Photon engine module and package module comprising the same

Abstract

The utility model provides a kind of photon engine module, can include backplate, fiber array unit attached to backplate, photon engine die attached to the backplate adjacent fiber array unit;And socket attached to backplate and connected to photon engine die.The method of forming photon engine module can include attaching fiber array unit to backplate, attaching photon engine die to the backplate adjacent fiber array unit, and attaching backplate to socket, so that fiber array unit and photon engine die are located between backplate and socket.

Description

Technical Field

[0001] This utility model relates to a photonic engine module and a packaging module including the same. Background Technology

[0002] A fiber array unit (FAU) is an optical component used in optical systems and devices. A FAU can manipulate and / or guide optical signals transmitted through one or more optical fibers.

[0003] A fiber optic array unit may include ports of a multi-fiber push-on / pull-off (MPO) unit, or one or more optical fiber ports that can serve as optical signal input / output (I / O) interfaces. The fiber optic ports can be arranged in a linear or two-dimensional array. The fiber optic array unit may also include a fiber holder (fiber receptacle) for each fiber port. The fiber holder (fiber receptacle) securely holds the fiber to maintain precise alignment and minimize signal loss.

[0004] An optical engine (OE) is a component in an optical fiber system that manages and manipulates optical signals. An OE can comprise a combination of optical components, such as lenses, mirrors, and prisms, arranged to efficiently couple light between various optical fibers and other optical components. The role of an OE can include aligning and focusing the light beam to maximize the efficiency of optical transmission, thereby minimizing losses and ensuring optimal performance of the optical fiber network. OEs can be used in various configurations, including single-fiber or multi-fiber arrangements, depending on the specific requirements of the system. Utility Model Content

[0005] This utility model provides a photonic engine module, which may include a backplane, an optical fiber array unit attached to the backplane, a photonic engine die attached to the backplane adjacent to the optical fiber array unit, and a socket attached to the backplane and connected to the photonic engine die.

[0006] The present invention provides a packaging module that may include a mounting structure, a photonic engine module located on the mounting structure, the photonic engine module including a backplane, an optical fiber array unit attached to the backplane, a photonic engine die attached to the backplane adjacent to the optical fiber array unit, a socket attached to the backplane and connected to the photonic engine die, and a semiconductor die mounted on the mounting structure adjacent to the photonic engine module, the semiconductor die being electrically coupled to the photonic engine module through the mounting structure. Attached Figure Description

[0007] The various embodiments of this utility model can be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, according to industry standard practice, the various feature components are not drawn to scale. In fact, for clarity, the dimensions of the various feature components can be arbitrarily increased or decreased.

[0008] Figure 1A It is a vertical cross-sectional view of a photonic engine (photonic engine) module according to one or more embodiments.

[0009] Figure 1B This is a perspective view of a photonic engine module according to one or more embodiments.

[0010] Figure 1C This is a perspective view of the photonic engine die and socket of a photonic engine module according to one or more embodiments.

[0011] Figure 2A It is a vertical cross-sectional view of an intermediate structure including fiber optic array units according to one or more embodiments.

[0012] Figure 2B It is a perspective view of an intermediate structure including a back panel according to one or more embodiments.

[0013] Figure 2C It is a vertical cross-sectional view of an intermediate structure including a photonic engine die according to one or more embodiments.

[0014] Figure 2D It is a vertical cross-sectional view of the intermediate structure of the socket according to one or more embodiments.

[0015] Figure 3 This is a flowchart illustrating a method for forming a photonic engine module according to one or more embodiments.

[0016] Figure 4 It is a vertical cross-sectional view of a photonic engine module having a first alternative design according to one or more embodiments.

[0017] Figure 5A This is a vertical cross-sectional view of an intermediate structure including a fiber array unit in a first alternative design of a photonic engine module according to one or more embodiments.

[0018] Figure 5B It is a vertical cross-sectional view of the intermediate structure including the backplane in a first alternative design of the photonic engine module according to one or more embodiments.

[0019] Figure 5C It is a vertical cross-sectional view of the intermediate structure of a photonic engine die in a first alternative design of a photonic engine module according to one or more embodiments.

[0020] Figure 5D This is a vertical cross-sectional view of the intermediate structure of the socket in a first alternative design of the photonic engine module according to one or more embodiments.

[0021] Figure 6 It is a vertical cross-sectional view of a photonic engine module having a second alternative design according to one or more embodiments.

[0022] Figure 7A This is a vertical cross-sectional view of an intermediate structure including a fiber array unit in a second alternative design of a photonic engine module according to one or more embodiments.

[0023] Figure 7B This is a vertical cross-sectional view of the intermediate structure including the backplane in a second alternative design of the photonic engine module according to one or more embodiments.

[0024] Figure 7C It is a vertical cross-sectional view of the intermediate structure of a photonic engine die in a first alternative design of a photonic engine module according to one or more embodiments.

[0025] Figure 7D This is a vertical cross-sectional view of the intermediate structure of the socket in a second alternative design of the photonic engine module according to one or more embodiments.

[0026] Figure 8 This is a vertical cross-sectional view of a photonic engine module having a third alternative design according to one or more embodiments.

[0027] Figure 9A This is a vertical cross-sectional view of the intermediate structure of a general socket on a fiber array unit in a third alternative design of a photonic engine module according to one or more embodiments.

[0028] Figure 9B This is a vertical cross-sectional view of the intermediate structure including a backplate in a third alternative design of the photonic engine module according to one or more embodiments.

[0029] Figure 9C This is a vertical cross-sectional view of the intermediate structure of the photonic engine die in a third alternative design of the photonic engine module according to one or more embodiments.

[0030] Figure 9D This is a vertical cross-sectional view of the intermediate structure of the socket in a third alternative design of the photonic engine module according to one or more embodiments.

[0031] Figure 10 This is a vertical cross-sectional view of a photonic engine module having a fourth alternative design according to one or more embodiments.

[0032] Figure 11It is an exploded perspective view of a photonic engine module having a fifth alternative design according to one or more embodiments.

[0033] Figure 12 It is a vertical cross-sectional view of a packaged module according to one or more embodiments.

[0034] Figure 13 It is a vertical cross-sectional view of a package structure including a package module according to one or more embodiments.

[0035] Figure 14 It is a vertical cross-sectional view of a packaged module having a first alternative design according to one or more embodiments.

[0036] Figure 15 It is a vertical cross-sectional view of a packaging structure having a first alternative design according to one or more embodiments.

[0037] Figure 16 It is a vertical cross-sectional view of a packaged module having a second alternative design according to one or more embodiments.

[0038] Figure 17 It is a vertical cross-sectional view of a packaging structure having a second alternative design according to one or more embodiments. Detailed Implementation

[0039] The following description provides numerous different embodiments or illustrations to implement various features of the invention. The specific examples of components and configurations described below are for the purpose of simplifying the present invention. These are, of course, merely illustrative and are not intended to be limiting. For example, the dimensions of components are not limited to the ranges or values ​​described, but may depend on process conditions and / or the characteristics required by the device. Furthermore, in the following description, the formation of a first feature on or above a second feature includes embodiments where the first and second features are in direct contact, as well as embodiments where other features are formed between the first and second features such that the first and second features are not in direct contact. For simplicity and clarity, various features may be drawn at any scale.

[0040] Furthermore, spatially relative terms such as "below," "below," "lower," "above," and "upper" may be used herein to facilitate the description of the relationship between one component or feature shown in the figure and another component or feature. These spatially relative terms are also intended to encompass different orientations of the device during use or operation. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein will be interpreted accordingly.

[0041] Figures 1A to 1C These are various views of the optical engine (OE) module 100 according to one or more embodiments. Figure 1A This is a vertical cross-sectional view of a photonic engine module 100 according to one or more embodiments. Figure 1B This is a perspective view of a photonic engine module 100 according to one or more embodiments. Figure 1C This is a perspective view of the photon engine die (OE die) 130 and socket 140 of a photon engine module 100 according to one or more embodiments.

[0042] like Figure 1A As shown, the photonic engine module 100 may include a backplate 110, a fiber array unit 120 attached to the backplate 110, a photonic engine die 130 attached to the backplate 110 adjacent to the fiber array unit 120, and a socket 140 (e.g., a socket interposer) attached to the backplate 110 and connected to the photonic engine die 130.

[0043] The photonic engine module 100 may include a compact assembly of optical components designed to perform specific functions related to the manipulation, transmission, and / or detection of light. The photonic engine module 100 is commonly found in a variety of optical systems and devices, including imaging systems, displays, optical communication systems, and sensors. The photonic engine module 100 is typically used in the field of co-packaged optics (CPOs).

[0044] The optical components of the photonic engine module 100 may be contained in the fiber array unit 120 and the photonic engine die 130. In particular, the photonic engine module 100 may include a light source (not shown). The light source may include, for example, a laser diode, a light-emitting diode (LED), etc. The light source can generate an initial beam, which is manipulated and guided by the optical system in the photonic engine module 100.

[0045] The optical components of the photonic engine module 100 may also include one or more optical lenses, optical mirrors, optical filters, and beamsplitters. Optical lenses can focus, collimate, or diverge the beam. Optical mirrors can be used to redirect or fold the light path within the module, enabling a compact and efficient optical design. Optical filters (e.g., bandpass filters, notch filters, polarizing filters, etc.) can selectively transmit or block light of specific wavelengths or polarization states. Beamsplitters can split the beam in the photonic engine module 100 into multiple beams or combine multiple beams into a single beam, for example, for use in interferometry or laser projection systems.

[0046] The optical components of the photonic engine module 100 may also include one or more optical waveguides, optical fibers, and photodetectors. Optical waveguides can guide light within the photonic engine module 100 and can be used for beam steering, coupling light between different components, or long-distance light transmission. Optical fibers can also be used to transmit light within the photonic engine module 100. Photodetectors (e.g., photodiodes, phototransistors, etc.) can be used to convert optical signals into electrical signals (or vice versa) and to detect and measure light intensity, wavelength, or polarization within the photonic engine module 100.

[0047] The photonic engine module 100 may also include control electronics (not shown), such as signal processing circuitry for a light source driver and a photodetector, as well as a feedback mechanism for controlling the optical components. The control electronics of the photonic engine module 100 may also include a microcontroller or digital signal processor to provide intelligence and control functions for the module, enabling automation, optimization, or integration with other systems.

[0048] like Figure 1AAs further shown, the back plate 110 may have a substantially hollow cuboid shape. The back plate 110 may include a plate portion 110a and a sidewall portion 110b projecting downward from the plate portion 110a. The plate portion 110a and the sidewall portion 110b may be integrally formed as a single unit, or they may be formed separately and connected, for example, by an adhesive (e.g., epoxy adhesive, silicone adhesive, etc.).

[0049] The back panel 110 may have a closed design, wherein the side wall portion 110b is substantially closed around the perimeter of the back panel 110, but includes one or more openings. Alternatively, the back panel 110 may have an open design, wherein the side wall portion 110b may include a post formed at the corner of the plate portion 110a of the back panel 110.

[0050] The backplate 110 may have a width W110 in the x-direction, ranging from 1 mm to 20 mm. The backplate 110 may have a length L110 in the y-direction (see...). Figure 1B The dimensions range from 1 mm to 30 mm. The back plate 110 may have a height H110 in the z-direction, ranging from 0.5 mm to 5.0 mm. Other dimensions are also within the scope of this invention.

[0051] The backplate 110 may be formed of a metallic material (e.g., aluminum, steel, etc.), a plastic material (e.g., high-density polyethylene (HDPE)), or a ceramic material. Other suitable materials are also within the scope of this invention. The backplate 110 may be formed, for example, by machining, stamping, molding (e.g., injection molding). In at least one embodiment, the backplate 110 may be integrally formed as a single-piece structure via an injection molding process. Other methods of forming the backplate 110 are also within the scope of this invention.

[0052] The fiber optic array unit 120 may be located inside the backplane 110. The fiber optic array unit 120 may be made of materials such as SiO2, silicon, quartz glass, or ceramic materials (e.g., alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), etc.). Polymer materials such as epoxy resin and polyimide may be used as adhesives or bonding materials in the fiber optic array unit 120.

[0053] The fiber optic array unit 120 can be used to transmit optical signals to and from the optical die 130 within the photonic engine module 100. For example, the fiber optic array unit 120 may include a fiber connection port 125 and one or more front-side mirrors (not shown) for guiding (redirecting) and / or manipulating optical signals from the fiber connection port 125. The front-side mirrors may include high-quality reflective surfaces that can be positioned at a specific angle within the fiber optic array unit 120. The front-side mirrors can be used to perform optical processing such as beam steering, signal routing, or distribution.

[0054] The fiber array unit 120 may also include one or more actuators (not shown) to control the position of the front reflector. The actuators allow for precise adjustment of the reflector angle, thereby enabling dynamic control of the optical path.

[0055] The fiber optic array unit 120 may be enclosed within a housing (not shown) that provides mechanical protection and ensures proper alignment and fixation of the various parts of the fiber optic array unit 120. The fiber optic array unit 120 may also include a microcontroller or microprocessor (not shown) for controlling the operation of the fiber optic array unit 120. In particular, the microcontroller or microprocessor can control actuators to allow remote and / or automatic control of the position of the front-side reflector. This is particularly useful in dynamic optical systems.

[0056] The fiber optic array unit 120 with a front-side reflector can be used, for example, in optical switching systems to redirect optical signals to different paths. The fiber optic array unit 120 can also be used in optical test and measurement systems to adjust beam direction for testing and alignment. The fiber optic array unit 120 can also be used in laser systems to control the beam path in the laser system for various applications such as laser cutting and medical surgery. The fiber optic array unit 120 can also be used in optical communication systems to manage signal direction in optical networks or for beamforming of optical antennas.

[0057] like Figure 1AAs shown, the fiber optic array unit 120 may include a fiber optic port 125 on its back side 120s. Optical signals may be input to and output from the photonic engine module 100 via the fiber optic port 125. The back side 120s of the fiber optic array unit 120 may be exposed to the outside of the backplate 110. In at least one embodiment, the back side 120s of the fiber optic array unit 120 may be substantially aligned with the outer surface of the sidewall portion 110b of the backplate 110. In at least one embodiment, the sidewall portion 110b of the backplate 110 may include an opening 111, and the back side 120s of the fiber optic array unit 120 may be exposed to the outside of the backplate 110 through the opening 111.

[0058] Fiber optic port 125 can be configured to detachably receive a multi-fiber push-on / pull-off (MPO) unit 50. The MPO unit 50 can be connected to one or more fibers in an optical transmission line. Fiber optic array unit 120 may also include an optical path 126. Fiber optic port 125 can be substantially aligned with the optical path 126 in fiber optic array unit 126. Inserting the MPO unit 50 into fiber optic port 125 couples fiber optics to the optical path 126 in fiber optic array unit 120.

[0059] In at least one embodiment, the photonic engine module 100 may include a fiber array unit holder 128. The fiber array unit holder 128 secures the fiber array unit 120 to the backplane 110. The fiber array unit holder 128 allows the fiber array unit 120 to be detached from the photonic engine die 130.

[0060] The fiber optic array unit support 128 may have a substantially L-shaped cross-section. Other shapes are also within the scope of this invention. The fiber optic array unit support 128 may be formed of, for example, polymers, plastics, ceramics, etc. Other materials are also within the scope of this invention.

[0061] A first end 128a of the fiber optic array unit bracket 128 may be attached to the fiber optic array unit 120. In at least one embodiment, the first end 128a of the fiber optic array unit bracket 128 may be detachably connected to the fiber optic array unit 120 via one or more guide pins 22. The guide pins 22 may be formed on the upper surface 122 of the fiber optic array unit 120 and protrude into an opening in the first end 128a of the fiber optic array unit bracket 128. The guide pins 22 allow the fiber optic array unit 128 to be easily detached from the fiber optic array unit bracket 128. The first end 128a of the fiber optic array unit bracket 128 may also be selectively or additionally attached to the upper surface of the fiber optic array unit 120 by an adhesive (not shown) (e.g., epoxy adhesive, silicone adhesive, etc.).

[0062] The second end 128b of the fiber array unit bracket 128 may be located in a recessed portion 112 of the plate portion 110a of the backplate 110. The second end 128b of the fiber array unit bracket 128 may also be attached to the surface of the recessed portion 112 by an adhesive (not shown) (e.g., epoxy adhesive, silicone adhesive, etc.). In at least one embodiment, the second end 128b of the fiber array unit bracket 128 may be attached to the surface of the recessed portion 112 by an optical gel (e.g., silicone) (not shown).

[0063] The second end 128b can also be attached to the photon engine die 130 via an adhesive layer 160. The adhesive layer 160 may include optical gel, epoxy resin adhesive, silicone adhesive, etc. Other adhesives are also within the scope of this invention.

[0064] like Figure 1A As further shown, the photonic engine die 130 may be located adjacent to the fiber array unit 120 and the fiber array unit support 128. The photonic engine die 130 may be separated from the fiber array unit 120 by a small gap of less than about 5 mm in length to provide a substantially compact design. In at least one embodiment, the photonic engine die 130 may contact the fiber array unit 120. The bottom surface of the photonic engine die 130 may be separated from the bottom surface of the fiber array unit 120 by a distance L1. The distance L1 may not be limited to any particular value, but may be used in manufacturing to ensure proper alignment of the fiber array unit 120 and the photonic engine die 130.

[0065] The photon engine die 130 may also include a substantially cubic shape. The photon engine die 130 may be attached to the plate portion 110a of the backplate 110 via an adhesive layer 162. The adhesive layer 162 may include epoxy resin adhesive, silicone adhesive, etc. Other adhesives are also within the scope of this invention.

[0066] The photonic engine die 130 may include one or more support structure layers 131. The support structure 131 may include, for example, bulk silicon or other suitable materials. The photonic engine die 130 may also include photonic engine circuitry 132 within the support structure 131. The photonic engine circuitry 132 may include, for example, one or more electronic integrated circuits (EICs) and one or more photonic integrated circuits (PICs).

[0067] In at least one embodiment, the photonic engine circuit 132 may include various optical components, such as light sources (e.g., laser diodes, light-emitting diodes, LEDs, etc.), optical lenses, optical mirrors, optical filters and beam splitters, optical waveguides, optical fibers, photodetectors, control electronics (e.g., light source driving circuits, photodetector signal processing circuits, feedback control circuits), microcontrollers, digital signal processors (DSPs), etc. The photonic engine circuit 132 may be connected to electrical wiring 134 (e.g., metal traces, metal vias, etc.) and optical path 136. Optical path 136 may constitute an optical input / output (I / O) and may be coupled to one or more photonic integrated circuits in the photonic engine circuit 132. Optical path 136 may include, for example, optical waveguides, optical fibers, etc. Optical path 136 may be substantially aligned with optical path 126 in the fiber array unit 120.

[0068] The photonic engine circuit 132 can receive optical signals on the optical path 136, convert the optical signals into electrical signals, and transmit the electrical signals through the electrical wiring 134. The photonic engine circuit 132 can receive electrical signals on the electrical wiring 134, convert the electrical signals into optical signals, and transmit the optical signals through the optical path 136.

[0069] The photon engine die 130 may also include a plurality of connector contacts 138 projecting from the bottom surface of the photon engine die 130. The connector contacts 138 may be formed of a conductive material, such as gold, copper, or other suitable metallic material. In at least one embodiment, the connector contacts 138 may be included in a connector contact array 138A (see...). Figure 1C The connector contact array 138A can be a 2x2 array of connector contacts 138 on the bottom surface of the photon engine die 130.

[0070] Connector contacts 138 may include fewer than about 20,000 contacts, a contact density of less than about 50 contacts per square millimeter, and a contact pitch (in the x and y directions) of less than about 200 micrometers. Connector contacts 138 may be electrically coupled to photonic engine circuitry 132 via electrical wiring 134.

[0071] like Figure 1A As shown, the socket 140 may include an upper surface 140s1 facing the backplate 110. The upper surface 140s1 may include one or more guide pins 142. In at least one embodiment, the guide pins 142 may be located at at least all four (4) corners of the socket 140. The guide pins 142 may be integrally formed with the body of the socket 140. The guide pins 142 may be inserted into openings 113 formed at the bottom of the sidewall portion 110b of the backplate 110. The guide pins 142 may help to properly align the backplate 110 with the socket 140. The photon engine module 100 may include a fastening mechanism (not shown), such as a latch or socket fixing screw, to securely attach the backplate 110 to the socket 140.

[0072] The receptacle 140 can be configured to allow fine-pitch attachment. The receptacle 140 may include a pin-type receptacle 140 utilizing probes, microelectromechanical (MEMS) pins, etc. In particular, the receptacle 140 may include a plurality of connector pins 144 in its upper surface 140s1. The connector pins 144 may protrude upward from the upper surface 140s1 of the receptacle 140 toward the photon engine die 130. The connector pins 144 may be formed of the same material as the connector contacts 138. In particular, the connector pins 144 may be formed of a conductive material, such as gold, copper, or other suitable metallic materials. In at least one embodiment, the connector pins 144 may be included in a connector pin array 144A (see...). Figure 1C The connector pin array 144A can be a 2x2 array of connector pins 144 on the upper surface 140s1 of the socket 140.

[0073] Connector pins 144 can contact connector contacts 138 of the photon engine die 130 to electrically couple the photon engine die 130 to the socket 140. A robust coupling between the photon engine die 130 and the socket 140 is maintained by compression of the connector pins 144 by the connector pads 138. Connector pins 144 detachably contact connector contacts 138, allowing the photon engine die 130 to be detachably connected to the socket 140.

[0074] Connector pins 144 may have a low profile, with a height of less than about 1 mm. Connector pins 144 may have a number, shape, and arrangement corresponding to the number, shape, and arrangement of connector contacts 138. In particular, connector pins 144 may include fewer than about 20,000 pins, a density of less than about 50 apertures per square millimeter, and an aperture pitch of less than about 200 micrometers.

[0075] The upper surface 140s1 of the socket 140 may have a substantially flat shape. The width of the socket 140 in the x-direction may be substantially the same as the width W110 of the backplate 110 (e.g., in the range of 1 mm to 20 mm). The length of the socket 140 in the y-direction may be substantially the same as the length L110 of the backplate 110 (see...). Figure 1B In at least one embodiment, the length of the socket 140 in the y-direction may be greater than the length L110 of the backplate 110. In at least one embodiment, the length of the socket 140 in the y-direction may be in the range of 1 mm to 50 mm. The height of the socket 140 in the z-direction may be less than the height H110 of the backplate 110. In at least one embodiment, the height of the socket 140 (including the height of the lead pin 142) may be less than 50% of the height H110 of the backplate 110. In at least one embodiment, the height of the socket 140 may be less than 5 mm.

[0076] The socket 140 may have a structure similar to an interposer. In at least one embodiment, the socket 140 may include one or more dielectric layers (e.g., silicon dioxide layers). The socket 140 may include one or more interconnect structures 146 formed in the dielectric layers. The interconnect structures 146 may be formed of one or more layers of metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, Cr, Ni, Sn, Ti, Ta, Au, TiN, TaN, WN, etc.). The interconnect structures 146 may include, for example, multiple metal traces (e.g., copper traces) and metal vias (e.g., copper vias). The interconnect structures 146 may be electrically coupled to connector pins 144.

[0077] The socket 140 may also include a plurality of contact pads 148 formed on the lower surface 140s2 of the socket 140. The contact pads 148 may also include one or more layers of metal, metal alloy and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, Cr, Ni, Sn, Ti, Ta, Au, TiN, TaN, WN, etc.). A ball-grid array (BGA) including a plurality of solder balls 150 may be formed on the contact pads 148 on the lower surface 140s2.

[0078] The interconnect structure 146 can electrically couple connector pins 144 to the contact pads 148 and the ball grid array on the lower surface 140s2 of the socket 140. Therefore, the photon engine die 130 can be electrically coupled to the ball grid array through the connector contacts 138 of the photon engine die 130 and the connector pins 144 of the socket 140.

[0079] With this configuration, socket 140 provides input / output (I / O) functionality, allowing photonic engine module 100 to be mounted on a substrate (e.g., a package substrate, interposer, redistribution layer (RDL) structure) and to transmit and receive data to and from the substrate via a ball grid array. Socket 140 allows components of photonic engine module 110, including backplane 110, fiber array unit 120, and photonic engine die 130, to be detachably connected to the substrate. Socket 140 allows easy replacement of photonic engine die 130 without affecting the functionality of other dies on the substrate (e.g., application-specific integrated circuit dies).

[0080] It should be noted that there are other ways to detachably connect the photon engine die 130 to the socket 140. In particular, a connector pin array including multiple connector pins can be formed on the bottom surface of the photon engine die 130. The connector pins 138 may include, for example, probes, microelectromechanical system pins, spring pins, etc. A connector pin aperture array including multiple connector pins can be formed on the upper surface 140s1 of the socket 140. The connector pins can be inserted into the connector pin apertures to detachably couple the photon engine die 130 to the socket 140.

[0081] In at least one embodiment, the receptacle 140 may have a structure and function substantially similar to that of a central processing unit (CPU) receptacle. The receptacle 140 may include, for example, a retaining clip that applies a constant force that must be overcome when the connector pin 138 of the photonic engine die 130 is inserted. The receptacle 140 may include a zero-insertion-force (ZIF) receptacle. The receptacle 140 may also include a pin grid array (PGA) type receptacle or a land grid array (LGA) type receptacle. In embodiments where the photonic engine module 100 includes a latch, the latch can be closed to secure the backplate 110 to the receptacle 140 after the connector contact 138 is positioned on the connector pin 144. This helps maintain the compressive force of the connector contact 138 on the connector pin 144, thereby providing good connection and mechanical stability between the connector contact 138 and the connector pin 144.

[0082] Figures 2A to 2DVarious intermediate structures that can be formed in the method of fabricating photonic engine module 100 according to one or more embodiments are described. Figure 2A This is a vertical cross-sectional view of an intermediate structure including fiber array unit 120 according to one or more embodiments. It should be noted that electromechanical pick-and-place (PnP) machines can be used to position or place various components in the method.

[0083] In the method of fabricating the photonic engine module 100, a fiber optic array unit bracket 128 may be positioned above the fiber optic array unit 120, such that the lead pins 22 are substantially aligned with openings in the fiber optic array unit bracket 128. A first end 128a of the fiber optic array unit bracket 128 may be separated from the front side 121 of the fiber optic array unit 120 by a first distance D1 in the x-direction. The first end 128a of the fiber optic array unit bracket 128 may be separated from the back side 120s of the fiber optic array unit 120 by a second distance D2 in the x-direction. The first distance D1 may be less than the second distance D2. In at least one embodiment, the first distance D1 may be less than 20% of the second distance D2.

[0084] Next, the first end 128a of the fiber array unit support 128 can be adhesively laminated onto the upper surface 122 of the fiber array unit 120. Therefore, the fiber array unit support 128 can be attached to the fiber array unit 120 without the use of an adhesive layer.

[0085] An adhesive layer (not shown) (e.g., epoxy adhesive, silicone adhesive, etc.) may be additionally or alternatively applied to the first end 128a of the fiber array unit holder 128 and / or the upper surface 122 of the fiber array unit 120. The first end 128a of the fiber array unit holder 128 may then contact the upper surface 122 of the fiber array unit 120 via the adhesive layer. The fiber array unit holder 128 may then be clamped onto the fiber array unit 120 until the adhesive layer cures.

[0086] Figure 2B This is a vertical cross-sectional view of an intermediate structure including a backplate 110 according to one or more embodiments. Figure 2B As shown, the fiber array unit 120 attached to the fiber array unit bracket 128 can be inserted into the back panel 110. In particular, the fiber array unit 120 can be inserted into the opening 111 in the side wall portion 110b of the back panel 110.

[0087] Fiber optic array unit 120 can be inserted into opening 111 such that the back side 120s of fiber optic array unit 120 is substantially aligned with the outer surface of the sidewall portion 110b of backplate 110. Specifically, fiber optic array unit 120 can be inserted into opening 111 such that the back side 120s of fiber optic array unit 120 is exposed to the outside of backplate 110 through opening 111. In at least one embodiment, the upper surface 122 of fiber optic array unit 120 can contact the upper surface of opening 111.

[0088] Optional adhesive layers (not shown) (e.g., epoxy adhesive, silicone adhesive, etc.) may be applied to the upper surface of the fiber array unit holder 128 and / or the recessed portion 112 in the plate portion 110a of the backplate 110. When the fiber array unit 120 is inserted into the opening 111, the fiber array unit holder 128 may be inserted into the recessed portion 112 in the plate portion 110a of the backplate 110 (see...). Figure 1A Next, the fiber array unit bracket 128 and / or the fiber array unit 120 can be clamped onto the backplate 110 until the adhesive layer cures.

[0089] Figure 2C This is a vertical cross-sectional view of an intermediate structure including a photonic engine die 130 according to one or more embodiments. Figure 2C As shown, adhesive layers 160 and 162 can be coated onto the upper surface of the photon engine die 130. Adhesive layers 160 and 162 can be formed as a single layer. Adhesive layers 160 and 162 can be formed from the same material and have substantially the same curing rate.

[0090] The thickness of adhesive layer 160 can be substantially the same as the thickness of adhesive layer 162. The bottom surface 110a-S of the plate portion 110a of the backplate 110 can be substantially coplanar with the bottom surface of the second end 128b of the fiber array unit support 128. Next, the photonic engine die 130 can be pressed into position on the bottom surface 110a-S of the plate portion 110a. Then, the photonic engine die 130 can be clamped onto the backplate 110 until adhesive layers 160 and 162 are cured. Therefore, the second end 128b of the fiber array unit support 128 can be attached to the photonic engine die 130 via adhesive layer 160. The bottom surface 110a-S of the plate portion 110a can be attached to the photonic engine die 130 via adhesive layer 162.

[0091] The photonic engine die 130 can be attached to the board portion 110a and the fiber array unit bracket 128, making it substantially coplanar with the fiber array unit 120. In particular, the optical path 136 of the photonic engine die 130 can be substantially aligned with the optical path 126 in the fiber array unit 120 (e.g., see...). Figure 1AFor example, this can be achieved through visual inspection to ensure that the distance between the bottom surface of the photonic engine die 130 and the bottom surface of the fiber array unit 120 is set to a specified distance L1 (see...). Figure 1A ).

[0092] Figure 2D This is a vertical cross-sectional view of an intermediate structure including socket 140 according to one or more embodiments. Figure 2D As shown, after adhesive layers 160 and 162 have cured, a backplate 110, including the photon engine die 130, can be connected (e.g., detachably connected) to a receptacle 140. First, the backplate 110 is positioned above the receptacle 140 such that the lead pins 142 on the upper surface 140s1 of the receptacle 140 are substantially aligned with an opening 113 in the sidewall portion 110b of the backplate 110. By aligning the lead pins 142 with the opening 113, connector contacts 138 on the photon engine die 130 are engaged with connector pins 144 in the upper surface 140s1 of the receptacle 140. The backplate 110 can then be firmly pressed onto the receptacle 140, causing the connector contacts 138 to contact the connector pins 144, and the photon engine die 130 to be electrically coupled to the receptacle 140. The backplate 110 can then be securely attached to the socket 140 using fastening mechanisms (not shown) such as latches or socket fixing screws.

[0093] Figure 3 This is a flowchart of a method for forming a photonic engine module 100 according to one or more embodiments. Step 310 of the method may include attaching a fiber array unit to a backplane. Step 320 may include attaching a photonic engine die to a backplane adjacent to the fiber array unit. Step 330 may include attaching the backplane to a receptacle such that the fiber array unit and the photonic engine die are located between the backplane and the receptacle.

[0094] Figure 4 This is a vertical cross-sectional view of a photonic engine module 100 having a first alternative design according to one or more embodiments. Figure 4 As shown, the photonic engine module 100 with the first alternative design can be used with... Figures 1A to 1C The photon engine module 100 in the first alternative design is essentially the same. Figures 1A to 1C The photon engine module 100 in the first alternative design differs from the photon engine module 100 because the first alternative design may include a microlens socket 428.

[0095] The microlens socket 428 can be located between the fiber array unit bracket 128 and the photon engine die 130. Figures 1A to 1CSimilar to the design in the example, the fiber array unit bracket 128 can be located in the recessed portion 112 of the plate portion 110a of the backplane 110. Alternatively, the fiber array unit bracket 128 can be attached to the bottom surface 110a-S of the plate portion 110a of the backplane 110. In either case, the fiber array unit bracket 128 can be attached using an adhesive layer (not shown) such as glue, optical gel, epoxy adhesive, silicone adhesive, etc.

[0096] The microlens socket 428 may have a shape substantially corresponding to the shape of the fiber array unit support 128. In at least one embodiment, the microlens socket 428 may be substantially L-shaped. The microlens socket 428 may be made of the same material as the fiber array unit support 128 (e.g., polymer, plastic, ceramic, etc.). Other materials are also within the scope of this invention.

[0097] The microlens socket 428 may have a first end 428a between the fiber array unit 120 and the photonic engine die 130. The microlens socket 428 may have a second end 428b between the fiber array unit support 128 and the photonic engine die 130. The second end 428b may be substantially aligned with the second end 128b of the fiber array unit support 128. The second end 428b may be attached to the photonic engine die 130 via an adhesive layer 163. The photonic engine die 130 may also be attached to the bottom surface 110a-S of the plate portion 110a of the backplane 110 via an adhesive layer 164. The thickness of the adhesive layer 164 may be greater than the thickness of the adhesive layer 163. In particular, the thickness of the adhesive layer 164 may be substantially equal to the combined thickness of the microlens socket 428 and the adhesive layer 163. Each of the adhesive layers 163 and 164 may include an optical gel (e.g., silicone), or an epoxy adhesive, silicone adhesive, etc. Other adhesives are also within the scope of this invention.

[0098] Microlens socket 428 may include a microlens 421 at its first end 428a. The microlens 421 may be formed of a light-transmitting material (e.g., fused silica, sapphire, germanium, zinc selenide, calcium fluoride, and magnesium fluoride) attached to the first end 428a of the microlens socket 428 (e.g., via an adhesive layer). The microlens 421 may be positioned substantially aligned with the optical path 126 in the fiber array unit 120 and the optical path 136 in the photonic engine die 130. Optical components other than the microlens 421 may be alternatively or additionally included in the microlens socket 428. The microlens 421 may collimate, diverge, or focus a light beam into the optical path 136.

[0099] The microlens socket 428 may include one or more leads 422 to ensure that the microlens socket 428 is correctly positioned on the fiber array unit bracket 128. The leads 422 may be inserted into one or more recesses in the fiber array unit bracket 128. The size of the microlens socket 428 may be smaller than the size of the fiber array unit bracket 128.

[0100] Figures 5A to 5D Various intermediate structures that can be formed in a method of manufacturing a photonic engine module 100 having a first alternative design, according to one or more embodiments, are described. It should be noted that in this method, various components can be positioned or placed using an electromechanical pick-and-place machine.

[0101] Figure 5A This is a vertical cross-sectional view of an intermediate structure including a fiber array unit 120 in a first alternative design of a photonic engine module 100 according to one or more embodiments.

[0102] Similar to Figures 1A to 1C In the design described in the first alternative design, the fiber array unit bracket 128 can be attached (e.g., via an adhesive layer (not shown)) or detachably connected (e.g., via lead pins (not shown)) to the fiber array unit 120. Next, a microlens socket 428 can be positioned below the fiber array unit bracket 128. Specifically, the lead pins 422 of the microlens socket 428 can be substantially aligned with a recessed portion of the fiber array unit bracket 128. An optional adhesive layer (e.g., epoxy adhesive, silicone adhesive) can be applied to the upper surface of the microlens socket 428.

[0103] Next, the second end 428b of the microlens socket 428 can be pressed against the bottom side of the fiber array unit support 128. The lead pin 422 on the microlens socket 428 can be inserted into the recessed portion of the fiber array unit support 128. The microlens 421 of the first end 428a of the microlens socket 428 can be positioned to be substantially aligned with the optical path 126 of the fiber array unit 120.

[0104] like Figure 5A As shown, the length L2 of the fiber optic array unit bracket 128 in the x-direction can be in the range of 3 mm to 6 mm. The length of the fiber optic array unit bracket 128 in the y-direction can also be in the range of 3 mm to 18 mm. The combined height Hc of the fiber optic array unit 120 and the fiber optic array unit bracket 128 in the z-direction can be in the range of 0.5 mm to 1 mm.

[0105] Figure 5BThis is a vertical cross-sectional view of an intermediate structure including a backplate 110 in a first alternative design of the photonic engine module 100 according to one or more embodiments. Optional adhesive layers (e.g., optical gel, epoxy adhesive, silicone adhesive, etc.) can be applied to the upper surface of the recessed portion 112 or the fiber array unit support 128. The fiber array unit 120, having the fiber array unit support 128 and the microlens socket 428 attached thereto, can then be inserted into the recessed portion 112. The fiber array unit 120 can also be inserted into an opening 111 in the sidewall portion 110b of the backplate 110 (see, for example, see...). Figure 1B ).

[0106] Fiber array unit 120 can be inserted into opening 111 such that the back side 120s of fiber array unit 120 can be substantially aligned with the outer surface of the sidewall portion 110b of backplate 110. When fiber array unit 120 is inserted into opening 111, fiber array unit support 128 can be pressed into recessed portion 112 in the bottom surface 110a-S of plate portion 110a of backplate 110. Subsequently, fiber array unit support 128 and / or fiber array unit 120 can be clamped onto backplate 110 until an optional adhesive layer (if applicable) cures.

[0107] Figure 5C This is a vertical cross-sectional view of an intermediate structure including a photonic engine die 130 in a first alternative design of the photonic engine module 100 according to one or more embodiments. Figure 5C As shown, adhesive layers 163 and 164 can be coated on the upper surface of the photonic engine die 130. Next, the photonic engine die 130 can be pressed into position on the bottom surface of the microlens socket 428. Then, the photonic engine die 130 can be clamped onto the microlens socket 428 until adhesive layers 163 and 164 cure. Therefore, the second end 428b of the microlens socket 428 can be attached to the photonic engine die 130 via adhesive layer 163. The photonic engine die 130 can be attached to the microlens socket 428 to be substantially coplanar with the fiber array unit 120.

[0108] Figure 5D This is a vertical cross-sectional view of an intermediate structure including a socket 140 in a first alternative design of the photonic engine module 100 according to one or more embodiments. Figure 5DAs shown, after adhesive layers 163 and 164 have cured, a backplate 110, including the photon engine die 130, can be attached to a receptacle 140. The backplate 110 can be positioned above the receptacle 140 such that the lead pins 142 on the upper surface 140s1 of the receptacle 140 are substantially aligned with the openings 113 in the sidewall portion 110b of the backplate 110. The backplate 110 can then be firmly pressed onto the receptacle 140, such that the connector contacts 138 firmly contact the connector pins 144, and the photon engine die 130 is electrically coupled to the receptacle 140. The backplate 110 can then be securely attached to the receptacle 140 using a fastening mechanism (not shown) such as a latch or receptacle fixing screws.

[0109] Figure 6 This is a vertical cross-sectional view of a photonic engine module 100 having a second alternative design according to one or more embodiments. Figure 6 As shown, the photonic engine module 100 with the second alternative design can be used with... Figures 1A to 1C The photon engine module 100 in the design is essentially the same. However, the second alternative design can be similar to... Figures 1A to 1C The photonic engine module 100 in the second alternative design differs from the one in that the fiber array unit bracket 128 can be omitted.

[0110] In the second alternative design, the fiber array unit 120 may include an upper fiber array unit portion 120U (e.g., an upper optical unit) and a lower fiber array unit portion 120L (e.g., a lower optical unit). Both the upper fiber array unit portion 120U and the lower fiber array unit portion 120L may be formed in an opening 111 in the sidewall portion 110b of the backplate 110. In the second alternative design, the upper wall of the opening 111 may also form the bottom surface 110a-S of the plate portion 110a of the backplate 110.

[0111] The upper portion 120U of the fiber array unit can be detachably connected to the lower portion 120L of the fiber array unit via one or more lead pins 642. The fiber array unit 120 can be easily damaged by the assembly process, and the detachable feature helps to allow the fiber array unit 120 to be easily replaced.

[0112] The lead pin 642 may be formed on the lower portion 120L of the fiber array unit and inserted into an opening in the upper portion 120U of the fiber array unit. Alternatively or additionally, the lead pin 642 may be formed on the upper portion 120U of the fiber array unit and inserted into an opening in the lower portion 120L of the fiber array unit.

[0113] Optical path 126 can extend from the fiber port 125 on the back side 120s of the fiber array unit 120 to the interface (e.g., gap interface) with the photonic engine die 130. The fiber array unit 120 may also include one or more optical components within optical path 126. Specifically, the fiber array unit 120 may include an upper optical mirror 627U (e.g., a reflector) in the upper portion 120U of the fiber array unit and a lower optical mirror 627L (e.g., a reflector) and an optional lens 621 (e.g., a microlens) in the lower portion 120L of the fiber array unit. The optical mirror 627L can be configured to guide optical signals from the upper portion 120U of the fiber array unit to the photonic engine die 130, and to guide optical signals from the photonic engine die 130 to the upper portion 120U of the fiber array unit.

[0114] The fiber optic connection portion 125 may be located in the upper portion 120U of the fiber optic array unit, and the optical path 126 may extend sequentially from the fiber optic connection portion 125 to the upper optical mirror 627U, the lower optical mirror 627L, and the lens 621. The optical path 126 from the lower optical mirror 627L through the microlens 621 may be substantially aligned with the optical path 136 of the photonic engine die 130. The optical path 126 may alternatively or additionally include other optical components, such as optical lenses, optical mirrors, optical filters and beam splitters, optical waveguides, optical fibers, etc. In particular, at least some portions of the optical path 126 may be formed of optical fiber (e.g., bent optical fiber).

[0115] The fiber optic array unit 120 can be attached to the bottom surface 110a-S of the plate portion 110a of the backplate 110 via an adhesive layer (not shown). The adhesive layer may include optical adhesive (e.g., silicone), or epoxy resin adhesive, silicone adhesive, etc. Other adhesives are also within the scope of this invention.

[0116] The fiber optic array unit 120 can also be attached to the upper surface of the photonic engine die 130 via an adhesive layer 165. The adhesive layer 165 may include optical adhesive (e.g., silicone), or epoxy resin adhesive, silicone adhesive, etc. Other adhesives are also within the scope of this invention. The fiber optic array unit 120 may have a height ranging from 0.5 mm to 1.0 mm in the z-direction. The fiber optic array unit 120 may have a width ranging from 3 mm to 8 mm in the x-direction. The fiber optic array unit 120 may have a length ranging from 1 mm to 18 mm in the y-direction.

[0117] Figures 7A to 7D Various intermediate structures that can be formed in a method of manufacturing a photonic engine module 100 having a second alternative design, according to one or more embodiments, are described. It should be noted that an electromechanical pick-and-place machine can be used in this method to locate or place various components.

[0118] Figure 7A This is a vertical cross-sectional view of an intermediate structure of a fiber optic array unit 120 in a photonic engine module 100 including a second alternative design according to one or more embodiments. The fiber optic array unit 120 can be assembled by attaching an upper portion 120U of the fiber optic array unit to a lower portion 120L of the fiber optic array unit. Specifically, the upper portion 120U can be pressed onto the lower portion 120L of the fiber optic array unit such that the lead pins 642 on the upper surface of the lower portion 120L are inserted into corresponding openings in the upper portion 120U of the fiber optic array unit.

[0119] An optional adhesive layer (not shown) may be applied alternatively or additionally to the lower portion 120L of the fiber array unit. In this case, the upper portion 120U of the fiber array unit may be pressed onto the adhesive layer. The adhesive layer may then be cured to complete the assembly of the fiber array unit 120.

[0120] Figure 7B This is a vertical cross-sectional view of the intermediate structure of the backplate 110 in the photonic engine module 100, including the second alternative design, according to one or more embodiments. An optional adhesive layer (not shown) (e.g., optical adhesive, epoxy adhesive, silicone adhesive, etc.) may be applied to the upper surface of the fiber array unit 120. The fiber array unit 120 can then be inserted into the backplate 110. In particular, the fiber array unit 120 may be inserted into an opening 111 in the sidewall portion 110b of the backplate 110.

[0121] Fiber optic array unit 120 can be inserted into opening 111 such that the back side 120s of fiber optic array unit 120 can be substantially aligned with the outer surface of the sidewall portion 110b of backplate 110. When fiber optic array unit 120 is inserted into opening 111, fiber optic array unit 120 can be attached to the bottom surface 110a-S of plate portion 110a of backplate 110. Fiber optic array unit 120 can then be clamped onto backplate 110 until an optional adhesive layer cures.

[0122] Figure 7C This is a vertical cross-sectional view of the intermediate structure of the photon engine die 130 in a photon engine module 100 including a first alternative design according to one or more embodiments. Figure 7C As shown, the adhesive layer 165 can be coated onto the upper surface of the photonic engine die 130. The photonic engine die 130 can then be pressed onto the bottom surface of the fiber array unit 120. The photonic engine die 130 can then be clamped onto the fiber array unit 120 until the adhesive layer 165 cures.

[0123] The photonic engine die 130 can be attached to the fiber array unit 120, making it substantially coplanar with the fiber array unit 120. Specifically, the optical path 136 of the photonic engine die 130 can be fabricated to be substantially aligned with the optical path 126 in the fiber array unit 120. This can be achieved, for example, by visual inspection to verify that the distance between the bottom surface of the photonic engine die 130 and the bottom surface of the fiber array unit 120 is set to a specified distance L2.

[0124] Figure 7D This is a vertical cross-sectional view of the intermediate structure of the socket 140 in the photonic engine module 100, which includes a second alternative design according to one or more embodiments. Figure 7D As shown, after the adhesive layer 165 has cured, the backplate 110, including the photon engine die 130, can be attached to the receptacle 140. The backplate 110 can be positioned above the receptacle 140 such that the lead pins 142 on the upper surface 140s1 of the receptacle 140 are substantially aligned with the openings 113 in the sidewall portion 110b of the backplate 110. The backplate 110 can then be firmly pressed onto the receptacle 140 such that the connector contacts 138 firmly contact the connector pins 144, and the photon engine die 130 is electrically coupled to the receptacle 140. The backplate 110 can then be securely attached to the receptacle 140 using a fastening mechanism (not shown) such as a latch or receptacle fixing screws.

[0125] Figure 8 This is a vertical cross-sectional view of a photonic engine module 100 having a third alternative design according to one or more embodiments. (See attached image.) Figure 8 As shown, the photonic engine module 100 with the third alternative design can be used with... Figure 6 The photon engine module 100 in the design is essentially the same. However, the third alternative design can be similar to... Figure 6 The photon engine module 100 in the third alternative design differs from the general socket 828.

[0126] In the third alternative design, the fiber array unit 120 may be substantially the same as the fiber array unit 120 in the second alternative design. The fiber array unit 120 may be located within an opening 111 in the sidewall portion 110b of the backplate 110. The fiber array unit 120 may be attached to the bottom surface 110a-S of the plate portion 110a of the backplate 110 via an adhesive layer 166. The adhesive layer 166 may include an optical gel (e.g., silicone gel), or an epoxy adhesive, silicone adhesive, etc. Other adhesives are within the scope of this invention.

[0127] A general socket 828 may be located between the upper surface of the fiber array unit 120 and the photon engine die 130. The general socket 828 may be substantially L-shaped. The general socket 828 may be made of the same material as the microlens socket 428 and the same material as the fiber array unit support 128 (e.g., polymer, plastic, ceramic, etc.). Other materials are within the scope of this invention.

[0128] A general socket 828 may have a short side located at one end along the lower portion 120L of the fiber array unit and a long side located between the fiber array unit 120 and the photon engine die 130. The general socket 828 can be attached to the photon engine die 130 via an adhesive layer 167. The adhesive layer 167 may include an optical gel (e.g., silicone gel), or an epoxy adhesive, silicone adhesive, etc. Other adhesives are within the scope of this invention.

[0129] The long side of the general socket 828 may include one or more lead pins 822 to ensure that the general socket 828 is correctly positioned on the fiber array unit 120. The lead pins 822 may be inserted into one or more recesses in the lower portion 120L of the fiber array unit.

[0130] Figures 9A to 9D Various intermediate structures that can be formed in a method of manufacturing a photonic engine module 100 with a third alternative design, according to one or more embodiments, are described. It should be noted that in this method, various components can be positioned or placed using an electromechanical pick-and-place machine.

[0131] Figure 9A This is a vertical cross-sectional view of an intermediate structure including a general socket 828 on a fiber array unit 120 in a third alternative design of the photonic engine module 100 according to one or more embodiments. The general socket 828 may be located below the fiber array unit 120 such that the lead pins 822 are substantially aligned with corresponding openings in the lower portion 120L of the fiber array unit. The general socket 828 can then be pressed onto the lower portion 120L of the fiber array unit such that the lead pins 822 on the general socket 828 are inserted into the corresponding openings in the lower portion 120L of the fiber array unit.

[0132] Figure 9BThis is a vertical cross-sectional view of an intermediate structure including a backplate 110 in a third alternative design of the photonic engine module 100 according to one or more embodiments. An adhesive layer 166 can be coated onto the upper surface of the fiber array unit 120. The fiber array unit 120 can then be inserted into the backplate 110. Specifically, the fiber array unit 120 can be inserted into an opening 111 in the sidewall portion 110b of the backplate 110. When the fiber array unit 120 is inserted into the opening 111, the fiber array unit 120 can be pressed against the adhesive layer 166 on the bottom surface 110a-S of the plate portion 110a of the backplate 110. The fiber array unit 120 can then be clamped onto the backplate 110 until the adhesive layer 166 cures.

[0133] Figure 9C This is a vertical cross-sectional view of an intermediate structure including a photonic engine die 130 in a first alternative design of the photonic engine module 100 according to one or more embodiments. Figure 9C As shown, adhesive layer 167 can be applied to the upper surface of photon engine die 130. Then, photon engine die 130 can be pressed into position on the bottom surface of general socket 828. Then, photon engine die 130 can be clamped onto general socket 828 until adhesive layer 167 cures.

[0134] The photonic engine die 130 can be attached to a general-purpose socket, making it substantially coplanar with the fiber array unit 120. Specifically, the optical path 136 of the photonic engine die 130 can be fabricated to be substantially aligned with the optical path 126 in the fiber array unit 120. This can be achieved, for example, by visual inspection to verify that the distance between the bottom surface of the photonic engine die 130 and the bottom surface of the fiber array unit 120 is set to a specified distance L3.

[0135] Figure 9D This is a vertical cross-sectional view of an intermediate structure including a socket 140 in a third alternative design of the photonic engine module 100 according to one or more embodiments. Figure 9D As shown, after the adhesive layer 167 has cured, the backplate 110, including the photon engine die 130, can be attached to the receptacle 140. The backplate 110 can be positioned above the receptacle 140 such that the lead pins 142 on the upper surface 140s1 of the receptacle 140 are substantially aligned with the openings 113 in the sidewall portion 110b of the backplate 110. The backplate 110 can then be firmly pressed onto the receptacle 140 such that the connector contacts 138 firmly contact the connector pins 144, and the photon engine die 130 is electrically coupled to the receptacle 140. The backplate 110 can then be securely attached to the receptacle 140 using a fastening mechanism (not shown) such as a latch or receptacle fixing screws.

[0136] Figure 10This is a vertical cross-sectional view of a photonic engine module 100 having a fourth alternative design according to one or more embodiments. (See attached image.) Figure 10 As shown, the photonic engine module 100 with the fourth alternative design can be used with... Figures 1A to 1C The photon engine module 100 in the design is essentially the same. However, the fourth alternative design can be related to... Figures 1A to 1C The photon engine module 100 in the fourth alternative design differs from the one in the fourth alternative design because it may include a different connection mechanism between the optical die 130 and the socket 140.

[0137] like Figure 10 As shown, the photonic engine die 130 in the fourth alternative design may include a plurality of connector pins 1038 protruding from the bottom surface of the photonic engine die 130, instead of connector contacts 138. The connector pins 1038 may be formed in a 2x2 array on the bottom surface of the photonic engine die 130.

[0138] Connector pins 1038 can be formed of a conductive material such as gold, copper, or other suitable metallic material. Connector pins 1038 may include, for example, probes, microelectromechanical system (MEMS) pins, etc. Connector pins 1038 may include fewer than about 20,000 pins, a pin density of less than about 50 pins / square millimeter, and a pin pitch of less than about 200 micrometers. Connector pins 1038 can be electrically coupled to photonic engine circuitry 132 via electrical wiring 134.

[0139] In the fourth alternative design, the upper surface 140s1 of the socket 140 may include multiple connector pin openings 1044, instead of as... Figures 1A to 9D Connector pins 144 in the illustrated embodiment. Connector pin openings 1044 can be formed in a 2x2 array in the upper surface 140s1 of the socket 140.

[0140] The walls of the connector pin opening 1044 may include conductive contact surfaces, such as metallic contact surfaces (e.g., formed of gold, copper, or other suitable metals). Connector pins 1038 of the photon engine die 130 may be inserted into the connector pin opening 1044 to electrically couple the photon engine die 130 to the receptacle 140. Connector pins 1038 may also be inserted into the connector pin opening 1044 to detachably connect the photon engine die 130 to the receptacle 140.

[0141] Connector pin openings 1044 can be configured to receive connector pins 1038 respectively. Connector pin openings 1044 can have a number, shape, and arrangement corresponding to the number, shape, and arrangement of connector pins 1038. Specifically, connector pin openings 1044 can include fewer than about 20,000 openings, a density of less than about 50 openings / square millimeter, and an opening spacing of less than about 200 micrometers.

[0142] Figure 11 This is an exploded perspective view of a photonic engine module 100 having a fifth alternative design according to one or more embodiments. Figure 11 As shown, the photonic engine module 100 with the fifth alternative design can be used with... Figures 1A to 1C The photon engine module 100 in the design is essentially the same. However, the fifth alternative design can be similar to it in several ways. Figures 1A to 1C The photon engine module 100 is different.

[0143] In particular, as shown in the fifth alternative design, the sidewall portion 110b of the back panel 110 can be formed by four sidewall posts located at the corners of the plate portion 110a of the back panel 110. In the fifth alternative design, the opening 111 can substantially extend between the sidewall posts. Therefore, in the fifth alternative design, the back panel 110 is an open design, compared to... Figures 1A to 1C The closed design within.

[0144] Furthermore, in the fifth alternative design, the microlens socket 428 may include a plurality of microlenses 421 (e.g., three microlenses). The microlenses 42 may be substantially aligned in the y-direction. Although Figure 11 Not shown, the fiber array unit 120 may include multiple optical channels (e.g., three optical channels) that are aligned in the y-direction and whose positions correspond to the positions of the multiple microlenses 421, respectively.

[0145] like Figure 11 As further shown, the optical die 130 may include a connector pin array 1038A, including a plurality of connector pins 1038 (see...). Figure 10 The socket 140 may also include a connector pin opening array 1044A, which includes a plurality of connector pin openings 1044 (see...). Figure 10 Therefore, in the fifth alternative design, the optical die 130 can be electrically coupled to the socket 140 by inserting the connector pins 1038 of the connector pin array 1038A into the connector pin openings 1044 of the connector pin opening array 1044A.

[0146] Figure 12 This is a vertical cross-sectional view of the packaging module 220 according to one or more embodiments. Figure 12 As shown, the encapsulation module 220 may include the photon engine module 100.

[0147] In package module 220, photonic engine module 100 can be mounted on interposer layer 20. One or more semiconductor dies 145 can also be mounted on interposer layer 20 adjacent to photonic engine module 100. Interposer layer 20 may include one or more bridging dies 200 (e.g., connection dies, local silicon interconnect (LSI) dies, etc.). Bridging dies 200 can interconnect semiconductor dies 145 and photonic engine module 100. Therefore, photonic engine module 100 can constitute co-packaged optics (CPO) in package module 220.

[0148] Although package module 220 is depicted as containing a specific number and arrangement of semiconductor dies, the number and arrangement of semiconductor dies are not limited to any specific number and arrangement. In particular, package module 220 can contain any number and any arrangement of semiconductor dies, as well as any combination of any number and any arrangement of semiconductor dies.

[0149] Interposer 20 is not necessarily limited to any particular material or configuration. Interposer 20 may include, for example, organic materials (e.g., dielectric polymers), inorganic materials (e.g., silicon), glass substrates, etc.

[0150] like Figure 12 As shown, the interposer 20 can be formed by a molding portion. The interposer 20 may include a lower passivation layer 14. The lower passivation layer 14 may include silicon oxide, silicon nitride, a low-k dielectric material such as carbon-doped oxide, an extremely low dielectric material such as porous carbon-doped silicon dioxide, a combination thereof, or other suitable materials.

[0151] Intermediate layer 20 may also include a molding material layer 227 (e.g., an encapsulation layer) formed on the underlying passivation layer 14. In at least one embodiment, molding material layer 227 may be formed of a curable material that can be cured to form a rigid, solid structure. Molding material layer 227 may include, for example, an epoxy molding compound (EMC). In at least one embodiment, molding material layer 227 may include a polymer material, particularly an epoxy-based polymer material. Other suitable molding materials may be used.

[0152] Intermediate layer 20 may also include one or more local silicon interconnect (LSI) dies 200a, 200b. Molding material layer 227 may be formed around bridging dies 200a, 200b in the x and y directions. In at least one embodiment, bridging dies 200a, 200b may be substantially embedded in molding material layer 227. Bridging dies 200a, 200b may include lower contacts 250 located on the bottom surface of bridging dies 200a, 200b.

[0153] Bridge dies 200a and 200b may include one or more interconnect structures 204 (e.g., metal traces and metal vias) for interconnecting semiconductor dies 145 in package module 220. Specifically, bridge die 200a may include one or more interconnect structures 204 for connecting the first semiconductor die 141 to the second semiconductor die 143. Bridge die 200b may include one or more interconnect structures 204 for connecting the second semiconductor die 143 to photon engine module 100. The first semiconductor die 141 can be connected to photon engine module 100 via bridge dies 200a and 200b.

[0154] In at least one embodiment, multiple interconnect structures 204 in each bridging die 200a, 200b can provide high wiring density die-to-die interconnects via multiple layers of sub-micron metal lines (e.g., copper). The interconnect structures 204 can allow the bridging dies 200a, 200b to adapt to a variety of different connectivity architectures (e.g., SoC to SoC, SoC to chiplet, SoC to HBM, etc.). The interconnect structures 204 can include, for example, one or more layers, and can include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metallic materials are within the scope of this invention.

[0155] Intermediate layer 20 may also integrate additional components, such as stand-alone integrated passive components (IPDs) (not shown). In at least one embodiment, IPDs may be located in a molding material layer 227 beneath one or more semiconductor dies 145 or photonic engine modules 100 to support signal communication.

[0156] Interposer 20 may also include one or more upper redistribution layer (RDL) layers 202a (e.g., metal traces) on the chip-side surface (e.g., the upper surface) of interposer 20 (e.g., on the upper surface of molding material layer 227). Interposer 20 may also include one or more lower redistribution layer 202b on the board-side surface (e.g., the lower surface) of interposer 20 (e.g., on the lower surface of molding material layer 227).

[0157] Intermediate layer 20 may include one or more upper intermediate bonding pads 251 on the upper surface of molding material layer 227 and one or more lower intermediate bonding pads 252 on the lower surface of molding material layer 227. Intermediate layer 20 may also include one or more intermediate vias (TIVs) 206 in molding material layer 227. Intermediate vias 206 may connect to the upper intermediate bonding pads 251 and the lower intermediate bonding pads 252.

[0158] The upper redistribution layer 202a and lower redistribution layer 202b may include a wide spacing and can be interconnected through the interposer via 206 to achieve efficient signal and power transmission. The upper redistribution layer 202a, lower redistribution layer 202b, interposer via 206, upper interposer bonding pad 251, and lower interposer bonding pad 252 may include, for example, one or more layers, and may include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metallic materials are within the scope of this invention. With this configuration, the interposer 20 can provide low-loss high-frequency signals in high-speed transmission.

[0159] The packaging module 220 may include multiple control collapse chip connection bumps (C4 bumps) 121 on the board-side surface of the interposer 20. The C4 bumps 121 may be formed in openings in the lower passivation layer 14 and may contact the lower bonding pads 252 of the interposer through these openings. The C4 bumps 121 may also contact the lower contacts 250 in the bridge connectors 200a and 200b.

[0160] In at least one embodiment, the C4 bump 121 can be formed by forming one or more under-bump metal (UBM) layers (not shown) on the bonding pad 252 under the interposer layer, forming contact pads on the under-bump metal layers, and forming solder balls on the contact pads.

[0161] Semiconductor dies 145 may be mounted on the interposer layer 20, above one or more bridging dies 200a, 200b. Typically, the thickness of each semiconductor die 145 in the z-direction may be substantially the same. Therefore, each upper surface of the first semiconductor die 141 and the second semiconductor die 143 may be substantially coplanar (e.g., formed in the same xy plane) and collectively referred to as semiconductor die upper surface 140a (upper surface).

[0162] Semiconductor die 145 can be mounted on interposer 20, for example, via microbumps 118. Each microbump 118 may include a copper post and a solder ball on the copper post. Microbumps 118 can (e.g., via solder balls) be bonded to metal contacts on the die-side surface of interposer 20. In at least one embodiment, microbumps 118 can be bonded to interconnect structures 204 in bridging dies 200a, 200b. In at least one embodiment, microbumps 118 can be bonded to interposer vias 206 in interposer 20. In at least one embodiment, microbumps 118 can be bonded to an upper redistribution layer 202a on the die-side surface of interposer 20. Therefore, semiconductor die 145 can be connected to C4 bump 121 via microbumps 118, upper redistribution layer 202a, interposer via 206, and lower redistribution layer 202b.

[0163] The underfill layer 129 of the package module can be formed (e.g., individually or in connection) under and around each semiconductor die 145. The underfill layer 129 of the package module can also be formed around the microbumps 118. The underfill layer 129 of the package module thus secures each semiconductor die 145 to the interposer 20. The underfill layer 129 of the package module can be formed of an epoxy-based polymer material.

[0164] Each of the semiconductor dies 145 may include, for example, a single semiconductor die, a system-on-chip (SOC) die, or a system-on-integrated chips (SoIC) die, and may be implemented by chip-on-wafer-on-substrate (CoWoS) technology or integrated fan-out on substrate (INFO-oS) technology.In particular, each of the semiconductor dies 145 may include, for example, semiconductor chips or chiplets, logic dies (e.g., mobile application processors, microcontrollers, etc.), or memory dies (e.g., high-bandwidth memory (HBM) dies, hybrid memory cubes (HMC), dynamic random access memory (DRAM) dies, wide I / O dies, M-RAM dies, R-RAM dies, inverted AND (NAND) dies, static random access memory (SRAM), etc.), central processing unit (CPU) chips, graphics processing unit (GPU) chips, field-programmable gate array (FPGA) chips, network chips, application-specific integrated circuits (ASICs), etc., for high-performance computing (HPC) applications, artificial intelligence (AI) applications, and 5G cellular network applications. This invention encompasses ASIC chips, AI / DNN accelerator chips, coprocessors, accelerators, on-chip memory buffers, high data rate transceiver dies, I / O interface dies, integrated passive device (IPD) dies, power management dies (e.g., power management integrated circuit (PMIC) dies), radio frequency (RF) dies, sensor dies, microelectromechanical system (MEMS) dies, signal processing dies (e.g., digital signal processing (DSP) dies), front-end dies (e.g., analog front-end (AFE) dies), and monolithic 3D heterogeneous chiplet stack dies. Other dies are also within the scope of this invention.

[0165] In at least one embodiment, the first semiconductor die 141 and the second semiconductor die 143 may include application-specific integrated circuit (ASIC) dies. In particular, the first semiconductor die 141 and the second semiconductor die 143 (e.g., application-specific integrated circuit dies) may be configured to include applications specific to the photonic engine module 100.

[0166] The packaging module 220 may also include an upper molding material layer 1227 formed around the semiconductor die 145. The upper molding material layer 1227 may also be formed above and around the bottom filler layer 129 of the packaging module. The upper molding material layer 1227 may have an outer wall substantially aligned with the outer wall of the interposer layer 20.

[0167] In at least one embodiment, an upper molding material layer 1227 may be formed on the sidewalls (inner and outer sidewalls) of each semiconductor die 145. The upper molding material layer 1227 may be formed between and bonded to the sidewalls of each semiconductor die 145. The upper molding material layer 1227 may also be bonded to the chip side surface of the interposer 20 and the bottom fill layer 129 of the package module.

[0168] In at least one embodiment, the upper molding material layer 1227 may be formed of a curable material that can be cured to form a rigid, solid structure. The upper molding material layer 1227 may include, for example, epoxy molding compound (EMC). In at least one embodiment, the upper molding material layer 1227 may include a material substantially similar to the bottom filler layer 129 of the encapsulation module, and / or a material substantially similar to the molding material layer 227 in the interposer layer 20. In at least one embodiment, the upper molding material layer 1227 may include a polymeric material, particularly an epoxy-based polymeric material. Other suitable molding materials are within the scope of this invention.

[0169] like Figure 12 As further shown, the photonic engine module 100 can be mounted on the interposer layer 20 via solder balls 150 of the ball grid array (BGA) at the bottom of the socket 140. At least a portion of the solder balls 150 can be connected to the interconnect structure 204 in the bridging die 200b. The photonic engine module 100 can be communicatively coupled to the second semiconductor die 143 via the interconnect structure 204 in the bridging die 200b. At least a portion of the solder balls 150 can be connected to the upper bonding pad 251 of the interposer layer. At least a portion of the solder balls 150 can be connected to the upper redistribution layer 202a.

[0170] The bottom fill layer 139 of the package module can be formed below and around the socket 140. The bottom fill layer 139 of the package module can also be formed around the solder balls 150. The bottom fill layer 139 of the package module thus secures the photon engine module 100 to the interposer layer 20. The bottom fill layer 139 of the package module can be formed of an epoxy polymer material or other suitable material.

[0171] Figure 13 This is a vertical cross-sectional view of a package structure 1300 including a package module 220 according to one or more embodiments.

[0172] The package structure 1300 may include a package substrate 710. The package substrate 710 may constitute a substrate for a multi-chip module (MCM). The package substrate 710 may include a cored or coreless substrate. In at least one embodiment, for example, the package substrate 710 may include a core 712, an upper package substrate dielectric layer 714 formed on the core 712 (e.g., a first side or chip side of the package substrate 710), and a lower package substrate dielectric layer 716 formed on the core 712 (e.g., a second side or board side of the package substrate 710). Specifically, the package substrate 710 may include a build-up film substrate such as an Ajinomoto build-up film (ABF) substrate. That is, in at least one embodiment, each of the upper package substrate dielectric layer 714 and the lower package substrate dielectric layer 716 may be described as an ABF layer.

[0173] Core 712 can help provide rigidity to the encapsulation substrate 710. Core 712 may include, for example, epoxy resins, such as bismaleimide triazine epoxy (BT epoxy) and / or woven glass laminates. Core 712 may alternatively or additionally include organic materials such as polymeric materials. Specifically, core 712 may include dielectric polymeric materials such as polyimide (PI), benzocyclo-butene (BCB), or polybenzobisoxazole (PBO). Other suitable dielectric materials are within the scope of the intended description.

[0174] The core 712 may include one or more vias 712a. The vias 712a may extend from the lower surface of the core 712 to the upper surface of the core 712. The vias 712a may allow electrical connections between the upper dielectric layer 714 and the lower dielectric layer 716 of the package substrate. The vias 712a may include, for example, one or more layers and may include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metallic materials are within the scope of this description.

[0175] An upper dielectric layer 714 of the packaging substrate may be formed on the upper surface of the core 712. The upper dielectric layer 714 may include a plurality of layers, and specifically, may include a laminated film (e.g., ABF). The upper dielectric layer 714 may also include an organic material such as a polymeric material. Specifically, the upper dielectric layer 714 may include a dielectric polymeric material such as polyimide (PI), benzocyclobutene (BCB), or polybenzobisoxazole (PBO). Other suitable dielectric materials are within the scope of this description.

[0176] The upper dielectric layer 714 of the package substrate may include one or more upper bonding pads 714a on the chip-side surface of the upper dielectric layer 714. Specifically, the upper bonding pads 714a may be exposed on the chip-side surface of the upper dielectric layer 714. The upper dielectric layer 714 may also include one or more metal interconnect structures 714b. The metal interconnect structures 714b may be connected to the upper bonding pads 714a and vias 712a in the die 712. The metal interconnect structures 714b may include metal layers (such as copper traces) and metal vias connecting the metal layers. The upper bonding pads 714a and the metal interconnect structures 714b may include, for example, one or more layers and may include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metal materials are within the scope of the intended description.

[0177] An upper passivation layer 710a may be formed on the chip-side surface of the upper dielectric layer 714 of the package substrate. The upper passivation layer 710a may partially cover the upper bonding pad 714a of the package substrate. The upper passivation layer 710a may include silicon oxide, silicon nitride, a low dielectric material such as carbon-doped oxide, an extremely low-k dielectric material such as porous carbon-doped silicon dioxide, a combination thereof, or other suitable materials.

[0178] A lower dielectric layer 716 may be formed on the lower surface of the core 712. The lower dielectric layer 716 may also comprise a plurality of layers, and specifically, may comprise a multilayer film (e.g., ABF). The lower dielectric layer 716 may also comprise an organic material such as a polymer material. Specifically, the lower dielectric layer 716 may comprise a dielectric polymer material such as polyimide (PI), benzocyclobutene (BCB), or polybenzobisoxazole (PBO). Other suitable dielectric materials are within the scope of this description.

[0179] The lower dielectric layer 716 of the package substrate may include one or more lower bonding pads 716a on the board-side surface of the lower dielectric layer 716. Specifically, the lower bonding pads 716a may be exposed on the board-side surface of the lower dielectric layer 716. The lower dielectric layer 716 may also include one or more metal interconnect structures 716b. The metal interconnect structures 716b may be connected to the lower bonding pads 716a and vias 712a in the core 712. The metal interconnect structures 716b may include metal layers (such as copper traces) and metal vias connecting the metal layers. The lower bonding pads 716a and the metal interconnect structures 716b may include, for example, one or more layers and may include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metal materials are within the scope of the intended description.

[0180] A lower passivation layer 710b may be formed on the board-side surface of the lower dielectric layer 716 of the package substrate. The lower passivation layer 710b may partially cover the lower bonding pad 716a of the package substrate. The lower passivation layer 710b may include silicon oxide, silicon nitride, a low dielectric material such as carbon-doped oxide, an ultra-low dielectric material such as porous carbon-doped silicon dioxide, a combination thereof, or other suitable materials.

[0181] An array of ball grids, including a plurality of solder balls 710c, can be formed on the board-side surface of the lower dielectric layer 716 of the package substrate. The solder balls 710c allow the package structure 1300 to be securely mounted on and electrically coupled to a substrate such as a printed circuit board (PCB). The solder balls 710c can contact the lower bonding pads 716a of the package substrate. Therefore, the solder balls 710c can be electrically connected to the upper bonding pads 714a of the package substrate via metal interconnect structures 716b, vias 712a, and metal interconnect structures 714b.

[0182] The packaging module 220 can be connected to the packaging substrate 710 via a C4 bump 121 on the side surface of the interposer 20. Specifically, the C4 bump 121 can be bonded (e.g., using reflow soldering, compression bonding, thermoforming bonding, etc.) to the upper bonding pad 714a of the packaging substrate 710.

[0183] Package module 220 can be attached to backplane 110 via package underfill layer 229. Package underfill layer 229 can be substantially similar to package module underfill layer 129 in package module 220. Package underfill layer 229 can be formed below interposer layer 20 and surround C4 bump 121. Package underfill layer 229 can also be formed on the sidewall of interposer layer 20.

[0184] The package structure 1300 may further include a reinforcing ring 730 located on the package substrate 710. The reinforcing ring 730 may be formed, for example, from a metallic material such as aluminum, copper, or stainless steel. The reinforcing ring 730 may be attached to the package structure 1300 via an adhesive layer 760. Specifically, the reinforcing ring 730 may be attached to the upper passivation layer 710a of the package substrate via the adhesive layer 760. The adhesive layer 760 may include epoxy resin adhesive, silicone adhesive, etc. Other adhesives are also within the scope of this invention.

[0185] The reinforcing ring 730 may be continuously formed around the entire periphery of the package module 220. The reinforcing ring 730 may have a shape substantially similar to the outer shape of the package module 220. Specifically, the reinforcing ring 730 may have a substantially rectangular outer shape and a substantially rectangular inner shape. Other suitable shapes of the reinforcing ring 730 may be used.

[0186] The width of the reinforcing ring 730 can be substantially uniform around the entire periphery of the packaging module 220. In at least one embodiment, the width of the reinforcing ring 730 can be greater than the distance between the inner wall of the reinforcing ring and the packaging module 220.

[0187] Figure 14 It is a vertical cross-sectional view of a package module 220 having a first alternative design in one or more embodiments.

[0188] like Figure 14 As shown, the package module 220 with the first alternative design can be used with Figure 12 The package module 220 is substantially similar. However, in the package module 220 with a first alternative design, the photon engine module 100 can be mounted on the redistribution path structure 30. The semiconductor die 145 can also be mounted on the redistribution path structure 30, adjacent to the photon engine module 100. The redistribution path structure 30 may optionally include one or more bridge dies (not shown), similar to... Figure 12The bridge die 200 is located in the middle. The redistribution layer structure 30 can interconnect the semiconductor die 145 and the photonic engine module 100. Therefore, in the package module 220 with the first alternative design, the photonic engine module 100 can constitute a common packaged optical assembly (CPO).

[0189] like Figure 14 As shown, the redistribution path layer structure 30 may include a plurality of polymer layers 12 and a plurality of redistribution path layers 12a stacked alternately. The description does not limit the number of polymer layers 12 and / or the number of redistribution path layers 12a in the redistribution path layer structure 30. The redistribution path layer structure 30 may alternatively or additionally include a redistribution path layer molding layer encapsulating the redistribution path layers 12a.

[0190] In at least one embodiment, the polymer layer 12 may include, for example, polyimide (PI), epoxy resin, acrylic resin, phenolic resin, benzocyclobutene (BCB), polybenzoxazole (PBO), or any other suitable polymeric dielectric material. In some embodiments, the redistribution layer 12a may include a conductive material. The conductive material may include metals such as copper, aluminum, nickel, titanium, or combinations thereof. Other suitable conductive materials may also be within the scope of this invention.

[0191] In at least one embodiment, the redistribution layer 12a may include multiple metal traces (lines) and multiple metal vias connecting these traces. The traces may be located on the polymer layer 12 and may extend along the x-direction (first horizontal direction) and y-direction (second horizontal direction) on the upper surface of the polymer layer 12.

[0192] An upper passivation layer (not shown) may be selectively formed on the die-side surface of the redistribution layer structure 30. The upper passivation layer may include silicon oxide, silicon nitride, low dielectric constant materials such as carbon-doped oxides, very low dielectric constant materials such as porous carbon-doped silicon dioxide, combinations thereof, or other suitable materials. One or more upper bonding pads (not shown) may also be formed in the upper passivation layer. The upper bonding pads may be connected to the redistribution layer 12a. The upper bonding pads may include, for example, one or more layers, and may include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metallic materials are also within the scope of this invention.

[0193] The lower passivation layer 14 can be formed on the plate-side surface of the redistribution layer structure 30. The lower passivation layer 14 may also include silicon oxide, silicon nitride, low dielectric constant materials such as carbon-doped oxides, very low dielectric constant materials such as porous carbon-doped silicon dioxide, combinations thereof, or other suitable materials.

[0194] One or more lower bonding pads (not shown) may be located on the board-side surface of the redistribution layer structure 30. The lower bonding pads may be bonded and electrically connected to the redistribution layer 12a. The lower bonding pads may be located in the lower passivation layer 14. The lower bonding pads may also comprise, for example, one or more layers, and may include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metallic materials are also within the scope of this invention.

[0195] like Figure 14 As further shown, a plurality of C4 bumps 121 may be connected to the redistribution layer 12a on the board-side surface of the redistribution layer structure 30. In at least one embodiment, the C4 bumps 121 may include an under-bump metallization (UBM) layer on the redistribution layer 12a. The C4 bumps 121 may further include contact pads (e.g., copper / nickel contact pads) on the UBM layer and solder balls (e.g., SnAg solder balls) on the contact pads. The C4 bumps 121 may allow the package module 220 to be connected to a substrate, such as a package substrate.

[0196] A semiconductor die 145 (e.g., an application-specific integrated circuit die) can be connected to a redistribution layer 12a on the die-side surface of the redistribution layer structure 30. Specifically, the semiconductor die 145 can be connected to the redistribution layer 12a via microbumps 118. The photonic engine module 100 can be connected to the redistribution layer 12a via solder balls 150. The semiconductor die 145 can be communicatively coupled to the photonic engine module 100 via the redistribution layer structure 30.

[0197] Figure 15 This is a vertical cross-sectional view of a package structure 1300 having a first alternative design according to one or more embodiments. The package structure 1300 having the first alternative design can be used with... Figure 13 The package structure 1300 is substantially similar to that in the previous one. However, the package structure 1300 with the first alternative design may include having Figure 14 The first alternative design in the packaged module is 220. The above text is about... Figure 13 The description of the 1300 package structure can also be applied to... Figure 15 The packaging structure 1300 features a first alternative design.

[0198] Figure 16It is a vertical cross-sectional view of a package module 220 having a second alternative design according to one or more embodiments.

[0199] like Figure 16 As shown, the package module 220 with the second alternative design can be used with Figure 12 The package module 220 is substantially similar. However, in the package module 220 with a second alternative design, the photon engine module 100 can be mounted on the substrate 910. The semiconductor die 145 can also be mounted on the substrate 910, adjacent to the photon engine module 100. The substrate 910 may optionally include one or more bridging dies (not shown), similar to... Figure 12 The bridge die 200 is in the middle. The substrate 910 can interconnect the semiconductor die 145 and the photon engine module 100. Therefore, in the package module 220 with the second alternative design, the photon engine module 100 can constitute a common package optics (CPO).

[0200] Substrate 910 may include a cored or coreless substrate. Substrate 910 may have the same characteristics as... Figure 13 and Figure 15 The structure is substantially similar to that of the 710 packaging substrate.

[0201] In particular, substrate 910 may include an upper passivation layer 910a substantially similar to an upper passivation layer 710a of the package substrate, an upper dielectric layer 914 substantially similar to an upper dielectric layer 714 of the package substrate, a core 912 substantially similar to a core 712, a lower dielectric layer 916 substantially similar to a lower dielectric layer 716 of the package substrate, and a lower passivation layer 910b substantially similar to a lower passivation layer 710b of the package substrate. Substrate 910 may also include an upper bonding pad 914a substantially similar to an upper bonding pad 714a of the package substrate, a metal interconnect structure 914b substantially similar to a metal interconnect structure 716b, a via 912a substantially similar to a via 712a, a lower bonding pad 916a substantially similar to a lower bonding pad 716a of the package substrate, and a metal interconnect structure 916b substantially similar to a metal interconnect structure 716b. In a second alternative design of the package module 220, the C4 bump 121 can be connected to the substrate under bonding pad 916a.

[0202] like Figure 16As shown, a semiconductor die 145 (e.g., an application-specific integrated circuit die) can be connected to a substrate upper bonding pad 914a on the die-side surface of the substrate 910. Specifically, the semiconductor die 145 can be connected to the substrate upper bonding pad 914a via microbumps 118. The photonic engine module 100 can be connected to the substrate upper bonding pad 914a via solder balls 150. The semiconductor die 145 can be communicatively coupled to the photonic engine module 100 via the substrate 910.

[0203] Figure 17 This is a vertical cross-sectional view of a package structure 1300 having a second alternative design according to one or more embodiments. The package structure 1300 having the second alternative design can be used with... Figure 13 The package structure 1300 is substantially similar to that in the previous one. However, the package structure 1300 with a second alternative design may include... Figure 16 The package module 220 has a second alternative design. The above refers to... Figure 13 The description of the 1300 package structure can also be applied to... Figure 17 The package structure 1300 features a second alternative design.

[0204] Various embodiments may include a pluggable (e.g., detachable) photonic engine module 100 (e.g., a pluggable photonic engine module assembly) including a socket 140 for optical input / output (I / O). The socket 140 allows the photonic engine module 100 to be detachably connected to a substrate (e.g., a multi-die module substrate). The photonic engine module 100 may also include a photonic engine die 130 and a fiber array unit 120 on a backplane 110. The photonic engine die 130 and the fiber array unit 120 may also be pluggable (e.g., detachably mounted on the backplane 110). A pluggable multi-fiber push-in / pull-out unit 50 may also be detachably connected to the fiber array unit 120. The backplane 110 provides a rigid structure to enhance the physical module when the photonic engine die 130, the fiber array unit 120, or the multi-fiber push-in / pull-out unit 50 is inserted / removed from the pluggable photonic engine module 100.

[0205] The socket 140 and backplane 110 allow the photonic engine die 130 to be combined with the fiber array unit 120 to realize a pluggable photonic engine module solution. This configuration allows for easy replacement of the photonic engine die 130 without affecting the functionality of other dies (e.g., application-specific integrated circuit dies) on the substrate (e.g., a multi-die module substrate). The pluggable photonic engine module 100 provides greater flexibility and convenience in network configuration and maintenance.

[0206] In some cases, the photonic engine die 130 can be damaged in an existing system, and this damage can affect other dies on the multi-die module substrate. The photonic engine die 130 can be connected to other dies (e.g., application-specific integrated circuit dies) via bridging dies (e.g., connecting dies), and the cost of these other dies can be significantly higher than that of the photonic engine die 130. Therefore, using a pluggable (e.g., detachable) photonic engine die 130 can reduce manufacturing costs. The manufacturing stability of the photonic engine die 130 can be lower than that of the application-specific integrated circuit die. Therefore, a detachable design allows for the removal of a defective photonic engine die 130 and the attachment of a new photonic engine die 130 in its place. In particular, the fiber array unit 120 may include a pluggable (e.g., detachable) fiber array unit 120 to facilitate the replacement of the damaged photonic engine die 130. This design helps alleviate concerns that a damaged photonic engine die can damage other dies (e.g., application-specific integrated circuit dies) on the multi-die module substrate.

[0207] refer to Figures 1A to 17 The photonic engine module 100 may include a backplane 110, a fiber array unit 120 attached to the backplane 110, a photonic engine die 130 attached to the backplane 110 adjacent to the fiber array unit 120, and a socket 140 attached to the backplane 110 and connected to the photonic engine die 130.

[0208] In one embodiment, the photonic engine die 130 may include a plurality of connector contacts 138, and the receptacle 140 may include a plurality of connector pins 144 configured to contact the plurality of connector contacts 138 to detachably connect the photonic engine die 130 to the receptacle 140. In another embodiment, the plurality of connector pins 144 may include at least one probe or microelectromechanical system (MEMS) pin. In yet another embodiment, the plurality of connector pins 144 may include fewer than about 20,000 pins, a pin density of less than about 50 pins 144 / mm², and a pin pitch of less than about 200 micrometers. In yet another embodiment, the receptacle 140 may include a plurality of solder balls 150 arranged in a ball grid array on the lower surface of the receptacle 140 opposite to the plurality of connector pins 144, and an interconnect structure 146 configured to electrically couple the plurality of connector pins 144 to the ball grid array. In yet another embodiment, the fiber array unit 120 may include a fiber port 125 configured to detachably receive a multi-fiber push-in / pull-out unit 50. In an embodiment, the fiber optic port 125 may be substantially aligned with the optical path 126 in the fiber optic array unit 120 and the optical path 136 in the photonic engine die 130. In an embodiment, the fiber optic array unit 120 may include an upper fiber optic array unit portion 120U, which includes the fiber optic port 125 and a first optical mirror 627U configured to guide optical signals along the optical path 126 in the upper fiber optic array unit portion 120U, and a lower fiber optic array unit portion 120L, detachably connected to the upper fiber optic array unit portion 120U and including a second optical mirror 627L configured to guide optical signals from the upper fiber optic array unit portion 120U to the photonic engine die 130 and vice versa. In an embodiment, the photonic engine module 100 may further include a fiber optic array unit support 128 for securing the fiber optic array unit 120 to a backplane 110. In one embodiment, the photonic engine module 100 may further include an attachment microlens socket 428 attached to the fiber array unit bracket 128, such that the microlens 421 of the attachment microlens socket 428 can be located between the optical die and the optical path 126 of the fiber array unit 120. In another embodiment, the photonic engine die 130 includes a photonic engine circuit 132 configured to receive optical signals from the fiber array unit 120, convert the optical signals into electrical signals, and transmit the electrical signals to the socket 140; and to receive electrical signals from the socket 140, convert the electrical signals received from the socket 140 into optical signals, and transmit the optical signals from the photonic engine circuit 132 to the fiber array unit 120.

[0209] Refer again Figures 1A to 17The method of forming the photonic engine module 100 may include attaching the fiber array unit 120 to the backplane 110, attaching the photonic engine die 130 to the backplane 110 at a position adjacent to the fiber array unit 120, and attaching the backplane 110 to the socket 140, such that the fiber array unit 120 and the photonic engine die 130 can be located between the backplane 110 and the socket 140.

[0210] In an embodiment, the method may further include attaching a fiber array unit bracket 128 to a fiber array unit 120, wherein attaching the fiber array unit 120 to a backplane 110 may include attaching the fiber array unit bracket 128 to the backplane 110. In an embodiment, the fiber array unit 120 may include lead pins 22, and attaching the fiber array unit bracket 128 to the fiber array unit 120 may include inserting the lead pins 22 into openings in the fiber array unit bracket 128. In an embodiment, the method may further include removably attaching a photonic engine die 130 to a receptacle 140. In an embodiment, the photonic engine die 130 may include a plurality of connector contacts 138, and the receptacle 140 may include a plurality of connector pins 144 configured to contact the plurality of connector contacts 138, and removably attaching the photonic engine die 130 to the receptacle 140 may include contacting the plurality of connector pins 144 with the plurality of connector contacts 138 respectively. In one embodiment, the receptacle 140 may include a plurality of leads 144, and attaching the backplate 110 to the receptacle 140 may include inserting the plurality of leads 144 into a plurality of openings in the backplate 110.

[0211] Refer again Figures 1A to 17 The packaging module 220 may include mounting structures 20, 30, and 910, a photonic engine module 100 located on the mounting structures 20, 30, and 910, the photonic engine module 100 may include a backplane 110, a fiber array unit 120 attached to the backplane 110, a photonic engine die 130 attached to the backplane 110 adjacent to the fiber array unit 120, and a socket 140 attached to the backplane 110 and connected to the photonic engine die 130, and a semiconductor die 145 mounted on the mounting structures 20, 30, and 910 adjacent to the photonic engine module 100, the semiconductor die 145 being electrically coupled to the photonic engine module 100 through the mounting structures 20, 30, and 910.

[0212] In an embodiment, mounting structures 20, 30, and 910 may include one of a substrate 910, an interposer 20, or a redistribution layer structure 30. In an embodiment, semiconductor die 145 may include an application-specific integrated circuit die 145, and mounting structures 20, 30, and 910 may include a bridge die 200, wherein the application-specific integrated circuit die 145 may be electrically coupled to the photonic engine module 100 via the bridge die 200.

[0213] The foregoing has outlined the features of several embodiments to enable those skilled in the art to better understand the nature of this invention. Those skilled in the art should understand that this invention can be readily used as a basis for designing or modifying other programs and structures to perform the same purposes as the embodiments introduced herein and / or achieve the same advantages as the embodiments introduced herein. Those skilled in the art should also recognize that such equivalent constructions should not depart from the spirit and scope of this invention, and that various changes, substitutions, and modifications can be made to this document without departing from the spirit and scope of this invention.

Claims

1. A photonic engine module, characterized in that, include: Back panel; Fiber optic array units attached to the backplane; A photonic engine die attached to the backplane adjacent to the fiber array unit; as well as A socket attached to the backplate and connected to the photon engine die.

2. The photonic engine module according to claim 1, characterized in that, The photonic engine die includes a plurality of connector contacts, and the socket includes a plurality of connector pins configured to contact the plurality of connector contacts to detachably connect the photonic engine die to the socket.

3. The photonic engine module according to claim 2, characterized in that, The plurality of connector pins include a number of less than about 20,000, a pin density of less than about 50 pins per square millimeter, and a pin pitch of less than about 200 micrometers.

4. The photonic engine module according to claim 2, characterized in that, The socket includes: A plurality of solder balls in a ball grid array are located on the lower surface of the socket relative to the plurality of connector pins; and An interconnect structure is configured to electrically couple the plurality of connector pins to the ball grid array.

5. The photonic engine module according to claim 1, characterized in that, The fiber array unit includes a fiber port configured to detachably receive a multi-fiber push-in and pull-out unit.

6. The photonic engine module according to claim 5, characterized in that, The optical fiber port is substantially aligned with the optical path length in the optical fiber array unit and the optical path length in the photonic engine die.

7. The photonic engine module according to claim 5, characterized in that, The fiber array unit includes: The upper portion of the fiber optic array unit includes the fiber optic port and a first optical mirror configured to guide an optical signal along the optical path in the upper portion of the fiber optic array unit; and The lower portion of the fiber array unit is detachably connected to the upper portion of the fiber array unit and includes a second optical mirror configured to guide optical signals from the upper portion of the fiber array unit to the photonic engine die and from the photonic engine die to the upper portion of the fiber array unit.

8. The photonic engine module according to claim 1, characterized in that, The photonic engine die includes a photonic engine circuit, configured as follows: The system receives optical signals from the fiber array unit, converts the optical signals into electrical signals, and transmits the electrical signals to the socket. as well as The system receives electrical signals from the socket, converts the electrical signals received from the socket into optical signals, and transmits the optical signals from the photonic engine circuit to the fiber optic array unit.

9. A packaging module, characterized in that, include: Installation structure; The photon engine module located on the mounting structure includes: Back panel; Fiber optic array units are attached to the backplane; A photonic engine die, attached to the backplane adjacent to the fiber array unit; and A socket, attached to the backplate and connected to the photon engine die; and A semiconductor die is mounted on the mounting structure adjacent to the photonic engine module and electrically coupled to the photonic engine module through the mounting structure.

10. The packaging module according to claim 9, characterized in that, The mounting structure includes one of a substrate, an interlayer, or a redistribution layer structure.

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