A high-low temperature box for chip detection

Abstract

The utility model discloses a high low temperature box for chip detection, including test box body, door body, bearing plate, two fixed blocks and two telescopic support spare. Install detection base on bearing plate, and bearing plate is set between two fixed blocks and is connected with fixed block sliding, and fixed block is connected with test box body lateral wall. Telescopic support spare includes support frame and telescopic board, and telescopic board stretches into support frame and is connected with support frame sliding, and one end of support frame is set in bearing plate below and is connected with bearing plate rotation, one end of telescopic board is set in fixed block below and is connected with fixed block rotation. Bearing plate can be pulled out to opening direction, and it is convenient to take and place the chip of being measured directly in the outside of test box body, and telescopic support spare rotates and telescopic board slides in support frame, and make telescopic support spare be lengthened, and the bearing plate that pulls out is supported by telescopic support spare, and staff need not hold up bearing plate with hand, and it is more convenient to operate and use.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, specifically a high and low temperature chamber for chip testing. Background Technology

[0002] High and low temperature chambers are primarily used in chip testing to simulate extreme temperature environments and verify the chip's operational stability, reliability, and lifespan under different temperature conditions. Unlike ordinary environmental test chambers, high and low temperature chambers for chip testing are not simply environmental simulations; they must also be compatible with temperature and humidity control and chip electrical performance testing.

[0003] Existing high and low temperature chambers for chip testing mainly consist of a temperature and humidity control system and a test chamber. The temperature and humidity control system maintains a stable temperature inside the test chamber through the coordinated operation of refrigeration, heating, and humidification / dehumidification units. The test chamber serves as a closed area for chip placement and testing. It typically contains a sample rack, on which a testing base is mounted. During use, the chip is mounted onto the testing base. The testing base establishes a reliable physical connection with the chip's pins via precision probes or spring contacts. Cables extending from the testing base connect to external instruments for chip testing. For example, the instrument applies a test signal (such as DC voltage) to the chip. The testing base transmits the signal to the chip's pins, and the chip's response electrical signal (such as leakage current) is returned to the instrument through the testing base. The instrument calculates and displays the results, and the data can be recorded by automated testing equipment to generate a test report and determine whether the chip is qualified.

[0004] However, in the existing technology, the detection base is fixed on the sample holder. When testing the chip, it is necessary to hold the chip under test and insert it into the test chamber, and then install the chip into the slot of the detection base. The installation and removal of the chip must be carried out inside the chamber, which is very inconvenient. Although the carrier plate can be pulled out of the test chamber, when installing the chip, it is still necessary to drag the carrier plate under the carrier plate by hand to avoid deforming the carrier plate when pressing down to install the chip, which would affect normal use.

[0005] Therefore, those skilled in the art have provided a high and low temperature chamber for chip testing, which improves the chip mounting structure to solve the problem of inconvenient chip mounting operations. Utility Model Content

[0006] To solve the above-mentioned technical problems, this utility model provides a high and low temperature chamber for chip testing, comprising: The test chamber has an opening on one side; A door, which is connected to the test chamber, is used to close the opening; A chip mounting mechanism is disposed within the test chamber, and the chip mounting mechanism includes: A carrier plate, on which a detection base is mounted, and the upper part of the detection base is provided with a slot for inserting the chip to be tested; Two fixing blocks are provided, and the support plate is disposed between the two fixing blocks. The two sides of the support plate are slidably connected to the two fixing blocks respectively, and the side of the fixing block opposite to the support plate is connected to the side wall of the test chamber. Two telescopic support members, each connected to a fixed block and a bearing plate respectively, each telescopic support member comprising: A support frame is disposed below the bearing plate, and one end of the support frame is rotatably connected to the bearing plate; A telescopic plate, one end of which is located below the fixed block and rotatably connected to the fixed block, the telescopic plate extending into the support frame from the other end of the support frame, and the telescopic plate being slidably connected to the support frame.

[0007] The technical advantages of this invention are as follows: The test chamber of this invention is equipped with a support plate that can be pulled out towards the opening, which facilitates the placement and removal of the chip to be tested from outside the test chamber. When the support plate is pulled out, the telescopic support rotates accordingly and the telescopic plate slides within the support frame, causing the telescopic support to be extended. The pulled-out support plate is supported by the telescopic support, so the chip to be tested can be placed and removed directly without the operator having to lift the support plate by hand, making the operation more convenient. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of a high and low temperature chamber for chip testing provided in an embodiment of this utility model; Figure 2 This is a schematic diagram of a chip mounting mechanism in a high and low temperature chamber for chip testing provided in this embodiment of the present invention; Figure 3 This is a bottom view of a chip mounting mechanism in a high and low temperature chamber for chip testing provided in this embodiment of the utility model; Figure 4 This is a bottom view of the chip mounting mechanism in the high and low temperature chamber for chip testing provided in this embodiment of the utility model after the first and second connectors have been removed; Figure 5 This is a bottom view of the chip mounting mechanism in the high and low temperature chamber for chip testing provided in this embodiment of the utility model after the carrier plate has been pulled out; Figure 6 This is a top view of a chip mounting mechanism in a high and low temperature chamber for chip testing provided in this embodiment of the utility model; Figure 7 This is a top view of the chip mounting mechanism in the high and low temperature chamber for chip testing provided in this embodiment of the utility model after the carrier plate has been pulled out; Figure 8 This is a partial schematic diagram of a chip mounting mechanism in a high and low temperature chamber for chip testing provided in this embodiment of the present invention; Figure 9 This is a schematic diagram of a telescopic support component in a high and low temperature chamber for chip testing provided in this embodiment of the present invention; Figure 10 This is a cross-sectional view along the thickness direction of the telescopic support member in the high and low temperature chamber for chip testing provided in this embodiment of the utility model; Figure 11 This is a cross-sectional view along the length of the telescopic plate in the high and low temperature chamber for chip testing provided in this embodiment of the utility model; Figure 12 This is a schematic diagram of the first connector in a high and low temperature chamber for chip testing provided in an embodiment of this utility model.

[0009] Figure 13 This is a schematic diagram of the second connector in a high and low temperature chamber for chip testing provided in an embodiment of this utility model.

[0010] In the diagram: Test box 1, door 2, fixing block 3, bearing plate 4, detection base 5, telescopic support 6, support block 61, first mounting hole 611, support frame 62, guide rail 63, limiting groove 64, limiting bolt 65, telescopic plate 66, second mounting hole 661, guide groove 67, slide rail 7, first connector 9, first limiting part 91, first smooth part 92, first threaded part 93, second connector 10, second limiting part 101, second smooth part 102, second threaded part 103, boss 11, mounting groove 12, chip 13. Detailed Implementation

[0011] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical applications of the present invention, and to enable those skilled in the art to understand the present invention and design various embodiments with various modifications suitable for a particular purpose.

[0012] Reference Figures 1-5 The high and low temperature chamber for chip testing provided in this embodiment includes a test chamber 1, a door 2 and a chip mounting mechanism. The test chamber 1 has an opening on one side, and the door 2 is connected to the test chamber 1 and is used to close the opening.

[0013] The chip mounting mechanism is located inside the test chamber 1 and includes a carrier plate 4, two fixing blocks 3, and two telescopic support members 6. A test base 5 is mounted on the carrier plate 4, and the upper part of the test base 5 has a slot for inserting the chip 13 to be tested. The carrier plate 4 is positioned between the two fixing blocks 3, with its two sides slidably connected to the two fixing blocks 3 respectively. The side of the fixing block 3 facing away from the carrier plate 5 is connected to the side wall of the test chamber 1. The two telescopic support members 6 connect one fixing block 3 and the carrier plate 4 respectively.

[0014] The telescopic support 6 includes a support frame 62 and a telescopic plate 66. The support frame 62 is located below the bearing plate 4, and one end of the support frame 62 is rotatably connected to the bearing plate 4. One end of the telescopic plate 66 is located below the fixing block 3 and is rotatably connected to the fixing block 3. The telescopic plate 66 extends into the support frame 62 from the other end of the support frame 62, and the telescopic plate 66 is slidably connected to the support frame 62.

[0015] It should be noted that the high and low temperature chamber provided in this embodiment also includes a temperature and humidity control system to maintain a stable temperature inside the test chamber. A screen is provided on the upper part of the high and low temperature chamber, allowing for operation of corresponding functions to control and adjust the high and low temperatures of the test chamber 1. Inside the test chamber 1, there is also a wiring harness connector for powering the detection base 5, used to connect to and supply power to the detection base 5. The temperature and humidity control function and wiring harness connector of the test chamber 1 are existing technologies in commercially available high and low temperature chambers. The control equipment involved in the high and low temperature chamber, including its supporting control system, switches, and drive modules, are provided by the respective manufacturers. In addition, the power supply module, circuits and electronic components, control module, and related sensors and measuring instruments used in the temperature monitor inside the test chamber 1 are all existing technologies in commercially available high and low temperature chambers.

[0016] Understandably, this embodiment improves the chip mounting mechanism. When installing chip 13, the chip mounting mechanism can be pulled out from the opening, allowing chip 13 to be installed outside the test chamber, facilitating operation. Specifically, when the carrier plate 4 is pulled out of the opening, the support frame 62 rotates relative to the carrier plate 4 below it, and the telescopic plate 66 rotates relative to the fixed block 3 below it. Simultaneously, the support frame 62 slides outside the telescopic plate 66, causing the telescopic support member 6 to be extended. At least part of the carrier plate 4 is pulled out of the test chamber 1, facilitating the installation of the chip 13 to be tested on the detection base 5 on the carrier plate 4. When chip 13 is picked up or put down, the telescopic support member 6 provides support for the carrier plate 4 from below, eliminating the need for operators to hold the carrier plate 4, making operation more convenient.

[0017] Furthermore, the fixing block 3 is fixed to the side wall of the test chamber 1 by bolts, which facilitates disassembly.

[0018] Furthermore, a slide rail 7 is provided on one side of the two fixed blocks 3 facing each other, and a slide groove is opened on both sides of the bearing plate 4 corresponding to the slide rail 7 to cooperate with the slide rail 7. The bearing plate 4 is slidably connected to the slide rail 7 through the slide groove.

[0019] Furthermore, referring to Figure 6 , Figure 7 The upper surface of the support plate 4 has mounting grooves 12 arranged in a matrix. The mounting grooves 12 are used to install and fix the detection base 5, which facilitates the installation and removal of the detection base 5.

[0020] In some alternative embodiments, refer to Figures 8-11 The support frame 62 is a downward-opening groove-shaped frame. Symmetrical guide rails 63 protruding inwards are arranged on the inner sidewall of the support frame 62. The sidewall of the telescopic plate 66 has guide grooves 67, and the guide rails 63 and guide grooves 67 are slidably connected. When the bearing plate 4 is pulled outwards, the guide rails 63 slide within the guide grooves 67, causing the telescopic support member 6 to extend and retract.

[0021] Furthermore, the guide rail 63 is an arc-shaped guide rail, and the guide groove 67 is an arc-shaped groove that mates with the guide rail, making the sliding smoother.

[0022] Furthermore, a limiting groove 64 is provided on the inner side of the top wall of the support frame 62. The bottom of the telescopic plate 66 away from the fixing block 3 is threaded with a limiting bolt 65 corresponding to the limiting groove 64. At least part of the upper end of the limiting bolt 65 is located in the limiting groove 64. The limiting bolt 65 extends into the limiting groove 64 and limits the telescopic plate 66 to prevent it from detaching from the support frame 62.

[0023] Furthermore, the limiting groove 64 is an arc-shaped groove, and the upper end of the limiting bolt 65 is hemispherical. The upper end of the limiting bolt 65 slides in the limiting groove 64, making the sliding smoother.

[0024] In some alternative embodiments, refer to Figure 8 , Figure 9 , Figure 12 The telescopic support 6 also includes a support block 61 and a first connector 9. The support block 61 is connected to the first end of the support frame 62 away from the telescopic plate 66, and the support block 61 has a first mounting hole 611 at its center. The first connector 9 includes a first smooth part 92 and a first limiting part 91 connected to each other. The first limiting part 91 is located on the side of the support block 61 away from the bearing plate 4, and the first smooth part 92 passes through the first mounting hole 611 and is connected to the lower end of the bearing plate 4. The support block 61 and the first smooth part 92 are rotatably connected.

[0025] Understandably, the diameter of the first limiting part 91 is larger than the diameter of the first mounting hole 611, thereby limiting the support block 61. The first smooth part 92 passes through the first mounting hole 611, allowing the support block 61 to rotate around the first smooth part 92. When the bearing plate 4 is pulled out, the support block 61 rotates around the first smooth part 92 and is pulled out along with the bearing plate 4.

[0026] In one specific embodiment, the top end of the first smooth portion 92 of the first connector 9 can be fixedly connected to the support plate 4.

[0027] In another specific embodiment, the first connector 9 further includes a first threaded portion 93, and the first threaded portion 93, the first smooth portion 92, and the first limiting portion 91 are connected in sequence. A threaded hole is provided at the lower end of the support plate 4, and the first connector 9 is threadedly connected to the threaded hole of the support plate 4 through the first threaded portion 93, which facilitates the disassembly of the first connector. Furthermore, anti-slip texture is engraved on the side of the first limiting portion 91 to facilitate the rotation of the first connector 9.

[0028] In some alternative embodiments, refer to Figure 8 , Figure 9 , Figure 13 The telescopic plate 66 has a second mounting hole 661 at one end away from the support frame 62; the telescopic support member 6 also includes a second connector 10, which includes a second smooth part 102 and a second limiting part 101. The second limiting part 101 is located on the side of the telescopic plate 66 away from the fixed block 3. The second smooth part 102 passes through the second mounting hole 661 and is connected to the fixed block 3. The telescopic plate 66 is rotatably connected to the second smooth part 102.

[0029] Understandably, the diameter of the second limiting part 101 is larger than the diameter of the second mounting hole 661, thereby limiting the telescopic plate 66. The second smooth part 102 passes through the second mounting hole 661, allowing the telescopic plate 66 to rotate around the second smooth part 102. When the bearing plate 4 is pulled out, the support block 61 rotates around the second smooth part 102 and is pulled out along with the bearing plate 4. The support frame 62 slides outside the telescopic plate 66 while driving the telescopic plate 66 to rotate around the second smooth part 102. That is, during the process of pulling the bearing plate 4 outward, the two ends of the telescopic support member 6 can rotate relative to the first connecting member 9 and the second connecting member 10. The telescopic plate 66 slides and stretches relative to the support frame 62, playing the role of supporting the bearing plate 4.

[0030] In one specific embodiment, the top end of the second smooth portion 102 of the second connector 10 can be fixedly connected to the support plate 4.

[0031] In another specific embodiment, the second connector 10 further includes a second threaded portion 103. The second threaded portion 103, the second smooth portion 102, and the first limiting portion 91 are connected in sequence. A threaded hole is provided at the lower end of the fixing block 3. The second connector 10 is threadedly connected to the threaded hole of the fixing block 3 through the second threaded portion 103, which facilitates the disassembly of the first connector. Furthermore, anti-slip textures are engraved on the side of the second limiting portion 101 to facilitate the rotation of the second connector 10.

[0032] Furthermore, a downward protruding boss 11 is provided at the lower end of the fixing block 3, and the second smooth part 92 is connected to the boss 11. The sum of the height of the boss 11 and the height of the telescopic plate 66 is equal to the height of the support frame 62.

[0033] In one specific embodiment, a threaded hole is formed at the center of the boss 11, and the threaded hole is threadedly connected to the second threaded part 103. The boss 11 is placed on the end of the telescopic plate 66 so that the top of the support frame 62 is in contact with the lower surface of the bearing plate 4.

[0034] Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of this utility model without creative effort should fall within the protection scope of this utility model. Structures, devices, and operating methods not specifically described and explained in this utility model, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A high and low temperature chamber for chip testing, characterized in that, include: The test chamber has an opening on one side; A door, which is connected to the test chamber, is used to close the opening; A chip mounting mechanism is disposed within the test chamber, and the chip mounting mechanism includes: A carrier plate, on which a detection base is mounted, and the upper part of the detection base is provided with a slot for inserting the chip to be tested; Two fixing blocks are provided, and the support plate is disposed between the two fixing blocks. The two sides of the support plate are slidably connected to the two fixing blocks respectively, and the side of the fixing block opposite to the support plate is connected to the side wall of the test chamber. Two telescopic support members, each connected to a fixed block and a bearing plate respectively, each telescopic support member comprising: A support frame is disposed below the bearing plate, and one end of the support frame is rotatably connected to the bearing plate; A telescopic plate, one end of which is located below the fixed block and rotatably connected to the fixed block, the telescopic plate extending into the support frame from the other end of the support frame, and the telescopic plate being slidably connected to the support frame.

2. The high and low temperature chamber for chip testing according to claim 1, characterized in that, The support frame is a slotted frame with an opening facing downwards. The inner sidewall of the support frame is symmetrically provided with guide rails protruding into the support frame. The sidewall of the telescopic plate is provided with guide grooves, and the guide rails and guide grooves are slidably connected.

3. The high and low temperature chamber for chip testing according to claim 2, characterized in that, The support frame has a limiting groove on the inner side of its top wall. The bottom of the telescopic plate away from the fixed block is threaded with a limiting bolt corresponding to the limiting groove. At least part of the upper end of the limiting bolt is located in the limiting groove.

4. The high and low temperature chamber for chip testing according to claim 3, characterized in that, The limiting groove is an arc-shaped groove, and the upper end of the limiting bolt is hemispherical, and the upper end of the limiting bolt slides within the limiting groove.

5. The high and low temperature chamber for chip testing according to claim 2, characterized in that, The guide rail is an arc-shaped guide rail, and the guide groove is an arc-shaped groove that mates with the guide rail.

6. The high and low temperature chamber for chip testing according to claim 1, characterized in that, The telescopic support also includes a support block and a first connector; The support block is connected to the first end of the support frame away from the telescopic plate, and the support block has a first mounting hole at its center; the first connecting member includes a first smooth part and a first limiting part connected to each other, the first limiting part is disposed on the side of the support block away from the bearing plate, the first smooth part passes through the first mounting hole and is connected to the lower end of the bearing plate, and the support block is rotatably connected to the first smooth part.

7. The high and low temperature chamber for chip testing according to claim 1, characterized in that, The telescopic plate has a second mounting hole at the end opposite to the support frame; The telescopic support also includes a second connector, which includes a second smooth part and a second limiting part. The second limiting part is disposed on the side of the telescopic plate away from the fixed block. The second smooth part passes through the second mounting hole and is connected to the fixed block. The telescopic plate is rotatably connected to the second smooth part.

8. The high and low temperature chamber for chip testing according to claim 7, characterized in that, The lower end of the fixed block is provided with a downward protruding boss, the second smooth part is connected to the boss, and the sum of the height of the boss and the height of the telescopic plate is equal to the height of the support frame.

9. The high and low temperature chamber for chip testing according to claim 1, characterized in that, A slide rail is provided on one side of each of the two fixed blocks. Slide grooves that cooperate with the slide rail are opened on both sides of the bearing plate at the corresponding positions of the slide rails. The bearing plate is slidably connected to the slide rail through the slide grooves.

10. The high and low temperature chamber for chip testing according to claim 1, characterized in that, The upper surface of the support plate has mounting slots arranged in a matrix, which are used to install and fix the detection base.

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