Semiconductor material detection workbench

Abstract

The utility model relates to the field of semiconductor material detection discloses a kind of semiconductor material detection workbench, including operation platform, the operation platform outer wall is provided with automatic calibration mechanism and buffer impact mechanism, the automatic calibration mechanism includes pivot support, and the pivot support bottom end is fixedly connected with operation platform top end, pivot support inner wall is rotatably connected with main pivot, the main pivot outer wall is fixedly connected with conveyor belt pivot, the conveyor belt pivot outer wall is rotatably connected with transport conveyor belt, and the transport conveyor belt outer wall is fixedly connected with calibration platform. In the utility model, automatic calibration mechanism does not need manually, accurate positioning clamping: servo motor can preset operation time, drive pivot and conveyor belt, so that calibration platform fixture is directly opposite detection tool;Calibration spring pushes down spherical head, drives calibration column to move down, is pulled by hinged link rod and is connected with clamping block, so that calibration clamping block automatically clamps material, reduces artificial deviation, and improves batch detection efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor material testing, and in particular to a semiconductor material testing workbench. Background Technology

[0002] A semiconductor material testing workbench, belonging to the field of semiconductor testing equipment, is mainly used in testing scenarios such as the electrical properties and physical parameters of semiconductor materials. It provides a stable platform for placing and testing semiconductor materials. Semiconductor material testing requires extremely high positional accuracy, and it is necessary to ensure that the semiconductor material is in a precise testing position to guarantee reliable test results. Currently, most of these workbenches rely on operators to manually pick up the semiconductor material and then manually calibrate the material position before completing the testing operation.

[0003] To address the high-precision requirements of semiconductor testing, existing technologies have optimized the testing stage. Some structures reduce positional errors by improving the flatness of the stage surface, while others improve the fixing structure of the testing probe to enhance testing stability. Still others add positioning scales to the stage surface to assist in calibration. These improvements are mostly focused on improving testing accuracy, only solving single accuracy-related issues. They do not address the cumbersome nature of manual operation for operators, and still require manual handling of semiconductor materials, calibration, and testing processes.

[0004] Existing semiconductor material testing workbenches have significant drawbacks. Operators must manually handle semiconductor materials throughout the entire process, calibrate the material positions one by one, and then manually perform the testing actions after calibration. The entire process is cumbersome, consuming a lot of manpower and time. Furthermore, operator fatigue or operational errors can easily lead to a decrease in calibration accuracy, affecting the reliability of the test results. Especially when testing semiconductor materials in batches, the cumbersome manual operation will significantly reduce testing efficiency, making it impossible to perform efficient and accurate testing. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a semiconductor material testing workbench, which aims to solve the problems of the existing technology that requires manual handling, calibration and testing throughout the process, which is cumbersome and labor-intensive, and is prone to reduced accuracy and reliability due to hand fatigue or deviation, resulting in low batch testing efficiency.

[0006] To achieve the above objectives, this utility model adopts the following technical solution: a semiconductor material testing workbench, including an operating table, an automatic calibration mechanism and a shock buffer mechanism are provided at the top of the operating table, the automatic calibration mechanism includes a rotating shaft support, the bottom end of the rotating shaft support is fixedly connected to the top of the operating table, a main rotating shaft is rotatably connected to the inner wall of the rotating shaft support, a conveyor belt rotating shaft is fixedly connected to the outer wall of the main rotating shaft, a transport conveyor belt is rotatably connected to the outer wall of the conveyor belt rotating shaft, a calibration table is fixedly connected to the outer wall of the transport conveyor belt, a calibration clamp is slidably connected to the top of the calibration table, a clamp connecting block is fixedly connected to the bottom of the calibration clamp, the clamp connecting block is slidably connected to the inner wall of the calibration table, a calibration column is hinged to the bottom of the clamp connecting block through a calibration hinge rod, a fixed column is slidably connected to the inner wall of the calibration column, the top of the fixed column is fixedly connected to the bottom of the calibration table, and the bottom of the calibration table is elastically connected to the calibration column through a calibration spring.

[0007] As a further description of the above technical solution: The automatic calibration mechanism also includes a grooved top ball block, the bottom end of which is fixedly connected to the top of the operating table.

[0008] As a further description of the above technical solution: The automatic calibration mechanism also includes a pulley, the inner wall of which is rotatably connected to the outer wall of the main shaft.

[0009] As a further description of the above technical solution: The automatic calibration mechanism also includes a detector bracket, the bottom of which is fixedly connected to the top of the grooved spherical block.

[0010] As a further description of the above technical solution: The automatic calibration mechanism also includes a detection tool, the bottom of which is fixedly connected to the top of the detector bracket.

[0011] As a further description of the above technical solution: The impact buffer mechanism includes a gently sloping groove, which is formed on the inner wall of the top spherical block of the groove.

[0012] As a further description of the above technical solution: The shock-absorbing mechanism also includes a spherical head, the outer wall of which is fixedly connected to the bottom end of the calibration column, and the outer wall of which is slidably connected to the inner wall of the gently sloping groove.

[0013] As a further description of the above technical solution: The outer wall of the grooved top ball block is slidably connected to the outer wall of the spherical head, and a servo motor is fixedly connected to the inner wall of the rotating shaft bracket. The output end of the servo motor is fixedly connected to the outer wall of the main rotating shaft.

[0014] This utility model has the following beneficial effects: 1. In this utility model, the automatic calibration mechanism does not require manual operation and accurately positions and clamps the material: the servo motor can be preset to operate for a certain time, drive the rotating shaft and the conveyor belt, and make the calibration table fixture face the testing tool; the calibration spring pushes down the spherical head, which drives the calibration column to move down, and pulls the clamping block connecting block through the hinge rod, so that the calibration clamping block automatically clamps the material, reducing human error and improving batch testing efficiency.

[0015] 2. In this utility model, the sloping groove of the buffer impact mechanism guides the spherical head to move smoothly downward, avoiding impact on the material from the movement of the calibration column; in conjunction with the calibration spring buffer, it protects the material from damage, ensures calibration stability, avoids affecting the reliability of the test results, and takes into account both automated testing and material protection. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the main structure of a semiconductor material testing workbench proposed in this utility model; Figure 2 This is a partial structural schematic diagram of a semiconductor material testing workbench proposed in this utility model; Figure 3 This is a partial structural schematic diagram of a semiconductor material testing workbench proposed in this utility model.

[0017] Legend: 1. Operating table; 2. Automatic calibration mechanism; 211. Rotary shaft support; 212. Main rotating shaft; 213. Groove top ball block; 214. Pulley; 215. Conveyor belt shaft; 216. Conveyor belt; 217. Detector support; 218. Detection tool; 219. Calibration table; 220. Calibration clamp; 221. Clamp connecting block; 222. Calibration hinge rod; 223. Calibration column; 224. Fixed column; 225. Calibration spring; 3. Buffer impact mechanism; 311. Sloping groove; 312. Spherical head; 4. Servo motor. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Reference Figures 1-2The present invention provides an embodiment of a semiconductor material testing workbench, comprising an operating table 1. The operating table 1 is the basic support platform of the entire testing workbench, providing an installation base for an automatic calibration mechanism 2 and a shock buffering mechanism 3. The automatic calibration mechanism 2 and the shock buffering mechanism 3 are mounted on the top of the operating table 1. The automatic calibration mechanism 2 is a mechanism for automatically positioning and calibrating semiconductor materials, and the shock buffering mechanism 3 is a mechanism for buffering the impact force during the calibration process. The automatic calibration mechanism 2 includes a rotating shaft support 211, which is a frame component supporting the main rotating shaft 212. The bottom end of the frame 211 is fixedly connected to the top end of the operating table 1. The rotating shaft bracket 211 achieves stable support by being fixed to the operating table 1. A main rotating shaft 212 is rotatably connected to the inner wall of the rotating shaft bracket 211. The main rotating shaft 212 is a shaft component that transmits power. A conveyor belt rotating shaft 215 is fixedly connected to the outer wall of the main rotating shaft 212. The conveyor belt rotating shaft 215 is a shaft component that drives the transport conveyor belt 216. The transport conveyor belt 216 is rotatably connected to the outer wall of the conveyor belt rotating shaft 215. The transport conveyor belt 216 is a conveying component used to transport the material to be tested. A... The calibration platform 219 is a platform component for placing and calibrating the material to be tested. A calibration clamp 220 is slidably connected to the top of the calibration platform 219. The calibration clamp 220 is a clamping component used to clamp the material to be tested. A clamp connecting block 221 is fixedly connected to the bottom of the calibration clamp 220. The clamp connecting block 221 is a component connecting the calibration clamp 220 and the calibration hinge rod 222. The clamp connecting block 221 is slidably connected to the inner wall of the calibration platform 219 and can slide along the inner wall of the calibration platform 219. The bottom of the clamp connecting block 221 is connected to the calibration hinge rod 222. The calibration column 223 is hinged, and the calibration hinge rod 222 is the hinge component that transmits the movement of the calibration column 223 to the clamping block 221. The inner wall of the calibration column 223 is slidably connected to the fixing column 224, which is a fixing component that provides sliding guidance for the calibration column 223. The top end of the fixing column 224 is fixedly connected to the bottom end of the calibration platform 219. The fixing column 224 achieves stable support by being fixed to the calibration platform 219. The bottom end of the calibration platform 219 is elastically connected to the calibration column 223 through the calibration spring 225, which is an elastic component that provides the reset spring force for the calibration column 223.

[0020] Reference Figures 2-3The automatic calibration mechanism 2 also includes a grooved top ball block 213, which is a block-shaped component that cooperates with the spherical head 312 to trigger calibration. The bottom end of the grooved top ball block 213 is fixedly connected to the top of the operating table 1. The grooved top ball block 213 is stably installed by being fixed to the operating table 1. The automatic calibration mechanism 2 also includes a pulley 214, which is a wheel-shaped component for transmitting power. The inner wall of the pulley 214 is rotatably connected to the outer wall of the main rotating shaft 212. The pulley 214 can rotate synchronously with the main rotating shaft 212. It also includes a detector bracket 217, which is a frame component that supports the detection tool 218. The bottom end of the detector bracket 217 is fixedly connected to the top end of the grooved top ball block 213. The detector bracket 217 achieves stable support by being fixed to the grooved top ball block 213. The automatic calibration mechanism 2 also includes a detection tool 218, which is a tool component used to detect semiconductor materials. The bottom end of the detection tool 218 is fixedly connected to the top end of the detector bracket 217. The detection tool 218 achieves stable installation by being fixed to the detector bracket 217.

[0021] Reference Figures 1-3 The impact buffering mechanism 3 includes a gently sloping groove 311, which is a groove-shaped structure on the top ball block 213 of the groove for buffering the impact of the spherical head 312. The gently sloping groove 311 is formed on the inner wall of the top ball block 213 of the groove, and the function of the gently sloping groove 311 is achieved by forming it on the top ball block 213 of the groove. The impact buffering mechanism 3 also includes a spherical head 312, which is a spherical component that cooperates with the gently sloping groove 311. The outer wall of the spherical head 312 is fixedly connected to the bottom end of the calibration column 223, and the spherical head 312 moves with the calibration column 223. In the step movement, the outer wall of the spherical head 312 is slidably connected to the inner wall of the gently sloping groove 311, and the spherical head 312 can slide along the inner wall of the gently sloping groove 311. The outer wall of the groove top ball block 213 is slidably connected to the outer wall of the spherical head 312, and the spherical head 312 can slide along the outer wall of the groove top ball block 213. A servo motor 4 is fixedly connected to the inner wall of the rotating shaft bracket 211. The servo motor 4 is a drive component that provides power to the main rotating shaft 212. The output end of the servo motor 4 is fixedly connected to the outer wall of the main rotating shaft 212, and the servo motor 4 can drive the main rotating shaft 212 to rotate.

[0022] Working principle: The semiconductor material testing workbench uses the operating table 1 as the basic support platform. The automatic calibration mechanism 2 realizes the automatic transportation, positioning and clamping of semiconductor materials. The impact buffer mechanism 3 reduces the impact force during the calibration process. The two work together to solve the problems of traditional workbench that require manual operation, low calibration accuracy and poor batch testing efficiency. It is suitable for the high-precision testing needs of semiconductor materials and takes into account both automated testing and material protection.

[0023] When performing batch testing of semiconductor materials, automatic transport and precise clamping are accomplished by the automatic calibration mechanism 2. The operator first places the semiconductor material to be tested on the calibration table 219 on the outer wall of the conveyor belt 216, presets the operating time of the servo motor 4 fixed on the inner wall of the rotating shaft bracket 211, and starts the servo motor 4. The output end of the servo motor 4 drives the main rotating shaft 212 to rotate, and the main rotating shaft 212 synchronously drives the conveyor belt rotating shaft 215 and the pulley 214 on the outer wall to rotate. The conveyor belt rotating shaft 215 drives the conveyor belt 216 to rotate, and the conveyor belt 216 moves the calibration table 219 toward the testing tool 218. At this time, the spherical head 312 at the bottom of the calibration column 223 slides against the outer wall of the groove top ball block 213, and the groove top ball block 213 supports the spherical head 312, so that the fixing column 224 on the inner wall of the calibration column 223 maintains the relative position. The top of the fixing column 224 is fixed to the bottom of the calibration platform 219, and the calibration spring 225 between the bottom of the calibration platform 219 and the calibration column 223 is in a compressed state. When the conveyor belt 216 moves the calibration platform 219 to the gentle slope slot 311 on the inner wall of the groove top ball block 213, the compressed calibration spring 225 gradually returns to its original position, pushing the calibration column 223 downward. The spherical head 312 slides smoothly into the slot along the inner wall of the gentle slope slot 311. As the calibration column 223 moves downward, it drives the calibration hinge rod 222, which is hinged at the bottom, to rotate. The calibration hinge rod 222 pulls the clamping block connecting block 221, which slides on the inner wall of the calibration platform 219. The clamping block connecting block 221 drives the calibration clamping block 220, which is fixed at the top, to slide towards the center of the calibration platform 219 until the calibration clamping block 220 clamps the semiconductor material to be tested. At this time, the calibration platform 219 is exactly aligned with the testing tool 218 at the top of the detector bracket 217. The bottom of the detector bracket 217 is fixed to the top of the groove top ball block 213, completing the automatic calibration and clamping of the material without manual intervention.

[0024] During calibration, the impact buffer mechanism 3 effectively reduces the impact force and protects the semiconductor material. The gentle slope groove 311 on the inner wall of the groove top ball block 213 adopts an inclined slope design. When the spherical head 312 moves from the outer wall of the groove top ball block 213 to the gentle slope groove 311, the slope of the gentle slope groove 311 guides the spherical head 312 to slide down smoothly, avoiding the impact caused by the calibration spring 225 pushing the calibration column 223 to move down rapidly when it resets. At the same time, the elastic deformation process of the calibration spring 225 can also buffer the downward force of the calibration column 223, preventing damage to the semiconductor material due to excessive impact force when the calibration clamp 220 clamps the material, ensuring the stability of the calibration process and the absence of material damage, and ensuring the reliability of the test results of the subsequent testing tool 218.

[0025] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor material testing workbench, comprising an operating table (1), characterized in that: The top of the operating table (1) is equipped with an automatic calibration mechanism (2) and a shock buffer mechanism (3). The automatic calibration mechanism (2) includes a rotating shaft support (211), the bottom of which is fixedly connected to the top of the operating table (1). A main rotating shaft (212) is rotatably connected to the inner wall of the rotating shaft support (211). A conveyor belt shaft (215) is fixedly connected to the outer wall of the main rotating shaft (212). A transport conveyor belt (216) is rotatably connected to the outer wall of the transport conveyor belt (216). A calibration table (219) is fixedly connected to the outer wall of the transport conveyor belt (216). A calibration clamp (220) is slidably connected to the top of the calibration table (219). The bottom end of the calibration clamp (220) is fixedly connected to the clamp connecting block (221), the clamp connecting block (221) is slidably connected to the inner wall of the calibration platform (219), the bottom end of the clamp connecting block (221) is hinged to the calibration column (223) through the calibration hinge rod (222), the inner wall of the calibration column (223) is slidably connected to the fixing column (224), the top end of the fixing column (224) is fixedly connected to the bottom end of the calibration platform (219), and the bottom end of the calibration platform (219) is elastically connected to the calibration column (223) through the calibration spring (225).

2. The semiconductor material testing workbench according to claim 1, characterized in that: The automatic calibration mechanism (2) also includes a grooved top ball block (213), the bottom end of which is fixedly connected to the top of the operating table (1).

3. The semiconductor material testing workbench according to claim 1, characterized in that: The automatic calibration mechanism (2) also includes a pulley (214), the inner wall of which is rotatably connected to the outer wall of the main rotating shaft (212).

4. A semiconductor material testing workbench according to claim 2, characterized in that: The automatic calibration mechanism (2) also includes a detector bracket (217), the bottom of which is fixedly connected to the top of the grooved top ball block (213).

5. A semiconductor material testing workbench according to claim 4, characterized in that: The automatic calibration mechanism (2) also includes a detection tool (218), the bottom of which is fixedly connected to the top of the detector bracket (217).

6. A semiconductor material testing workbench according to claim 1, characterized in that: The buffer impact mechanism (3) includes a gentle slope groove (311), which is formed on the inner wall of the groove top ball block (213).

7. A semiconductor material testing workbench according to claim 1, characterized in that: The buffer impact mechanism (3) also includes a spherical head (312), the outer wall of which is fixedly connected to the bottom end of the calibration column (223), and the outer wall of which is slidably connected to the inner wall of the gentle slope groove (311).

8. A semiconductor material testing workbench according to claim 2, characterized in that: The outer wall of the grooved top ball block (213) is slidably connected to the outer wall of the spherical head (312), and a servo motor (4) is fixedly connected to the inner wall of the rotating shaft bracket (211). The output end of the servo motor (4) is fixedly connected to the outer wall of the main rotating shaft (212).

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