An integrated circuit chip burn-in test apparatus

Abstract

The utility model relates to integrated circuit chip research and development technical field discloses a kind of integrated circuit chip aging test device, including device table, the top of device table is fixed with test box, the top of left side in device table front end is equipped with controller. The integrated circuit chip aging test device uses, integrated circuit chip is unlocked after being tested in the inside of test box, then can be extracted to the right side of device table, and integrated circuit chip can be placed in the inside of placing box, after fan can be controlled to start, utilize air intake passage to suck outside air, and send to the inside of placing box, the integrated circuit chip inside placing box can be carried out auxiliary quick air cooling cooling, reduce integrated circuit chip temperature, it is convenient to carry out inspection detection operation to integrated circuit chip quickly, solve is not convenient to the integrated circuit chip board after testing Auxiliary quick cooling problem.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit chip research and development technology, specifically to an integrated circuit chip aging test device. Background Technology

[0002] Integrated circuit chips are miniature electronic circuits formed by highly integrating electronic components such as transistors, resistors, and capacitors on a semiconductor substrate. They can realize complex functions and improve the miniaturization, low power consumption, and reliability of devices. In the research and development process of integrated circuit chips, a large number of tests are required to test the reliability of integrated circuit chips. Among them, when testing the performance and stability of chips under high temperature environments, some integrated circuit chip aging test devices are needed.

[0003] However, in actual use, after the integrated circuit chip aging test device has completed the high-temperature aging test, when inspecting the chip board after the test, the high temperature test will cause the chip board temperature to rise, and the natural cooling process takes a long time, which affects the test efficiency and is inconvenient to assist in the rapid cooling of the integrated circuit chip board after the test.

[0004] Now, a novel integrated circuit chip aging test device is proposed to address the above-mentioned shortcomings. Utility Model Content

[0005] The purpose of this invention is to provide an integrated circuit chip aging test device to solve the problem mentioned in the background art of the inconvenience of assisting rapid cooling of the integrated circuit chip board after testing.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an integrated circuit chip aging test device, comprising a device platform, a test box fixed to the top of the device platform, a controller installed on the top of the left side of the front end of the device platform, a base provided at the bottom of the test box, an inner cavity provided inside the right side of the device platform, and a placement box inserted into the inner right side of the inner cavity, a fan installed at the top of the inner cavity, an air inlet duct opened inside the top right side of the device platform, and a filter screen fixed inside the inner right side of the air inlet duct, and several air outlet slots opened inside the inner right side of the placement box, and locking blocks movably connected to both ends of the bottom right side of the device platform.

[0007] As a further technical solution of this utility model, the air inlet duct is connected to the interior of the fan, and the fan is connected to the interior of the placement box.

[0008] As a further technical solution of this utility model, a plurality of the air outlet slots are distributed at equal intervals inside the right side of the placement box, and the air outlet slots penetrate through the inside of the right side of the placement box and communicate with the inside of the placement box.

[0009] As a further technical solution of this utility model, a top seat is provided at the top of the test box, and a heating plate is installed at the bottom of the top seat. A top frame is fixed at the top of the test box. A threaded sleeve is movably connected at the middle position of the top of the test box, and a gear ring is fixed on the outer side of the threaded sleeve. A servo motor is installed and fixed on the right side of the top of the top frame, and the output shaft of the servo motor passes through the interior of the top of the top frame and is fixed with a drive gear. A lead screw is threadedly connected inside the threaded sleeve, and the bottom end of the lead screw passes through the interior of the top of the test box and is movably connected to the top of the top seat. Guide rods are vertically fixed on both sides of the top of the top seat, and sliding sleeves are fixed inside both sides of the top of the test box.

[0010] As a further technical solution of this utility model, the top end of the lead screw penetrates the interior of the top end of the top frame, the drive gear is meshed with the gear ring, and the guide rod penetrates the interior of the sliding sleeve.

[0011] As a further technical solution of this utility model, the bottom end of the base is fixed with a mounting platform, and the rear ends of the two sides of the bottom of the mounting platform are respectively fixed with sliders. The two sides of the bottom of the test box are respectively provided with sliding grooves. The bottom of the front end of the test box is installed with a limiting plate. The front end of the sliding groove penetrates the interior of the front end of the test box. The front end of the mounting platform is fixed with a handle.

[0012] As a further technical solution of this utility model, a door is hinged to the left side of the front end of the test box, and a locking rod is respectively provided through the top and bottom of the right side of the front end of the door. Locking holes are respectively provided at the top and bottom of the right side of the front end of the test box, and casters are respectively fixed at the four corners of the bottom of the device platform.

[0013] As a further technical solution of this utility model, a heating plate is installed at the top of the base.

[0014] Compared with the prior art, the beneficial effects of this utility model are: the integrated circuit chip aging test device not only facilitates the auxiliary rapid cooling of the integrated circuit chip board after testing and facilitates the uniform heating of the outside of the integrated circuit chip, but also facilitates the safe handling of the integrated circuit chip inside the device during the testing process.

[0015] (1) By setting up a device platform, inner cavity, placement box, fan, air inlet, filter, air outlet and locking block, when the test device is used, after the integrated circuit chip is tested and unlocked inside the test box, the placement box can be pulled out to the right side of the device platform, and the integrated circuit chip can be placed inside the placement box. Then the fan can be started to draw in the outside air through the air inlet and send it into the placement box. This can provide auxiliary and rapid air cooling and heat dissipation for the integrated circuit chip inside the placement box, reduce the temperature of the integrated circuit chip, and facilitate rapid inspection and testing of the integrated circuit chip.

[0016] (2) The device is equipped with a test box, base, top seat, guide rod, top frame, threaded sleeve, lead screw, servo motor, drive gear, sliding sleeve and gear ring. When the device is in use, after the integrated circuit chip is placed on the top of the base, the drive gear can be started by controlling the servo motor to rotate. When the drive gear rotates, the threaded sleeve can be driven to rotate by the meshing gear ring. When the threaded sleeve rotates, the lead screw connected by the internal thread can be driven to move down, and the top seat and heating plate 2 can be moved down to the top position of the integrated circuit chip. The heating plate 2 and the bottom heating plate 1 can heat the top and bottom surfaces of the integrated circuit chip at the same time, so that the two sides of the integrated circuit chip can be heated and tested evenly.

[0017] (3) By setting up a device platform, test box, base, mounting platform, limit plate, slider and slide groove, during the use of the test device, after the integrated circuit chip is tested inside the device, the box door is opened and the mounting platform can be pulled forward. Then the base is moved out of the test box and removed from the high temperature area inside. The integrated circuit chip can be safely placed and removed from the heating plate on the outside. Attached Figure Description

[0018] Figure 1 This is a frontal cross-sectional view of the present invention.

[0019] Figure 2 This is a top view of a partial cross-sectional structure of the test box of this utility model;

[0020] Figure 3 This is a partial sectional view of the test chamber of this utility model.

[0021] Figure 4 This is a partial cross-sectional view of the placement box of this utility model.

[0022] In the diagram: 1. Casters; 2. Device platform; 3. Controller; 4. Test box; 5. Base; 6. Heating plate II; 7. Top seat; 8. Guide rod; 9. Top frame; 10. Threaded sleeve; 11. Lead screw; 12. Servo motor; 13. Drive gear; 14. Sliding sleeve; 15. Gear ring; 16. Heating plate I; 17. Mounting platform; 18. Limiting plate; 19. Sliding block; 20. Slide groove; 21. Inner cavity; 22. Placement box; 23. Fan; 24. Box door; 25. Air inlet duct; 26. Filter screen; 27. Air outlet duct; 28. Locking block. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-4 This utility model provides an embodiment of an integrated circuit chip aging test device, including a device platform 2, a test box 4 fixed at the top of the device platform 2, a controller 3 installed at the top of the left front side of the device platform 2, a base 5 provided at the bottom of the test box 4, an inner cavity 21 provided inside the right side of the device platform 2, and a placement box 22 inserted into the inner cavity 21 on the right side, a fan 23 installed at the top of the inner cavity 21, an air inlet duct 25 opened inside the top right side of the device platform 2, and a filter screen 26 fixed inside the air inlet duct 25 on the right side, and a plurality of air outlet slots 27 opened inside the placement box 22 on the right side, and locking blocks 28 movably connected to both ends of the bottom right side of the device platform 2.

[0025] The air inlet duct 25 is connected to the interior of the fan 23, the fan 23 is connected to the interior of the placement box 22, and several air outlet slots 27 are equally spaced inside the right side of the placement box 22. The air outlet slots 27 penetrate the interior of the right side of the placement box 22 and are connected to the interior of the placement box 22.

[0026] Specifically, such as Figure 1 and Figure 4 As shown, after the integrated circuit chip is unlocked and removed from the test box 4, the placement box 22 can be pulled out to the right side of the device platform 2, and the integrated circuit chip can be placed inside the placement box 22. Then, the fan 23 can be started, and the outside air is drawn in through the air inlet duct 25 and sent into the placement box 22. This can provide auxiliary and rapid air cooling and heat dissipation for the integrated circuit chip inside the placement box 22, thereby reducing the temperature of the integrated circuit chip.

[0027] The test chamber 4 has a top seat 7 at its top and a heating plate 6 at its bottom. The test chamber 4 has a top frame 9 fixed at its top. A threaded sleeve 10 is movably connected at the middle of the top of the test chamber 4. A gear ring 15 is fixed on the outside of the threaded sleeve 10. A servo motor 12 is fixed on the right side of the top of the top of the top frame 9. The output shaft of the servo motor 12 passes through the inside of the top ...

[0028] Specifically, such as Figure 1 and Figure 2 As shown, after the integrated circuit chip is placed on top of the base 5, the drive gear 13 can be started by controlling the servo motor 12 to rotate. The rotation of the drive gear 13 can drive the threaded sleeve 10 to rotate using the meshing gear ring 15. The rotation of the threaded sleeve 10 can drive the internally threaded lead screw 11 to move down, and can also drive the top seat 7 and the second heating plate 6 to move down to the top position of the integrated circuit chip. The second heating plate 6 and the first bottom heating plate 16 can simultaneously heat the top and bottom surfaces of the integrated circuit chip, so that both sides of the integrated circuit chip can be heated and tested evenly.

[0029] The bottom of the base 5 is fixed with a mounting platform 17, and the rear ends of the two sides of the bottom of the mounting platform 17 are respectively fixed with sliders 19. The two sides of the bottom of the test box 4 are respectively provided with sliding grooves 20. The bottom of the front end of the test box 4 is installed with a limit plate 18. The front end of the sliding groove 20 penetrates the interior of the front end of the test box 4. The front end of the mounting platform 17 is fixed with a handle.

[0030] Specifically, such as Figure 1 and Figure 3 As shown, after the integrated circuit chip has finished testing inside the device, the door 24 is opened and the mounting platform 17 can be pulled forward. Then, the base 5 is moved out of the test chamber 4 and removed from the high-temperature area inside. The integrated circuit chip can then be safely placed and removed from the heating plate 16 on the outside.

[0031] The test chamber 4 is hinged to the left side of the front end with a door 24, and a locking rod is installed through the top and bottom of the right side of the front end of the door 24. The test chamber 4 is provided with a lock hole at the top and bottom of the right side of the front end. Casters 1 are fixed at the four corners of the bottom of the device platform 2. A heating plate 16 is installed at the top of the base 5.

[0032] Working Principle: In use, after placing the integrated circuit chip on top of the base 5, the servo motor 12 is activated to drive the drive gear 13 to rotate. Simultaneously, the rotating drive gear 13, through the meshing gear ring 15, drives the threaded sleeve 10 to rotate. The rotation of the threaded sleeve 10, in turn, drives the internally threaded lead screw 11 to move downwards, thereby moving the top seat 7 and the second heating plate 6 to the top position of the integrated circuit chip. The second heating plate 6 and the first bottom heating plate 16 simultaneously heat the top and bottom surfaces of the integrated circuit chip, ensuring uniform heating and testing on both sides. After the integrated circuit chip is tested inside the device, the chamber door 24 is opened, and the mounting platform 17 is pulled forward. The base 5 is then moved out of the internal high-temperature area, allowing for safe placement and removal of the integrated circuit chip from the heating plate 16 from the outside position. After the integrated circuit chip is tested and unlocked inside the test box 4, the placement box 22 can be pulled out to the right side of the device stage 2, and the integrated circuit chip can be placed inside the placement box 22. Then, the fan 23 can be started, and the outside air is drawn in through the air inlet duct 25 and sent into the placement box 22. This can provide auxiliary and rapid air cooling and heat dissipation for the integrated circuit chip inside the placement box 22, thereby reducing the temperature of the integrated circuit chip.

[0033] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An integrated circuit chip aging test apparatus, comprising a test stand (2), characterized in that: The top of the device platform (2) is fixed with a test box (4), the top of the left front of the device platform (2) is equipped with a controller (3), the bottom of the test box (4) is provided with a base (5), the right side of the device platform (2) is provided with an inner cavity (21), and a placement box (22) is inserted into the right side of the inner cavity (21). The top of the inner cavity (21) is equipped with a fan (23), the top of the right side of the device platform (2) is provided with an air inlet channel (25), and a filter screen (26) is fixed inside the right side of the air inlet channel (25). The right side of the placement box (22) is provided with several air outlet slots (27), and the two ends of the bottom right side of the device platform (2) are movably connected with locking blocks (28).

2. The integrated circuit chip aging test apparatus according to claim 1, characterized in that: The air inlet duct (25) is connected to the interior of the fan (23), and the fan (23) is connected to the interior of the placement box (22).

3. The integrated circuit chip aging test apparatus according to claim 1, characterized in that: Several of the air outlet slots (27) are evenly distributed inside the right side of the placement box (22), and the air outlet slots (27) penetrate the inside of the right side of the placement box (22) and communicate with the inside of the placement box (22).

4. The integrated circuit chip aging test apparatus according to claim 1, characterized in that: The test box (4) has a top seat (7) at the top and a heating plate (6) at the bottom. The test box (4) has a top frame (9) fixed at the top. A threaded sleeve (10) is movably connected at the middle position of the top of the test box (4). A gear ring (15) is fixed on the outside of the threaded sleeve (10). A servo motor (12) is fixed on the right side of the top of the top of the top of the top frame (9). The output shaft of the servo motor (12) passes through the inside of the top of the top of the top frame (9) and is fixed with a drive gear (13). A lead screw (11) is threaded inside the threaded sleeve (10). The bottom end of the lead screw (11) passes through the inside of the top of the test box (4) and is movably connected to the top of the top seat (7). Guide rods (8) are vertically fixed on both sides of the top of the top of the top of the top of the test box (4). Sliding sleeves (14) are fixed inside both sides of the top of the test box (4).

5. The integrated circuit chip aging test apparatus according to claim 4, characterized in that: The top end of the lead screw (11) penetrates the interior of the top end of the top frame (9), the drive gear (13) meshes with the gear ring (15), and the guide rod (8) penetrates the interior of the sliding sleeve (14).

6. The integrated circuit chip aging test apparatus according to claim 1, characterized in that: The bottom of the base (5) is fixed with a mounting platform (17), and the rear ends of the two sides of the bottom of the mounting platform (17) are respectively fixed with sliders (19). The two sides of the bottom of the test box (4) are respectively provided with sliding grooves (20). The bottom of the front end of the test box (4) is installed with a limiting plate (18). The front end of the sliding groove (20) penetrates the interior of the front end of the test box (4). The front end of the mounting platform (17) is fixed with a handle.

7. The integrated circuit chip aging test apparatus according to claim 1, characterized in that: The test box (4) is hinged to the left side of the front end with a door (24), and a locking rod is provided through the top and bottom of the right side of the front end of the door (24). The test box (4) is provided with a lock hole at the top and bottom of the right side of the front end. Casters (1) are fixed at the four corners of the bottom of the device platform (2).

8. The integrated circuit chip aging test apparatus according to claim 1, characterized in that: A heating plate (16) is installed at the top of the base (5).

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