AWG assembly for laser welding process and fixing structure thereof
Patent Information
- Application Number
- CN202522391947.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-11
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2035-11-11
AI Technical Summary
AWG通常与光模块COB封装技术绑定,组装在PCBA表面,AWG各个波导光路与PCBA上的光接收芯片(PD)需要精准对位耦合固定,通常使用UV胶多次烘烤固定,胶水膨胀系数、点胶位置、胶量大小、烘烤温度,烘烤时间等多因素都会影响AWG与PD的耦合良率,且耦合工艺复杂,烘烤时间较长,对后续的批量制造和可靠性存在较大挑战,
[0022]本实用新型的用于激光焊接工艺的AWG组件,在阵列波导光栅的芯片上套设金属外壳,通过金属外壳可快速将AWG组件与PCBA板固定,不需要多次烘烤,且金属焊接固定牢靠,光路稳定性较高,可靠性也得到保障。
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Figure CN224907065U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical communication device technology. More specifically, this utility model relates to an AWG assembly and its fixing structure for laser welding processes. Background Technology
[0002] With the increasing growth of the telecommunications, artificial intelligence, and data center markets, multi-channel wavelength division multiplexing (WDM) optical modules are gradually becoming mainstream, which extensively utilizes arrayed waveguide gratings (AWGs). AWGs are primarily used for multi-wavelength demultiplexing applications in the receiving optical path of optical modules. AWGs are typically bonded to the optical module's COB packaging technology and assembled on the PCBA surface. The various waveguide optical paths of the AWG and the optical receiver chip (PD) on the PCBA require precise alignment and coupling. This typically involves multiple baking cycles with UV adhesive. Factors such as the adhesive's coefficient of expansion, dispensing location, adhesive volume, baking temperature, and baking time all affect the coupling yield between the AWG and the PD. Furthermore, the coupling process is complex and time-consuming, posing significant challenges to subsequent mass production and reliability. Utility Model Content
[0003] The purpose of this invention is to provide an AWG assembly and its fixing structure for laser welding processes, which can quickly fix the AWG assembly to the PCBA board without multiple baking processes, and the metal welding fixation is reliable, with high optical path stability and guaranteed reliability.
[0004] To achieve these objectives and other advantages according to the present invention, an AWG assembly for laser welding processes is provided, comprising:
[0005] Arrayed waveguide grating;
[0006] A metal casing is fitted onto the chip of the arrayed waveguide grating, and clamping parts and welding parts are respectively provided on opposite sides of the metal casing.
[0007] Furthermore, in the aforementioned AWG assembly for laser welding process, a clamping boss is provided on one side of the metal shell, and the clamping boss forms the clamping part.
[0008] Furthermore, in the aforementioned AWG assembly for laser welding process, two welding grooves are provided opposite each other on the middle of the other side of the metal shell, and the welding grooves form the welding part.
[0009] Furthermore, in the aforementioned AWG assembly for laser welding processes, the metal casing is made of stainless steel or Kovar alloy.
[0010] Furthermore, in the aforementioned AWG assembly for laser welding processes, the arrayed waveguide grating includes:
[0011] A glass waveguide chip, wherein the metal casing is fitted onto the glass waveguide chip;
[0012] Metal adapter;
[0013] The glass capillary assembly has its two ends connected to the glass waveguide chip and the metal adapter, respectively.
[0014] Furthermore, in the aforementioned AWG assembly for laser welding process, the end of the glass waveguide chip furthest from the metal adapter has a 45-degree slope structure.
[0015] Furthermore, in the aforementioned AWG assembly for laser welding processes, the glass capillary assembly includes:
[0016] A capillary tube, one end of which is connected to the glass waveguide chip;
[0017] The optical fiber is connected at both ends to the other end of the capillary tube and the metal adapter, respectively.
[0018] Furthermore, in the aforementioned AWG assembly for laser welding process, the glass waveguide chip and the metal casing are sintered and fixed together.
[0019] This utility model also provides a fixing structure for an AWG assembly, including the AWG assembly described in any of the above claims, and further comprising:
[0020] The AWG assembly is soldered onto the PCBA board via the solder joint.
[0021] The beneficial effects of this utility model are:
[0022] The AWG assembly for laser welding process of this utility model has a metal shell on the chip of the arrayed waveguide grating. The metal shell can quickly fix the AWG assembly to the PCBA board without multiple baking, and the metal welding fixation is reliable, with high optical path stability and guaranteed reliability.
[0023] Other advantages, objectives and features of this invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the structure of the AWG component described in this utility model;
[0025] Figure 2 This is a schematic diagram of the structure of the metal casing described in this utility model.
[0026] The reference numerals in the attached figures are as follows:
[0027] 1. Glass waveguide chip; 2. Metal casing; 21. Clamping boss; 22. Welding groove; 23. Solder joint; 3. Capillary tube; 4. Optical fiber; 5. Metal adapter. Detailed Implementation
[0028] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are for illustrative purposes only and are not intended to limit the scope of this utility model. The utility model is described more specifically in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of this utility model will become clearer from the following description and claims. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this utility model.
[0029] It should be noted that when a component is described as "fixed to" another component, it can be directly on the other component or may have a component in between. When a component is considered "connected to" another component, it can be directly connected to the other component or may have a component in between. When a component is considered "set on" another component, it can be directly set on the other component or may have a component in between. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0031] like Figure 1 As shown, an embodiment of this utility model provides an AWG assembly for laser welding processes, comprising:
[0032] Arrayed waveguide grating;
[0033] A metal casing 2 is fitted onto the chip of the arrayed waveguide grating. Clamping portions and welding portions are respectively provided on opposite sides of the metal casing 2. The metal casing 2 is made of stainless steel or Kovar alloy.
[0034] In this embodiment, by fitting the metal housing 2 onto the chip of the arrayed waveguide grating, when fixing the arrayed waveguide grating onto the PCBA board, during the precise coupling and alignment process of each waveguide optical path of the arrayed waveguide grating with the optical receiving chip (PD) on the PCBA board, the coupling fixture moves in six directions (up, down, left, right, front, and back) by clamping the clamping part at the upper end of the metal housing to achieve the function of searching for optical signals. When the coupling response of the four channel waveguide optical signals with the four receiving chips (PD) on the PCBA reaches the standard, the coupling stops, and the next step of laser welding is waited for. The welding part of the metal housing 2 is welded to the contact gap of the metal area of the PCBA board, instantly fixing the AWG assembly and the PCBA board. In the entire alignment, coupling and fixing process, multiple baking is not required, and the metal welding fixation is reliable, the optical path stability is high, and the reliability is also guaranteed.
[0035] Preferably, as another embodiment of this utility model, such as Figures 1-2 As shown, a clamping boss 21 is provided on one side of the metal casing 2, and the clamping boss 21 forms the clamping part.
[0036] In this embodiment, during the precise coupling and alignment of each waveguide optical path of the array waveguide grating with the optical receiving chip (PD) on the PCBA board, the PCBA board is located below, the clamping boss 21 is set upward, and the coupling fixture moves in six directions (up, down, left, right, front, and back) by clamping the clamping boss 21 at the upper end of the metal jacket.
[0037] Preferably, as another embodiment of this utility model, such as Figures 1-2 As shown, two welding grooves 22 are provided opposite each other in the middle of the other side of the metal shell 2, and the welding grooves 22 form the welding part.
[0038] In this embodiment, the two welding grooves 22 of the metal casing 2 are welded to the contact gaps of the metal area of the PCBA board. Electric welding is used for welding, and the weld points 23 are as follows: Figure 2 As shown.
[0039] Preferably, in another embodiment of the present invention, the arrayed waveguide grating includes:
[0040] Glass waveguide chip 1, the metal shell 2 is sleeved on the glass waveguide chip 1;
[0041] Metal adapter 5;
[0042] The glass capillary 3 assembly has its two ends connected to the glass waveguide chip 1 and the metal adapter 5, respectively.
[0043] In this embodiment, the glass waveguide chip 1 and the metal jacket are fixed together using a glass-metal sintering process. The glass waveguide chip 1 and the glass capillary assembly are optically aligned using an optical coupling process and simultaneously fixed with adhesive. The glass capillary assembly and the metal adapter 54 are fixed using a V-groove fiber-optic embedding adhesive process.
[0044] Preferably, in another embodiment of the present invention, the end of the glass waveguide chip 1 away from the metal adapter 5 has a 45-degree slope structure.
[0045] Preferably, in another embodiment of the present invention, the glass capillary 3 assembly includes:
[0046] Capillary 3, one end of which is connected to the glass waveguide chip 1;
[0047] The optical fiber 4 is connected at both ends to the other end of the capillary tube 3 and the metal adapter 5, respectively.
[0048] An embodiment of this utility model also provides a fixing structure for an AWG assembly, including the aforementioned AWG assembly, and further comprising:
[0049] The AWG assembly is soldered onto the PCBA board via the solder joint.
[0050] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and embodiments shown and described herein.
Claims
1. An AWG assembly for laser welding processes, characterized in that, include: Arrayed waveguide grating; A metal casing is fitted onto the chip of the arrayed waveguide grating, and clamping parts and welding parts are respectively provided on opposite sides of the metal casing.
2. An AWG assembly for laser welding process as described in claim 1, characterized in that, The metal casing has a clamping boss on one side, which forms the clamping part.
3. An AWG assembly for laser welding process as described in claim 1, characterized in that, Two welding grooves are provided opposite each other on the middle of the other side of the metal casing, and the welding grooves form the welded part.
4. An AWG assembly for laser welding process as described in claim 1, characterized in that, The metal casing is made of stainless steel or Kovar alloy.
5. An AWG assembly for laser welding process as described in claim 1, characterized in that, The arrayed waveguide grating includes: A glass waveguide chip, wherein the metal casing is fitted onto the glass waveguide chip; Metal adapter; The glass capillary assembly has its two ends connected to the glass waveguide chip and the metal adapter, respectively.
6. An AWG assembly for laser welding process as described in claim 5, characterized in that, The end of the glass waveguide chip furthest from the metal adapter has a 45-degree slope structure.
7. An AWG assembly for laser welding process as described in claim 5, characterized in that, The glass capillary assembly includes: A capillary tube, one end of which is connected to the glass waveguide chip; The optical fiber is connected at both ends to the other end of the capillary tube and the metal adapter, respectively.
8. An AWG assembly for laser welding process as described in claim 5, characterized in that, The glass waveguide chip and the metal casing are sintered and fixed together.
9. A fixing structure for an AWG assembly, characterized in that, Including the AWG component as described in any one of claims 1-8, further comprising: The AWG assembly is soldered onto the PCBA board via the solder joint.