Conversion module of circuit board testing device and circuit board testing device

Abstract

The application relates to a conversion module of a circuit board testing device and the circuit board testing device. The conversion module comprises a needle plate, a carrier plate and a conversion plate. The needle plate is provided with a plurality of probes, and the first needle end and the second needle end of the probe are located on the first side and the second side of the needle plate respectively. The carrier plate is arranged on the first side of the needle plate and can move along a preset direction or a direction opposite to the preset direction. The carrier plate has a plurality of needle holes, the needle holes penetrate through the carrier plate along the preset direction and can be provided with the first needle end of the corresponding probe. The conversion plate is configured to plug the target connector of the circuit board to be tested and can be installed on the carrier plate to be in conductive contact or separation with the first needle end of the probe when the carrier plate moves. The conversion module can electrically connect the FFC connector on the PCB with external testing instruments, does not need manual plugging of the FFC flexible flat cable, can improve the testing efficiency, reduces manual work, and can avoid problems such as inconvenient plugging operation and low connection precision caused by the soft texture of the FFC flexible flat cable.

Description

Technical Field

[0001] This application relates to the field of circuit board testing technology, and in particular to a conversion module and a circuit board testing device for a circuit board testing apparatus. Background Technology

[0002] In the field of printed circuit board (PCB) testing, for flexible flat cable (FFC) connectors that do not have dedicated test points and are located far from the board edge, current mainstream testing methods heavily rely on manual insertion and removal of the FFC cables. However, this method is not only inefficient and wasteful of manpower, but also, due to the soft texture of the FFC cables, it directly leads to a series of problems such as inconvenient insertion and removal operations and low connection accuracy. Utility Model Content

[0003] Therefore, it is necessary to provide a conversion module for a circuit board testing device and a circuit board testing device to address the above-mentioned technical problems.

[0004] A conversion module for a circuit board testing device includes:

[0005] A needle plate is provided with multiple probes, each probe having a first needle end and a second needle end opposite to each other in a preset direction, the first needle end and the second needle end being located on a first side and a second side of the needle plate, respectively.

[0006] A carrier plate, disposed on a first side of the needle plate and movable along the preset direction or in a direction opposite to the preset direction, the carrier plate having a plurality of needle holes, the needle holes penetrating the carrier plate along the preset direction and allowing the first needle tip corresponding to the probe to pass through; and

[0007] The conversion board is configured to insert a target connector into the test circuit board and can also be mounted on the carrier board to make conductive contact with or separate from the first pin end of the probe when the carrier board moves.

[0008] In one embodiment, the conversion module further includes a plurality of first elastic elements connected between the needle plate and the carrier plate, the first elastic elements being capable of providing a force to the carrier plate that moves away from the probe.

[0009] In one embodiment, one of the needle plate and the carrier plate is provided with a plurality of guide rods extending along the preset direction, and the other is provided with a plurality of guide holes, the guide holes allowing the corresponding guide rods to be movably inserted.

[0010] In one embodiment, the conversion module further includes a plurality of linear bearings, which are disposed in the corresponding guide holes and are slidably assembled with the corresponding guide rods.

[0011] In one embodiment, one of the carrier plate and the conversion plate is provided with a plurality of positioning posts, and the other is provided with positioning holes, wherein the positioning posts can be inserted into the corresponding positioning holes.

[0012] In one embodiment, the surface of the carrier plate opposite to the needle plate is provided with a conversion plate placement area, and the positioning post or the positioning hole is located in the conversion plate placement area;

[0013] The conversion module also includes multiple guide posts, which are disposed on the carrier plate and surround the conversion plate placement area.

[0014] In one embodiment, the positioning post includes a first positioning segment and a second positioning segment coaxially connected. The first positioning segment is connected to the carrier plate and can be inserted into the corresponding positioning hole. The second positioning segment is a frustum-shaped structure whose outer diameter gradually increases along the preset direction; and / or,

[0015] The guide post includes a first guide section and a second guide section coaxially connected. The first guide section is connected to the carrier plate, and the second guide section is a frustum structure with an outer diameter that gradually increases along the preset direction.

[0016] A circuit board testing device includes a mounting module, a pressing module, and a conversion module as described in any one of the above.

[0017] The mounting module is connected to the pin plate of the conversion module, and the pressing module can press against the conversion plate of the conversion module so that the carrier plate of the conversion module can move in a preset direction.

[0018] In one embodiment, the mounting module is also configured to provide resilient support for the circuit board under test.

[0019] In one embodiment, the mounting module includes a needle box, a tray, and a plurality of second elastic members; the tray has a circuit board placement area; the second elastic members are connected between the needle box and the tray to elastically support the tray on the needle box; the needle plate is connected to the top of the needle box and close to the circuit board placement area.

[0020] In one embodiment, the pressing module includes a mounting plate, a first pressing member, and a second pressing member;

[0021] The first pressing member and the second pressing member are located on the same side of the mounting plate. The first pressing member can press against the circuit board under test, and the second pressing member can press against the conversion plate.

[0022] The aforementioned circuit board testing device's conversion module and circuit board testing device, by moving the carrier board along a preset direction or in the opposite direction, enable the conversion board, which is plugged into the circuit board under test, to make conductive contact or separation with the probe, thereby realizing the transmission and interaction of test electrical signals between the circuit board under test and the testing machine. For FFC connectors that do not have dedicated test points and are located far from the edge of the PCB board, there is no need to use FFC flexible flat cables to connect the FFC connectors to the testing instruments, thus eliminating the need for manual plugging and unplugging of FFC flexible flat cables. This can improve the testing efficiency of PCBs, reduce manual labor, and avoid a series of problems such as inconvenient plugging and unplugging operations and low connection accuracy caused by the soft texture of FFC flexible flat cables. Moreover, compared with FFC flexible flat cables, the conversion module is more robust and durable, with a lifespan more than 3 times that of FFC flexible flat cables, reducing the amount of consumables used and saving consumable costs. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the circuit board testing device provided in an embodiment of this application when the carrier board and the probe are in conductive contact.

[0024] Figure 2 This is a schematic diagram of the structure of a conversion module provided in an embodiment of this application.

[0025] Figure 3 for Figure 1 A magnified view of a portion at point A.

[0026] The labels in the attached diagram are explained as follows:

[0027] 10. Circuit board testing device; 100. Conversion module; 110. Needle plate; 111. Probe; 1111. First needle end; 1112. Second needle end; 120. Carrier plate; 121. Guide rod; 122. Positioning post; 1221. First positioning section; 1222. Second positioning section; 130. Conversion plate; 140. First elastic element; 150. Linear bearing; 160. Guide post; 161. First guide section; 162. Second guide section; 200. Mounting module; 210. Needle box; 211. Box body; 212. Top plate; 2121. Opening; 220. Support plate; 300. Pressing module; 310. Mounting plate; 320. First pressing element; 321. Pressing rod; 330. Second pressing element; 20. Circuit board under test; 20a. FFC connector. Detailed Implementation

[0028] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0029] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0030] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0031] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0032] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0033] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0034] In the field of electronic assembly and testing, flexible flat cables (FFCs) are widely used for internal connections in various printed circuit boards (PCBs) due to their advantages such as small size, light weight, and good flexibility, especially in modern electronic devices with compact space (such as smartphones, laptops, tablets, wearable devices, etc.).

[0035] Currently, when performing functional testing or signal measurement on FFC connectors soldered onto PCBs, the industry generally faces a technical challenge: when the FFC connector itself does not have dedicated test points and its physical location is far from the edge of the PCB, existing testing methods have significant efficiency and reliability issues.

[0036] Specifically, the current testing process relies entirely on manual operation and mainly includes the following steps:

[0037] Manual identification and positioning: The operator first needs to visually locate the FFC connector to be tested on the assembled PCB.

[0038] Manual insertion of FFC flexible flat cable: The operator manually picks up an FFC flexible flat cable used as a test interface, and, relying on feel and experience, accurately aligns and inserts it into the FFC connector to be tested.

[0039] Perform the test: After ensuring a stable connection, the test instrument applies test signals or reads parameters through the flexible flat cable to complete the corresponding electrical performance test.

[0040] Manual unplugging and resetting: After the test is completed, the operator needs to manually unplug the FFC flexible flat cable from the connector again and put the test cable back in place in preparation for the test of the next PCB board.

[0041] However, this purely manual testing method involves manually plugging and unplugging the FFC connector to electrically connect it to the testing instrument. This is not only inefficient and wasteful of manpower, but also causes a series of problems such as inconvenient plugging and unplugging operations and low connection accuracy due to the soft texture of the FFC cable.

[0042] This application provides a novel circuit board testing device that uses a conversion module to electrically connect the FFC connector on the PCB to an external testing instrument (i.e., a testing machine). For FFC connectors that do not have dedicated test points and are located far from the edge of the PCB, there is no need to use an FFC flexible cable to connect the FFC connector to the testing instrument, thus eliminating the need for manual insertion and removal of the FFC flexible cable. This not only improves the testing efficiency of the PCB and reduces manual labor, but also avoids a series of problems such as inconvenient insertion and removal operations and low connection accuracy caused by the soft texture of the FFC flexible cable.

[0043] In one embodiment, such as Figure 1 As shown, the circuit board testing apparatus 10 includes a mounting module 200, a pressing module 300, a conversion module 100, and a testing machine; the mounting module 200 is configured to support the conversion module 100; the pressing module 300 is capable of pressing against the conversion module 100; the conversion module 100 is configured to connect a target connector (e.g., an FFC connector) on the circuit board under test 20 to the testing machine.

[0044] like Figure 1 and Figure 2 As shown, the conversion module 100 includes a needle plate 110, a carrier plate 120, and a conversion plate 130. The needle plate 110 is connected to the mounting module 200 and is provided with a plurality of probes 111. The carrier plate 120 is configured to support the conversion plate 130 and is movably disposed on one side of the carrier plate 120 so that the conversion plate 130 can make conductive contact with or separate from the probes 111. The pressing module 300 can press against the conversion plate 130 of the conversion module 100 in a preset direction.

[0045] The probe 111 has a first needle end 1111 and a second needle end 1112 facing each other in a preset direction. The first needle end 1111 and the second needle end 1112 are located on the first side and the second side of the needle plate 110, respectively. The first needle end 1111 can make conductive contact with or separate from the probe 111, and the second needle end 1112 is electrically connected to the testing machine. The probes 111 can be arranged in a matrix or other shapes.

[0046] The carrier plate 120 is disposed on the first side of the needle plate 110 and can move in a preset direction or in a direction opposite to the preset direction. The carrier plate 120 has a plurality of needle holes, which penetrate the carrier plate 120 in a preset direction and allow the first needle tip 1111 of the corresponding probe 111 to pass through. There may be one needle hole, which allows all probes 111 to move through; or there may be multiple needle holes, each of which allows one or more corresponding probes 111 to move through.

[0047] The conversion board 130 is configured to insert the target connector of the test circuit board 20 and can also be mounted on the carrier board 120 so that it can make or separate conductive contact with the first pin end 1111 of the probe 111 when the carrier board 120 moves.

[0048] in, Figure 1 The direction indicated by the straight arrow in the middle represents the preset direction, which can be the up or down direction during PCB testing.

[0049] like Figure 1 As shown, during PCB testing, the pressure module 300 can be connected to the testing press first, and refer to... Figure 3 The conversion board 130 of the conversion module 100 is inserted into the FFC connector 20a of the circuit board 20 under test. Then, the conversion board 130 with the circuit board 20 under test inserted is placed on the mounting module 200. The pressing signal is activated, and the test press drives the pressing module 300 to press down. After the pressing module 300 contacts the conversion board 130, it continues to press down, pushing the carrier plate 120 to move in a preset direction until the first pin end 1111 of the probe 111 extends into the pin hole of the carrier plate 120 and makes conductive contact with the conversion board 130. The test is started, and the test machine transmits the test electrical signal to the conversion board 130 through the probe 111. The conversion board 130 then transmits the test electrical signal to the FFC connector 20a of the circuit board under test, realizing signal interaction and judgment.

[0050] After the test is completed, the rising signal is activated, and the test press drives the pressing module 300 to lift upward. The carrier plate 120 moves in the opposite direction to the prevention direction until the conversion plate 130 separates from the first needle end 1111 of the probe 111. Then, the circuit board 20 to be tested is taken out and placed on the production line to be transported to the next process.

[0051] The aforementioned conversion module 100, by moving the carrier board 120 in a preset direction or the opposite direction, enables the conversion board 130, which is plugged into the circuit board under test 20, to make conductive contact or separation with the probe 111, thereby realizing the transmission and interaction of test electrical signals between the circuit board under test 20 and the test equipment. For FFC connectors 20a that do not have dedicated test points and are located far from the edge of the PCB board, there is no need to use FFC flexible flat cables to connect the FFC connectors 20a to the test instruments, thus eliminating the need for manual plugging and unplugging of FFC flexible flat cables. This can improve the testing efficiency of PCBs, reduce manual labor, and avoid a series of problems such as inconvenient plugging and unplugging operations and low connection accuracy caused by the soft texture of FFC flexible flat cables. Moreover, compared with FFC flexible flat cables, the conversion module 100 is more robust and durable, with a lifespan more than 3 times that of FFC flexible flat cables, reducing the amount of consumables used and saving consumable costs.

[0052] like Figure 2 As shown, in some embodiments, the conversion module 100 further includes a plurality of first elastic elements 140. The first elastic elements 140 are connected between the needle plate 110 and the carrier plate 120. The first elastic elements 140 can provide a force to the carrier plate 120 that moves away from the probe 111. The first elastic elements 140 not only support the carrier plate 120, but also, when the pressing module 300 is lifted, the first elastic elements 140 can reset the carrier plate 120, allowing the carrier plate 120 to move along a force opposite to a preset direction, thereby realizing the separation of the conversion plate 130 and the probe 111.

[0053] The first elastic element 140 can be a spring post. The number of the first elastic elements 140 can be set to one, two, three or more as needed. This application does not impose a specific limitation on this, as long as it can provide stable elastic support for the carrier plate 120. For example, there are multiple first elastic elements 140, and the multiple first elastic elements 140 are arranged at the edge of the carrier plate 120.

[0054] like Figure 2 As shown, in some embodiments, the side of the carrier plate 120 facing the needle plate 110 is provided with a plurality of guide rods 121 extending in a preset direction, and the needle plate 110 is provided with a plurality of guide holes, which allow the corresponding guide rods 121 to pass through. Through the cooperation of the guide rods 121 and the guide holes, the movement of the carrier plate 120 can be guided, so that the carrier plate 120 can move in an directional manner, which can ensure that the adapter plate and the probe 111 can make smooth contact or separation; in addition, by setting the guide rods 121 and the guide holes on the carrier plate 120 and the needle plate 110 respectively, it is not necessary to extend the guide rods 121 from the carrier plate 120, which can avoid interference between the guide rods 121 and the pressing module 300.

[0055] Of course, in some other embodiments, the needle plate 110 may be provided with a guide rod 121 and the carrier plate 120 may be provided with a guide hole; or, the needle plate 110 may be provided with a portion of the guide rod 121 and a portion of the guide hole, and the carrier plate 120 may be provided with another portion of the guide rod 121 and another portion of the guide hole.

[0056] The number of guide rods 121 is the same as the number of guide holes, and they correspond one-to-one. The number of guide rods 121 can be one, two, three, or more, depending on the requirements; this application does not impose a specific limitation, as long as they can effectively guide the carrier plate 120. For example, multiple guide rods 121 are arranged at both ends of the carrier plate 120 along its length. The length direction of the carrier plate 120 refers to the extension direction of its long side, which is perpendicular to a predetermined direction.

[0057] See also Figure 2 The conversion module 100 also includes several linear bearings 150, which are disposed in corresponding guide holes and can be slidably assembled with corresponding guide rods 121. The linear bearings 150 can reduce the friction between the guide rods 121 and the inner wall of the guide holes, making the movement of the carrier plate 120 more effortless and smoother.

[0058] The number of linear bearings 150 may be equal to or less than the number of guide holes, that is, linear bearings 150 are installed in a portion of the guide holes, while linear bearings 150 are not installed in a portion of the guide holes.

[0059] like Figure 2 As shown, in some embodiments, the carrier plate 120 has a plurality of positioning posts 122 on the side opposite to the probe plate 110, and the conversion plate 130 has a plurality of positioning holes, and the positioning posts 122 can be inserted into the corresponding positioning holes. Through the cooperation of the positioning posts 122 and the positioning holes, the carrier plate 120 can be prevented from shifting position when pressing down on the carrier plate 120 or when testing the PCB, thus ensuring reliable contact between the carrier plate 120 and the probe 111.

[0060] Of course, in some other embodiments, the needle plate 110 may be provided with positioning holes, and the carrier plate 120 may be provided with positioning posts 122; or, the needle plate 110 may be provided with a portion of positioning posts 122 and a portion of positioning holes, and the carrier plate 120 may be provided with another portion of positioning posts 122 and another portion of positioning holes.

[0061] The positioning post 122 includes a first positioning segment 1221 and a second positioning segment 1222 coaxially connected. The first positioning segment 1221 is connected to the carrier plate 120 and can be inserted into the corresponding positioning hole. The second positioning segment 1222 is a frustum structure with an outer diameter that gradually increases along a preset direction. Placing the second positioning segment 1222 in a frustum structure with an outer diameter that gradually increases along a preset direction facilitates the entry of the first positioning segment 1221 into the positioning hole, thereby improving the assembly efficiency of the conversion plate 130.

[0062] The first positioning segment 1221 can be a cylindrical structure. Because the first positioning segment 1221 is cylindrical, even after it is inserted into the corresponding positioning hole, and the conversion plate 130 can rotate around the central axis of the first positioning segment 1221, a circumferential positional shift of the conversion plate 130 will still occur. To address this, multiple positioning pins 122 can be used, such as two, three, or more, to prevent circumferential shift of the conversion plate 130. The number of positioning holes and positioning pins 122 is the same, and they correspond one-to-one.

[0063] The first positioning segment 1221 can also be a polygonal prism, and the positioning hole can be a polygonal hole adapted to the structure of the first positioning segment 1221. The first positioning segment 1221 of this structure prevents the conversion plate 130 from rotating about the central axis of the first positioning segment 1221. For this purpose, the positioning pin 122 can be set to one, or it can be set to multiple, such as two, three or more.

[0064] Furthermore, such as Figure 2 As shown, in one embodiment, the surface of the back-to-pin plate 110 of the carrier plate 120 is provided with a conversion plate placement area, and the positioning post 122 is located in the conversion plate placement area; the conversion module 100 also includes a plurality of guide posts 160, which are disposed on the carrier plate 120 and surround the conversion plate placement area. The guide posts 160 can guide the lowering of the conversion plate 130, so that the conversion plate 130 can be oriented downwards. During the lowering process, the positioning post 122 can always be aligned with the corresponding positioning hole, eliminating the need to repeatedly adjust the position of the conversion plate 130 during the lowering process, saving assembly time of the conversion plate 130 and improving assembly efficiency.

[0065] Of course, in some other embodiments, when the positioning hole is located on the carrier plate 120, the positioning hole may also be located in the conversion plate placement area.

[0066] The guide posts 160 can be two, three, or more; this application does not impose specific limitations on this, as long as they can effectively orient the conversion plate 130 downwards. As an example, the guide posts 160 can be four.

[0067] The guide post 160 may include a first guide section 161 and a second guide section 162 coaxially connected. The first guide section 161 is connected to the carrier plate 120, and the second guide section 162 is a frustum structure with an outer diameter that gradually increases along a preset direction. Setting the second guide section 162 as a frustum structure with an outer diameter that gradually increases along a preset direction facilitates the lowering of the conversion plate 130 to the conversion plate placement area, eliminating the need to precisely align the conversion plate 130 with the conversion plate placement area before lowering it, thus improving the assembly efficiency of the conversion plate 130.

[0068] The first guide section 161 can be a cylindrical structure, a polygonal prism structure, or other structures. This application does not impose specific restrictions, as long as it enables the conversion plate 130 to be oriented downwards.

[0069] like Figure 1 As shown, in some embodiments, the mounting module 200 is also configured to elastically support the circuit board under test 20. After the FFC connector 20a of the circuit board under test 20 is inserted into the conversion board 130, the circuit board under test 20 is placed on the mounting module 200, and the conversion board 130 is mounted on the carrier board 120; then the pressing module 300 is pressed down, and after the conversion board 130 contacts the pressing module 300, the pressing module 130 is pressed down until the conversion board 130 makes conductive contact with the probe 111. The circuit board under test (TBD) 20 is elastically supported on the mounting module 200. When the conversion board 130 is pressed down after contacting the pressing module 300, the TBD 20 can continue to move down without affecting the downward movement of the conversion board 130, ensuring that the conversion board 130 makes conductive contact with the probe 111. In addition, the mounting module 200 can also support the TBD 20, preventing the FFC connector 20a of the TBD 20 from failing to firmly connect with the conversion board 130 when the conversion board 130 is pressed down and the TBD 20 is tested, which would lead to inaccurate testing. Compared with mounting the TBD 20 and the conversion board 130 together on the conversion board 130, mounting the TBD 20 and the conversion board 130 separately on the mounting module 200 and the conversion board 130 can reduce the area of ​​the conversion board 130 and the number of positioning posts 122, guide posts 160 and the first elastic element 140, making the structure of the conversion module 100 simpler and more compact.

[0070] It should be noted that, since the conversion board 130 is connected to the circuit board under test 20, in order not to affect the lowering of the conversion board 130 and the circuit board under test 20, the guide post 160 can be set in a half circle along the conversion board placement area, so that the guide post 160 is not set on the side of the conversion board placement area closest to the circuit board under test 20. Of course, when the circuit board under test 20 and the conversion board 130 are installed together on the conversion board 130, the guide post 160 can be set in a full circle along the conversion board placement area.

[0071] See Figure 1The mounting module 200 may include a needle box 210, a tray 220, and several second elastic members. The tray 220 has a circuit board placement area. The second elastic members are connected between the needle box 210 and the tray 220 to elastically support the tray 220 on the needle box 210. The needle plate 110 is located on the top of the needle box 210 and near the conversion plate placement area of ​​the tray 220. The arrangement of the second elastic members allows for a certain distance (e.g., 10mm) between the tray 220 and the needle box 210. When the conversion plate 130 contacts the pressing module 300 and continues to be pressed down, the circuit board 20 under test can continue to move down, and the second elastic members can also support the tray 220.

[0072] The second elastic element can be a spring column. There can be two, three, four or more second elastic elements. There are no specific restrictions unless an application is made, as long as they can effectively support the pallet 220.

[0073] The testing equipment can be installed inside the needle box 210, and the needle box 210 can be used as follows: Figure 1 As shown, the device includes a box body 211 and a top plate 212. The top plate 212 is detachably mounted on the top of the box body 211. The top plate 212 has an opening 2121. A needle plate 110 is mounted on the top plate 212, and the second needle end 1112 of the needle plate 110 extends into the box body 211 through the opening 2121.

[0074] See also Figure 1 The pressing module 300 may include a mounting plate 310, a first pressing member 320, and a second pressing member 330. The first pressing member 320 and the second pressing member 330 are located on the same side of the mounting plate 310. The first pressing member 320 can press against the circuit board under test 20, and the second pressing member 330 can press against the conversion plate 130. By using the first pressing member 320 and the second pressing member 330 to press against the circuit board under test 20 and the conversion plate 130 respectively, the circuit board under test 20 and the conversion plate 130 can move down synchronously under the pressure of the pressing module 300, which can keep the circuit board under test 20 and the conversion plate 130 at the same height and improve the connection firmness of the circuit board under test 20 and the conversion plate 130.

[0075] Mounting plate 310 can be connected to the testing press by means of snap-fit, screw-fit, etc.

[0076] The first pressing member 320 may include a plurality of pressing rods 321, which are arranged in a rectangular or other form.

[0077] The second pressing component 330 can be a contour pressing block, the shape of which can be set according to the shape of the conversion plate 130.

[0078] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A conversion module for a circuit board testing device, characterized in that, include: A needle plate is provided with multiple probes, each probe having a first needle end and a second needle end opposite to each other in a preset direction, the first needle end and the second needle end being located on a first side and a second side of the needle plate, respectively. A carrier plate is disposed on the first side of the needle plate and can move along the preset direction or in a direction opposite to the preset direction. The carrier plate has a plurality of needle holes, which penetrate the carrier plate along the preset direction and allow the first needle end corresponding to the probe to pass through. as well as The conversion board is configured to insert a target connector into the test circuit board and can also be mounted on the carrier board to make conductive contact with or separate from the first pin end of the probe when the carrier board moves.

2. The conversion module according to claim 1, characterized in that, The conversion module further includes several first elastic elements, which are connected between the needle plate and the carrier plate. The first elastic elements can provide a force to the carrier plate that moves away from the probe.

3. The conversion module according to claim 1, characterized in that, One of the needle plate and the carrier plate is provided with a plurality of guide rods extending along the preset direction, and the other is provided with a plurality of guide holes, the guide holes allowing the corresponding guide rods to be movably inserted.

4. The conversion module according to claim 3, characterized in that, The conversion module also includes several linear bearings, which are disposed in the corresponding guide holes and can be slidably assembled with the corresponding guide rods.

5. The conversion module according to any one of claims 1 to 4, characterized in that, One of the carrier plate and the conversion plate is provided with a plurality of positioning posts, and the other is provided with positioning holes, wherein the positioning posts can be inserted into the corresponding positioning holes.

6. The conversion module according to claim 5, characterized in that, The carrier plate has a conversion plate placement area on its surface opposite to the needle plate, and the positioning post or the positioning hole is located in the conversion plate placement area; The conversion module also includes multiple guide posts, which are disposed on the carrier plate and surround the conversion plate placement area.

7. The conversion module according to claim 6, characterized in that, The positioning post includes a first positioning section and a second positioning section coaxially connected. The first positioning section is connected to the carrier plate and can be inserted into the corresponding positioning hole. The second positioning section is a frustum-shaped structure with an outer diameter that gradually increases along the preset direction; and / or, The guide post includes a first guide section and a second guide section coaxially connected. The first guide section is connected to the carrier plate, and the second guide section is a frustum structure with an outer diameter that gradually increases along the preset direction.

8. A circuit board testing device, characterized in that, Includes an installation module, a pressing module, and a conversion module as described in any one of claims 1 to 7; The mounting module is connected to the pin plate of the conversion module, and the pressing module can press against the conversion plate of the conversion module so that the carrier plate of the conversion module can move in a preset direction.

9. The circuit board testing apparatus according to claim 8, characterized in that, The mounting module is also configured to provide flexible support for the circuit board under test.

10. The circuit board testing apparatus according to claim 9, characterized in that, The mounting module includes a needle box, a tray, and several second elastic members; the tray has a circuit board placement area; the second elastic members are connected between the needle box and the tray to elastically support the tray on the needle box; The needle plate is connected to the top of the needle box and is close to the circuit board placement area.

11. The circuit board testing apparatus according to claim 9, characterized in that, The pressing module includes a mounting plate, a first pressing component, and a second pressing component; The first pressing member and the second pressing member are located on the same side of the mounting plate. The first pressing member can press against the circuit board under test, and the second pressing member can press against the conversion plate.

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