Chip double-face testing device and chip quality monitoring system

Abstract

The application relates to a chip double-face testing device and a chip quality monitoring system. The chip double-face testing device comprises a testing cover and a testing seat. The testing cover is provided with a vacuum cavity, a first testing socket and a conversion plate. The vacuum cavity is used for adsorbing a chip on the side of the testing cover facing the testing seat. The conversion plate is electrically connected with the first testing socket. The testing seat is provided with a second testing socket, a signal conducting probe and a load plate. The second testing socket and the signal conducting probe are respectively electrically connected with the load plate. The signal conducting probe is used for contacting the conversion plate to electrically connect the load plate and the first testing socket. The load plate is used for simultaneously sending testing signals to the first testing socket and the second testing socket, so that the first testing socket and the second testing socket respectively test the first surface and the second surface. The chip double-face testing device can realize synchronous testing of the double faces of the chip, help improve the detection efficiency, reduce the process links, and guarantee the reliability and stability of the detection results.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and more specifically, to a chip double-sided testing device and a chip quality monitoring system. Background Technology

[0002] With the continuous development of semiconductor technology, chip structures are becoming increasingly complex, with significantly improved integration and functional density. Both sides of a chip may contain critical circuit structures or interconnect interfaces. Therefore, after chip manufacturing and packaging are completed, comprehensive testing of both sides becomes a crucial step in ensuring product yield and reliability.

[0003] However, traditional chip double-sided testing equipment typically only has single-sided testing capabilities, requiring testing of both sides of the chip individually. In applications requiring double-sided testing, the chip often needs to be flipped manually or mechanically for testing, leading to low testing efficiency, failing to meet the needs of large-scale production, and potentially introducing errors due to repeated positioning, affecting testing accuracy.

[0004] Therefore, there is an urgent need for a technology and device that can achieve simultaneous testing of both sides of a chip to improve testing efficiency, reduce process steps, and ensure the reliability and stability of test results. Utility Model Content

[0005] This application provides at least one chip double-sided testing device and chip quality monitoring system. The chip double-sided testing device can realize simultaneous testing of both sides of the chip, which helps to improve testing efficiency, reduce process steps, and ensure the reliability and stability of test results.

[0006] In a first aspect, embodiments of this application provide a chip double-sided testing apparatus, wherein the chip has a first surface and a second surface opposite to each other, and the testing apparatus includes a test cover and a test socket, wherein the test cover is movable relative to the test socket so that the two are attached to each other or separated from each other; The test cover is provided with a vacuum chamber, a first test socket and an adapter plate. The vacuum chamber is used to adsorb the chip onto the side of the test cover facing the test socket by negative pressure. The first test socket is used to contact the detection point on the first surface of the chip. The adapter plate is electrically connected to the first test socket. The test socket is provided with a second test socket, a signal conduction probe, and a load board. The second test socket and the signal conduction probe are electrically connected to the load board. When the test cover and the test socket are in contact with each other, the second test socket is used to contact the detection point on the second surface of the chip, and the signal conduction probe is used to contact the adapter board to make the load board and the first test socket electrically connected. The load board is used to send test signals to the first test socket and the second test socket simultaneously, so that the first test socket and the second test socket test the first surface and the second surface respectively.

[0007] In one optional embodiment, the first test socket and the adapter plate are stacked, and the vacuum cavity is a through hole that penetrates the thickness of the first test socket and the adapter plate.

[0008] In one alternative embodiment, a sealing ring is provided between the first test socket and the adapter plate, the sealing ring being disposed around the vacuum chamber.

[0009] In one optional embodiment, the test cover is further provided with a positioning groove for positioning the chip so that the detection points of the first test socket and the first surface of the chip are aligned.

[0010] In one optional embodiment, the test cover is provided with a first positioning part, and the test socket is provided with a second positioning part. The first positioning part and the second positioning part are used to position the test cover and the test socket so that the detection points of the second test socket and the second surface of the chip are aligned.

[0011] In one alternative embodiment, one of the first positioning portion and the second positioning portion is a protrusion, and the other is a groove conforming to the protrusion.

[0012] In one optional embodiment, the signal conduction probe includes a first probe region and a second probe region, which are symmetrically distributed on both sides of the second test socket.

[0013] In one alternative embodiment, the testing apparatus further includes a robotic arm for moving the test cover.

[0014] In one alternative embodiment, the testing apparatus further includes a clamping mechanism for applying pressure to the test cover to ensure a tight fit between the test cover and the test seat.

[0015] Secondly, embodiments of this application also provide a chip quality monitoring system, including the chip double-sided testing device described above.

[0016] The above-mentioned technical solution of this application has the following beneficial technical effects: The chip double-sided testing apparatus of this application, through the integrated design of the test cover and test socket, enables simultaneous electrical performance testing of all test points on both sides of the chip in a single pressing action. In other words, this chip double-sided testing apparatus can achieve simultaneous testing of both sides of the chip. Compared with the traditional single-sided testing method, it helps to improve testing efficiency, reduce process steps, ensure the reliability and stability of test results, and reduce the risk of chip damage caused by step-by-step testing.

[0017] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This illustration shows a test schematic diagram of a chip double-sided testing device provided in an embodiment of this application; Figure 2 A schematic diagram of the structure of the test cover provided in an embodiment of this application is shown; Figure 3 A schematic diagram of the structure of the test fixture provided in an embodiment of this application is shown; In the picture: 1. Test cover; 11. Vacuum chamber; 12. First test socket; 121. First board; 122. Second board; 123. First metal contact; 124. Connecting probe; 125. Positioning groove; 13. Adapter board; 131. Second metal contact; 132. Third metal contact; 2. Test socket; 21. Second test socket; 211. Fourth metal contact; 22. Signal conduction probe; 23. Load board; 24. Housing; 241. Groove; 242. Mounting hole; 3. Clamping mechanism; 100. Chip. Detailed Implementation

[0020] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0021] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0022] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0023] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0024] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] This application provides a chip double-sided testing apparatus that enables simultaneous testing of both sides of a chip, improving testing efficiency, reducing process steps, and ensuring the reliability and stability of test results. In this document, the double sides of a chip refer to its opposing first and second surfaces, both of which contain critical circuit structures or interconnect interfaces. For example, the first surface may contain a flash memory controller, and the second surface may contain memory chips.

[0026] refer to Figures 1 to 3 The double-sided testing device for the chip 100 includes a test cover 1 and a test socket 2. The test cover 1 can move relative to the test socket 2 to allow the two to fit together or separate. The test cover 1 is provided with a vacuum chamber 11, a first test socket 12, and an adapter plate 13. The vacuum chamber 11 is used to attract the chip 100 to the side of the test cover 1 facing the test socket 2 by negative pressure. The first test socket 12 is used to contact the detection point (flash memory controller) on the first surface of the chip 100. The adapter plate 13 is electrically connected to the first test socket 12. The test socket 2 is provided with a second test socket 21, a signal conduction probe 22 and a load plate 23. The second test socket 21 and the signal conduction probe 22 are electrically connected to the load plate 23 respectively. When the test cover 1 and the test socket 2 are in contact with each other, the second test socket 21 is used to contact the detection point (inner particle) on the second surface of the chip 100, and the signal conduction probe 22 is used to contact the adapter plate 13 to make the load plate 23 and the first test socket 12 electrically connected. The load plate 23 is used to send test signals to the first test socket 12 and the second test socket 21 at the same time, so that the first test socket 12 and the second test socket 21 test the first surface and the second surface respectively.

[0027] During the testing process, the test cover 1 first moves to the loading end to adsorb the chip 100 to be tested, then moves back to above the test base 2, and then moves down to make the test cover 1 and the test base 2 fit together. At this time, the chip 100 to be tested is located between the test cover 1 and the test base 2. The first test socket 12 contacts the detection point on the first surface of the chip 100, the second test socket 21 contacts the detection point on the second surface of the chip 100, and the signal transmission probe 22 contacts the adapter plate 13. The load plate 23 can simultaneously send test signals to the first test socket 12 and the second test socket 21, so that the first test socket 12 and the second test socket 21 test the first surface and the second surface respectively, thereby realizing synchronous testing of both sides of the chip 100.

[0028] In some embodiments, the first test socket 12 and the adapter plate 13 are stacked. For example... Figure 1 As shown in the example, this embodiment demonstrates that the adapter plate 13 is disposed on the side of the first test socket 12 away from the test base 2.

[0029] In some embodiments, a first metal contact 123 is provided on the side of the first test socket 12 facing the test base 2, and the first test socket 12 contacts the detection point on the first surface of the chip 100 through the first metal contact 123. Compared with using a probe to directly contact the surface of the chip 100, using a metal contact can reduce punctures and ball damage.

[0030] In some embodiments, the adapter plate 13 is provided with a second metal contact 131, and the first test socket 12 is provided with a connection probe 124. The first test socket 12 contacts the second metal contact 131 through the connection probe 124 to electrically connect the first test socket 12 and the adapter plate 13. Specifically, one end of the connection probe 124 is connected to the corresponding first metal contact 123, and the other end of the connection probe 124 is used to contact the corresponding second metal contact 131 to electrically connect the first test socket 12 and the adapter plate 13.

[0031] In some embodiments, the first test socket 12 includes a first plate 121 and a second plate 122. The first plate 121 is detachably mounted on the second plate 122, and the second plate 122 is located between the first plate 121 and the adapter plate 13 and is detachably mounted on the adapter plate 13. A first metal contact 123 is disposed on the side of the first plate 121 facing the test cover 1. A connection probe 124 passes through the second plate 122. That is, the first test socket 12 adopts a split design. During use, if the first metal contact 123 or the connection probe 124 fails, only some components can be replaced.

[0032] In some embodiments, the test cover 1 is further provided with a positioning groove 125. The positioning groove 125 is located on the side of the first test socket 12 opposite to the adapter plate 13. The positioning groove 125 is used to position the chip 100 so that the detection points of the first test socket 12 and the first surface of the chip 100 are aligned. In specific settings, the positioning groove 125 can be formed by slotting the surface of the first test socket 12 (first plate 121), or by adding a limiting member to the surface of the first test socket 12 (first plate 121). During use, positioning the chip 100 through the positioning groove 125 can ensure that the first metal contact 123 of the first test socket 2 accurately contacts the detection point of the first surface of the chip 100, avoiding the impact of positional deviation on the test results.

[0033] In some embodiments, the vacuum chamber 11 is a through hole penetrating the thickness of the first test socket 12 and the adapter plate 13. Specifically, the first plate 121, the second plate 122, and the adapter plate 13 are respectively provided with a first through hole, a second through hole, and a third through hole. In the installed state, the first through hole, the second through hole, and the third through hole constitute the vacuum chamber 11. In use, the vacuum through hole is connected to the air inlet of the suction device, and the suction is started, which creates a negative pressure in the vacuum chamber 11, thereby adsorbing the chip 100 onto the test cover 1.

[0034] In some embodiments, a sealing ring is provided between the first test socket 12 and the adapter plate 13, and the sealing ring is arranged around the vacuum chamber 11 to achieve a seal. Specifically, there may be two sealing rings, one of which is located between the first plate 121 and the second plate 122, and the other is located between the adapter plate 13 and the second plate 122.

[0035] In some embodiments, a third metal contact 132 is provided on the side of the adapter plate 13 facing the test socket 2. The third metal contact 132 is connected to the corresponding second metal contact 131. In the mating state, the signal transmission probe 22 contacts the corresponding third metal contact 132, so that the load plate 23 is electrically connected to the first test socket 12 through the signal transmission probe 22 and the adapter plate 13. In specific settings, the third metal contacts 132 can be centrally located or distributed at different positions on the adapter plate 13. This embodiment exemplarily shows that the third metal contacts 132 are divided into two parts and symmetrically distributed on both sides of the vacuum chamber 11.

[0036] In some embodiments, a fourth metal contact 211 is provided on the side of the second test socket 21 facing the test cover 1, and the second test socket 21 contacts the detection point on the second surface of the chip 100 through the fourth metal contact 211. Compared with using a probe to directly contact the surface of the chip 100, using a metal contact can reduce punctures and ball damage.

[0037] In some embodiments, the test cover 1 is provided with a first positioning part, and the test socket 2 is provided with a second positioning part. In the mating state, the first and second positioning parts are used to position the test cover 1 and the test socket 2 so that the detection points of the second test socket 21 and the second surface of the chip 100 are aligned. During use, positioning the test cover 1 and the test socket 2 by the first and second positioning parts ensures that the fourth metal contact 211 of the second test socket 2 accurately contacts the detection points of the second surface of the chip 100, avoiding the impact of positional deviation on the test results.

[0038] In some embodiments, one of the first positioning part and the second positioning part is a protrusion, and the other is a groove 241 conforming to the protrusion. This embodiment exemplarily shows that the test cover 1 has a protrusion on the side facing the test seat 2, and the test seat 2 has a groove 241 on the side facing the test cover 1. In the fitted state, the protrusion is inserted into the groove 241, enabling positioning.

[0039] In some embodiments, the protrusion is the first test socket 12 itself. This embodiment exemplarily shows that the cross-sectional dimension of the first plate 121 is smaller than that of the second plate 122, and the outer peripheral surface of the first plate 121 is a stepped surface. The first plate 121 serves as a conformal protrusion to the groove 241. In the mating state, the first plate 121 can be inserted into the groove 241 for positioning.

[0040] In some embodiments, the cross-section of the protrusion is rectangular. Of course, in other embodiments, the cross-section of the protrusion can also be other shapes, such as trapezoidal, triangular, elliptical, etc.

[0041] In some embodiments, the test socket 2 is provided with a housing 24, which is disposed on the side of the load plate 23 facing the test cover 1, and a groove 241 is formed in the housing 24. This embodiment exemplarily shows that the housing 24 has an annular structure, which is disposed around the second test socket 21 and connected and fixed to the load plate 23, and the inner cavity of the housing 24 serves as a groove 241 that mates with a protrusion.

[0042] In some embodiments, the signal conduction probe 22 is mounted in the housing 24. This embodiment exemplarily shows that the housing 24 has a mounting hole 242 extending through its thickness, and the signal conduction probe 22 passes through the mounting hole 242. In the installed state, one end of the signal conduction probe 22 contacts the load plate 23 (its contact point) to electrically connect the two. When the test cover 1 and the test socket 2 are in contact with each other, the other end of the signal conduction probe 22 contacts the third metal contact 132 of the adapter plate 13, so that the load plate 23 can transmit test signals to the first test socket 12 through the signal conduction probe 22 and the adapter plate 13.

[0043] In some embodiments, the signal conduction probe 22 includes a first probe area and a second probe area, which are symmetrically distributed on both sides of the second test socket 21. In actual use, the first probe area and the second probe area respectively contact two third metal contacts 132 on the adapter plate 13. Compared with the signal conduction probe 22 being centrally arranged, this arrangement can ensure the levelness of the adapter plate 13 and avoid the device tilting due to contact on one side, which would prevent some contacts of the first test socket 12 or the second test socket 21 from contacting the corresponding detection point and affecting the detection effect.

[0044] In some embodiments, both the first test socket 12 and the second test socket 21 are precision contact RF sockets (PCR sockets). Compared to traditional probe sockets, precision contact RF sockets support higher test frequencies and can meet the high-frequency testing requirements of chip 100.

[0045] In some embodiments, the testing apparatus further includes a robotic arm for moving the test cover 1. Specifically, the robotic arm can grasp the test cover 1 and move it. It should be understood that, in specific implementations, the robotic arm can move the test cover 1 not only between the loading end and the testing end, but also to the unloading end. For example, based on the test results, the robotic arm can move the test cover 1 to the unloading end, and by removing the negative pressure, place the chip 100 into different sorting containers.

[0046] In some embodiments, the testing apparatus further includes a clamping mechanism 3, which applies pressure to the test cover 1 to ensure a tight fit between the test cover 1 and the test seat 2. Specifically, the clamping mechanism 3 enables the test cover 1 and the test seat 2 to fit tightly together, eliminating micro-gaps, achieving low-impedance contact, and ensuring the accuracy of the test results.

[0047] The chip 100 double-sided testing device of this application embodiment, through the integrated design of the test cover 1 and the test socket 2, enables synchronous electrical performance testing of all test points on both sides of the chip 100 in a single pressing action. In other words, this chip 100 double-sided testing device can achieve synchronous testing of both sides of the chip 100. Compared with the traditional single-sided testing method, it helps to improve testing efficiency, reduce process steps, ensure the reliability and stability of test results, and reduce the risk of chip 100 damage caused by step-by-step testing.

[0048] This application also provides a chip 100 quality monitoring system, including the chip 100 double-sided testing device described above. This chip 100 double-sided testing device is the same as the chip 100 double-sided testing device described above; its specific structure has been described in detail above and will not be repeated here.

[0049] The chip 100 quality monitoring system of this application includes a chip 100 double-sided testing device. Through the integrated design of the test cover 1 and the test socket 2, it enables simultaneous electrical performance testing of all test points on both sides of the chip 100 in a single pressing operation. In other words, this chip 100 double-sided testing device can achieve simultaneous testing of both sides of the chip 100. Compared with traditional single-sided testing methods, this helps improve testing efficiency, reduce process steps, ensure the reliability and stability of test results, and reduce the risk of chip 100 damage caused by step-by-step testing. One or more embodiments of this specification are intended to cover all such substitutions, modifications, and variations falling within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments of this specification should be included within the protection scope of this application.

[0050] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chip double-sided testing apparatus, wherein the chip has opposing first and second surfaces, characterized in that, The testing device includes a test cover and a test base, wherein the test cover is movable relative to the test base so that the two are either in contact with each other or separated from each other; The test cover is provided with a vacuum chamber, a first test socket and an adapter plate. The vacuum chamber is used to adsorb the chip onto the side of the test cover facing the test socket by negative pressure. The first test socket is used to contact the detection point on the first surface of the chip. The adapter plate is electrically connected to the first test socket. The test socket is provided with a second test socket, a signal conduction probe, and a load board. The second test socket and the signal conduction probe are electrically connected to the load board. When the test cover and the test socket are in contact with each other, the second test socket is used to contact the detection point on the second surface of the chip, and the signal conduction probe is used to contact the adapter board to make the load board and the first test socket electrically connected. The load board is used to send test signals to the first test socket and the second test socket simultaneously, so that the first test socket and the second test socket test the first surface and the second surface respectively.

2. The chip double-sided testing apparatus according to claim 1, characterized in that, The first test socket and the adapter plate are stacked together, and the vacuum chamber is a through hole that penetrates the thickness of the first test socket and the adapter plate.

3. The chip double-sided testing apparatus according to claim 2, characterized in that, A sealing ring is provided between the first test socket and the adapter plate, and the sealing ring is arranged around the vacuum cavity.

4. The chip double-sided testing apparatus according to claim 1, characterized in that, The test cover is also provided with a positioning groove, which is used to position the chip so that the detection points of the first test socket and the first surface of the chip are aligned.

5. The chip double-sided testing apparatus according to claim 1, characterized in that, The test cover is provided with a first positioning part, and the test socket is provided with a second positioning part. The first positioning part and the second positioning part are used to position the test cover and the test socket so that the detection points of the second test socket and the second surface of the chip are aligned.

6. The chip double-sided testing apparatus according to claim 5, characterized in that, One of the first positioning part and the second positioning part is a protrusion, and the other is a groove that conforms to the protrusion.

7. The chip double-sided testing apparatus according to claim 1, characterized in that, The signal conduction probe includes a first probe area and a second probe area, which are symmetrically distributed on both sides of the second test socket.

8. The chip double-sided testing apparatus according to claim 1, characterized in that, The testing device also includes a robotic arm for moving the test cover.

9. The chip double-sided testing apparatus according to claim 1, characterized in that, The testing device also includes a clamping mechanism for applying pressure to the test cover to make the test cover and the test seat fit tightly together.

10. A chip quality monitoring system, characterized in that, Includes the chip double-sided testing apparatus according to any one of claims 1-9.

Images