A bidirectional dc-dc converter test system

Abstract

The utility model discloses a kind of bidirectional direct current conversion circuit test system, comprising: substrate;Resonant circuit module is set on substrate;Primary side module is pluggably set on substrate, and primary side module is electrically connected with the first end of resonant circuit module when being inserted on substrate;Secondary side module is pluggably set on substrate, and secondary side module is electrically connected with the second end of resonant circuit module when being inserted on substrate;Wherein, primary side module is provided with primary side power device test site, primary side power device test site is configured as installation power device to be measured to carry out performance test to power device to be measured;And / or, secondary side module is provided with secondary side power device test site, secondary side power device test site is configured as installation power device to be measured to carry out performance test to power device to be measured.In the application, primary side module and secondary side module are pluggably set on substrate, facilitate installation and test, and can carry out bilateral test, effectively improve test efficiency.

Description

Technical Field

[0001] This application relates to the field of integrated circuit technology, and in particular to a bidirectional DC-DC converter circuit testing system. Background Technology

[0002] In the application of integrated circuits, the testing of various devices is usually carried out using specific testing systems.

[0003] In practice, the researchers of this application found that testing power devices, especially silicon carbide (SiC) power devices, is inconvenient because SiC power devices are indispensable components in CLLC systems. CLLC systems based on SiC power device solutions are usually integrally welded together, making it difficult to test the welded SiC power devices. Furthermore, it cannot meet the testing requirements of SiC power devices with multiple drive voltages, resulting in poor flexibility and affecting testing efficiency. Utility Model Content

[0004] The main technical problem addressed by this application is to provide a bidirectional DC-DC converter circuit testing system that can be detachably installed for testing power devices and can perform bidirectional testing of the primary and secondary sides. This better conforms to the bidirectional power transmission characteristics of CLLC (Capacitor-Inductor-Inductor-Capacitor, bidirectional full-bridge resonant topology) systems, thereby improving testing efficiency.

[0005] To solve the above-mentioned technical problems, this application adopts the following technical solution: A bidirectional DC-DC converter circuit testing system is provided, comprising: a substrate; a resonant circuit module disposed on the substrate; a primary-side module detachably disposed on the substrate, wherein the primary-side module is electrically connected to a first terminal of the resonant circuit module when inserted into the substrate; and a secondary-side module detachably disposed on the substrate, wherein the secondary-side module is electrically connected to a second terminal of the resonant circuit module when inserted into the substrate; wherein the primary-side module is provided with a primary-side power device test position, the primary-side power device test position being configured to install a power device under test for performance testing of the power device under test; and / or, the secondary-side module is provided with a secondary-side power device test position, the secondary-side power device test position being configured to install a power device under test for performance testing of the power device under test.

[0006] Unlike current technologies, the bidirectional DC-DC converter circuit testing system provided in this application includes both a primary-side module and a secondary-side module, both of which can be plugged into the substrate. Both the primary-side and secondary-side modules are equipped with power device test positions, allowing testing of the power device under test on both modules. In other words, the technical solution of this application allows for pluggable mounting of the primary-side and secondary-side modules on the substrate, facilitating installation and testing, and enabling bilateral testing of both modules, effectively improving testing efficiency. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the structure of the first embodiment of the bidirectional DC-DC converter circuit test system in this application; Figure 2 This is a schematic diagram of the structure of the second embodiment of the bidirectional DC-DC converter circuit test system in this application; Figure 3 This is a schematic diagram of the structure of one embodiment of the driver in this application; Figure 4 This is a schematic diagram of the third embodiment of the bidirectional DC-DC converter circuit test system in this application; Figure 5 This is a schematic diagram of the fourth embodiment of the bidirectional DC-DC converter circuit test system in this application; Figure 6 This is a schematic diagram of the fifth embodiment of the bidirectional DC-DC converter circuit test system in this application; Figure 7 This is a schematic diagram of the sixth embodiment of the bidirectional DC-DC converter circuit test system in this application.

[0008] In the attached figures, the components include: substrate 100, resonant circuit module 200, transformer 210, sampling module 220, primary-side module 300, primary-side control module 301, first converter 3021, primary-side half-bridge circuit module 302, first driver 3022, first isolation power supply module 30221, first gate drive module 30222, first primary-side module 310, first primary-side control module 311, first primary-side half-bridge circuit module 312, second primary-side half-bridge circuit module 313, second primary-side module 320, second primary-side control module 321, third primary-side half-bridge circuit module 322, fourth primary-side half-bridge circuit module 323, secondary-side module 400, secondary-side control module 401, secondary-side half-bridge circuit module 402, and second driver. The following components are included: actuator 4022, first secondary-side module 410, first secondary-side control module 411, first secondary-side half-bridge circuit module 412, second secondary-side half-bridge circuit module 413, second secondary-side module 420, second secondary-side control module 421, third secondary-side half-bridge circuit module 422, fourth secondary-side half-bridge circuit module 423, input capacitor module 500, output capacitor module 600, heat dissipation module 700, first heat sink 710, second heat sink 720, cooling fan 730, cover 800, primary-side power device test position A, secondary-side power device test position B, first resistor R1, second resistor R2, power device under test D, first resonant inductor L1, second resonant inductor L2, first resonant capacitor C1, and second resonant capacitor C2. Detailed Implementation

[0009] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are only for explaining this application and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts related to this application are shown in the accompanying drawings, not all structures. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0010] The reference to "embodiment" in this application means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0011] The steps in the embodiments of this application are not necessarily processed in the order described. The steps can be rearranged, deleted, or added as needed. The step descriptions in the embodiments of this application are only optional combinations of sequences and do not represent all possible combinations of steps in the embodiments of this application. The order of steps in the embodiments should not be considered as a limitation of this application.

[0012] The term "and / or" in the embodiments of this application refers to any and all possible combinations including one or more of the associated listed items. It should also be noted that, when used in this specification, "including / comprising" specifies the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, and / or components and / or groups thereof.

[0013] The terms "first," "second," etc., used in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0014] A bidirectional DC-DC converter circuit testing system is provided, which can be detachably installed for testing power devices and can perform bidirectional testing of the primary and secondary sides, which is more in line with the bidirectional power transmission characteristics of CLLC systems and improves testing efficiency.

[0015] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the first embodiment of the bidirectional DC-DC converter circuit test system in this application.

[0016] like Figure 1 As shown, the test system in this application includes: a substrate 100, a resonant circuit module 200, a primary-side module 300, and a secondary-side module 400.

[0017] A resonant circuit module 200 is disposed on a substrate 100; a primary-side module 300 is pluggably disposed on the substrate 100, and the primary-side module 300 is electrically connected to the first terminal of the resonant circuit module 200 when plugged into the substrate 100; a secondary-side module 400 is electrically connected to the second terminal of the resonant circuit module 200 when plugged into the substrate 100. The primary-side module 300 is provided with a primary-side power device test position A, configured to mount a power device under test (DUT) for performance testing; and / or the secondary-side module 400 is provided with a secondary-side power device test position B, configured to mount a DUT for performance testing.

[0018] The substrate 100 is a circuit board. The power device under test can be a silicon carbide (SiC) power device.

[0019] Specifically, the resonant circuit module 200, the primary-side module 300, and the secondary-side module 400 are all disposed on the substrate 100, and the primary-side module 300 and the secondary-side module 400 are pluggably disposed on the substrate 100. When it is necessary to test the power device under test, the power device under test can be installed in the primary-side power device test position of the primary-side module, or in the primary-side power device test position of the secondary-side module, or in both the primary-side power device test positions of the primary-side module and the secondary-side power device test position of the secondary-side module; then, when the primary-side module 300 is inserted into the substrate 100, it is electrically connected to the first terminal of the resonant circuit module 200, and when the secondary-side module 400 is inserted into the substrate 100, it is electrically connected to the second terminal of the resonant circuit module 200, thereby performing performance tests on the installed power devices under test respectively.

[0020] In this embodiment, the primary-side module and the secondary-side module are modularly designed and pluggably mounted on the substrate, which facilitates lateral comparison and replacement of devices and is beneficial to the maintenance and management of the test system. Furthermore, the primary-side module and the secondary-side module are respectively located on both sides of the resonant circuit module, which is more in line with the bidirectional transmission characteristics of the CLLC system and improves the test efficiency.

[0021] See Figure 2 , Figure 3 , Figure 4 , Figure 2 This is a schematic diagram of the structure of the second embodiment of the bidirectional DC-DC converter circuit test system in this application; Figure 3 This is a schematic diagram of the structure of one embodiment of the driver in this application; Figure 4 This is a schematic diagram of the third embodiment of the bidirectional DC-DC converter circuit test system in this application.

[0022] like Figure 2As shown, the primary-side module 300 includes a primary-side control module 301 and a primary-side half-bridge circuit module 302.

[0023] The primary-side control module 301 is pluggably disposed on the substrate 100 and is configured to provide primary-side test signals. The primary-side half-bridge circuit module 302 is pluggably disposed on the substrate 100. When both the primary-side control module 301 and the primary-side half-bridge circuit module 302 are plugged into the substrate 100, the primary-side half-bridge circuit module 302 is electrically connected to the first terminal of the resonant circuit module 200, and the input terminal of the primary-side half-bridge circuit module 302 is electrically connected to the primary-side control module 301. The output terminal of the primary-side half-bridge circuit module 302 is provided with a primary-side power device test position A. When the power device under test (DUT) is installed at the primary-side power device test position A, the performance of the power device under test (DUT) is tested based on the primary-side test signals.

[0024] Furthermore, it may also include a secondary-side module 400, which includes a secondary-side control module 401 and a secondary-side half-bridge circuit module 402.

[0025] The secondary-side control module 401 is pluggably disposed on the substrate 100 and is configured to provide secondary-side test signals. The secondary-side half-bridge circuit module 402 is pluggably disposed on the substrate 100. When both the secondary-side control module 401 and the secondary-side half-bridge circuit module 402 are plugged into the substrate 100, the secondary-side half-bridge circuit module 402 is electrically connected to the second terminal of the resonant circuit module 200, and the input terminal of the secondary-side half-bridge circuit module 402 is electrically connected to the secondary-side control module 401. The output terminal of the secondary-side half-bridge circuit module 402 is provided with a secondary-side power device test position B. When the power device under test (DUT) is installed at the secondary-side power device test position B, the performance of the power device under test (DUT) is tested based on the secondary-side test signals.

[0026] In this embodiment, both the primary-side module and the secondary-side module are equipped with corresponding control modules and corresponding half-bridge circuit modules, forming a symmetrical structure design that conforms to the bidirectional transmission characteristics of the CLLC system and improves testing efficiency.

[0027] Continue reading Figure 2 In some embodiments, the half-bridge circuit module can be a primary-side half-bridge circuit module and a secondary-side half-bridge circuit module.

[0028] The primary-side half-bridge circuit module is used for illustration. The primary-side half-bridge circuit module 302 includes a first converter 3021 and a first driver 3022.

[0029] When both the primary-side half-bridge circuit module 302 and the primary-side control module 301 are inserted onto the substrate 100, the first converter 3021 is electrically connected to the power interface of the primary-side control module 301 to convert the output voltage provided by the primary-side control module 301 into a first driving voltage. The first input terminal of the first driver 3022 is connected to the first converter 3021 to operate under the drive of the first driving voltage, and the second input terminal of the first driver 3022 is electrically connected to the signal interface of the primary-side control module 301 when both the primary-side half-bridge circuit module 302 and the primary-side control module 301 are inserted onto the substrate 100 to receive primary-side test signals.

[0030] Furthermore, the first driver 3022 uses the received primary-side test signal to perform performance testing on the power device under test installed on the primary-side power device test position, thereby determining the performance of the power device.

[0031] Furthermore, it may also include a secondary half-bridge circuit module 402, which includes a second converter 4021 and a second driver 4022.

[0032] When both the secondary-side half-bridge circuit module 402 and the secondary-side control module 401 are inserted onto the substrate 100, the second converter 4021 is electrically connected to the power interface of the secondary-side control module 401 to convert the input voltage provided by the secondary-side control module 401 into a second driving voltage. The first input terminal of the second driver 4022 is connected to the second converter 4021 to operate under the drive of the second driving voltage, and the second input terminal of the second driver 4022 is electrically connected to the model interface of the secondary-side control module 401 when both the secondary-side half-bridge circuit module 402 and the secondary-side control module 401 are inserted onto the substrate 100 to receive secondary-side test signals.

[0033] Furthermore, the second driver 4022 uses the received secondary-side test signal to perform performance testing on the power device under test installed on the secondary-side power device test position, thereby determining the performance of the power device.

[0034] In this embodiment, corresponding converters and drivers are respectively set in the primary-side half-bridge circuit module and the secondary-side half-bridge circuit module. The corresponding driver is driven by the driving voltage converted by the converter. The driver then uses the received test signal to perform performance testing on the power device under test at the power device test position. This conforms to the bidirectional transmission characteristics of the CLLC system and improves the testing efficiency.

[0035] Furthermore, the driver may also include an isolated power supply module and a gate drive module.

[0036] Please see Figure 3Taking the first driver 3022 as an example, the first driver 3022 includes a first isolated power supply module 30221 and a first gate drive module 30222, which are respectively connected to the primary side control module 301.

[0037] When both the primary-side half-bridge circuit module 302 and the primary-side control module 301 are inserted onto the substrate 100, the first isolation power supply module 30221 is electrically connected to the power interface of the primary-side control module 301 to adjust the first driving voltage to the first gate driving voltage. The first input terminal of the first gate driving module 30222 is electrically connected to the signal interface of the primary-side control module 301, and the second input terminal of the first gate driving module 30222 is electrically connected to the output terminal of the first isolation power supply module 30221 to work under the drive of the first gate driving voltage. When both the primary-side half-bridge circuit module 302 and the primary-side control module 301 are inserted onto the substrate 100, the first output terminal of the first gate driving module 30222 is electrically connected to the power device under test (DUT) D through the first resistor R1, and the second output terminal of the first gate driving module 30222 is electrically connected to the power device under test (DUT) D through the second resistor R2 to drive the power device under test (DUT) D using the first gate driving voltage.

[0038] Among them, the first resistor R1 and the second resistor R2 are adjustable resistors.

[0039] Furthermore, the second driver 4022 can also be described, and its structure is the same as that of the first driver 3022, which can be referred to in [reference needed]. Figure 3 .

[0040] The second driver 4022 includes a second isolated power supply module and a second gate drive module.

[0041] When both the secondary-side half-bridge circuit module 402 and the secondary-side control module 401 are inserted into the substrate 100, the second isolated power supply module is electrically connected to the power interface of the secondary-side control module 401 to adjust the second driving voltage to the second gate driving voltage. The first input terminal of the second gate driving module is electrically connected to the signal interface of the secondary-side control module 401, and the second input terminal of the second gate driving module is electrically connected to the output terminal of the second isolated power supply module to operate under the drive of the second gate driving voltage. When both the secondary-side half-bridge circuit module 402 and the secondary-side control module 401 are inserted into the substrate 100, the first output terminal of the second gate driving module is electrically connected to the power device under test D through the third resistor, and the second output terminal of the first gate driving module is electrically connected to the power device under test D through the fourth resistor to drive the power device under test D using the second gate driving voltage.

[0042] Among them, the third and fourth resistors are adjustable resistors.

[0043] In this embodiment, by setting an adjustable resistor, the driving voltage can be quickly changed, that is, the driving voltage is flexibly adjustable, which can be applied to the testing and evaluation of power devices with different driving voltage level requirements, thereby improving testing efficiency.

[0044] In some embodiments, the first end of the resonant circuit module 200 includes a first sub-connection terminal and a second sub-connection terminal, and the second end of the resonant circuit module 200 includes a third sub-connection terminal and a fourth sub-connection terminal. Multiple primary-side modules may be included, for example, a first primary-side module and a second primary-side module; correspondingly, multiple secondary-side modules may be included, for example, a first secondary-side module and a second secondary-side module.

[0045] like Figure 4 As shown, Figure 4 As shown in the circuit diagram, the primary-side module 300 includes a first primary-side module 310 and a second primary-side module. When both the first primary-side module 310 and the second primary-side module 320 are inserted onto the substrate 100, the output terminal of the first primary-side module 310 is electrically connected to the first sub-connection terminal of the resonant circuit module 200, and the output terminal of the second primary-side module 320 is electrically connected to the second sub-connection terminal of the resonant circuit module 200.

[0046] The first primary-side module 310 includes a first primary-side control module 311, a first primary-side half-bridge circuit module 312, and a second primary-side half-bridge circuit module 313. When the first primary-side control module 311, the first primary-side half-bridge circuit module 312, and the second primary-side half-bridge circuit module 313 are all inserted on the substrate 100, the first primary-side control module 311 is electrically connected to the first primary-side half-bridge circuit module 312 and the second primary-side half-bridge circuit module 313, respectively. The second primary-side module 320 includes a second primary-side control module 321, a third primary-side half-bridge circuit module 322, and a fourth primary-side half-bridge circuit module 323. When the second primary-side control module 321, the third primary-side half-bridge circuit module 322, and the fourth primary-side half-bridge circuit module 323 are all inserted on the substrate 100, the second primary-side control module 321 is electrically connected to the third primary-side half-bridge circuit module 322 and the fourth primary-side half-bridge circuit module 323, respectively.

[0047] It is understandable that the structures of the first primary-side control module 311 and the second primary-side control module 321 are the same as those of the primary-side control module 301; the structures of the first primary-side half-bridge circuit module 312, the second primary-side half-bridge circuit module 313, the third primary-side half-bridge circuit module 322 and the fourth primary-side half-bridge circuit module 323 are the same as those of the primary-side half-bridge circuit module 302.

[0048] Furthermore, the secondary side module 400 may also include a first secondary side module 410 and a second secondary side module 420. When both the first secondary side module 410 and the second secondary side module 420 are inserted into the substrate 100, the output terminal of the first secondary side module 410 is electrically connected to the third sub-connection terminal of the resonant circuit module 200, and the output terminal of the second secondary side module 420 is electrically connected to the fourth sub-connection terminal of the resonant circuit module 200.

[0049] The first secondary-side module 410 includes a first secondary-side control module 411, a first secondary-side half-bridge circuit module 412, and a second secondary-side half-bridge circuit module 413. When all three modules are inserted onto the substrate 100, the first secondary-side control module 411 is electrically connected to both the first secondary-side half-bridge circuit module 412 and the second secondary-side half-bridge circuit module 413. The second secondary-side module 420 includes a second secondary-side control module 421, a third secondary-side half-bridge circuit module 422, and a fourth secondary-side half-bridge circuit module 423. When all three modules are inserted onto the substrate 100, the second secondary-side control module 421 is electrically connected to both the third secondary-side half-bridge circuit module 422 and the fourth secondary-side half-bridge circuit module 423.

[0050] It is understandable that the structures of the first secondary-side control module 411 and the second secondary-side control module 421 are the same as those of the secondary-side control module 401; the structures of the first secondary-side half-bridge circuit module 412, the second secondary-side half-bridge circuit module 413, the third secondary-side half-bridge circuit module 422 and the fourth secondary-side half-bridge circuit module 423 are the same as those of the secondary-side half-bridge circuit module 402.

[0051] In this embodiment, the primary and secondary modules are designed in a fully symmetrical manner, so that the parameters of the primary and secondary modules are exactly the same and the layout is strictly symmetrical, which is more in line with the bidirectional power transmission characteristics of the CLLC system. This allows for bidirectional testing of the primary and secondary modules, effectively improving testing efficiency.

[0052] In some embodiments, the resonant circuit module 200 includes a transformer 210, a first resonant inductor L1, a second resonant inductor L2, a first resonant capacitor C1, a second resonant capacitor C2, and a sampling module 220.

[0053] The transformer 210, the first resonant inductor L1 and the second resonant inductor L2 are all detachably mounted on the substrate 100, while the first resonant capacitor C1, the second resonant capacitor C2 and the layoff module are all fixedly mounted on the substrate 100.

[0054] Furthermore, when the primary-side module 300, transformer 210, and first resonant inductor L1 are all inserted onto the substrate 100, the first end of the first resonant inductor L1 is connected to the first output terminal of the primary-side module 300, and the second end of the first resonant inductor L1 is electrically connected to the transformer 210. Also, when the primary-side module 300 and transformer 210 are both inserted onto the substrate 100, the first end of the first resonant capacitor C1 is connected to the second output terminal of the primary-side module 300, and the second end of the first resonant capacitor C1 is electrically connected to the transformer 210.

[0055] Furthermore, when the secondary module 400, transformer 210, and second resonant inductor L2 are all inserted onto the substrate 100, the first end of the second resonant inductor L2 is connected to the first input terminal of the secondary module 400, and the second end of the second resonant inductor L2 is electrically connected to the transformer 210. Also, when both the secondary module 400 and transformer 210 are inserted onto the substrate 100, the first end of the second resonant capacitor C2 is connected to the second input terminal of the secondary module 400, and the second end of the second resonant capacitor C2 is electrically connected to the transformer 210.

[0056] The sampling module 220 is connected to the second end of the first resonant capacitor C1, and the second end of the sampling module 220 is connected to the second end of the second resonant capacitor C2. The sampling module 220 is configured to sample the primary side test signal corresponding to the primary side module 300 and / or the secondary side test signal corresponding to the secondary side module to determine the test result.

[0057] Understandably, during the operation of the test system, the sampling module 220 continuously collects the operating current of the power device under test, that is, it collects the primary side test signal and / or secondary side test signal of the power device under test, and then feeds it back to the control terminal to determine the test structure of the power device under test.

[0058] In this embodiment, the transformer provides electrical isolation during the operation of the test system and interacts with the resonant inductor and resonant capacitor to form a resonant circuit, thereby achieving efficient energy transfer.

[0059] In some embodiments, the test system further includes an input capacitor module 500 and an output capacitor module 600.

[0060] An input capacitor module 500 is fixedly mounted on the substrate 100 and configured to provide electrical energy. When the primary-side module 300 is inserted into the substrate 100, the input capacitor module 500 is electrically connected to the primary-side module 300, and the input capacitor module 500 is located on the side of the primary-side module 300 furthest from the resonant circuit module 200. An output capacitor module 600 is fixedly mounted on the substrate 100 and configured to store the electrical energy provided by the input capacitor module 500 and transfer it to the output load.

[0061] When the secondary module 400 is inserted into the substrate 100, the output capacitor module 600 is electrically connected to the secondary module 400, and the output capacitor module 600 is located on the side of the secondary module 400 away from the resonant circuit module 200.

[0062] Furthermore, when both the primary-side module 300 and the secondary-side module 400 are inserted onto the substrate 100, the secondary-side module 400 and the primary-side module 300 are symmetrically distributed on opposite sides of the resonant circuit module 200 in the first direction. The input capacitor module 500 and the output capacitor module 600 are symmetrically distributed on opposite sides of the resonant circuit module 200 in the first direction.

[0063] It is understandable that the first direction can be the extension direction of the primary side module 300, the resonant circuit module 200 and the secondary side module 400. For example, if the primary side module 300, the resonant circuit module 200 and the secondary side module 400 are on a straight line, then the first direction is the direction of the straight line.

[0064] In this embodiment, electrical energy is injected from the input capacitor module 500, processed and inverted by the primary-side module 300, converting the electrical energy from DC to AC, and then transmitted to the secondary-side module 400 through the resonant circuit module 200. The secondary-side module 400 then rectifies the voltage to generate an output voltage, which finally flows to the output capacitor module 600 for energy storage, or can be transmitted to the output load.

[0065] In some embodiments, a heat dissipation module 700 is also included.

[0066] Please see Figure 5 , Figure 5 This is a schematic diagram of the fourth embodiment of the bidirectional DC-DC converter circuit test system in this application.

[0067] like Figure 5 As shown, Figure 5 In a top view, the heat dissipation module 700 includes a first heat sink 710, a second heat sink 720, and a cooling fan 730. Both the first heat sink 710 and the second heat sink 720 are located on the first side of the cooling fan 730, and are positioned opposite each other and spaced apart. At least a portion of the first heat sink 710 is opposite the cooling fan 730, and at least a portion of the second heat sink 720 is opposite the cooling fan 730.

[0068] The resonant circuit module 200 is located between the cooling fan 730, the first heat sink 710, and the second heat sink 720.

[0069] When the primary side module 300 is inserted into the substrate 100, the primary side module 300 is located on the first side of the heat dissipation fan 730, on the first side of the resonant circuit module 200 in the first direction, and is disposed close to the first heat dissipation component.

[0070] When the secondary side module 400 is inserted into the substrate 100, it is located on the first side of the heat dissipation fan 730, on the second side of the resonant circuit module 200 in the first direction, and close to the second heat sink.

[0071] It is understood that the first heat sink 710 and the second heat sink 720 can adopt the structure of heat sink fins, and the cooling fan 730 is a fan that can be used in the art.

[0072] Furthermore, the resonant circuit module 200 includes a transformer 210, a first resonant inductor L1, a second resonant inductor L2, and a sampling module 220.

[0073] The transformer 210 is located on the first side of the cooling fan 730, between the first heat sink 710 and the second heat sink 720, with the transformer 210 and the cooling fan 730 spaced apart. The first resonant inductor L1, the second resonant inductor L2, the first resonant capacitor C1, and the second resonant capacitor C2 are all located between the cooling fan 730, the transformer 210, the first heat sink 710, and the second heat sink 720. The sampling module 220 is located on the side of the transformer 210 away from the cooling fan 730, between the first heat sink 710 and the second heat sink 720.

[0074] Furthermore, the heat dissipation module 700 may also include: a third heat dissipation component, a fourth heat dissipation component, a fifth heat dissipation component, a sixth heat dissipation component, and a seventh heat dissipation component.

[0075] The third heat sink is arranged around the transformer 210; the fourth heat sink is arranged on the top side of the first resonant inductor L1 away from the substrate 100; the fifth heat sink is arranged on the bottom side of the first resonant inductor L1 facing the substrate 100; the sixth heat sink is arranged on the top side of the second resonant inductor L2 away from the substrate 100; and the seventh heat sink is arranged on the bottom side of the second resonant inductor L2 facing the substrate 100.

[0076] It is understandable that "top side" refers to the top side of the resonant inductor, that is, the hierarchical relationship from bottom to top is substrate 100, first resonant inductor L1, fourth heat sink, and the sixth heat sink is arranged similarly; "bottom side" refers to the bottom side of the resonant inductor, that is, the hierarchical relationship from bottom to top is substrate 100, fifth heat sink, first resonant inductor L1, and the seventh heat sink is arranged similarly.

[0077] In some embodiments, the first heat sink and the second heat sink are provided with multiple tooth-like structures to form multiple sub-air ducts.

[0078] Please see Figure 6 and Figure 7 , Figure 6 This is a schematic diagram of the fifth embodiment of the bidirectional DC-DC converter circuit test system in this application; Figure 7 This is a schematic diagram of the sixth embodiment of the bidirectional DC-DC converter circuit test system in this application.

[0079] in, Figure 6 This is a top view. Figure 7 This is a cross-sectional view.

[0080] In the direction parallel to the first and second heat sinks, and in the direction parallel to the substrate 100, the projection of the cooling fan covers the projections of the first and second heat sinks. It is understood that the third, fourth, fifth, sixth, and seventh heat sinks also have multiple toothed structures, forming multiple sub-air ducts.

[0081] In some embodiments, there are multiple first heat sinks, each corresponding to a primary edge module, wherein the multiple first heat sinks are symmetrically distributed; there are multiple second heat sinks, each corresponding to a secondary edge module, wherein the multiple second heat sinks are symmetrically distributed.

[0082] In some embodiments, in the direction perpendicular to the substrate, the height of the first heat sink is greater than the height of the primary side module 300, and the height of the second heat sink is greater than the height of the secondary side module 400.

[0083] In some embodiments, the test system further includes a cover 800, which, together with the substrate 100, forms a receiving cavity, which is configured to receive a heat dissipation module 700, a primary side module 300, a secondary side module 400, and a resonant circuit module 200.

[0084] In some embodiments, the resonant circuit module 200 may also be pluggably disposed on the substrate 100.

[0085] In this application, the primary-side module and the secondary-side module are modularly designed and pluggably mounted on the substrate, which facilitates lateral comparison and replacement of devices and is beneficial to the maintenance and management of the test system. Furthermore, the primary-side module and the secondary-side module are respectively located on both sides of the resonant circuit module, which is more in line with the bidirectional transmission characteristics of the CLLC system and improves the test efficiency.

[0086] In the embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces, or indirect coupling or communication connection between apparatuses or units, and may be electrical, mechanical, or other forms.

[0087] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0088] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A bidirectional DC-DC converter circuit testing system, characterized in that, include: substrate; The resonant circuit module is disposed on the substrate; The primary-side module is pluggably disposed on the substrate, and the primary-side module is electrically connected to the first end of the resonant circuit module when it is plugged into the substrate. The secondary side module is pluggably disposed on the substrate, and when the secondary side module is plugged into the substrate, it is electrically connected to the second terminal of the resonant circuit module. The primary-side module is provided with a primary-side power device test position, which is configured to install a power device under test for performance testing; and / or, the secondary-side module is provided with a secondary-side power device test position, which is configured to install a power device under test for performance testing.

2. The testing system according to claim 1, characterized in that, The primary edge module includes: A primary-side control module is pluggably disposed on the substrate, and the primary-side control module is configured to provide a primary-side test signal; A primary-side half-bridge circuit module is pluggably mounted on the substrate. When both the primary-side control module and the primary-side half-bridge circuit module are plugged into the substrate, the primary-side half-bridge circuit module is electrically connected to the first terminal of the resonant circuit module, and the input terminal of the primary-side half-bridge circuit module is electrically connected to the primary-side control module. The output terminal of the primary-side half-bridge circuit module is provided with a primary-side power device test position. When a power device under test is installed at the primary-side power device test position, performance testing of the power device under test is performed based on the primary-side test signal. And / or, the secondary side module includes: A secondary-side control module is pluggably disposed on the substrate, and the secondary-side control module is configured to provide a secondary-side test signal; A secondary-side half-bridge circuit module is pluggably mounted on the substrate. When both the secondary-side control module and the secondary-side half-bridge circuit module are plugged into the substrate, the secondary-side half-bridge circuit module is electrically connected to the second terminal of the resonant circuit module, and the input terminal of the secondary-side half-bridge circuit module is electrically connected to the secondary-side control module. The output terminal of the secondary-side half-bridge circuit module is provided with a secondary-side power device test position. When the power device under test is installed at the secondary-side power device test position, the performance of the power device under test is tested based on the secondary-side test signal.

3. The testing system according to claim 2, characterized in that, The primary-side half-bridge circuit module includes: The first converter is electrically connected to the power interface of the primary-side control module when both the primary-side half-bridge circuit module and the primary-side control module are inserted on the substrate, so as to convert the input voltage provided by the primary-side control module into a first driving voltage. The first driver has a first input terminal electrically connected to the first converter to operate under the drive of the first drive voltage, and the second input terminal of the first driver is electrically connected to the signal interface of the primary-side control module when both the primary-side half-bridge circuit module and the primary-side control module are inserted on the substrate to receive the primary-side test signal. And / or, the secondary half-bridge circuit module includes: The second converter is electrically connected to the power interface of the primary control module when both the secondary half-bridge circuit module and the secondary control module are inserted on the substrate, so as to convert the input voltage provided by the secondary control module into a second driving voltage. The second driver has a first input terminal electrically connected to the second converter to operate under the drive of the second drive voltage, and a second input terminal electrically connected to the model interface of the secondary control module when both the secondary half-bridge circuit module and the secondary control module are inserted on the substrate, to receive the secondary test signal.

4. The testing system according to claim 3, characterized in that, The first driver includes: The first isolated power supply module is electrically connected to the power interface of the primary-side control module when both the primary-side half-bridge circuit module and the primary-side control module are inserted on the substrate, so as to adjust the first driving voltage to the first gate driving voltage. A first gate driving module has a first input terminal electrically connected to the signal interface of the primary-side control module, and a second input terminal electrically connected to the output terminal of the first isolation power supply module to operate under the drive of the first gate driving voltage. When both the primary-side half-bridge circuit module and the primary-side control module are inserted on the substrate, the first output terminal of the first gate driving module is electrically connected to the power device under test through a first resistor, and the second output terminal of the first gate driving module is electrically connected to the power device under test through a second resistor to drive the power device under test using the first gate driving voltage. The first resistor and the second resistor are adjustable resistors. And / or, a second drive, including: The second isolated power supply module is electrically connected to the power interface of the secondary control module when both the secondary half-bridge circuit module and the secondary control module are inserted on the substrate, so as to adjust the second driving voltage to the second gate driving voltage. The second gate driving module has a first input terminal electrically connected to the signal interface of the secondary-side control module, and a second input terminal electrically connected to the output terminal of the second isolation power supply module to operate under the drive of the second gate driving voltage. When both the secondary-side half-bridge circuit module and the secondary-side control module are inserted on the substrate, the first output terminal of the second gate driving module is electrically connected to the power device under test through a third resistor, and the second output terminal of the second gate driving module is electrically connected to the power device under test through a fourth resistor to drive the power device under test using the second gate driving voltage. The third and fourth resistors are adjustable resistors.

5. The testing system according to claim 1, characterized in that, The resonant circuit module includes: a transformer, a first resonant inductor, a second resonant inductor, a first resonant capacitor, a second resonant capacitor, and a sampling module; The transformer, the first resonant inductor, and the second resonant inductor are all detachably mounted on the substrate, while the first resonant capacitor, the second resonant capacitor, and the sampling module are all fixedly mounted on the substrate. When the primary-side module, the transformer, and the first resonant inductor are all inserted on the substrate, the first end of the first resonant inductor is connected to the first output end of the primary-side module, and the second end of the first resonant inductor is electrically connected to the transformer. When both the primary-side module and the transformer are inserted onto the substrate, the first end of the first resonant capacitor is connected to the second output end of the primary-side module, and the second end of the first resonant capacitor is electrically connected to the transformer. When the secondary module, the transformer, and the second resonant inductor are all inserted on the substrate, the first end of the second resonant inductor is connected to the first input end of the secondary module, and the second end of the second resonant inductor is electrically connected to the transformer. When both the secondary module and the transformer are inserted onto the substrate, the first end of the second resonant capacitor is connected to the second input terminal of the secondary module, and the second end of the second resonant capacitor is electrically connected to the transformer. The first end of the sampling module is connected to the second end of the first resonant capacitor, and the second end of the sampling module is connected to the second end of the second resonant capacitor. The sampling module is configured to sample the primary side test signal corresponding to the primary side module and / or the secondary side test signal corresponding to the secondary side module to determine the test result.

6. The testing system according to claim 1, characterized in that, The testing system also includes: An input capacitor module is fixedly mounted on the substrate and configured to provide electrical power; wherein, when the primary-side module is inserted into the substrate, the input capacitor module is electrically connected to the primary-side module, and the input capacitor module is located on the side of the primary-side module away from the resonant circuit module; An output capacitor module is fixedly mounted on the substrate and configured to store the electrical energy provided by the input capacitor module and transfer it to the output load. When the secondary side module is inserted into the substrate, the output capacitor module is electrically connected to the secondary side module, and the output capacitor module is located on the side of the secondary side module away from the resonant circuit module.

7. The testing system according to claim 6, characterized in that, When both the primary side module and the secondary side module are inserted onto the substrate, the secondary side module and the primary side module are symmetrically distributed on opposite sides of the resonant circuit module in the first direction; The input capacitor module and the output capacitor module are symmetrically distributed on opposite sides of the resonant circuit module in the first direction.

8. The testing system according to claim 1, characterized in that, Also includes: A heat dissipation module includes a first heat dissipation component, a second heat dissipation component, and a heat dissipation fan; the first heat dissipation component and the second heat dissipation component are both located on the first side of the heat dissipation fan, and the first heat dissipation component and the second heat dissipation component are opposite to each other and spaced apart, the first heat dissipation component is at least partially opposite to the heat dissipation fan, and the second heat dissipation component is at least partially opposite to the heat dissipation fan; The resonant circuit module is located between the cooling fan, the first heat sink, and the second heat sink. When the primary edge module is inserted into the substrate, it is located on the first side of the heat dissipation fan, on the first side of the resonant circuit module in the first direction, and close to the first heat dissipation component. When the secondary side module is inserted into the substrate, it is located on the first side of the heat dissipation fan and on the second side of the resonant circuit module in the first direction, and is disposed close to the second heat sink.

9. The testing system according to claim 8, characterized in that, The resonant circuit module includes a transformer, a first resonant inductor, a second resonant inductor, a first resonant capacitor, a second resonant capacitor, and a sampling module; wherein, The transformer is located on the first side of the cooling fan and between the first heat sink and the second heat sink, and the transformer and the cooling fan are spaced apart; The first resonant inductor, the second resonant inductor, the first resonant capacitor, and the second resonant capacitor are all located between the cooling fan, the transformer, the first heat sink, and the second heat sink. The sampling module is located on the side of the transformer away from the cooling fan, and between the first heat sink and the second heat sink.

10. The testing system according to claim 9, characterized in that, The heat dissipation module also includes: A third heat sink is arranged around the transformer; The fourth heat sink is disposed on the top side of the first resonant inductor away from the substrate; The fifth heat sink is disposed on the bottom side of the first resonant inductor facing the substrate; The sixth heat sink is disposed on the top side of the second resonant inductor away from the substrate; A seventh heat sink is disposed on the bottom side of the second resonant inductor facing the substrate; And / or, The testing system also includes a cover, which, together with the substrate, forms a receiving cavity. The receiving cavity is configured to accommodate the heat dissipation module, the primary side module, the secondary side module, and the resonant circuit module. And / or, The resonant circuit module is pluggably mounted on the substrate.

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