is provided between the countersunk hole 1 and the countersunk hole 2.

4. The double-sided chip testing fixture according to claim 1, characterized in that, The test module 1 includes a support bracket 1, a test end 1 is provided on the support bracket 1, and the test end 1 includes conductive adhesive 1 and a test interface 1; both the support bracket 1 and the conductive adhesive 1 are provided with multiple positioning holes 1, and the conductive adhesive 1 is provided with multiple positioning pins 1.

5. The double-sided chip testing fixture according to claim 1, characterized in that, The second test module includes a second support bracket, on which a second test end is provided. The second test end includes a second conductive adhesive and a second test interface. The second conductive adhesive is provided with a plurality of second positioning holes and a plurality of second positioning pins.

6. The double-sided chip testing fixture according to claim 2, characterized in that, The second test module is provided with a latch on one side, and the first test module is provided with a latching groove corresponding to the position of the latch.

7. The double-sided chip testing fixture according to claim 6, characterized in that, The outer shell has an opening corresponding to the position of the fastening groove, and the fastening groove is disposed in the opening.

8. The double-sided chip testing fixture according to claim 2, characterized in that, The pull rod mechanism includes a side pull rod, one end of which has a hinge hole and a waist hole. The side pull rod is hinged to the base. The waist hole of the side pull rod is connected to one end of a sliding plate. The sliding plate is disposed in the horizontal groove.

9. The double-sided chip testing fixture according to claim 8, characterized in that, The sliding positioning pins are provided on both sides of the rotating shaft bracket, and a sliding groove is provided on the side of the sliding plate near the rotating shaft bracket, and the sliding positioning pins are disposed in the sliding groove.

10. The double-sided chip testing fixture according to claim 9, characterized in that, There is a height difference between one end of the contact edge between the groove and the sliding positioning pin and the other end.