Optical module

Abstract

The utility model discloses a kind of optical modules. Optical module includes shell, circuit board in shell, power device, photoelectric element, circuit board has first surface and second surface, optical module further includes first heat conduction block, second heat conduction block and the connecting structure of connecting first heat conduction block and second heat conduction block, first heat conduction block and power device are fixed in the first surface of circuit board, second heat conduction block is fixed on first heat conduction block by connecting structure, and power device and shell are heat-conducting connection. In the utility model, second heat conduction block is independent of first heat conduction block, and the both are connected by connecting structure, second heat conduction block is used to transmit the heat of power device to shell alone, and its dimensional tolerance only needs to consider the spacing between power device and shell, second heat conduction block can be close to shell and power device, so as to effectively conduct the heat of power device to shell.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] The power devices in an optical module can only operate normally within a certain temperature range. For example, the maximum operating temperature of a common power device, a digital signal processor, cannot exceed 85°C. To address this, an optical module is equipped with a heat sink, which conducts heat from the power devices to the module's housing, where it is then dissipated.

[0003] In existing optical modules, a single heat sink is typically installed. All components of the optical module that require heat dissipation are attached to the heat sink so that they can be cooled through the heat sink. The position of the heat sink needs to take into account the installation errors and dimensional tolerances of multiple components. The actual distance between the heat sink and a specific power device cannot be effectively controlled. When the distance between the heat sink and the specified power device is too large, it cannot effectively dissipate heat for the power device, thus failing to meet the heat dissipation requirements of the optical module. Utility Model Content

[0004] This invention provides an optical module, the purpose of which is to solve the problem in the prior art that the actual distance between the heat sink of the optical module and a certain power device cannot be effectively controlled, thus failing to effectively dissipate heat for the power device.

[0005] To achieve the above objectives, this utility model provides an optical module, which includes a housing, a circuit board located within the housing, a power device, and an optoelectronic element. The circuit board has a first surface and a second surface disposed opposite to each other in the thickness direction. The optical module also includes a first heat-conducting block, a second heat-conducting block, and a connecting structure connecting the first heat-conducting block and the second heat-conducting block. The first heat-conducting block and the power device are both fixed to the first surface of the circuit board. The second heat-conducting block is fixed to the first heat-conducting block through the connecting structure and thermally connects the power device and the housing.

[0006] As a further improvement of this utility model, the first heat-conducting block includes a third surface facing the circuit board and a fourth surface away from the circuit board. A through hole is formed on the first heat-conducting block, penetrating the third surface and the fourth surface. The connecting structure is disposed between the hole wall of the through hole and the second heat-conducting block. The second heat-conducting block is fixed in the through hole by the connecting structure.

[0007] As a further improvement of this utility model, the connection structure includes a fixing adhesive filled between the hole wall of the through hole and the second heat-conducting block, the fixing adhesive bonding the first heat-conducting block and the second heat-conducting block.

[0008] As a further improvement of this utility model, the through hole includes a first hole formed from the fourth surface and a second hole extending from the bottom wall of the first hole to the third surface. The second heat-conducting block includes a first heat-conducting part located at least partially within the first hole and a second heat-conducting part located at least partially within the second hole. The second heat-conducting part is thermally connected to the power device. The first hole extends beyond the second hole in the length and / or width direction of the first heat-conducting block, and the first heat-conducting part extends beyond the second heat-conducting part in the length and / or width direction of the second heat-conducting block. The fixing adhesive fills the space between the hole wall of the first hole and the first heat-conducting part.

[0009] As a further improvement of this utility model, there is a gap between the first heat-conducting part and the bottom wall of the hole.

[0010] As a further improvement of this utility model, the second heat-conducting block and the shell are connected and fixed by a first heat-conducting adhesive.

[0011] As a further improvement of this utility model, a second thermally conductive adhesive is provided between the power device and the second thermally conductive block, and the power device and the second thermally conductive block are thermally connected through the second thermally conductive adhesive.

[0012] As a further improvement of this utility model, the optical module further includes a silicon photonic chip electrically connected to the first surface, an optical emitting module optically coupled to the silicon photonic chip, and a first optical fiber assembly. The optical emitting module and the first optical fiber assembly are both fixed on the third surface of the first heat-conducting block, and the fourth surface of the first heat-conducting block is thermally connected to the housing.

[0013] As a further improvement of this utility model, the projected area of ​​the second heat-conducting block on the first surface is at least three times the projected area of ​​the power device on the first surface, and the thickness of the second heat-conducting block is at least twice the thickness of the power device.

[0014] As a further improvement of this utility model, the housing includes a main housing with a receiving cavity, a heat dissipation cover detachably connected to the main housing for opening and closing the receiving cavity, the circuit board and power devices are both located in the receiving cavity, and the first heat-conducting block and the second heat-conducting block are both thermally connected to the heat dissipation cover.

[0015] Beneficial effects: In the optical module provided by this utility model, the first heat-conducting block is connected to the circuit board, which can dissipate heat from some power devices and serve as a positioning reference for some components of the optical module. The second heat-conducting block is independent of the first heat-conducting block, and the two are connected by a connecting structure to ensure the stability of their relative positions. The second heat-conducting block is used to transfer the heat generated by the power devices to the housing. The dimensional tolerance of the second heat-conducting block relative to the housing and the power devices only needs to take into account the distance between the power devices and the housing. The second heat-conducting block can be closely attached to the housing and the power devices, thereby effectively conducting the heat of the power devices to the housing for heat dissipation. Attached Figure Description

[0016] Figure 1 A three-dimensional structural diagram of an optical module provided in an embodiment of this utility model; Figure 2 A top view of an optical module provided in an embodiment of this utility model; Figure 3 for Figure 2 A portion of the cross-sectional view of the optical module after it has been cut along the AA direction; Figure 4 An exploded view of an optical module provided in an embodiment of this utility model; Figure 5 A top view of the first heat-conducting block, the second heat-conducting block, and the circuit board in an optical module provided according to an embodiment of the present utility model; Figure 6 for Figure 5 A magnified diagram of point A in the middle; Figure 7 A cross-sectional view of a partial structure of an optical module provided in an embodiment of the present invention; Figure 8 An exploded perspective view of the first heat-conducting block and the second heat-conducting block in an optical module provided according to an embodiment of the present invention; Figure 9 A top view of a partial structure of an optical module provided in an embodiment of this utility model; Figure 10 A bottom view of a portion of the housing in an optical module provided according to an embodiment of this utility model; Figure 11 A schematic diagram showing the general shape of the first thermally conductive adhesive in an optical module provided according to an embodiment of the present invention; Figure 12 This is a three-dimensional exploded view of an optical module provided in an embodiment of the present invention.

[0017] In the picture: 100. Optical module; 10. Housing; 11. Glue Dispensing Channel; 111. First Channel Section; 112. Second Channel Section; 113. Arc-shaped Section; 12. Main Housing; 121. Receiving Cavity; 122. First Housing; 123. Second Housing; 13. Heat Sink Cover; 131. Heat Dissipation Channel; 20. Circuit board; 21. First surface; 22. Second surface; 30. Power devices; 40. First heat-conducting block; 41. Third surface; 42. Fourth surface; 43. Through hole; 431. First hole body; 432. Second hole body; 433. Bottom wall of hole; 434. Escape angle; 50. Second heat-conducting block; 51. First heat-conducting part; 52. Second heat-conducting part; 60. Connecting structure; 61. Fixing adhesive; 70. Silicon photonics chip; 71. Optical emission module; 72. First optical fiber assembly; 73. Second optical fiber assembly; 80. First thermally conductive adhesive; 81. Main body; 82. Lug; 90. Second thermally conductive adhesive; S, a square area; h, gap. Detailed Implementation The present invention will now be described in detail with reference to the embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any modifications to the mechanism, method, or function made by those skilled in the art based on these embodiments are included within the protection scope of the present invention.

[0018] The terms used herein, such as "up," "down," "left," "right," "front," and "back," indicating spatial relative position, are for illustrative purposes to describe the relationship of one feature relative to another, as shown in the accompanying drawings. It is understood that, depending on the product's placement, these terms may be intended to include different orientations besides those shown in the figures, and should not be construed as limiting the claims. Furthermore, the descriptive term "horizontal" used herein is not entirely equivalent to being perpendicular to the direction of gravity, and allows for a certain angle of inclination.

[0019] like Figure 1-5 As shown, one embodiment of this utility model provides an optical module 100. In optical communication equipment, the optical module 100 is a tool for realizing the mutual conversion of photoelectric signals and is a key component in optical communication equipment. The optical module 100 includes a housing 10, a circuit board 20, a power device 30, and optoelectronic elements. The optoelectronic elements can be capacitors, resistors, lasers, detectors, silicon photonic chips, optical fibers, etc.

[0020] The housing 10 is hollow and may be made of aluminum alloy. The circuit board 20, power device 30, and optoelectronic components are all located inside the housing 10. The circuit board 20 has a first surface 21 and a second surface 22 disposed opposite to each other in the thickness direction. Specifically, the circuit board 20 may be a printed circuit board, i.e., a PCB.

[0021] The optical module 100 also includes a first heat-conducting block 40, a second heat-conducting block 50, and a connecting structure 60 connecting the first heat-conducting block 40 and the second heat-conducting block 50. The second heat-conducting block 40 and the second heat-conducting block 50 are separately arranged and connected together by the connecting structure 60. The first heat-conducting block 40 and the power device 30 are both fixed to the first surface 21 of the circuit board 20, and the second heat-conducting block 50 is fixed to the first heat-conducting block 40 through the connecting structure 60, and thermally connects the power device 30 and the housing 10.

[0022] The second heat-conducting block 50 is located on the side of the power device 30 away from the circuit board 20 and thermally connects the power device 30 and the housing 10 to conduct heat from the power device 30 to the housing 10.

[0023] The first heat-conducting block 40 includes a third surface 41 facing the circuit board 20 and a fourth surface 42 facing away from the circuit board 20. The phrase "the first heat-conducting block 40 is connected to the first surface 21" means that the first heat-conducting block 40 and the circuit board 20 are joined together through the connection of the third surface 41 and the first surface 21. Specifically, the third surface 41 and the first surface 21 are connected together by adhesive.

[0024] The third surface 41 may be wavy to increase the contact area with the adhesive, so that the first heat-conducting block 40 can be reliably attached and fixed to the circuit board 20.

[0025] In the optical module 100 provided in this embodiment, the first heat-conducting block 40 is connected to the circuit board 20, which facilitates the electrical connection between the optoelectronic components on the first heat-conducting block 40 and the circuit board 20. The first heat-conducting block 40 can also serve as a positioning reference for other components within the optical module 100, thereby facilitating the assembly of other components.

[0026] The second heat-conducting block 50 is used to transfer the heat from the power device 30 to the housing 10. Its assembly tolerance only needs to consider the distance between the power device 30 and the housing 10. During actual installation, the position of the second heat-conducting block 50 can be determined first, ensuring it is in close contact with both the housing 10 and the power device 30. Then, it is connected to the first heat-conducting block 40 via the connecting structure 60. The position of the first heat-conducting block 40 depends only on the positions of the housing 10 and the power device 30, and is independent of other components of the optical module 100. This ensures that the second heat-conducting block 50 is in close contact with both the housing 10 and the power device 30. The second heat-conducting block 50 effectively conducts the heat from the power device 30 to the housing 10 for heat dissipation. When rework is required and the housing 10 is disassembled, the second heat-conducting block 50 will not be carried away by the housing 10 because it is fixedly connected to the first heat-conducting block 40. Since the second heat-conducting block 50 remains stationary, the power device 30, which is connected to the second heat-conducting block 50 with thermally conductive adhesive, will not be damaged.

[0027] In this embodiment, the power device 30 is a digital signal processor (DSP). The DSP is used in the optical module 100 to process and modulate various digital signals. The DSP requires a low operating temperature during operation. In this embodiment, a second heat-conducting block 50 is used to dissipate heat from the DSP separately, and the second heat-conducting block 50 is in close contact with both the DSP and the housing 10, effectively dissipating heat from the DSP.

[0028] In other embodiments of this utility model, the power device 30 may also be other chips in the optical module 100, which are not limited here.

[0029] In this embodiment, the first heat-conducting block 40 and the second heat-conducting block 50 are made of copper. The first heat-conducting block 40 and the second heat-conducting block 50 can also be referred to as the first heat sink and the second heat sink.

[0030] Continue to join Figure 6-8 As shown, in this embodiment, a through hole 43 is provided on the first heat-conducting block 40, and at least a portion of the second heat-conducting block 50 is accommodated in the through hole 43. The through hole 43 penetrates the third surface 41 and the fourth surface 42 so that the second heat-conducting block 50 can contact the power device 30 and the housing 10. The through hole 43 serves to limit the second heat-conducting block 50.

[0031] The aforementioned connecting structure 60 is disposed between the hole wall of the through hole 43 and the second heat-conducting block 50, and the second heat-conducting block 50 is fixed in the through hole 43 by the connecting structure 60. The connecting structure 60 can connect the first heat-conducting block 40 and the second heat-conducting block 50, so that the relative positions of the first heat-conducting block 40 and the second heat-conducting block 50 remain stable. It should be noted that the hole wall of the through hole 43 may include its peripheral hole sidewalls and the hole bottom wall opposite to the second heat-conducting block 50 in the height direction of the through hole 43.

[0032] In this embodiment, the through hole 43 is a square hole that is closed on all sides, formed by four hole sidewalls. It is conceivable that in other embodiments of this invention, one or both sides of the through hole 43 may be open, and the through hole 43 may only include three or two hole sidewalls. Of course, the through hole 43 can also be a circular hole.

[0033] The connection structure 60 includes a fixing adhesive 61 that fills the space between the through-hole 43 and the second heat-conducting block 50. The fixing adhesive 61 bonds the first heat-conducting block 40 and the second heat-conducting block 50. By bonding the first heat-conducting block 40 and the second heat-conducting block 50 with the fixing adhesive 61, on the one hand, the first heat-conducting block 40 and the second heat-conducting block 50 can be reliably connected together; on the other hand, heat on the second heat-conducting block 50 can be conducted to the first heat-conducting block 40 through the fixing adhesive 61. Generally, the volume of the first heat-conducting block 40 is larger than the volume of the second heat-conducting block 50. The transfer of heat from the second heat-conducting block 50 to the first heat-conducting block 40 is beneficial for the heat dissipation of the power device 30.

[0034] In this embodiment, the through hole 43 includes a first hole body 431 and a second hole body 432. The first hole body 431 is formed from the fourth surface 42 of the first heat-conducting block 40, and does not completely penetrate the first heat-conducting block 40, having a bottom wall 433. The second hole body 432 penetrates from the bottom wall 433 of the first hole body 431 to the third surface 41 of the first heat-conducting block 40, thus the through hole 43 penetrates the entire first heat-conducting block 40. That is, the through hole 43 is a stepped hole. The bottom wall 433 is the stepped surface of the stepped hole.

[0035] The second heat-conducting block 50 includes a first heat-conducting part 51 and a second heat-conducting part 52. A first aperture 431 houses at least a portion of the first heat-conducting part 51, and a second aperture 432 houses at least a portion of the second heat-conducting part 52. The second heat-conducting part 52 is thermally connected to the power device 30. The heat from the power device 30 is first conducted to the second heat-conducting part 52, then from the second heat-conducting part 52 to the first heat-conducting part 51, and finally to the housing 10.

[0036] The first hole 431 extends beyond the second hole 432 in the length and / or width direction of the first heat-conducting block 40, and the cross-section of the through hole 43 is approximately "convex". The first heat-conducting part 51 extends beyond the second heat-conducting part 52 in the length and / or width direction of the second heat-conducting block 50, and the cross-section of the second heat-conducting block 50 is approximately "convex". The shape of the through hole 43 matches the shape of the second heat-conducting block 50, and the bottom wall 433 of the first hole 431 can abut against the first heat-conducting part 51, preventing the first heat-conducting part 51 from entering the second hole 432.

[0037] In this embodiment, the adhesive 61 is filled between the hole wall of the first hole 431 and the first heat-conducting part 51. The adhesive 61 bonds the hole wall of the first hole 431 and the second heat-conducting part 52, thereby fixing the second heat-conducting block 50 to the first heat-conducting block 40. The hole wall of the first hole 431 includes a bottom wall 433 at its bottom and side walls around its perimeter, allowing for sufficient bonding area between the adhesive 61 and the first heat-conducting block 40. Furthermore, the bottom wall 433 can support the adhesive 61, preventing it from flowing downwards to the circuit board 20 and affecting the operation of the components on the circuit board 20.

[0038] Both the first heat-conducting part 51 and the first hole 431 are square. The fixing adhesive 61 can be filled into at least two diagonal corners of the first hole 431 to ensure that the relative positions of the first heat-conducting block 40 and the second heat-conducting block 50 can remain stable.

[0039] Specifically, the adhesive 61 can be filled into the four corners of the first hole 431, thus achieving multi-point bonding between the first heat-conducting block 40 and the first heat-conducting part 51, with the bonding points evenly distributed, ensuring a reliable and stable connection between the first heat-conducting block 40 and the first heat-conducting part 51. An escape corner 434 can be provided at the four corners of the first hole 431, and sufficient adhesive 61 can be filled into the escape corner 434 to ensure the adhesive 61 effectively bonds and fixes the first heat-conducting block 40 and the second heat-conducting block 50.

[0040] In other embodiments of this utility model, the connection structure 60 connecting the first heat-conducting block 40 and the second heat-conducting block 50 can be designed in other ways. For example, the connection structure 60 may include a protrusion extending from the second heat-conducting block 50, through which the second heat-conducting block 50 is connected to the first heat-conducting block 40.

[0041] In this embodiment, there is a gap h between the first heat-conducting part 51 and the bottom wall 433 of the hole. This gap h allows the second heat-conducting block 50 to have adjustment space relative to the first heat-conducting block 40 in the thickness direction of the optical module 100, so that the second heat-conducting block 50 can be fixed in the desired position.

[0042] Specifically, during the assembly of the optical module 100, the second heat-conducting block 50 is first attached to the power device 30, and then the second heat-conducting block 50 is connected to the first heat-conducting block 40 through the connecting structure 60. There is a gap h between the first heat-conducting part 51 and the bottom wall 433 of the hole, so that the movement of the second heat-conducting block 50 in the thickness direction of the optical module 100 is not restricted by the first heat-conducting block 40, thereby the second heat-conducting block 50 can be fixed in the required position.

[0043] In this embodiment, the second heat-conducting block 50 and the housing 10 are connected and fixed by a first thermally conductive adhesive 80. The first thermally conductive adhesive 80 fully contacts the second heat-conducting block 50 and the housing 10, which is beneficial to the heat conduction between the second heat-conducting block 50 and the housing 10.

[0044] The optical module 100 also includes a second thermally conductive adhesive 90 disposed between the power device 30 and the second heat-conducting block 50. The power device 30 and the second heat-conducting block 50 are thermally connected through the second thermally conductive adhesive 90. The second thermally conductive adhesive 90 fully contacts the second heat-conducting block 50 and the power device 30, which is beneficial for heat conduction between the second heat-conducting block 50 and the power device 30. Specifically, the first thermally conductive adhesive 80 is disposed between the first heat-conducting part 51 and the housing 10, and the second thermally conductive adhesive 90 is disposed between the second heat-conducting part 52 and the power device 30.

[0045] As described above, since the dimensional tolerance of the second heat-conducting block 50 only needs to take into account the distance between the power device 30 and the housing 10, the gap between the second heat-conducting block 50 and the power device 30 and the housing 10 can be controlled to be as small as possible, so that the thickness of the first thermally conductive adhesive 80 and the second thermally conductive adhesive 90 can be made extremely thin, so that the power device 30, the second heat-conducting block 50 and the housing 10 have high thermal conductivity.

[0046] As one might expect, both the first thermal adhesive 80 and the second thermal adhesive 90 are made of materials with high thermal conductivity, such as silicone grease or thermal paste.

[0047] Continue to join Figure 10-11 As shown, the first thermally conductive adhesive 80 is formed by extrusion of the second thermally conductive block 50 and the housing 10. A dispensing groove 11 is formed on the side of the housing 10 facing the first thermally conductive adhesive 80. When forming the first thermally conductive adhesive 80, the fluid-like material of the first thermally conductive adhesive 80 is first dotted onto the area of ​​the dispensing groove 11. Then, the second thermally conductive block 50 and the housing 10 extrude the material of the first thermally conductive adhesive 80, causing it to spread. Finally, the material of the first thermally conductive adhesive 80 is cured, thereby forming the first thermally conductive adhesive 80. It is conceivable that the shape of the dispensing groove 11 determines the final shape of the formed first thermally conductive adhesive 80. After setting the shape of the dispensing groove 11, it can shape the first thermally conductive adhesive 80 into a preset shape.

[0048] In this embodiment, the dispensing groove 11 includes two parallel first groove segments 111 and two parallel second groove segments 112. The two second groove segments 112 are located between the two first groove segments 111. The extending directions of the two first groove segments 111 and the extending directions of the two second groove segments 112 enclose a square area S. The two first groove segments 111 and the two second groove segments 112 do not intersect. The dispensing groove 11 also includes an arc-shaped segment 113 connecting the ends of the adjacent first groove segments 111 and second groove segments 112. The arc-shaped segment 113 protrudes outward from the square area S.

[0049] After the first thermally conductive adhesive 80 material in a fluid state is applied to the dispensing groove 11 area, the housing 10 and the second thermally conductive block 50 squeeze the first thermally conductive adhesive 80 material, and the first thermally conductive adhesive 80 material spreads to the inside and outside of the dispensing groove 11. The final formed first thermally conductive adhesive 80 includes a generally square main body 81 and four lugs 82 respectively connected to the four corners of the main body 81.

[0050] The dispensing groove 11 adopts the above design, and the four corners of the first thermally conductive adhesive 80 formed include four protruding ears 82, which solves the problem in the prior art that the four corners of the first thermally conductive adhesive 80 are rounded and cannot effectively cover the second thermally conductive block 50.

[0051] like Figure 3 , 4 As shown in Figures 9 and 12, the optical module 100 further includes a silicon photonic chip 70 electrically connected to the first surface 21 of the circuit board 20, an optical emitting module 71 optically coupled to the silicon photonic chip 70, and a first optical fiber assembly 72. Both the optical emitting module 71 and the first optical fiber assembly 72 are fixed to the first heat-conducting block 40.

[0052] The optical emitting module 71 is used to emit light without carrying a signal to the silicon photonic chip 70. The silicon photonic chip 70 is used to modulate the light without carrying a signal emitted by the optical emitting module 71 into light carrying a signal. The light carrying a signal is transmitted outward through the first optical fiber assembly 72.

[0053] In this embodiment, the optical emitting module 71 and the first optical fiber assembly 72 are fixed on the third surface 41 of the first heat-conducting block 40. The optical emitting module 71 and the first optical fiber assembly 72 can be positioned relative to the first heat-conducting block 40, and the heat from the optical emitting module 71 and the first optical fiber assembly 72 can be transferred to the first heat-conducting block 40 for heat dissipation. The fourth surface 42 of the first heat-conducting block 40 is thermally connected to the housing 10, meaning that the heat from the first heat-conducting block 40 can be conducted to the housing 10 for heat dissipation.

[0054] The optical emission module 71 and the first optical fiber assembly 72 can be connected to the first heat-conducting block 40 by adhesive bonding. The fourth surface 42 of the first heat-conducting block 40 is thermally connected to the housing 10. This should be understood as the fourth surface 42 of the first heat-conducting block 40 being in direct contact with the housing 10, allowing heat to be transferred between the first heat-conducting block 40 and the housing 10. Alternatively, a thermally conductive material can be filled between the fourth surface 42 of the first heat-conducting block 40 and the housing 10, allowing heat transfer between the first heat-conducting block 40 and the housing 10 through the thermally conductive material.

[0055] In this embodiment, the optical module 100 further includes a second optical fiber assembly 73 disposed on the second surface of the circuit board. The second optical fiber assembly 73 is used to receive external optical signals. The second surface of the circuit board is provided with an optical receiving assembly. The optical signals received by the second optical fiber assembly 73 will be transmitted to the optical receiving assembly.

[0056] In this embodiment, the housing 10 applies pressure to the second heat-conducting block 50, and under the pressure of the housing 10, the second heat-conducting block 50 is in close proximity to the power device 30. This minimizes the gaps between the second heat-conducting block 50 and the power device 30, as well as the gaps between the second heat-conducting block 50 and the housing 10. Consequently, the first thermally conductive adhesive 80 and the second thermally conductive adhesive 90 become extremely thin, which facilitates the second heat-conducting block 50 conducting heat from the power device 30 to the housing 10.

[0057] In this embodiment, the projected area of ​​the second heat-conducting block 40 on the first surface 21 is much larger than the projected area of ​​the power device 30 on the first surface 21, and the thickness of the second heat-conducting block 50 is also greater than the thickness of the power device 30. In this way, the heat flux density of the second heat-conducting block 50 during heat conduction can be reduced, and the heat dissipation efficiency of the power device 30 can be improved.

[0058] Specifically, the projected area of ​​the second heat-conducting block 50 on the first surface 21 is at least three times the projected area of ​​the power device 30 on the first surface 21, and the thickness of the second heat-conducting block 50 is at least twice the thickness of the power device 30.

[0059] The housing 10 includes a main housing 12 and a heat sink 13. A receiving cavity 121 is formed inside the main housing 12, and the circuit board 20 and power device 30 are located inside the receiving cavity 121. The heat sink 13 is detachably connected to the main housing 12 and can be used to open and close the receiving cavity 121.

[0060] It is conceivable that the aforementioned silicon photonics chip 70, optical emission module 71, first optical fiber assembly 72, and second optical fiber assembly 73 may all be located in the receiving cavity 121.

[0061] In this embodiment, both the first heat-conducting block 40 and the second heat-conducting block 50 are thermally connected to the heat dissipation cover 13. That is, the heat on the first heat-conducting block 40 and the second heat-conducting block 50 is first transferred to the heat dissipation cover 13, and then transferred to the main housing 12 through the heat dissipation cover 13. The heat dissipation cover 13 is provided with multiple heat dissipation channels 131 to enhance the heat dissipation effect of the heat dissipation cover 13.

[0062] The circuit board 20 is fixed to the main housing 12. Because the second heat-conducting block 50 is connected to the first heat-conducting block 40, when the heat sink 13 is separated from the main housing 12, the heat sink 13 will not lift the second heat-conducting block 50, and the position of the second heat-conducting block 50 can remain stable. The main housing 12 includes a first housing 122 and a second housing 123, which are detachably connected together. The first housing 122 and the second housing 123 can also be separated for maintenance and repair of the components inside the main housing 12.

[0063] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0064] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. An optical module, comprising a housing, a circuit board located within the housing, a power device, and an optoelectronic element, wherein the circuit board has a first surface and a second surface disposed opposite to each other in the thickness direction, characterized in that, The optical module further includes a first heat-conducting block, a second heat-conducting block, and a connecting structure connecting the first heat-conducting block and the second heat-conducting block. The first heat-conducting block and the power device are both fixed to the first surface of the circuit board. The second heat-conducting block is fixed to the first heat-conducting block through the connecting structure and thermally connects the power device to the housing.

2. The optical module according to claim 1, characterized in that, The first heat-conducting block includes a third surface facing the circuit board and a fourth surface facing away from the circuit board. A through hole is formed on the first heat-conducting block, penetrating the third surface and the fourth surface. The connecting structure is disposed between the hole wall of the through hole and the second heat-conducting block. The second heat-conducting block is fixed in the through hole by the connecting structure.

3. The optical module according to claim 2, characterized in that, The connection structure includes a fixing adhesive that fills the hole wall of the through hole and the second heat-conducting block, and the fixing adhesive bonds the first heat-conducting block and the second heat-conducting block.

4. The optical module according to claim 3, characterized in that, The through hole includes a first hole formed from the fourth surface and a second hole extending from the bottom wall of the first hole to the third surface. The second heat-conducting block includes a first heat-conducting part located at least partially within the first hole and a second heat-conducting part located at least partially within the second hole. The second heat-conducting part is thermally connected to the power device. The first hole extends beyond the second hole in the length and / or width direction of the first heat-conducting block, and the first heat-conducting part extends beyond the second heat-conducting part in the length and / or width direction of the second heat-conducting block. The fixing adhesive fills the space between the hole wall of the first hole and the first heat-conducting part.

5. The optical module according to claim 4, characterized in that, There is a gap between the first heat-conducting part and the bottom wall of the hole.

6. The optical module according to claim 1, characterized in that, The second heat-conducting block and the housing are connected and fixed together by the first heat-conducting adhesive.

7. The optical module according to claim 1, characterized in that, A second thermally conductive adhesive is provided between the power device and the second thermally conductive block, and the power device and the second thermally conductive block are thermally connected through the second thermally conductive adhesive.

8. The optical module according to claim 2, characterized in that, The optical module further includes a silicon photonic chip electrically connected to the first surface, an optical emitting module optically coupled to the silicon photonic chip, and a first optical fiber assembly. The optical emitting module and the first optical fiber assembly are both fixed to the third surface of the first heat-conducting block, and the fourth surface of the first heat-conducting block is thermally connected to the housing.

9. The optical module according to claim 1, characterized in that, The projected area of ​​the second heat-conducting block on the first surface is at least three times the projected area of ​​the power device on the first surface, and the thickness of the second heat-conducting block is at least twice the thickness of the power device.

10. The optical module according to claim 1, characterized in that, The housing includes a main housing with a receiving cavity, and a heat dissipation cover detachably connected to the main housing for opening and closing the receiving cavity. The circuit board and power devices are both located inside the receiving cavity, and the first heat-conducting block and the second heat-conducting block are both thermally connected to the heat dissipation cover.

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