An optical module

Abstract

In the optical module provided by the present disclosure, the surface of the circuit board comprises a first pad. One end of the first pad is connected to the optical modulation chip by wire bonding, and the other end forms two connection ports. Therefore, optical modulation chips with different low-frequency pad arrangements can be respectively connected to different positions on the surface of the circuit board through the first pad, and the electrical connection between the optical modulation chips with different low-frequency pad arrangements and the circuit board is adapted. Through the two connection ports, the first pad is multiplexed, and optical modulation chips with different low-frequency pad arrangements are compatible. The surface of the circuit board comprises a third pad and a fourth pad. The size of the fourth pad is larger than that of the third pad, and the number of wire bonds between the fourth pad and the optical modulation chip is less than that between the third pad and the optical modulation chip. Therefore, the fourth pad can adapt to a pad corresponding to multiple wire-bonded optical modulation chip pads, or a pad corresponding to a small number of wire-bonded optical modulation chip pads, thereby meeting the wire-bonding quantity requirements of different optical modulation chip pads and being compatible with optical modulation chips with different low-frequency pad arrangements.

Description

Technical Field

[0001] This disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, advancements in optical communication technology have become increasingly important. In optical communication technology, the optical module, as one of the key components in optical communication equipment, enables photoelectric signal conversion; and in the development of optical communication technology, the data transmission rate of optical modules is required to continuously improve. Utility Model Content

[0003] In some embodiments, an optical module is provided to provide a circuit board pad layout design that is compatible with optical modulation chips with different low-frequency pad layouts.

[0004] In some embodiments, an optical module is provided, comprising: The light emitting component includes: A laser is configured to output light that does not carry a signal. An optical modulation chip is disposed in the output optical path of the laser and is configured to modulate the light that does not carry a signal to generate an optical signal; A circuit board, electrically connected to the optical modulation chip, wherein the surface of the circuit board includes: The first pad has one end wire-connected to the optical modulation chip, and the other end forms two connection ports. When one connection port is electrically connected to a trace on the surface of the circuit board, the other connection port is not electrically connected to another trace on the surface of the circuit board. The second pad is wire-connected to the optical modulation chip; The third pad is wire-connected to the optical modulation chip, and its size is larger than that of the second pad. The number of wires between the third pad and the optical modulation chip is greater than the number of wires between the second pad and the optical modulation chip. The fourth pad is wire-connected to the optical modulation chip. Its size is larger than that of the third pad, and the number of wires between the fourth pad and the optical modulation chip is less than the number of wires between the third pad and the optical modulation chip.

[0005] One of the above technical solutions has the following advantages or beneficial effects: The optical module includes an optical emitting component and a circuit board. The optical emitting component includes a laser and an optical modulation chip. The laser is configured to output light without carrying a signal. The optical modulation chip is located in the output optical path of the laser and is configured to modulate the light without carrying a signal to generate an optical signal. The circuit board is electrically connected to the optical modulation chip. Different models of optical modulation chips have different low-frequency pad arrangements. The surface of the circuit board includes a first pad. One end of the first pad is wire-connected to the optical modulation chip, and the other end forms two connection ports. Optical modulation chips with different low-frequency pad arrangements can be electrically connected to different positions on the circuit board surface through the first pad to adapt to the electrical connection between optical modulation chips with different low-frequency pad arrangements and the circuit board. When one connection port is electrically connected to a trace on the circuit board surface, the other connection port is not electrically connected to another trace on the circuit board surface. The connection port electrically connected to the trace on the circuit board surface can electrically connect the optical modulation chip to the target position on the circuit board surface, while the other connection port remains unconnected. By setting different connection ports, the first pad is reused, thus enabling electrical connections between optical modulation chips and circuit boards with different low-frequency pad arrangements. The circuit board surface includes a second, third, and fourth pad. The second pad is wire-connected to the optical modulation chip. The third pad is also wire-connected to the optical modulation chip; the third pad is larger than the second pad, and the number of wires between the third pad and the optical modulation chip is greater than the number between the second pad and the optical modulation chip. Because the third pad is larger than the second pad, it can support a greater number of wires, accommodating optical modulation chip pads with multiple wires per pad. The fourth pad is wire-bonded to the optical modulation chip. The size of the fourth pad is larger than that of the third pad. The number of wires between the fourth pad and the optical modulation chip is less than that between the third pad and the optical modulation chip. Therefore, the fourth pad can be adapted to an optical modulation chip pad with multiple wires corresponding to one pad, or an optical modulation chip pad with a small number of wires corresponding to one pad. This allows it to be compatible with the wire bonding requirements of optical modulation chips with different low-frequency pad arrangements. The same circuit board is compatible with the electrical connection between optical modulation chips with different low-frequency pad arrangements and the circuit board.

[0006] In some embodiments, the circuit board surface includes: Fifth pad; The sixth pad is located on one side of the fifth pad; one end of the sixth pad and the fifth pad are connected to the same position on the circuit board; one of the sixth pad and the fifth pad is electrically connected to the optical modulation chip, while the other pad is not electrically connected to the optical modulation chip.

[0007] One of the above technical solutions has the following advantages or beneficial effects: The circuit board surface includes a fifth pad and a sixth pad. The sixth pad is located on one side of the fifth pad, and one end of the sixth pad and the fifth pad are connected to the same position on the circuit board. Therefore, the sixth pad and the fifth pad have the same electrical properties. The fifth pad and the sixth pad are respectively adapted to pads with the same connection function but different physical positions in different low-frequency pad arrangement optical modulation chips. One of the sixth pads and the fifth pad is electrically connected to the optical modulation chip, while the other pad is not electrically connected. When the sixth pad is wire-connected to the optical modulation chip, the fifth pad is left unconnected, achieving an electrical connection between one type of optical modulation chip and the circuit board. When the fifth pad is wire-connected to the optical modulation chip, the sixth pad is left unconnected, achieving an electrical connection between another type of optical modulation chip and the circuit board.

[0008] In some embodiments, the circuit board surface includes: The seventh pad is connected to the optical modulation chip by a wire; or, it is not connected to the optical modulation chip by a wire.

[0009] One of the above technical solutions has the following advantages or beneficial effects: the circuit board surface includes a seventh pad. By setting the seventh pad, its connection state can be configured according to the model of the optical modulation chip being electrically connected, enabling the same circuit board to adapt to the differences in pin layout of different models of optical modulation chips. When the optical modulation chip includes pads with specific connection functions, a wire bond connects the seventh pad to the optical modulation chip. When the optical modulation chip does not include pads with specific connection functions, no wire bond connects the seventh pad to the optical modulation chip; the seventh pad is left empty, serving as a blank pad and not participating in circuit connections.

[0010] In some embodiments, the number of pads on the circuit board surface is greater than the number of pads on the optical modulation chip surface.

[0011] One of the above technical solutions has the following advantages or beneficial effects: the number of pads on the circuit board surface is greater than the number of pads on the optical modulation chip surface, so the circuit board surface has more pads than the optical modulation chip surface. Therefore, the circuit board surface can meet the connection requirements of pads with the same function but different physical positions between optical modulation chips with different low-frequency pad arrangements, and can also meet the connection requirements of pads with the same function but different numbers between optical modulation chips with different low-frequency pad arrangements. This makes it easy for the same circuit board to be compatible with optical modulation chips with different low-frequency pad arrangements.

[0012] In some embodiments, an optical module is provided, comprising: The light emitting component includes: A laser is configured to output light that does not carry a signal. An optical modulation chip is disposed in the output optical path of the laser and is configured to modulate the light that does not carry a signal to generate an optical signal; A circuit board, electrically connected to the optical modulation chip, wherein the surface of the circuit board includes: The first pad has one end wire-connected to the optical modulation chip, and the other end forms two connection ports. When one connection port is electrically connected to a trace on the surface of the circuit board, the other connection port is not electrically connected to another trace on the surface of the circuit board. The second pad is wire-connected to the optical modulation chip; The third pad is wire-connected to the optical modulation chip, and its size is larger than that of the second pad. The number of wires between the third pad and the optical modulation chip is greater than the number of wires between the second pad and the optical modulation chip. The fourth pad is wire-connected to the optical modulation chip, and its size is larger than that of the third pad. The number of wires between the fourth pad and the optical modulation chip is greater than the number of wires between the third pad and the optical modulation chip.

[0013] One of the above technical solutions has the following advantages or beneficial effects: The optical module includes an optical emitting component and a circuit board. The optical emitting component includes a laser and an optical modulation chip. The laser is configured to output light without carrying a signal. The optical modulation chip is located in the output optical path of the laser and is configured to modulate the light without carrying a signal to generate an optical signal. The circuit board is electrically connected to the optical modulation chip. Optical modulation chips with different low-frequency pad arrangements have different low-frequency pad arrangements. The surface of the circuit board includes a first pad. One end of the first pad is wire-connected to the optical modulation chip, and the other end forms two connection ports. Optical modulation chips with different low-frequency pad arrangements can be electrically connected to different positions on the circuit board surface through the first pad to adapt to the electrical connection between optical modulation chips with different low-frequency pad arrangements and the circuit board. When one connection port is electrically connected to a trace on the circuit board surface, the other connection port is not electrically connected to another trace on the circuit board surface. The connection port electrically connected to the trace on the circuit board surface can electrically connect the optical modulation chip to a target position on the circuit board surface, while the other connection port remains unconnected. By setting different connection ports, the first pad is reused, thus enabling electrical connections between optical modulation chips and circuit boards with different low-frequency pad arrangements. The circuit board surface includes a second, third, and fourth pad. The second pad is wire-connected to the optical modulation chip. The third pad is also wire-connected to the optical modulation chip; the third pad is larger than the second pad, and the number of wires between the third pad and the optical modulation chip is greater than the number between the second pad and the optical modulation chip. Because the third pad is larger than the second pad, it can support a greater number of wires, accommodating optical modulation chip pads with multiple wires per pad. The fourth pad is wire-connected to the optical modulation chip. The size of the fourth pad is larger than that of the third pad, and the number of wires between the fourth pad and the optical modulation chip is greater than that between the third pad and the optical modulation chip. Therefore, the fourth pad can be adapted to an optical modulation chip pad with multiple wires corresponding to one pad, which meets the wire connection requirements of optical modulation chips with different low-frequency pad arrangements. The same circuit board is compatible with the electrical connection between optical modulation chips with different low-frequency pad arrangements and the circuit board.

[0014] In some embodiments, the circuit board surface includes: Fifth pad; The sixth pad is located on one side of the fifth pad; one end of the sixth pad and the fifth pad are connected to the same position on the circuit board; one of the sixth pad and the fifth pad is electrically connected to the optical modulation chip, while the other pad is not electrically connected to the optical modulation chip.

[0015] One of the above technical solutions has the following advantages or beneficial effects: The circuit board surface includes a fifth pad and a sixth pad. The sixth pad is located on one side of the fifth pad, and one end of the sixth pad and the fifth pad are connected to the same position on the circuit board. Therefore, the sixth pad and the fifth pad have the same electrical properties. The fifth pad and the sixth pad are respectively adapted to pads with the same connection function but different physical positions in different low-frequency pad arrangement optical modulation chips. One of the sixth pads and the fifth pad is electrically connected to the optical modulation chip, while the other pad is not electrically connected. When the sixth pad is wire-connected to the optical modulation chip, the fifth pad is left unconnected, achieving an electrical connection between one type of optical modulation chip and the circuit board. When the fifth pad is wire-connected to the optical modulation chip, the sixth pad is left unconnected, achieving an electrical connection between another type of optical modulation chip and the circuit board.

[0016] In some embodiments, the circuit board surface includes: The seventh pad is connected to the optical modulation chip by a wire; or, it is not connected to the optical modulation chip by a wire.

[0017] One of the above technical solutions has the following advantages or beneficial effects: the circuit board surface includes a seventh pad. By setting the seventh pad, its connection state can be configured according to the model of the optical modulation chip being electrically connected, enabling the same circuit board to adapt to the differences in pin layout of different models of optical modulation chips. When the optical modulation chip includes pads with specific connection functions, a wire bond connects the seventh pad to the optical modulation chip. When the optical modulation chip does not include pads with specific connection functions, no wire bond connects the seventh pad to the optical modulation chip; the seventh pad is left empty, serving as a blank pad and not participating in circuit connections.

[0018] In some embodiments, the number of pads on the circuit board surface is greater than the number of pads on the optical modulation chip surface.

[0019] One of the above technical solutions has the following advantages or beneficial effects: the number of pads on the circuit board surface is greater than the number of pads on the optical modulation chip surface, so the circuit board surface has more pads than the optical modulation chip surface. The circuit board surface can meet the pad connection requirements of different optical modulation chips with the same function but different physical positions, and can also meet the pad connection requirements of different optical modulation chips with the same function but different numbers of pads. This makes it easy for the same circuit board to be compatible with optical modulation chips with different low-frequency pad arrangements.

[0020] In some embodiments, an optical module is provided, comprising: The light emitting component includes: A laser is configured to output light that does not carry a signal. An optical modulation chip is disposed in the output optical path of the laser and is configured to modulate the light that does not carry a signal to generate an optical signal; A circuit board, electrically connected to the optical modulation chip, wherein the surface of the circuit board includes: The first pad has one end wire-connected to the optical modulation chip, and the other end has a first connection port and a second connection port. When one end is electrically connected to the optical modulation chip with a first low-frequency pad arrangement, the first connection port is electrically connected to a first trace on the surface of the circuit board. When one end is electrically connected to the optical modulation chip with a second low-frequency pad arrangement, the second connection port is electrically connected to a second trace on the surface of the circuit board. The second pad is wire-connected to the optical modulation chip; The third pad is wire-connected to the optical modulation chip, and its size is larger than that of the second pad. The number of wires between the third pad and the optical modulation chip is greater than the number of wires between the second pad and the optical modulation chip. The fourth pad is larger than the third pad. When the fourth pad is electrically connected to an optical modulation chip with a first low-frequency pad arrangement, the number of wires leading out from the fourth pad is greater than the number of wires between the third pad and the optical modulation chip. When the fourth pad is electrically connected to an optical modulation chip with a second low-frequency pad arrangement, the number of wires leading out from the fourth pad is less than the number of wires between the third pad and the optical modulation chip.

[0021] One of the above technical solutions has the following advantages or beneficial effects: The optical module includes an optical emitting component and a circuit board. The optical emitting component includes a laser and an optical modulation chip. The laser is configured to output light without carrying a signal. The optical modulation chip is located in the output optical path of the laser and is configured to modulate the light without carrying a signal to generate an optical signal. The circuit board is electrically connected to the optical modulation chip. Different types of optical modulation chips have different low-frequency pad arrangements. The surface of the circuit board includes a first pad. One end of the first pad is wire-connected to the optical modulation chip, and the other end forms a first connection port and a second connection port. Optical modulation chips with different low-frequency pad arrangements can be electrically connected to different positions on the circuit board surface through the first pad to adapt to the electrical connection between different optical modulation chips and the circuit board. Of the two connection ports, when one connection port is electrically connected to a trace on the circuit board surface, the other connection port is not electrically connected to another trace on the circuit board surface. The connection port electrically connected to the trace on the circuit board surface can electrically connect the optical modulation chip to the target position on the circuit board surface, while the other connection port remains unconnected. When the first pad is electrically connected to an optical modulation chip with a first low-frequency pad arrangement, the first connection port is electrically connected to the first trace on the circuit board surface, and the second connection port is idle. When the first pad is electrically connected to an optical modulation chip with a second low-frequency pad arrangement, the second connection port is electrically connected to the second trace on the circuit board surface, and the first connection port is idle. By setting different connection ports, the first pad can be reused, thereby enabling compatibility between optical modulation chips with different low-frequency pad arrangements and the circuit board. The circuit board surface includes a second pad, a third pad, and a fourth pad. The second pad is wire-connected to the optical modulation chip. The third pad is wire-connected to the optical modulation chip. The size of the third pad is larger than that of the second pad, and the number of wires between the third pad and the optical modulation chip is greater than the number of wires between the second pad and the optical modulation chip. The third pad is larger than the second pad, so it can support a larger number of wires to accommodate optical modulation chip pads with multiple wires per pad. The fourth pad is wire-bonded to the optical modulation chip. The size of the fourth pad is larger than that of the third pad. The number of wires between the fourth pad and the optical modulation chip is less than that between the third pad and the optical modulation chip. Therefore, the fourth pad can be adapted to an optical modulation chip pad with multiple wires corresponding to one pad, or an optical modulation chip pad with a small number of wires corresponding to one pad. This allows it to be compatible with the wire bonding requirements of different optical modulation chips. The same circuit board is compatible with the electrical connection between optical modulation chips with different low-frequency pad arrangements and the circuit board.

[0022] In some embodiments, the circuit board surface includes: Fifth pad; The sixth pad is located on one side of the fifth pad; one end of the sixth pad and the fifth pad are connected to the same position on the circuit board; one of the sixth pad and the fifth pad is electrically connected to the optical modulation chip, while the other pad is not electrically connected to the optical modulation chip. The seventh pad is connected to the optical modulation chip by a wire; or, it is not connected to the optical modulation chip by a wire.

[0023] One of the above technical solutions has the following advantages or beneficial effects: The circuit board surface includes a fifth pad and a sixth pad. The sixth pad is located on one side of the fifth pad, and one end of the sixth pad and the fifth pad are connected to the same position on the circuit board. Therefore, the sixth pad and the fifth pad have the same electrical properties, and the fifth pad and the sixth pad are respectively adapted to pads with the same connection function but different physical locations in different optical modulation chips. One of the sixth pads and the fifth pad is electrically connected to the optical modulation chip, while the other pad is not electrically connected. When the sixth pad is wire-connected to the optical modulation chip, the fifth pad is left unconnected, achieving an electrical connection between one type of optical modulation chip and the circuit board. When the fifth pad is wire-connected to the optical modulation chip, the sixth pad is left unconnected, achieving an electrical connection between another type of optical modulation chip and the circuit board. The circuit board surface includes a seventh pad. By setting the seventh pad, its connection state can be configured according to the model of the electrically connected optical modulation chip, enabling the same circuit board to adapt to the differences in pin layout of different models of optical modulation chips. When the optical modulation chip includes pads with specific connection functions, a wire bond connects the seventh pad to the optical modulation chip. When the optical modulation chip does not include pads with specific connection functions, no wire bond connects the seventh pad to the optical modulation chip; the seventh pad remains empty and is used as a blank pad without participating in circuit connections. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are merely drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. Furthermore, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0025] Figure 1 This is a schematic diagram of the structure of an optical module access switch according to some embodiments; Figure 2 This is a partial structural diagram of a switch according to some embodiments; Figure 3 This is a structural diagram of an optical module according to some embodiments; Figure 4 An exploded view of an optical module according to some embodiments; Figure 5 This is a structural diagram of an optical module according to some embodiments; Figure 6 A partial view of the interior of an optical module according to some embodiments Figure 1 ; Figure 7 A partial view of the interior of an optical module according to some embodiments Figure 2 ; Figure 8 This is a surface pin structure diagram of a first optical modulation chip according to some embodiments; Figure 9 This is a surface pin structure diagram of a second optical modulation chip according to some embodiments; Figure 10 This is a schematic diagram of a circuit board surface pad arrangement according to some embodiments; Figure 11 This is a schematic diagram of the electrical connection between a circuit board and a first optical modulation chip according to some embodiments; Figure 12 This is a schematic diagram of the electrical connection between a circuit board and a second optical modulation chip according to some embodiments; Figure 13 This is a schematic diagram of wire bonding between a circuit board and a first optical modulation chip according to some embodiments; Figure 14 This is a schematic diagram of wire bonding between a circuit board and a second optical modulation chip according to some embodiments. Detailed Implementation

[0026] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0027] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0028] In optical communication technology, information is loaded onto light to generate optical signals, which are then used to transmit information between information processing devices. Connections are established between these devices via optical transmission equipment. Optical power loss is minimal during transmission through this equipment, allowing for long-distance transmission with relatively low power loss. Light boasts extremely high transmission speeds, and the cost of optical transmission equipment, such as fiber optic cables, is lower than that of electrical transmission equipment like copper wires. Using optical signals to transmit information offers advantages such as long-distance transmission, high speed, and low cost.

[0029] Information processing equipment typically includes switches, servers, optical network units (ONUs), optical distribution networks (ODNs), optical line terminals (OLTs), gateways, routers, mobile phones, computers, tablets, televisions, etc.; optical transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can recognize and process electrical signals, while optical transmission equipment can transmit optical signals. Therefore, optical modules are needed between the optical transmission equipment and the information processing equipment to perform the conversion between optical and electrical signals.

[0030] In some embodiments, the optical signal input and / or optical signal output of the optical module are connected to an optical fiber, and the electrical signal input and / or electrical signal output of the optical module are connected to a switch; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the switch; a second electrical signal from the switch is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.

[0031] Information processing equipment connected to optical modules is also known as the host computer for optical modules. In access network transmission scenarios, the host computer for optical modules is usually an ONU, ODN, or OLT; in data center transmission scenarios, the host computer for optical modules is usually a Switch or Server.

[0032] Figure 1 This is a schematic diagram of the structure of an optical module access switch according to some embodiments. For example... Figure 1 As shown, switch 100 has multiple optical module interfaces. Multiple optical modules are inserted into the switch through these interfaces, establishing electrical signal communication between the optical modules and the switch. Optical fiber 101 is connected to the optical modules, establishing optical signal communication between the optical fiber and the optical modules. One end of optical fiber 101 is connected to the optical module, and the other end of optical fiber 101 (…) Figure 1 (not shown in the image) connects to another optical module ( Figure 1 (Not shown in the image), another optical module accesses the server ( Figure 1 (not shown in the image) or another switch ( Figure 1 (Not shown in the image).

[0033] In some embodiments, the optical fiber 101 and the optical module 200 are detachably connected; in other embodiments, the optical fiber 101 and the optical module 200 are non-detachably connected.

[0034] The switch 100 is configured to provide data electrical signals to the optical module 200, or receive data electrical signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0035] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0036] Figure 2 This is a partial structural diagram of a switch according to some embodiments. To clearly show the connection relationship between the optical module 200 and the switch 100, Figure 2 Only the structure of the switch 100 related to the optical module 200 is shown. (Example) Figure 2As shown, in some embodiments, the switch 100 further includes a PCB circuit board 102 disposed in the receiving cavity, and a cage 103 disposed on the surface of the PCB circuit board 102; the optical module 200 is inserted into the cage 103 and fixed by the cage 103.

[0037] In some embodiments, a heat sink 104 is provided on the cage 103 to dissipate heat for the optical module; in some embodiments, the heat sink 104 has protruding structures such as fins to increase the heat dissipation area.

[0038] In some embodiments, an electrical connector is provided inside the cage 103, which is configured to access the electrical interface of the optical module 200.

[0039] In some embodiments, the optical module 200 is inserted into the cage 103 of the switch 100, and the cage 103 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 103 and then diffused through the heat sink 104.

[0040] In some embodiments, the optical module 200 is inserted into the cage 103 of the switch 100, and the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 103, thereby establishing an electrical signal connection between the optical module 200 and the switch 100.

[0041] In some embodiments, the optical interface of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0042] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical interface and the other is an optical interface. In some embodiments, the shell forms an opening that serves as both an electrical interface and an optical interface.

[0043] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0044] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0045] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 (The right end), opening 205 is also located at the end of optical module 200 ( Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0046] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0047] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0048] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0049] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the switch 100.

[0050] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0051] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0052] In some implementations, the gold fingers 301 are disposed on the surface of one side of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers 301 are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to applications with high pin count requirements.

[0053] In some implementations, the gold fingers of the circuit board extend from the electrical interface and insert into the electrical connector of the switch 100; the circuit board is inserted into the cage 106, and the gold fingers 301 are connected to the electrical connector inside the cage 106. The gold fingers 301 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0054] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0055] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the switch 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0056] In some embodiments, the optical module includes a light emitting component 400. In some embodiments, the optical module includes a light receiving component 500. In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold finger 301.

[0057] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0058] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0059] Figure 5 This is a diagram illustrating the internal structure of an optical module according to some embodiments. Figure 6 A partial view of the interior of an optical module according to some embodiments Figure 1 , Figure 7 A partial view of the interior of an optical module according to some embodiments Figure 2 .like Figures 5-7 As shown, in some embodiments, the surface of the circuit board 300 is provided with a light emitting component 400 and a light receiving component 500.

[0060] In some embodiments, the light emitting component 400 may include a laser 401. The laser 401 may emit light along its side without modulating the optical signal, so that the light emitted by the laser 401 does not carry an optical signal. The laser 401 is a DFB laser.

[0061] In some embodiments, the light emitting component 400 may include a lens 402. The lens 402 is located in the light output path of the laser 401. The lens 402 may be a converging lens to converge the diverging light emitted by the laser 401.

[0062] In some embodiments, the light emitting component 400 may include an isolator 403. The isolator 403 is located in the light output path of the lens 402 to prevent light emitted by the laser 401 from returning to the laser 401, thereby ensuring the light output quality of the laser 401.

[0063] In some embodiments, the light emitting component 400 may include an optical modulation chip 404. The optical modulation chip 404 is located in the output optical path of the isolator 403 and receives the light output from the isolator 403. The optical modulation chip 404 performs signal phase modulation on the light output from the isolator 403 to generate an optical signal.

[0064] In some embodiments, the optical modulation chip 404 integrates an MZ modulator to modulate the optical signal and transmit it. The optical modulation chip 404 can be a silicon photonics chip, a thin-film lithium niobate chip, or a III-V group chip.

[0065] In some embodiments, the light emitting component 400 may include a driver chip 405. The driver chip 405 is disposed on one side of the light modulation chip 404. The driver chip 405 is electrically connected to the light modulation chip 404, and the driver chip 405 provides a driving electrical signal to the light modulation chip 404 to drive the light modulation chip 404 to modulate the light signal.

[0066] In some embodiments, the optical emitting component 400 may include an optical fiber array 406. The optical fiber array 406 is end-face coupled to the optical modulation chip 404. The optical fiber array 406 is located in the optical output path of the optical modulation chip 404 to transmit the optical signal modulated by the optical modulation chip 404 to the outside.

[0067] In some embodiments, the light emitted by the laser 401 is transmitted to the optical modulation chip 404, where it is modulated to generate an optical signal. The optical signal is then output from the optical modulation chip 404 and transmitted through the fiber array 406.

[0068] In some embodiments, the laser 401, lens 402, and isolator 403 are located in the incident optical path of the optical modulation chip 404, providing the light source to be modulated to the optical modulation chip 404. The fiber array 406 is coupled to the output optical port of the optical modulation chip 404. Since the incident and output ports of the optical modulation chip 404 are formed on the same side, the laser 401, lens 402, isolator 403, and fiber array 406 are located on the same side of the optical modulation chip 404.

[0069] In some embodiments, the light receiving component 500 may include a refractive element 501. The end face of the refractive element 501 is formed with a reflective surface 5011 to change the transmission direction of the light signal within the refractive element 501.

[0070] In some embodiments, the light receiving component 500 may include a light receiving chip 502. The light receiving chip 502 is located below the reflective surface 5011 to receive the light signal output from the reflective surface 5011. The light receiving chip 502 converts the received light signal into a photocurrent signal.

[0071] In some embodiments, the light receiving component 500 may include a transimpedance amplifier chip 503. The transimpedance amplifier chip 503 is disposed on one side of the light receiving chip 502. The transimpedance amplifier chip 503 converts the photocurrent signal output by the light receiving chip 502 into a photovoltage signal and amplifies the photovoltage signal.

[0072] In some embodiments, the refracting element 501 includes an optical fiber extending toward the optical receiver chip 502, with the end of the optical fiber exposed above the optical receiver chip 502. A reflective surface 5011 is formed at the end of the optical fiber, which is also exposed above the optical receiver chip 502. The reflective surface 5011 is used to reflect and change the transmission direction of the optical signal transmitted through the optical fiber, thereby reflecting the optical signal transmitted through the optical fiber to the optical receiver chip 502 and achieving a reversal of the optical path.

[0073] Figure 8 This is a surface pin structure diagram of a first optical modulation chip according to some embodiments. Figure 9 This is a surface pin structure diagram of a second optical modulation chip according to some embodiments. Figure 8 and Figure 9 As shown, in some embodiments, different types of optical modulation chips have different low-frequency pad arrangements. The first optical modulation chip 404a and the second optical modulation chip 404b are two different types of chips, and their surface pin distribution structures are not entirely the same.

[0074] In some embodiments, a first high-frequency pin array 414a is provided at one end of the first optical modulation chip 404a, and a first low-frequency pin array 424a is provided at the adjacent end. Exemplarily, the first high-frequency pin array 414a is located at the left end, and the first low-frequency pin array 424a is located at the top end. In some embodiments, a second high-frequency pin array 414b is provided at one end of the second optical modulation chip 404b, and a second low-frequency pin array 424b is provided at the adjacent end. Exemplarily, the second high-frequency pin array 414b is located at the left end, and the second low-frequency pin array 424b is located at the top end.

[0075] In some embodiments, the first high-frequency pin array 414a and the second high-frequency pin array 414b may have the same pin arrangement. For example, they have the same number, order and spacing of pins, thereby fixing the high-frequency traces on the surface of the circuit board 300 and ensuring the continuity of the high-frequency signal path impedance and signal quality.

[0076] In some embodiments, high-frequency signals are sensitive to impedance and parasitic effects. The first high-frequency pin array 414a or the second high-frequency pin array 414b has fixed pins, and the high-frequency pad array on the surface of the circuit board 300 has fixed pads. The fixed pads are electrically connected to the corresponding fixed pins, that is, the high-frequency pin array and the high-frequency pad array adopt a fixed and one-to-one connection, thereby ensuring the stability of the high-frequency signal path and the small impedance change of the high-frequency signal path, thereby ensuring the integrity of high-speed signal transmission.

[0077] In some embodiments, the pin definitions and arrangements of the first low-frequency pin array 424a and the second low-frequency pin array 424b are different. For example, the positions of pins with the same function are different; or, the number of pins with the same function is different; or, the functions of pins set at the same position are different.

[0078] In some embodiments, the first low-frequency pin array 424a includes, in sequence: two ground pins 4241a, four heating element pins 4242a, four common-mode voltage pins 4243a, one bias voltage pin 4244a, two power detector sensing voltage pins 4245a, four pairs of power detector monitoring voltage pins 4246a, and one power detector sensing current pin 4247a.

[0079] In some embodiments, the second low-frequency pin array 424b sequentially includes: four heating element pins 4242b, two ground pins 4243b, one bias voltage pin 4244b, two common-mode voltage pins 4245b, one unused position, four pairs of power detector monitoring voltage pins 4246b, one power detector current detection pin 4247b, and one power detector voltage detection pin 4248b.

[0080] Figure 10 This is a schematic diagram of a circuit board surface pad arrangement according to some embodiments. Figure 11 This is a schematic diagram showing the electrical connection between a circuit board and a first optical modulation chip according to some embodiments. Figure 12 This is a schematic diagram illustrating the electrical connection between a circuit board and a second optical modulation chip according to some embodiments. Figures 10-12 As shown, in some embodiments, different optical modulation chips have different low-frequency pin arrays, and the definition conflict on the low-frequency pins of different optical modulation chips is the main obstacle to achieving circuit board compatibility. The surface pad structure of circuit board 300 is compatible with the pin configurations of the first optical modulation chip 404a and the second optical modulation chip 404b.

[0081] In some embodiments, a high-frequency pad array 310 is formed at one end of the circuit board 300, and a low-frequency pad array 320 is formed at the adjacent end. The high-frequency pad array 310 is electrically connected to a first high-frequency pin array 414a; or, the high-frequency pad array 310 is electrically connected to a second high-frequency pin array 414b. The low-frequency pad array 320 is electrically connected to a first low-frequency pin array 424a; or, the low-frequency pad array 320 is electrically connected to a second low-frequency pin array 424b.

[0082] In some embodiments, the low-frequency pad array 320 may include a first pad 321. One end of the first pad 321 is wire-connected to the optical modulation chip, and the other end forms two connection ports. Optical modulation chips with different low-frequency pad arrangements can be electrically connected to different positions on the circuit board surface through the two connection ports of the first pad 321, so as to adapt the electrical connection between optical modulation chips with different low-frequency pad arrangements and the circuit board 300.

[0083] In some embodiments, when one of the two connection ports is electrically connected to a trace on the circuit board surface, the other connection port is not electrically connected to another trace on the circuit board surface. The connection port electrically connected to the trace on the circuit board surface can electrically connect the optical modulation chip to a target location on the circuit board surface, while the other connection port is left unused.

[0084] In some embodiments, by setting different connection ports, the first pad 321 can be reused, thereby enabling the electrical connection between the optical modulation chip 404 with different low-frequency pad arrangements and the circuit board.

[0085] In some embodiments, the two connection ports included in the first pad 321 are referred to as the first connection port and the second connection port. One end of the first pad 321 is wire-connected to the first optical modulation chip 404a, and the other end of the first connection port is electrically connected to a first location on the surface of the circuit board 300 via a first trace, thus achieving an electrical connection between the first optical modulation chip 404a and the first location on the surface of the circuit board 300. In this case, the second connection port is an unused port and does not participate in the electrical connection.

[0086] In some embodiments, the two connection ports of the first pad 321 may have different connection attributes, and the connection ports of the first pad 321 can be switched to adapt to the differences in low-frequency pin configurations between the first optical modulation chip 404a and the second optical modulation chip 404b. The first pad 321 is electrically connected to the corresponding pin in the first optical modulation chip 404a with a first connection attribute, and the first pad 321 is electrically connected to the corresponding pin in the second optical modulation chip 404b with a second connection attribute, so as to be compatible with the pin configurations of the first optical modulation chip 404a and the second optical modulation chip 404b.

[0087] In some embodiments, one end of the first pad 321 is wire-connected to the second optical modulation chip 404b, and the second connection port at the other end is electrically connected to a second position on the surface of the circuit board 300 through a second trace, thereby realizing the electrical connection between the second optical modulation chip 404a and the second position on the surface of the circuit board 300. In this case, the first connection port is an unused port and does not participate in the electrical connection.

[0088] In some embodiments, the low-frequency pad array 320 may include a second pad 322. The second pad 322 is wire-connected to the optical modulation chip.

[0089] In some embodiments, the low-frequency pad array 320 may include a third pad 323. The third pad 323 is wire-connected to the optical modulation chip.

[0090] In some embodiments, the low-frequency pad array 320 may include a fourth pad 324. The fourth pad 324 is wire-bonded to the optical modulation chip.

[0091] In some embodiments, the size of the third pad 323 is larger than the size of the second pad 322, and the number of wires between the third pad 323 and the optical modulation chip is greater than the number of wires between the second pad 322 and the optical modulation chip. Since the third pad 323 is larger than the second pad 322 and can support a greater number of wires, it can accommodate optical modulation chip pad arrangements where one pad corresponds to multiple wires.

[0092] In some embodiments, the size of the fourth pad 324 is larger than the size of the third pad 323, and the number of wires between the fourth pad 324 and the optical modulation chip 404 is less than the number of wires between the third pad 323 and the optical modulation chip 404. Thus, the fourth pad 324 can be adapted to an optical modulation chip pad with multiple wires corresponding to one pad, and can also be adapted to an optical modulation chip 404 pad with a small number of wires corresponding to one pad. It is compatible with the wire bonding requirements of optical modulation chips 404 with different low-frequency pad arrangements. Thus, the same circuit board 300 can be compatible with the electrical connection between optical modulation chips 404 with different low-frequency pad arrangements and the circuit board.

[0093] In some embodiments, the low-frequency pad array 320 may include a fifth pad 325.

[0094] In some embodiments, the low-frequency pad array 320 may include a sixth pad 326. The sixth pad 326 is located on one side of the fifth pad 325, and one end of the sixth pad 326 and the fifth pad 325 are connected to the same position on the circuit board 300. Therefore, the sixth pad and the fifth pad have the same electrical properties. The fifth pad 325 and the sixth pad 326 are respectively adapted to pads with the same connection function but different physical positions in different low-frequency pad arrangement optical modulation chips 404.

[0095] In some embodiments, if one of the sixth pad 326 and the fifth pad 325 is electrically connected to the optical modulation chip 404, then the other pad is not electrically connected to the optical modulation chip 404. When the sixth pad 326 is wire-connected to the optical modulation chip 404, the fifth pad 325 is left unconnected, thus achieving an electrical connection between the first optical modulation chip 404a and the circuit board 300. When the fifth pad 325 is wire-connected to the optical modulation chip, the sixth pad 326 is left unconnected, thus achieving an electrical connection between the second optical modulation chip 404b and the circuit board 300.

[0096] In some embodiments, the low-frequency pad array 320 may include a seventh pad 327. The seventh pad 327 is connected to the optical modulation chip via a wire bond. Alternatively, the seventh pad 327 may not be connected to the optical modulation chip via a wire bond.

[0097] In some embodiments, the connection state of the seventh pad 327 can be configured according to the model of the optical modulation chip to which it is electrically connected, so that the same circuit board 300 can adapt to the differences in pin layout of different models of optical modulation chips. When the optical modulation chip includes pads with specific connection functions, a wire bond is connected between the seventh pad 327 and the optical modulation chip. When the optical modulation chip does not include pads with specific connection functions, no wire bond is connected between the seventh pad 327 and the optical modulation chip, and the seventh pad is left empty as a blank pad and does not participate in the circuit connection.

[0098] In some embodiments, when the first optical modulation chip 404a includes pads with specific connection functions, a wire bond connects the seventh pad 327 to the first optical modulation chip 404a. When the second optical modulation chip 404b includes pads with specific connection functions, a wire bond connects the seventh pad 327 to the second optical modulation chip 404b.

[0099] In some embodiments, the number of pads on the surface of the circuit board 300 is greater than the number of pads on the surface of the optical modulation chip 404. Therefore, the surface of the circuit board 300 has extra pads compared to the surface of the optical modulation chip 404. This allows the surface of the circuit board 300 to meet the connection requirements of pads with the same function but different physical locations between optical modulation chips 404 with different low-frequency pad arrangements. It can also meet the connection requirements of pads with the same function but different numbers between optical modulation chips with different low-frequency pad arrangements. This makes it easy for the same circuit board 300 to be compatible with optical modulation chips with different low-frequency pad arrangements.

[0100] Figure 13 This is a schematic diagram showing the wire bonding between a circuit board and a first optical modulation chip according to some embodiments. Figure 14 This is a schematic diagram showing the wire bonding between a circuit board and a second optical modulation chip according to some embodiments. Figure 13 and Figure 14 As shown, in some embodiments, the surface pad structure of the circuit board 300 is compatible with the pin configurations of the first optical modulation chip 404a and the second optical modulation chip 404b.

[0101] In some embodiments, the first low-frequency pin array 424a includes, in sequence: two ground pins 4241a, four heating element pins 4242a, four common-mode voltage pins 4243a, one bias voltage pin 4244a, two power detector sensing voltage pins 4245a, four pairs of power detector monitoring voltage pins 4246a, and one power detector sensing current pin 4247a.

[0102] In some embodiments, the second low-frequency pin array 424b sequentially includes: four heating element pins 4242b, two ground pins 4243b, one bias voltage pin 4244b, two common-mode voltage pins 4245b, one unused position, four pairs of power detector monitoring voltage pins 4246b, one power detector current detection pin 4247b, and one power detector voltage detection pin 4248b.

[0103] In some embodiments, the first pad 321 can serve as a pad describing a connection function, having two connection ports formed at its end facing the circuit board 300. The pad referred to by the first pad 321 can also serve as a pad describing the pad size, in which case it is described as the fourth pad 324. In some embodiments, the third pad 323 can serve as a pad describing the pad size. The pad referred to by the third pad 323 can also serve as a pad describing a connection function, in which case it is described as the sixth pad 326.

[0104] In some embodiments, the end of the first pad 321 facing the circuit board includes a first connection port and a second connection port. The first pad 321 is electrically connected to a trace on the surface of the circuit board through the first connection port, electrically connecting the first optical modulation chip 404a to a location on the surface of the circuit board 300, exemplarily, electrically connecting to a first chip on the surface of the circuit board 300. The first pad 321 is electrically connected to a trace on the surface of the circuit board through the second connection port, electrically connecting the second optical modulation chip 404b to another location on the surface of the circuit board 300, exemplarily, electrically connecting to a second chip on the surface of the circuit board 300.

[0105] like Figure 13 As shown, in some embodiments, the first connection attribute of the first pad 321 can be a common-mode voltage pad. One end of the first pad 321 is connected to four common-mode voltage pins 4243a in the first low-frequency pin array 424a by a bonding wire, and the other end is electrically connected to the common-mode voltage source chip location on the surface of the circuit board 300 through the first connection port.

[0106] like Figure 14 As shown, in some embodiments, the first connection attribute of the first pad 321 can be a bias voltage pad. One end of the first pad 321 is connected to a bias voltage pin 4244b in the second low-frequency pin array 424b by a bonding wire, and the other end is electrically connected to the bias voltage source chip location on the surface of the circuit board 300 through a second connection port.

[0107] In some embodiments, the size of the second pad 322 is smaller than the size of the third pad 323, and the size of the third pad 323 is smaller than the size of the fourth pad 324. The number of wires between the second pad 322 and the first optical modulation chip 404a is 2, the number of wires between the third pad 323 and the first optical modulation chip 404a is 0, and the number of wires between the fourth pad 324 and the first optical modulation chip 404a is 4. Therefore, the third pad 323 is a reserved pad to accommodate the electrical connection between the circuit board 300 and the second optical modulation chip 404b.

[0108] In some embodiments, the four pads between the fifth pad 325 and the third pad 323 are all second pads 322. When the circuit board is electrically connected to the first optical modulation chip 404a, these four second pads 322 can be electrically connected to the four heating element pins 4242a in the first low-frequency pin array 424a, respectively. These four second pads 322 can serve as shared pads, with the same pad definition and function for the electrical connection between the circuit board 300 and the second optical modulation chip 404b. For example, when the circuit board is electrically connected to the second optical modulation chip 404b, these four second pads 322 can be electrically connected to the four heating element pins 4242b in the second low-frequency pin array 424b, respectively. The four heating element pins in the first low-frequency pin array 424a and the four heating element pins in the second low-frequency pin array 424b are located at the same positions.

[0109] In some embodiments, both the fifth pad 325 and the sixth pad 326 can be ground pads. The fifth pad 325 serves as the first ground pad, making electrical connections between the circuit board 300 and the first optical modulation chip 404a. In this case, the sixth pad 326 serves as a blank pad and does not participate in wire bonding. For example, the fifth pad 325 is wire bonded to two ground pins 4241a in the first low-frequency pin array 424a.

[0110] In some embodiments, the sixth pad 326 serves as the second ground pad for electrical connection between the circuit board 300 and the second optical modulation chip 404b, while the fifth pad 325 serves as a blank pad and does not participate in wire bonding. For example, the sixth pad 326 is wire bonded to two ground pins 4243b in the second low-frequency pin array 424b.

[0111] In some embodiments, the seventh pad 327 is electrically connected to the first optical modulation chip 404a with the first connection attribute being a power detector detection voltage pad. For example, the seventh pad 327 is wire-connected to two power detector detection voltage pins 4245a in the first low-frequency pin array 424a, forming a one-to-two wire-connection.

[0112] In some embodiments, when the circuit board 300 is electrically connected to the second optical modulation chip 404b, the seventh pad 327 is not exposed and is an empty pad. In some embodiments, the pads following the seventh pad 327 are arranged according to the order of the remaining pins of the first optical modulation chip 404a and the second optical modulation chip 404b.

[0113] In some embodiments, the eighth pad 328 is electrically connected to the first optical modulation chip 404a with the first connection attribute being a bias voltage pad. Exemplarily, a wire bond is connected between the eighth pad 328 and a bias voltage pin 4244a in the first low-frequency pin array 424a, forming a one-to-one wire bond connection.

[0114] In some embodiments, the eighth pad 328 is electrically connected to the second optical modulation chip 404b with the second connection attribute being a common-mode voltage pad. Exemplarily, a wire bond is connected between the eighth pad 328 and two common-mode voltage pins 4245b in the second low-frequency pin array 424b, forming a one-to-two wire bond connection.

[0115] In some embodiments, the properties of the ninth pad 329 are the same as those of the seventh pad 327. When the circuit board 300 is electrically connected to the first optical modulation chip 404a, the ninth pad 329 is a blank pad and does not participate in wire bonding. When the circuit board 300 is electrically connected to the second optical modulation chip 404b, the ninth pad 329 is wire bonded to the power detector's detection voltage pin 4248b.

[0116] In some embodiments, the tenth pad 3210 serves as a common pad in the electrical connection between the circuit board 300 and different optical modulation chips. When the circuit board 300 is electrically connected to the first optical modulation chip 404a, the tenth pad 3210 is wired to the four pairs of power detector monitoring voltage pins 4246a. When the circuit board 300 is electrically connected to the second optical modulation chip 404b, the tenth pad 3210 is wired to the four pairs of power detector monitoring voltage pins 4246b.

[0117] In some embodiments, the target impedance of the high-speed differential input port of the Mach-Zehnder modulator inside different optical modulation chips 404 varies. When the fixed impedance of the high-frequency signal line does not match the input impedance of the optical modulation chip, signal reflection will occur. To address this, an absorbing dielectric layer is wrapped around the surface of the high-frequency signal line, using the thickness of the absorbing dielectric layer as a key variable. Different thicknesses of absorbing dielectric layers can change the effective dielectric constant between the signal line and the reference ground, thereby changing its characteristic impedance. This allows the impedance of the high-frequency signal line to match the input impedance of the optical modulation chip 404, improving signal transmission stability.

[0118] In some embodiments, when the optical modulator inside the optical modulation chip 404 has a first differential impedance, the absorbing dielectric layer has a first preset thickness to match the high-frequency signal line and the first differential impedance. When the optical modulator inside the optical modulation chip 404 has a second differential impedance, the absorbing dielectric layer has a second preset thickness to match the high-frequency signal line and the second differential impedance.

[0119] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An optical module, characterized in that, include: The light emitting component includes: A laser is configured to output light that does not carry a signal. An optical modulation chip is disposed in the output optical path of the laser and is configured to modulate the light that does not carry a signal to generate an optical signal; A circuit board, electrically connected to the optical modulation chip, wherein the surface of the circuit board includes: The first pad has one end wire-connected to the optical modulation chip, and the other end forms two connection ports. When one connection port is electrically connected to a trace on the surface of the circuit board, the other connection port is not electrically connected to another trace on the surface of the circuit board. The second pad is wire-connected to the optical modulation chip; The third pad is wire-connected to the optical modulation chip, and its size is larger than that of the second pad. The number of wires between the third pad and the optical modulation chip is greater than the number of wires between the second pad and the optical modulation chip. The fourth pad is wire-connected to the optical modulation chip. Its size is larger than that of the third pad, and the number of wires between the fourth pad and the optical modulation chip is less than the number of wires between the third pad and the optical modulation chip.

2. The optical module according to claim 1, characterized in that, The surface of the circuit board includes: Fifth pad; The sixth pad is located on one side of the fifth pad; one end of the sixth pad and the fifth pad are connected to the same position on the circuit board; one of the sixth pad and the fifth pad is electrically connected to the optical modulation chip, while the other pad is not electrically connected to the optical modulation chip.

3. The optical module according to claim 1, characterized in that, The surface of the circuit board includes: The seventh pad is connected to the optical modulation chip by a wire; or, it is not connected to the optical modulation chip by a wire.

4. The optical module according to claim 1, characterized in that, The number of pads on the circuit board surface is greater than the number of pads on the optical modulation chip surface.

5. An optical module, characterized in that, include: The light emitting component includes: A laser is configured to output light that does not carry a signal. An optical modulation chip is disposed in the output optical path of the laser and is configured to modulate the light that does not carry a signal to generate an optical signal; A circuit board, electrically connected to the optical modulation chip, wherein the surface of the circuit board includes: The first pad has one end wire-connected to the optical modulation chip, and the other end forms two connection ports. When one connection port is electrically connected to a trace on the surface of the circuit board, the other connection port is not electrically connected to another trace on the surface of the circuit board. The second pad is wire-connected to the optical modulation chip; The third pad is wire-connected to the optical modulation chip, and its size is larger than that of the second pad. The number of wires between the third pad and the optical modulation chip is greater than the number of wires between the second pad and the optical modulation chip. The fourth pad is wire-connected to the optical modulation chip, and its size is larger than that of the third pad. The number of wires between the fourth pad and the optical modulation chip is greater than the number of wires between the third pad and the optical modulation chip.

6. The optical module according to claim 5, characterized in that, The surface of the circuit board includes: Fifth pad; The sixth pad is located on one side of the fifth pad; one end of the sixth pad and the fifth pad are connected to the same position on the circuit board; one of the sixth pad and the fifth pad is electrically connected to the optical modulation chip, while the other pad is not electrically connected to the optical modulation chip.

7. The optical module according to claim 5, characterized in that, The surface of the circuit board includes: The seventh pad is connected to the optical modulation chip by a wire; or, it is not connected to the optical modulation chip by a wire.

8. The optical module according to claim 5, characterized in that, The number of pads on the circuit board surface is greater than the number of pads on the optical modulation chip surface.

9. An optical module, characterized in that, include: The light emitting component includes: A laser is configured to output light that does not carry a signal. An optical modulation chip is disposed in the output optical path of the laser and is configured to modulate the light that does not carry a signal to generate an optical signal; A circuit board, electrically connected to the optical modulation chip, wherein the surface of the circuit board includes: The first pad has one end wire-connected to the optical modulation chip, and the other end has a first connection port and a second connection port. When one end is electrically connected to the optical modulation chip with a first low-frequency pad arrangement, the first connection port is electrically connected to a first trace on the surface of the circuit board. When one end is electrically connected to the optical modulation chip with a second low-frequency pad arrangement, the second connection port is electrically connected to a second trace on the surface of the circuit board. The second pad is wire-connected to the optical modulation chip; The third pad is wire-connected to the optical modulation chip, and its size is larger than that of the second pad. The number of wires between the third pad and the optical modulation chip is greater than the number of wires between the second pad and the optical modulation chip. The fourth pad is larger than the third pad. When the fourth pad is electrically connected to an optical modulation chip with a first low-frequency pad arrangement, the number of wires leading out from the fourth pad is greater than the number of wires between the third pad and the optical modulation chip. When the fourth pad is electrically connected to an optical modulation chip with a second low-frequency pad arrangement, the number of wires leading out from the fourth pad is less than the number of wires between the third pad and the optical modulation chip.

10. The optical module according to claim 9, characterized in that, The surface of the circuit board includes: Fifth pad; The sixth pad is located on one side of the fifth pad; one end of the sixth pad and the fifth pad are connected to the same position on the circuit board; one of the sixth pad and the fifth pad is electrically connected to the optical modulation chip, while the other pad is not electrically connected to the optical modulation chip. The seventh pad is connected to the optical modulation chip by a wire; or, it is not connected to the optical modulation chip by a wire.

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