Parallel optical transceiver module

Abstract

The utility model discloses a parallel light transceiver module, including casing, at least one photoelectric chip group, circuit board subassembly, casing includes the box body that is provided with the middle part and the both sides of middle part has the upper accommodating cavity, the lower accommodating cavity of middle part, upper cover, bottom plate, the box body is made of good material of heat conduction, including upper opening, lower opening, upper cover, bottom plate are connected with upper opening, lower opening respectively, the upside of middle part forms the chip mounting part, and at least one through -hole is formed around the chip mounting part, photoelectric chip group includes light chip, electric chip, is fixedly installed on the chip mounting part in the upper accommodating cavity, and directly contacts with middle part, circuit board subassembly is located in the lower accommodating cavity of middle part downside, and is fixedly connected with the box body, and photoelectric chip group is electrically connected with circuit board subassembly through the through -hole, the utility model discloses the chip is directly connected with casing, improves the heat dissipation effect, improves module package density, reduces module volume.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, specifically to a parallel optical transceiver module. Background Technology

[0002] With the promotion and in-depth application of optical communication, the demand for photoelectric conversion modules is increasing daily. Market demand is also developing towards miniaturization, high speed, and high density. However, the resulting heat dissipation problems affect the applicability and lifespan of the products. How to comprehensively solve these needs has become a key breakthrough for the development of optical modules.

[0003] Currently, there are few such small, high-density, high-speed module products on the market, and most of them rely on external heat dissipation fins or heat sinks for heat dissipation. However, the heat dissipation effect is still far from ideal. The main reason is that the chip is mounted on the internal PCB, making it difficult to effectively transfer the chip's heat to the casing. Simply adding a heat sink to the casing cannot fundamentally solve the problem.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Summary of the Invention

[0005] To address the problem mentioned in the background art that adding heat dissipation fins or external heat sinks to the optical module housing does not achieve ideal heat dissipation, this utility model proposes a parallel optical transceiver module that directly connects the chip to the housing, effectively reducing the thermal resistance between the chip and the housing, solving the heat dissipation problem of the module, improving the heat dissipation effect, increasing the module packaging density, reducing the module size, and benefiting the application of high-density integrated communication systems.

[0006] To achieve the above-mentioned objectives, the present invention employs the following technical solution: A parallel optical transceiver module includes a housing, at least one optoelectronic chipset, and a circuit board assembly; The housing includes a box body with a central partition and upper and lower receiving cavities on both sides of the partition, an upper cover plate, and a bottom plate; the box body includes an upper opening and a lower opening; the box body is made of a material with good thermal conductivity; the upper cover plate and the bottom plate are respectively connected to the upper opening and the lower opening, covering the upper opening and the lower opening; a chip mounting portion is formed on the upper side of the partition, and at least one through hole is formed around the chip mounting portion; The optoelectronic chip group includes an optical chip and an electrical chip, which are located on the chip mounting part in the upper receiving cavity and are directly in contact with and fixedly connected to the middle partition. The circuit board assembly is located in the lower receiving cavity below the partition and is fixedly connected to the housing; the optoelectronic chip group is electrically connected to the circuit board assembly through the through hole.

[0007] In some specific embodiments, there are two through holes, namely a first through hole and a second through hole, which are respectively provided for the optical chip and the electrical chip, and are used for the electrical connection between the optical chip, the electrical chip and the circuit board assembly.

[0008] In some specific embodiments, it also includes at least one lens, at least one fiber array assembly, and at least one sealing cap; The lens is located within the upper receiving cavity, above the optical chip; and is connected to the optical chip. The fiber optic array assembly is located inside the upper receiving cavity and is fixedly connected to the lens; the sealing cover is located inside the upper receiving cavity, outside the fiber optic array assembly, and is connected to the housing.

[0009] In some specific embodiments, at least one pigtail is also included, one end of which is fixedly connected to the fiber array assembly and located on the underside of the upper cover plate; A third through hole is formed on the side of the upper receiving cavity; one end of the pigtail connected to the fiber array assembly passes through the third through hole.

[0010] In some specific embodiments, the upper side of the third through hole is open; at least one first groove is formed on the side wall of the upper receiving cavity opposite to the third through hole; at least one screw hole is formed on the port on the side where the third through hole is located; One end of the upper cover plate has an outwardly extending insertion part corresponding to the position of the first groove, which is inserted into the corresponding first groove; the other end of the upper cover plate has a fourth through hole corresponding to the position of the screw hole, which is a countersunk hole with the outer side recessed; the screw connects the fourth through hole and the screw hole.

[0011] In some specific embodiments, a plurality of third grooves are formed on the outer side wall of the box near the end of the upper cover plate for heat dissipation.

[0012] In some specific embodiments, a plurality of second grooves are formed on the lower side of the partition portion; The circuit board assembly includes multiple electronic components and a substrate; each of the electronic components is located on the side of the substrate facing the partition; the circuit board assembly is connected to the partition, and each of the electronic components is located in each of the second grooves.

[0013] In some specific embodiments, at least one downward-facing positioning post is formed on the lower side of the partition. A fifth through hole is formed on the circuit board assembly to be adapted to and corresponding to the positioning post, and is fitted onto the positioning post.

[0014] In some specific embodiments, an electrical connection interface, which is an LGA type connector, is also included; The base plate has a sixth through hole adapted to the electrical connection interface; the electrical connection interface is installed in the sixth through hole and fixedly connected to the circuit board assembly.

[0015] In some specific embodiments, the electrical connection interface has a seventh through hole corresponding to the position of each of the positioning posts, and is fitted onto the positioning posts.

[0016] This utility model's parallel optical transceiver module directly contacts and fixes the optoelectronic chip group to a heat-conducting partition, allowing the heat generated by the optoelectronic chip group to be directly conducted from the partition to the entire housing and casing, and then conducted and radiated from the entire housing and casing. This improves the heat dissipation of the optoelectronic chip group inside the casing, enhances the heat dissipation effect of the optoelectronic chip group, and improves the reliability and lifespan of the module. In addition, the heat dissipation effect can be guaranteed without adding heat sinks or heat radiators, increasing the module packaging density and reducing the module size, which is beneficial for the application of high-density integrated communication systems.

[0017] Other features and advantages of this utility model will become clearer after reading the detailed embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a parallel optical transceiver module according to an embodiment; Figure 2 This is a schematic diagram of the structure of a parallel optical transceiver module according to an embodiment; Figure 3 This is an exploded structural diagram of the parallel optical transceiver module according to an embodiment; Figure 4 This is a longitudinal cross-sectional view of the parallel optical transceiver module according to an embodiment; Figure 5 This is a schematic diagram of the upper cavity mounting structure of the parallel optical transceiver module according to an embodiment; Figure 6This is a schematic diagram of the upper cavity mounting structure of the parallel optical transceiver module according to an embodiment; Figure 7 This is a schematic diagram of the mounting structure on the lower side of the housing of the parallel optical transceiver module according to an embodiment; Figure 8 This is a schematic diagram of the box structure according to an embodiment; Figure 9 This is a schematic diagram of the box structure according to an embodiment; Figure 10 This is a schematic diagram of the upper cover plate structure according to an embodiment; Figure 11 This is a schematic diagram of the upper cover structure according to an embodiment.

[0020] Figure label, 1. Housing; 11. Box body; 111. Third through hole; 112. First groove; 113. Screw hole; 12. Top cover plate; 121. Insertion part; 122. Fourth through hole; 123. Fourth groove; 13. Bottom plate; 131. Sixth through hole; 14. Middle partition; 141. Chip mounting part; 142. Through hole; 1421. First through hole; 1422. Second through hole; 143. Second groove; 144. Positioning post; 145. Third groove; 15. Upper receiving cavity; 16. Lower receiving cavity; 17. Third groove; 2. Optoelectronic chipset; 21. Optical chip; 22. Electrical chip; 3. Circuit board assembly; 31. Fifth through hole; 4. Lens; 5. Fiber optic array assembly; 6. Sealing cover; 7. Pigtail; 8. Electrical connection interface; 81. Seventh through hole. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0024] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0026] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0027] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 6 , Figure 8 , Figure 9 This utility model discloses a parallel optical transceiver module, which includes a housing 1, at least one optoelectronic chip group 2, and a circuit board assembly 3.

[0028] The housing 1 includes a box body 11 with a central partition 14 and upper receiving cavity 15 and lower receiving cavity 16 on both sides of the partition 14, an upper cover plate 12, and a bottom plate 13. The box body 11 is made of a material with good thermal conductivity and includes an upper opening and a lower opening. That is, the upper receiving cavity 15 has an upper opening and the lower receiving cavity 16 has a lower opening. The upper cover plate 12 and the bottom plate 13 are respectively fitted and installed on the upper opening and the lower opening to cover the upper opening and the lower opening, so that the upper receiving cavity 15 and the lower receiving cavity 16 form a closed space.

[0029] A chip mounting portion 141 is formed on the upper side of the partition 14, and at least one through hole 142 is formed around the chip mounting portion 141. The optoelectronic chip group 2 includes an optical chip 21 and an electrical chip 22, which are located on the chip mounting portion 141 in the upper receiving cavity 15 and on the inner side of the upper cover plate 12. They are in direct contact with and fixedly connected to the partition 14, so that the heat generated by the optical chip 21 and the electrical chip 22 is directly conducted out through the partition 14.

[0030] The circuit board assembly 3 is located in the lower receiving cavity 16 below the partition 14, inside the base plate 13, and is fixedly connected to the box body 11; the optoelectronic chip group 2 is electrically connected to the circuit board assembly 3 through the through hole 142, so as to realize the electrical connection between the optoelectronic chip group 2 and the circuit board assembly 3 when the optoelectronic chip group 2 is not directly connected to the circuit board assembly 3.

[0031] The parallel optical transceiver module of this invention directly contacts and fixes the optoelectronic chip group 2 to the heat-conducting partition 14, which has good thermal conductivity. This allows the heat generated by the optoelectronic chip group 2 to be directly conducted from the partition 14 to the entire housing 11 and shell 1, and then conducted and radiated from the entire housing 11 and shell 1. This improves the heat dissipation of the optoelectronic chip group 2 inside the shell 1, enhances the heat dissipation effect of the optoelectronic chip group 2, and improves the reliability and lifespan of the module. In addition, the heat dissipation effect can be guaranteed without adding heat sinks or heat radiators, increasing the module packaging density and reducing the module size, which is beneficial for the application of high-density integrated communication systems.

[0032] The specific structure and principle of the parallel optical transceiver module of this utility model will be described in detail below through specific embodiments.

[0033] In some specific embodiments, refer to Figure 3 , Figure 6 , Figure 8 , Figure 9There are two through holes, namely a first through hole 1421 and a second through hole 1422, which are respectively provided for the optical chip 21 and the electrical chip 22; that is, the optical chip 21 and the electrical chip 22 are respectively fixedly mounted on the chip mounting part 141; the first through hole 1421 is provided on one side or around the optical chip 21; the second through hole 1422 is provided on one side or around the electrical chip 22. The first through hole 1421 and the second through hole 1422 are used for electrical connection between the optical chip 21, the electrical chip 22 and the circuit board assembly 3; that is, the electrical connection lines between the optical chip 21, the electrical chip 22 and the circuit board pass through the partition part 14 through the first through hole 1421 and the second through hole 1422.

[0034] The parallel optical transceiver module in this embodiment provides a first through hole 1421 and a second through hole 1422 corresponding to the optical chip 21 and the electrical chip 22, respectively, which facilitates the electrical connection between the optical chip 21, the electrical chip 22 and the circuit board assembly 3, reduces the difficulty of wiring and improves the assembly efficiency.

[0035] In some specific embodiments, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 , Figure 9 The parallel optical transceiver module also includes at least one lens 4, at least one fiber array assembly 5, and at least one sealing cover 6.

[0036] Lens 4 is located inside the upper cavity 15, above the optical chip 21, and inside the upper cover plate 12; it is connected to the optical chip 21.

[0037] The fiber array assembly 5 is located inside the upper cavity 15 and inside the upper cover plate 12, and is fixedly connected to the lens 4. It is used to transmit the optical signal generated by the optical chip 21 to the optical fiber. The sealing cover 6 is a flat plate extension and bending structure adapted to the shape of the fiber array assembly 5. It is located inside the upper cavity 15, outside the fiber array assembly 5, and inside the upper cover plate 12, and is connected to the box body 11.

[0038] In this embodiment, the parallel optical transceiver module uses a sealing cover 6 on the outside of the fiber optic array assembly 5 to fix the fiber optic array assembly 5 together with the lens 4 above the optical chip 21, thereby improving the stability of the fiber optic array assembly 5. In addition, the sealing cover 6 provides protection for the optoelectronic chip group 2, the lens 4, and the fiber optic array assembly 5, thereby improving the waterproof and dustproof rating of the optoelectronic chip group 2, the lens 4, and the fiber optic array assembly 5.

[0039] In some specific embodiments, refer to Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 A third groove 145 is formed on the upper side of the partition 14 to be adapted to the sealing cover 6; the chip mounting part 141, the first through hole 1421, and the second through hole 1422 are located in the third groove 145; the sealing cover 6 is connected to the bottom of the third groove 145.

[0040] In some specific embodiments, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 The parallel optical transceiver module also includes at least one pigtail 7, one end of which is fixedly connected to the fiber array assembly 5 and located on the underside of the upper cover plate 12.

[0041] A third through hole 111 is formed on the side of the upper receiving cavity 15; the end of the pigtail 7 connected to the fiber array assembly 5 passes through the third through hole 111.

[0042] In some specific embodiments, refer to Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 The upper side of the third through hole 111 is open; at least one first groove 112 is formed on the side wall of the upper receiving cavity 15 opposite to the third through hole 111; at least one screw hole 113 is formed on the port on the side where the third through hole 111 is located.

[0043] One end of the upper cover plate 12 has an outwardly extending insertion part 121 corresponding to the position of the first groove 112, which is inserted into the corresponding first groove 112; the other end of the upper cover plate 12 has a fourth through hole 122 corresponding to the position of the screw hole 113, which is a countersunk hole with the outer side recessed; the screw connects the fourth through hole 122 and the screw hole 113.

[0044] The parallel optical transceiver module of this embodiment facilitates the installation of the pigtail 7 by opening the upper side of the third through hole 111, thereby improving assembly efficiency. A first groove 112 is provided on the side wall of the upper receiving cavity 15 and a screw hole 113 is provided on the opposite port. These grooves cooperate with the insertion part 121 and the fourth through hole 122 of the upper cover plate 12, which facilitates the installation and fixation of the upper cover plate 12 and the box body 11, thereby improving assembly efficiency.

[0045] In some specific embodiments, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 10 , Figure 11 At least one fourth groove 123 is formed on the side of the upper cover plate 12 facing the central partition to accommodate a portion of the sealing cover 6 and the fiber array assembly 5. The space for accommodating the portion of the sealing cover 6 and the fiber array assembly 5 is provided with minimal reduction in the strength of the upper cover plate 12, thereby increasing the packaging density of the module and reducing the module volume.

[0046] In some specific embodiments, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 The chip mounting section 141 has two components, and the number of optoelectronic chip group 2, lens 4, fiber array assembly 5, and pigtail 7 are all two, realizing a 24-channel high-density high-speed optoelectronic communication conversion module in a small package.

[0047] In some specific embodiments, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 Multiple third grooves 17 are formed on the outer side wall of the box 11 near the end of the upper cover plate 12 to increase the heat dissipation area and improve the heat dissipation effect.

[0048] In some specific embodiments, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 The shell 1 is square, and each third groove 17 can be evenly distributed on the four edges or any one, two or three of the four edges of one end of the box 11.

[0049] In some specific embodiments, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7, Figure 8 , Figure 9 , Figure 10 , Figure 11 The upper cover plate 12 and each of the third grooves 17 have a fourth groove with the same shape and size as each of the third grooves 17, which are connected to each of the third grooves to increase the heat dissipation area.

[0050] In some specific embodiments, refer to Figure 3 , Figure 4 , Figure 9 A plurality of second grooves 143 are formed on the lower side of the partition 14.

[0051] The circuit board assembly 3 includes multiple electronic components and a substrate; each electronic component is located on the side of the substrate facing the partition 14; each second groove 143 is adapted to the size of the corresponding electronic component; the circuit board assembly 3 is connected to the partition 14, and each electronic component is located in each second groove 143.

[0052] The parallel optical transceiver module of this embodiment uses multiple second grooves 143 provided on the lower side of the partition 14 to accommodate the electronic components of the circuit board assembly 3, thereby reducing the space occupied by the circuit board assembly 3 in the lower cavity 16, increasing the module's packaging density, and reducing the module's volume.

[0053] In some specific embodiments, refer to Figure 2 , Figure 3 , Figure 4 , Figure 7 , Figure 9 At least one downward-facing positioning post 144 is formed on the lower side of the partition 14. A fifth through hole 31 is formed on the circuit board assembly 3 to be fitted and adapted to the positioning post 144 and to correspond to the position of each positioning post 144, and is fitted onto the positioning post 144.

[0054] The parallel optical transceiver module of this embodiment provides a downwardly protruding positioning post 144 on the lower side of the partition 14 and a corresponding fifth through hole 31 on the circuit board assembly 3. The circuit board assembly 3 is quickly positioned by fitting the fifth through hole 31 onto the positioning post 144, thereby improving the installation efficiency of the circuit board assembly 3 and thus improving the assembly efficiency of the module.

[0055] In some specific embodiments, refer to Figure 2 , Figure 3 , Figure 4 , Figure 7 The parallel optical transceiver module also includes an electrical connection interface 8, which is an LGA type connector.

[0056] The base plate 13 has a sixth through hole 131 that is adapted to the electrical connection interface 8; the electrical connection interface 8 is installed in the sixth through hole 131 and is fixedly connected to the circuit board assembly 3.

[0057] In some specific embodiments, refer to Figure 2 , Figure 3 , Figure 4 , Figure 7 The electrical connection interface 8 has a seventh through hole 81 corresponding to the position of each positioning post 144, which is fitted onto the positioning post 144.

[0058] In this embodiment, the parallel optical transceiver module improves the installation efficiency of the electrical connection interface 8 by connecting the seventh through hole 81 on the electrical connection interface 8 to the positioning post 144.

[0059] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0060] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A parallel optical transceiver module, characterized in that, include: A housing includes a box body with a central partition and upper and lower receiving cavities on both sides of the partition, a top cover, and a bottom plate; the box body includes an upper opening and a lower opening; the box body is made of a material with good thermal conductivity; the top cover and the bottom plate are connected to the upper and lower openings respectively, covering the upper and lower openings; a chip mounting portion is formed on the upper side of the partition, and at least one through hole is formed around the chip mounting portion; At least one optoelectronic chip assembly, including an optical chip and an electrical chip, is located on the chip mounting portion within the upper receiving cavity and is directly contacted and fixedly connected to the intermediate partition portion; A circuit board assembly is located in the lower receiving cavity below the partition and is fixedly connected to the housing; the optoelectronic chip group is electrically connected to the circuit board assembly through the through hole.

2. The parallel optical transceiver module according to claim 1, characterized in that, The number of through holes is two, namely a first through hole and a second through hole, which are respectively provided for the optical chip and the electrical chip, and are used for the electrical connection between the optical chip, the electrical chip and the circuit board assembly.

3. The parallel optical transceiver module according to claim 1, characterized in that, It also includes at least one lens, at least one fiber array assembly, and at least one sealing cap; The lens is located within the upper receiving cavity, above the optical chip; and is connected to the optical chip. The fiber optic array assembly is located inside the upper receiving cavity and is fixedly connected to the lens; the sealing cover is located inside the upper receiving cavity, outside the fiber optic array assembly, and is connected to the housing.

4. The parallel optical transceiver module according to claim 3, characterized in that, It also includes at least one pigtail, one end of which is fixedly connected to the fiber array assembly and located on the underside of the upper cover plate; A third through hole is formed on the side of the upper receiving cavity; one end of the pigtail connected to the fiber array assembly passes through the third through hole.

5. The parallel optical transceiver module according to claim 4, characterized in that, The upper side opening of the third through hole; at least one first groove is formed on the side wall of the upper receiving cavity opposite to the third through hole; at least one screw hole is formed on the port on the side where the third through hole is located; One end of the upper cover plate has an outwardly extending insertion part corresponding to the position of the first groove, which is inserted into the corresponding first groove; the other end of the upper cover plate has a fourth through hole corresponding to the position of the screw hole, which is a countersunk hole with the outer side recessed; the screw connects the fourth through hole and the screw hole.

6. The parallel optical transceiver module according to claim 1, characterized in that, Multiple third grooves are formed on the outer side wall of the box near the top cover plate for heat dissipation.

7. The parallel optical transceiver module according to any one of claims 1 to 6, characterized in that, A plurality of second grooves are formed on the lower side of the partition; The circuit board assembly includes multiple electronic components and a substrate; each of the electronic components is located on the side of the substrate facing the partition; the circuit board assembly is connected to the partition, and each of the electronic components is located in each of the second grooves.

8. The parallel optical transceiver module according to claim 7, characterized in that, At least one downward-facing positioning post is formed on the lower side of the partition. A fifth through hole is formed on the circuit board assembly to be adapted to and corresponding to the positioning post, and is fitted onto the positioning post.

9. The parallel optical transceiver module according to claim 8, characterized in that, It also includes an electrical connection interface, which is an LGA type connector; The base plate has a sixth through hole adapted to the electrical connection interface; the electrical connection interface is installed in the sixth through hole and fixedly connected to the circuit board assembly.

10. The parallel optical transceiver module according to claim 9, characterized in that, The electrical connection interface has a seventh through hole corresponding to the position of each of the positioning posts, and is fitted onto the positioning posts.

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