An optical module

Abstract

The light module provided by the disclosure, the laser assembly comprises: a laser chip for generating an optical signal; a carrier provided with a high-frequency wire on a top surface, and an edge of one end of the carrier is provided with a notch; one end of the notch extends to one end of the carrier, and one side of the notch extends to an edge of one side of the carrier; a chip mounting surface is formed at the bottom of the notch, the chip mounting surface is lower than the top surface of the carrier, and the chip mounting surface is connected with the laser chip; one end of the high-frequency wire is provided with a first connecting portion, and the other end of the high-frequency wire is provided with a second connecting portion; one end of the first connecting portion is connected with the second connecting portion, the other end of the first connecting portion extends along the edge of the notch, and the width of the other end of the first connecting portion is greater than the width of one end of the first connecting portion; the other end of the first connecting portion is electrically connected with the laser chip, and the second connecting portion is electrically connected with a circuit board; a matching circuit is located between the high-frequency wire and the laser chip, and is located at the side of the first connecting portion and is electrically connected with the first connecting portion. The width of the laser assembly is reduced.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, advancements in optical communication technology have become increasingly important. In optical communication technology, the optical module, as one of the key components in optical communication equipment, enables photoelectric signal conversion; and in the development of optical communication technology, the data transmission rate of optical modules is required to continuously improve.

[0003] To meet the demands of optical communication technology development, the transmission rate of optical modules is constantly increasing, especially in recent years, with higher-speed optical modules such as 800G gradually being introduced to the market. To achieve the transmission rate of optical modules such as 800G, it is necessary to integrate 8 or more laser components and optical receiver components in a QSFP-DD or OSFP package. Utility Model Content

[0004] Some embodiments provide an optical module that reduces the width of the laser component.

[0005] Some embodiments provide an optical module, including: Circuit board; The light emitting component includes a laser assembly; the laser assembly is electrically connected to a circuit board for emitting light signals; The laser component includes: Laser chips are used to generate optical signals; The carrier has a high-frequency line on its top surface and a notch at one end. One end of the notch extends to one end of the carrier, and one side of the notch extends to the edge of one side of the carrier. A chip mounting surface is formed at the bottom of the notch, which is lower than the top surface of the carrier and is connected to a laser chip. A first connecting portion is formed at one end of the high-frequency line, and a second connecting portion is formed at the other end. One end of the first connecting portion is connected to the second connecting portion, and the other end of the first connecting portion extends along the edge of the notch, with the width of the other end of the first connecting portion being greater than the width of the first end of the first connecting portion. The other end of the first connecting portion is electrically connected to the laser chip. The matching circuit is located between the high-frequency line and the laser chip, and is located on the side of the first connection part, and is electrically connected to the first connection part.

[0006] One of the above technical solutions has the following advantages or beneficial effects: The light emitting component includes a laser assembly, which includes a laser chip, a carrier, and a matching circuit. A notch is formed at one end of the carrier's edge, and a chip mounting surface is formed at the bottom of the notch, connecting the laser chip. A high-frequency line is provided on the top surface of the carrier, which can be electrically connected to the laser chip via wire bonding. The chip mounting surface is lower than the top surface of the carrier, facilitating adjustment of the relative height between the laser chip and the top surface of the carrier, thereby keeping the wire bonding between the high-frequency line and the laser chip within a relatively short range. One end of the notch extends to one end of the carrier, and one side of the notch extends to the edge of one side of the carrier, which facilitates the assembly of the laser chip into the notch and allows for control of the notch's size, thus saving space on the carrier. A first connecting portion is formed at one end of the high-frequency line, and a second connecting portion is formed at the other end. One end of the first connecting portion is used to connect to the second connecting portion, and the other end of the first connecting portion is located at the edge of the notch, allowing the first connecting portion to be as close as possible to the laser chip. The first connection portion connects to the matching circuit. The width of the other end of the first connection portion is greater than the width of one end of the first connection portion, which increases the parasitic capacitance of the first connection portion and helps ensure the resonance effect between the first connection portion and the matching circuit. The matching circuit is located between the high-frequency line and the laser chip. Compared to placing the matching circuit on the side of the laser chip away from the high-frequency line, it is easier to reduce the width of the carrier, thereby reducing the width of the laser component and making the laser component suitable for use in multi-channel optical modules.

[0007] In some embodiments, an optical module is provided in which the carrier includes a first carrier and a second carrier; a notch extends through the top and bottom surfaces of the first carrier, a high-frequency line extends from the edge of the notch to the other end of the first carrier, a first ground layer is provided on one side of the high-frequency line, a second ground layer is provided on the other side of the high-frequency line, the first ground layer extends to the edge of the first carrier, and the second ground layer extends to the edge of the first carrier. A third ground layer is set on the top surface of the second carrier, and the chip mounting surface is located on the third ground layer; A via is provided at the edge of the first carrier, and the via is electrically connected to the first formation and the third formation, or the via is electrically connected to the second formation and the third formation.

[0008] Another technical solution in the above-mentioned technical solution has the following advantages or beneficial effects: The carrier includes a first carrier and a second carrier. A notch is formed on the first carrier, penetrating the top and bottom surfaces of the first carrier, which facilitates the setting of the notch. A first ground layer is set on one side of the high-frequency line, and a second ground layer is set on the other side of the high-frequency line, which facilitates ensuring the performance of the high-frequency line in transmitting high-frequency signals. The first ground layer extends to the edge of one side of the first carrier, and the second ground layer extends to the edge of the other side of the first carrier, which facilitates the full utilization of the space on the first carrier, thereby reducing the width of the first carrier. A third ground layer is set on the top surface of the second carrier, and a chip mounting surface is formed on the third ground layer, which enables the laser chip to be set on the second carrier, and facilitates the adjustment of the relative height between the top surface of the laser chip and the top surface of the carrier by adjusting the thickness of the first carrier. A through hole is set on the edge of the side of the first carrier, through which the electrical connection between the ground layer on the first carrier and the third ground layer is realized, ensuring the integrity of the ground layer on the carrier. In addition, during the carrier forming process, the first carrier and the second carrier can be processed separately, and then the first carrier and the second carrier can be stacked on top of each other to form a carrier, which facilitates carrier processing and control of carrier size.

[0009] In some embodiments, an optical module is provided in which the first connecting portion includes a first segment and a second segment, the second segment being located at one end of the first connecting portion and the first segment being located at the other end of the first connecting portion; the width of the first segment is greater than the width of the second segment, and the first segment extends along the edge of the notched corner; The first segment has pads on its side, and the matching circuit includes resistors and inductors, which are arranged along the extension direction of the first segment. The laser chip is connected to the middle of the first segment by wire bonding, one end of the resistor is electrically connected to the first segment, and the other end of the resistor is connected in series with an inductor.

[0010] Another technical solution in the above-mentioned technical solution has the following advantages or beneficial effects: The first connecting part includes a first segment and a second segment. The second segment is located at one end of the first connecting part, and the first segment is located at the other end of the first connecting part. The width of the first segment is greater than the width of the second segment to form a T-shaped structure for the first connecting part. The first segment extends along the edge of the notched corner, which facilitates the selection of wire bonding positions on the first segment based on the laser chip settings, so that the wire bonding between the first connecting part and the laser chip can be shortened as much as possible. The matching circuit includes a resistor and an inductor. One end of the resistor is connected to the first segment, and the other end of the resistor is connected in series with the inductor. The resistor and inductor are arranged along the extension direction of the first segment, which facilitates the control of the space occupied by the matching circuit in the width direction of the carrier, and facilitates the reduction of the width of the carrier.

[0011] In some embodiments, an optical module is provided in which the high-frequency line further includes an extension, one end of which is connected to one end of a first connection portion, and the other end of which is connected to a second connection portion. The width of the second connecting part is greater than the width of the extension part, the distance between one side of the second connecting part and the first stratum is greater than the distance between one side of the extension part and the first stratum, and the distance between the other side of the second connecting part and the second stratum is the same as the distance between the other side of the extension part and the second stratum.

[0012] Another technical solution described above has the following advantages or beneficial effects: The high-frequency line includes an extension, one end of which connects to a first connection, and the other end of which connects to a second connection, thus achieving a transition from the first connection to the second connection. Typically, multiple bonding wires are used to connect the second connection and the circuit board. The width of the second connection is greater than the width of the extension, providing sufficient space for the bonding connection between the second connection and the circuit board. The distance between one side of the second connection and the first ground layer is greater than the distance between one side of the extension and the first ground layer, and the distance between the other side of the second connection and the second ground layer is similar to the distance between the other side of the extension and the second ground layer, which helps to reduce the influence of the ground layer on the carrier on the bonding between the second connection and the circuit board.

[0013] In some embodiments, an optical module is provided in which the distance between the other end of the extension and one side edge of the first carrier is greater than the distance between one end of the extension and one side edge of the first carrier.

[0014] Another technical solution in the above-mentioned technical solution has the following advantages or beneficial effects: the distance between the other end of the extension and the edge of the first carrier is greater than the distance between the end of the extension and the edge of the first carrier, which facilitates the transition from the first connection part to the second connection part on the high-frequency line, and makes the end of the extension part as close as possible to the edge of the first carrier, which makes it easier for the high-frequency line to be used on the first carrier with a relatively small width.

[0015] In some embodiments, an optical module is provided in which the angle between the axis of the laser chip and the axis of the carrier is 3-10°. A first electrode, a second electrode, and a third electrode are formed on the top of the laser chip; the third electrode is close to one end of the laser chip, the first electrode is close to the other end of the laser chip, and the second electrode is located between the first electrode and the third electrode; the second electrode is electrically connected to the first connection part. The laser assembly also includes a first capacitor and a second capacitor. Both the first capacitor and the second capacitor are arranged along a direction parallel or approximately parallel to the axis of the laser chip. The second capacitor is closer to the laser chip than the first capacitor. The first capacitor is wired to the first electrode, and the second capacitor is wired to the third electrode.

[0016] Another technical solution described above has the following advantages or beneficial effects: the angle between the axis of the laser chip and the axis of the carrier is 3-10°, which facilitates the reduction of light signals reflected back from lenses and other components from being retransmitted to the laser chip, ensuring the quality of the light signals generated by the laser chip. The laser assembly also includes a first capacitor and a second capacitor, which serve as filter capacitors for the laser chip. Both the first and second capacitors are arranged parallel to or approximately parallel to the axis of the laser chip, placing them at the other end of the laser chip. This allows for full utilization of the space at the other end of the laser chip, thereby reducing the width of the carrier. It also facilitates staggering the wiring used to electrically connect the first and second capacitors to the laser chip, reducing the risk of wire crossing.

[0017] In some embodiments, an optical module is provided in which a groove is provided on the chip mounting surface, and the groove is located below the light emission direction of the laser chip.

[0018] Another technical solution described above has the following advantages or beneficial effects: By providing a groove below the laser chip's light emission direction, the groove can reduce the obstruction of the laser chip's light spot by the chip mounting surface at the edge of the carrier, thus ensuring the quality of the laser component's output light spot. Additionally, the groove can also be used to position the carrier, facilitating the precise mounting of the laser chip on the chip mounting surface.

[0019] In some embodiments, an optical module is provided in which a limiting surface is formed within the notch, the limiting surface including a first limiting part and a second limiting part; the angle between the extending direction of the first limiting part and the axis of the carrier is 3-10°; The first limiting part is located on the other side of the laser chip, and the second limiting part is located at the other end of the laser chip. The first limiting part and the second limiting part limit the laser chip.

[0020] Another technical solution described above has the following advantages or beneficial effects: a limiting surface is formed within the notch, comprising a first limiting part and a second limiting part. The angle between the extension direction of the first limiting part and the axis of the carrier is 3-10°, facilitating the first limiting part to be adapted to be tilted and positioned on the laser chip, allowing the first limiting part to limit the laser chip from the side. The second limiting part is located at the other end of the laser chip, allowing the second limiting part to limit the laser chip from the end of the laser chip. Therefore, by limiting the laser chip through the first and second limiting parts formed within the notch, the phase of the laser chip is facilitated, thereby improving the assembly accuracy of the laser chip within the notch.

[0021] Some embodiments provide an optical module, including: Circuit board; The light emitting component includes a laser assembly; the laser assembly is electrically connected to a circuit board for generating light signals; The laser components include: The first carrier has a high-frequency line and a ground layer on its top surface, and a notch is formed at one end of its edge; one end of the notch extends to one end of the first carrier, and one side of the notch extends to the edge of one side of the first carrier; one end of the high-frequency line is located on the side of the notch, and the high-frequency line extends to the other end of the first carrier; the ground layer is located on the side of the high-frequency line, and the ground layer extends to the side of the first carrier; several vias are opened on the side of the first carrier. The second carrier has a third stratum formed on its top surface, and the top surface is connected to the first carrier; the third stratum is electrically connected to the stratum on the first carrier through a via. The laser chip is located in the third stratum; the side of the laser chip is close to the edge of the notched corner.

[0022] Another technical solution in the above-mentioned technical solution has the following advantages or beneficial effects: The light emitting component includes a laser assembly, which includes a first carrier, a second carrier, and a laser chip. The top surface of the second carrier is connected to the first carrier, enabling the carriers to be stacked vertically. A notch is formed at one end of the edge of the first carrier, penetrating the top and bottom surfaces of the first carrier, facilitating the formation of the notch on the first carrier. One end of the notch extends to one end of the first carrier, and one side of the notch extends to the edge of one side of the first carrier, which facilitates the assembly of the laser chip into the notch and also facilitates the control of the notch size, thereby saving space on the first carrier. A high-frequency line and a ground layer are provided on the top surface of the first carrier, with the ground layer distributed on the side of the high-frequency line. One end of the high-frequency line can be connected to the laser chip via wire bonding, and the other end of the high-frequency line can be connected to the circuit board via wire bonding. One end of the high-frequency line is located on the side of the notch, allowing it to be as close as possible to the laser chip, facilitating the control of the wire bonding length between the high-frequency line and the laser chip. The other end of the high-frequency line is located at the other end of the first carrier, facilitating the electrical connection of the high-frequency line to the circuit board. A third ground layer is formed on the top surface of the second carrier. The laser chip is mounted on the third ground layer near the notch, facilitating laser chip adaptation to the notch and adjusting the relative height between the top surface of the laser chip and the top surface of the carrier by adjusting the thickness of the first carrier. A via is provided on the edge of the side of the first carrier to achieve electrical connection between the ground layer on the first carrier and the third ground layer, ensuring the integrity of the ground layer on the carrier. Furthermore, during carrier forming and processing, the first and second carriers can be processed separately, and then stacked one on top of the other to form a single carrier, facilitating carrier processing and size control.

[0023] In some embodiments, an optical module is provided in which a first ground layer is formed on one side of a high-frequency line, and the first ground layer extends from one end of the first carrier to the other end of the first carrier; One end of the high-frequency line is formed with a first segment and a second segment. The first segment is located on the side of the laser chip and extends along the side of the notched corner. The second segment connects to the middle of the first segment and is located on the side of the first segment away from the laser chip. A second stratum is formed on the other side of the high-frequency line, extending from the sides of the first and second segments to the other end of the first carrier.

[0024] Another technical solution described above has the following advantages or beneficial effects: A first ground layer is provided on one side of the high-frequency line, and a second ground layer is provided on the other side, which facilitates ensuring the performance of the high-frequency line in transmitting high-frequency signals. The first ground layer extends to the edge of one side of the first carrier, and the second ground layer extends to the edge of the other side of the first carrier, which facilitates full utilization of the space on the first carrier, thereby reducing the width of the first carrier. One end of the high-frequency line has a first segment and a second segment. The first segment is located on the side of the laser chip and extends along the side of the notched corner. The second segment connects to the middle of the first segment and is located on the side of the first segment away from the laser chip, so as to form a T-shaped structure at one end of the high-frequency line, which facilitates increasing the parasitic capacitance at one end of the high-frequency line, and the edge ensures the resonance effect of the high-frequency line. The first segment is located on the side of the laser chip, which facilitates selecting the wire bonding connection position on the first segment based on the laser chip setting, so that the wire bonding between the first connection part and the laser chip can be shortened as much as possible. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly introduced below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0026] Figure 1 This is a schematic diagram of the structure of an optical module access switch according to some embodiments; Figure 2 This is a partial structural diagram of a switch according to some embodiments; Figure 3 This is a structural diagram of an optical module according to some embodiments; Figure 4 An exploded view of an optical module according to some embodiments; Figure 5 This is a partial schematic diagram of a light emitting component according to some embodiments; Figure 6 This is a structural diagram of a laser assembly according to some embodiments; Figure 7 This is a structural diagram of a laser chip according to some embodiments; Figure 8 This is an assembly diagram of a carrier and a laser chip according to some embodiments; Figure 9A Structure of a laser assembly according to some embodiments Figure 1 ; Figure 9B Structure of a laser assembly according to some embodiments Figure 2 ; Figure 9C This is an exploded schematic diagram of a laser assembly according to some embodiments; Figure 9D This is a structural diagram of a carrier according to some embodiments; Figure 9E An exploded view of a carrier according to some embodiments; Figure 10 This is a partial enlarged view of a carrier according to some embodiments. Detailed Implementation

[0027] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0028] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0029] In optical communication technology, information is loaded onto light to generate optical signals, which are then used to transmit information between information processing devices. Connections are established between these devices via optical transmission equipment. Optical power loss is minimal during transmission through this equipment, allowing for long-distance transmission with relatively low power loss. Light boasts extremely high transmission speeds, and the cost of optical transmission equipment, such as fiber optic cables, is lower than that of electrical transmission equipment like copper wires. Using optical signals to transmit information offers advantages such as long-distance transmission, high speed, and low cost.

[0030] Information processing equipment typically includes switches, servers, optical network units (ONUs), optical distribution networks (ODNs), optical line terminals (OLTs), gateways, routers, mobile phones, computers, tablets, televisions, etc.; optical transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can recognize and process electrical signals, while optical transmission equipment can transmit optical signals. Therefore, optical modules are needed between the optical transmission equipment and the information processing equipment to perform the conversion between optical and electrical signals.

[0031] In some embodiments, the optical signal input and / or optical signal output of the optical module are connected to an optical fiber, and the electrical signal input and / or electrical signal output of the optical module are connected to a switch; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the switch; a second electrical signal from the switch is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.

[0032] Information processing equipment connected to optical modules can also be referred to as the host computer for optical modules. In access network transmission scenarios, the host computer for optical modules is usually an ONU, ODN, or OLT; in data center transmission scenarios, the host computer for optical modules is usually a Switch or Server.

[0033] Figure 1 This is a schematic diagram of the structure of an optical module access switch according to some embodiments. For example... Figure 1 As shown, switch 100 has multiple optical module interfaces. Multiple optical modules are inserted into the switch through these interfaces, establishing electrical signal communication between the optical modules and the switch. Optical fiber 101 is connected to the optical modules, establishing optical signal communication between the optical fiber and the optical modules. One end of optical fiber 101 is connected to the optical module, and the other end of optical fiber 101 (…) Figure 1 (not shown in the image) connects to another optical module ( Figure 1 (Not shown in the image), another optical module accesses the server ( Figure 1 (not shown in the image) or another switch ( Figure 1 (Not shown in the image).

[0034] In some embodiments, the optical fiber 101 and the optical module 200 are detachably connected; in other embodiments, the optical fiber 101 and the optical module 200 are non-detachably connected.

[0035] The switch 100 is configured to provide data electrical signals to the optical module 200, or receive data electrical signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0036] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0037] Figure 2 This is a partial structural diagram of a switch according to some embodiments. To clearly show the connection relationship between the optical module 200 and the switch 100, Figure 2 Only the structure of the switch 100 related to the optical module 200 is shown. For example... Figure 2 As shown, in some embodiments, the switch 100 further includes a PCB circuit board 102 disposed in the receiving cavity, and a cage 103 disposed on the surface of the PCB circuit board 102; the optical module 200 is inserted into the cage 103 and fixed by the cage 103.

[0038] In some embodiments, a heat sink 104 is provided on the cage 103 to dissipate heat for the optical module; in some embodiments, the heat sink 104 has protruding structures such as fins to increase the heat dissipation area.

[0039] In some embodiments, an electrical connector is provided inside the cage 103, which is configured to access the electrical interface of the optical module 200.

[0040] In some embodiments, the optical module 200 is inserted into the cage 103 of the switch 100, and the cage 103 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 103 and then diffused through the heat sink 104.

[0041] In some embodiments, the optical module 200 is inserted into the cage 103 of the switch 100, and the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 103, thereby establishing an electrical signal connection between the optical module 200 and the switch 100.

[0042] In some embodiments, the optical interface of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0043] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 203 and 204, one of which is an electrical interface and the other is an optical interface. In some embodiments, the shell forms an opening that serves as both an electrical interface and an optical interface.

[0044] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0045] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0046] The direction of the line connecting the two openings 203 and 204 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 203 is located at the end of the optical module 200. Figure 3 (The right end), opening 204 is also located at the end of optical module 200 ( Figure 3 (The left end). Alternatively, opening 203 is located at the end of optical module 200, while opening 204 is located on the side of optical module 200.

[0047] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0048] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0049] like Figure 3 and Figure 4As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0050] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the switch 100.

[0051] In some embodiments, the circuit board may also include a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0052] In some embodiments, the circuit board further includes gold fingers 301 formed on its end surface, the gold fingers 301 being composed of a plurality of independent pins.

[0053] In some implementations, the gold fingers 301 are disposed on the surface of one side of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers 301 are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to applications with high pin count requirements.

[0054] In some implementations, the gold fingers 301 of the circuit board 300 extend from the electrical interface and insert into the electrical connector of the switch 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers 301 are configured to establish an electrical connection with the switch, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0055] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the switch, or to release the fixed connection between the optical module 200 and the switch.

[0056] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the switch 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the switch, so as to release the fixation between the optical module 200 and the switch, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0057] In some embodiments, the optical module includes a light emitting component 400. In some embodiments, the optical module includes a light receiving component 500.

[0058] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold fingers.

[0059] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0060] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0061] In some embodiments, the optical module 200 further includes an optical transmission component 700 disposed within the housing. The optical transmission component 700 is used to establish an optical connection between the optical transmitting component 400, the optical receiving component 500 and the external optical fiber 101 (hereinafter referred to as the external optical fiber), so that the optical signal generated by the optical transmitting component 400 can be coupled to the external optical fiber, and the optical signal input from the external optical fiber can be coupled to the optical receiving component.

[0062] In some embodiments, the optical transmission component 700 includes an optical fiber adapter and an optical fiber, which may be an internal optical fiber relative to an external optical fiber. One end of the optical fiber is connected to the optical fiber adapter, and the other end is connected to the optical transmitting component 400 or the optical receiving component 500. Exemplarily, the optical transmission component 700 includes multiple optical fiber adapters and multiple optical fibers. The optical transmitting component 400 can be connected to one or more optical fiber adapters via multiple optical fibers, and the optical receiving component 500 can be connected to multiple optical fiber adapters via multiple optical fibers. Of course, in this embodiment, the structure of the optical fiber adapter is not limited to one type; it can also be an LC connector, where the optical fiber adapter connects to one optical fiber.

[0063] In some embodiments, the optical transmission component 700 may include two optical fiber adapters and multiple optical fibers, each optical fiber adapter being connected to the optical transmitting component 400 and the optical receiving component 500 via the multiple optical fibers.

[0064] In some embodiments, a mounting hole 302 is provided on the circuit board 300, and the light emitting component 400 is assembled and connected to the mounting hole 302. For example, the light emitting component 400 is embedded in the mounting hole 302.

[0065] In some embodiments, the mounting hole 302 is a through hole, such that the top of the light emitting component 400 is above the mounting hole 302 and the bottom of the light emitting component 400 is below the mounting hole 302.

[0066] In some embodiments, a DSP chip 303 is disposed on the front side of the circuit board 300; the DSP chip 303 is used to transmit high-frequency signals to the light emitting component 400, etc. The light emitting component 400 receives the high-frequency signals transmitted by the DSP chip 303 to generate light signals. Two opposing surfaces on the circuit board 300 are the main bearing surfaces of the circuit board 300; one of these surfaces is called the front surface of the circuit board 300, facing the upper cover plate 2011; the other surface is the back surface of the circuit board 300, facing the bottom plate 2021. The front and back surfaces of the circuit board 300 are opposing surfaces.

[0067] In some embodiments, the light receiving component 500 is disposed on the back side of the circuit board 300. Of course, in this embodiment, the light receiving component 500 is not limited to being disposed on the back side of the circuit board 300, but may also be disposed on the front side of the circuit board 300.

[0068] In some embodiments, the optical transmission component 700 may include a fiber optic adapter and multiple optical fibers. The optical transmitting component 400 can be optically connected to the fiber optic adapter through a portion of the multiple optical fibers, and the optical receiving component 500 can be optically connected to the fiber optic adapter through a portion of the multiple optical fibers.

[0069] Figure 5This is a partial schematic diagram of a light emitting component according to some embodiments. Figure 5 The present invention illustrates the structure of a light emitting component, but the structure of the light emitting component in this embodiment is not limited to that described above. Figure 5 The structure shown. (As illustrated) Figure 5 As shown, in some embodiments, the optical emitting component 400 includes a laser component 400a, which generates an optical signal. The optical signal output by the laser component 400a can be coupled to an optical fiber after passing through a lens or other device, and then transmitted to an optical fiber adapter via the optical fiber.

[0070] In some embodiments, the light emitting component 400 may include a plurality of laser components 400a arranged side by side. Exemplarily, four, eight, or sixteen laser components 400a may be arranged side by side on the emitting base.

[0071] In some embodiments, a lens, such as a collimating lens or a converging lens, may be provided in the output direction of the laser component 400a to converge the optical signal, so as to facilitate the coupling of the optical signal generated by the laser component 400a into the optical fiber.

[0072] Figure 6 This is a structural diagram of a laser assembly according to some embodiments. Figure 6 As shown, in some embodiments, the laser assembly 400a includes a carrier 410 and a laser chip 420. A circuit pattern is formed on the carrier 410, and the laser chip 420 is disposed on the carrier 410. The laser chip 420 is electrically connected to the circuit pattern on the carrier 410. The circuit pattern on the carrier 410 is electrically connected to a circuit board 300, allowing the laser chip 420 to be electrically connected to the circuit board 300 via the circuit pattern on the carrier 410. The laser chip 420 is used to generate optical signals.

[0073] Figure 7 This is a structural diagram of a laser chip according to some embodiments. Figure 7 As shown, in some embodiments, a first electrode 421 is disposed on the top of the laser chip 420. The first electrode 421 can be connected to the circuit pattern on the carrier 410, and a bias current is input to the laser chip 420 through the carrier 410 to make the laser chip 420 generate light.

[0074] In some embodiments, the laser chip 420 can be an electroabsorption modified laser (EML) chip, and a second electrode 422 is disposed on the top of the laser chip 420. The second electrode 422 can be connected to the circuit pattern on the carrier 410, and an electrical signal is input to the laser chip 420 through the carrier 410, causing the laser chip 420 to modulate light to generate an optical signal. The second electrode 422 can be located on one side of the first electrode 421.

[0075] In some embodiments, the laser chip 420 includes a semiconductor optical amplifier (SOA), and a third electrode 423 is disposed on the top of the laser chip 420. The third electrode 423 can be connected to the circuit pattern on the carrier 410, and the carrier 410 inputs an optical power amplification drive signal to the laser chip 420, enabling the laser chip 420 to amplify the optical power of the processed optical signal. Based on the optical power amplification drive signal input to the third electrode 423, the output terminal of the laser chip 420 outputs an optical signal with amplified optical power. The third electrode 423 is located on the side of the second electrode 422 away from the first electrode 421, and at the end of the third electrode 423 close to the carrier 410.

[0076] In some embodiments, the laser chip 420 may be disposed on the top of the carrier 410, and the laser chip 420 may be wire-connected to the circuit pattern on the carrier 410. Exemplarily, the first electrode 421, the second electrode 422, and the third electrode 423 may be wire-connected to the circuit pattern on the carrier 410, respectively.

[0077] Figure 8 This is an assembly diagram of a carrier and a laser chip according to some embodiments. Figure 8 As shown, in some embodiments, a chip mounting surface 411 is formed on the carrier 410, and the chip mounting surface 411 is connected to the laser chip 420. The chip mounting surface 411 may be lower than the top surface of the carrier 410, and the laser chip 420 may be mounted on the chip mounting surface 411. The chip mounting surface 411 being lower than the surface of the carrier 410 facilitates control of the relative height between the top surface of the laser chip 420 and the top surface of the carrier 410, thereby facilitating the proximity of the top surface of the laser chip 420 to the top surface of the carrier 410, and thus enabling control of the wire bonding length of the laser chip 420 to the circuit pattern on the carrier 410.

[0078] In some embodiments, the chip mounting surface 411 may be located at the edge of the carrier 410. Exemplarily, the side of the chip mounting surface 411 extends to the edge of the side of the carrier 410.

[0079] In some embodiments, one end of the chip mounting surface 411 extends to the edge of one end of the carrier 410, and one side of the chip mounting surface 411 extends to the edge of one side of the carrier 410, so that one end of the laser chip 420 is close to the edge of one end of the carrier 410, and one side of the laser chip 420 is close to the edge of one side of the carrier 410, which facilitates a significant reduction in the width of the carrier 410, thereby reducing the width of the laser assembly 400a, so that a greater number of laser assemblies 400a can be provided within the limited width range of the light emitting component 400.

[0080] In some embodiments, a ground layer may be formed on the chip mounting surface 411, and the laser chip 420 may be electrically connected to the ground layer.

[0081] In some embodiments, the laser chip 420 is tilted on the carrier 410, meaning the extension direction of the axis of the laser chip 420 is not parallel to the extension direction of the axis of the carrier 410. This facilitates the reduction of light signals reflected back from lenses, etc., from the laser chip 420 and then retransmitted to the laser chip 420. For example, the axis M of the carrier 410 and the axis N of the laser chip 420 are not parallel. The angle between the axes M and N can be 3-10°, such as 7°, 8°, etc.

[0082] In some embodiments, the laser chip 420 is tilted and disposed on the carrier 410, with one corner of one end of the laser chip 420 close to the edge of one end of the carrier 410, and the other corner of one end of the laser chip 420 slightly away from the edge of one end of the carrier 410. A groove 412 is formed on the carrier 410, located below the light emission direction of the laser chip 420, with the bottom surface of the groove 412 lower than the chip mounting surface 411. Thus, the groove 412 can reduce the obstruction of the laser chip 420's light spot by the chip mounting surface 411 at the edge of the carrier 410, thereby ensuring the quality of the output light spot of the laser assembly 400a. The groove 412 can also be used to position the carrier 410, facilitating the precise mounting of the laser chip 420 onto the chip mounting surface 411.

[0083] In some embodiments, a lens may be disposed within the groove 412 to focus the optical signal output by the laser chip 420. The optical axis of the lens may be parallel to the axis of the carrier 410.

[0084] In some embodiments, a high-frequency line 413 is provided on the carrier 410, with one end of the high-frequency line 413 close to the laser chip 420 and the other end extending to the edge of the other end of the carrier 410. One end of the high-frequency line 413 is used for electrical connection to the laser chip 420, and the other end is used for electrical connection to the circuit board 300. Exemplarily, one end of the high-frequency line 413 is wire-connected to the laser chip 420, and the other end is wire-connected to the circuit board 300.

[0085] In some embodiments, one side of the high-frequency line 413 is located between the laser chip 420 and the other side of the carrier 410, and the other side of the high-frequency line 413 is close to the edge of the other side of the carrier 410. This makes the high-frequency line 413 close to the other side of the carrier 410, which allows the high-frequency line 413 to make full use of the space on the carrier 410, thereby reducing the width of the carrier 410 and thus reducing the width of the laser assembly 400a.

[0086] In some embodiments, a matching circuit 430 is provided on the carrier 410. The matching circuit 430 is electrically connected to the laser chip 420. Examplely, the matching circuit 430 is located on the other side of the laser chip 420, positioned between the laser chip 420 and the high-frequency line 413, and electrically connected to the high-frequency line 413, thus connecting the matching circuit 430 to the laser chip 420 via the high-frequency line 413. The matching circuit 430's placement between the laser chip 420 and the high-frequency line 413 facilitates full utilization of the space on the carrier 410, thereby reducing the width of the laser assembly 400a.

[0087] In some embodiments, the matching circuit 430 may include a resistor 431 and an inductor 432. One end of the resistor 431 is connected to the high-frequency line 413, and the other end of the resistor 431 is connected in series with the inductor 432. The resistor 431 and the inductor 432 may be arranged on the other side of the laser chip 420 along the extension direction of the laser chip 420 to facilitate control of the width of the carrier 410.

[0088] In some embodiments, a first capacitor 440 is disposed on the carrier 410, and the first capacitor 440 is electrically connected to the laser chip 420. The first capacitor 440 is disposed at the other end of the laser chip 420. Exemplarily, the first capacitor 440 is connected to the first electrode 421 via a bonding wire 1, and the first capacitor 440 serves as a filter capacitor for the laser chip 420. In some existing solutions, the filter capacitor of the laser chip 420 is usually disposed on one side of the laser chip 420, which requires a relatively wide carrier 410. Compared to disposing the first capacitor 440 on one side of the laser chip 420, disposing the first capacitor 440 at the other end of the laser chip 420 can reduce the width of the carrier 410.

[0089] In some embodiments, a second capacitor 450 is disposed on the carrier 410, and the second capacitor 450 is electrically connected to the laser chip 420. The second capacitor 450 is disposed at the other end of the laser chip 420. Exemplarily, the second capacitor 450 can be connected to the third electrode 423 via wire bonding 2, and the second capacitor 450 serves as a filter capacitor for the SOA in the laser chip 420. In some existing solutions, the SOA filter capacitor is usually disposed on one side of the laser chip 420, which requires a relatively wide carrier 410. Compared to disposing the SOA filter capacitor on one side of the laser chip 420, disposing the second capacitor 450 at the other end of the laser chip 420 can reduce the width of the carrier 410.

[0090] In some embodiments, the second capacitor 450 is closer to the other end of the laser chip 420 than the first capacitor 440. The first capacitor 440 and the second capacitor 450 are disposed at an angle on the carrier 410, so that the first capacitor 440 and the second capacitor 450 are not arranged side by side along the width direction of the carrier 410 at one end of the laser chip 420. This allows both the first capacitor 440 and the second capacitor 450 to be close to the laser chip 420, facilitating the staggering of wire bonding 1 and wire bonding 2 and preventing wire bonding 1 and wire bonding 2 from crossing. It also balances the lengths of wire bonding 1 and wire bonding 2 and makes full use of the space at the other end of the laser chip 420, making it easier to reduce the width of the carrier 410.

[0091] In some embodiments, the sum of the widths of the first capacitor 440 and the second capacitor 450 is greater than the width from one side of the high-frequency line 413 to the carrier 410. If the first capacitor 440 and the second capacitor 450 are arranged side by side along the width direction of the carrier 410, the first capacitor 440 and the second capacitor 450 cannot be used on the carrier 410. By arranging the first capacitor 440 and the second capacitor 450 at an angle, it is easier to reduce the width requirement of the carrier 410 for setting the first capacitor 440 and the second capacitor 450. If the first capacitor 440 and the second capacitor 450 are arranged side by side along the length direction of the carrier 410, although it can accommodate the smaller width of the carrier 410, it is easy to cause the bonding wire 1 or bonding wire 2 to be too long, and it will also make it difficult to stagger the bonding wire 1 and bonding wire 2.

[0092] In some embodiments, the first capacitor 440 and the second capacitor 450 may be arranged along a direction parallel or approximately parallel to the axis of the laser chip 420. In this way, the first capacitor 440 and the second capacitor 450 can make full use of the space on the carrier 410.

[0093] Figure 9A Structure of a laser assembly according to some embodiments Figure 1 , Figure 9B Structure of a laser assembly according to some embodiments Figure 2 , Figure 9C This is an exploded schematic diagram of a laser assembly according to some embodiments. Figure 9D This is a structural diagram of a carrier according to some embodiments. Figure 9E This is an exploded view of a carrier according to some embodiments. For example... Figures 9A-9E As shown, in some embodiments, a notch 414 is formed on the carrier 410. One end of the notch 414 extends to one end of the carrier 410, and one side of the notch 414 extends to one side of the carrier 410. A chip mounting surface 411 is formed at the bottom of the notch 414, so that the notch 414 does not extend to the bottom surface of the carrier 410. The laser chip 420 is located within the notch 414.

[0094] In some embodiments, a limiting surface 415 is formed within the notch 414, and the limiting surface 415 is located on the side of the laser chip 420. The limiting surface 415 can be used to limit the laser chip 420.

[0095] In some embodiments, the limiting surface 415 includes a first limiting portion 4151 and a second limiting portion 4152. The first limiting portion 4151 may be located at the edge of the other side of the laser chip 420, and the second limiting portion 4152 may be located at the edge of the other end of the laser chip 420. One end of the first limiting portion 4151 extends to one end of the carrier 410, and the other end of the first limiting portion 4151 is connected to one end of the second limiting portion 4152. The other end of the second limiting portion 4152 extends to the edge of one side of the carrier 410.

[0096] In some embodiments, the extension direction of the first limiting portion 4151 can form an angle of 3-10° with the axial direction of the carrier 410, so that the side surface of the other side of the laser chip 420 is parallel or approximately parallel to the first limiting portion 4151; the extension direction of the second limiting portion 4152 is not parallel to the width direction of the carrier 410. For example, the second limiting portion 4152 extends away from the laser chip 420 to avoid the second limiting portion 4152 interfering with the assembly of the laser chip 420.

[0097] In some embodiments, the carrier 410 includes a first carrier 410a and a second carrier 410b, with the first carrier 410a disposed above the second carrier 410b. A notch 414 is formed on the first carrier 410a, penetrating both the top and bottom surfaces of the first carrier 410a, thereby forming a chip mounting surface 411 on the top surface of the second carrier 410b. Since the carrier 410 typically uses ceramic with good heat dissipation capabilities, using a carrier 410 formed by stacking the first carrier 410a and the second carrier 410b reduces the processing difficulty of the carrier 410.

[0098] In some embodiments, a high-frequency line 413 is provided on the top surface of the first carrier 410a, one end of the high-frequency line 413 extends to the edge of the notch 414, and the other end of the high-frequency line 413 extends to the other end of the first carrier 410a.

[0099] In some embodiments, a first ground layer 416 and a second ground layer 417 are disposed on the top surface of the first carrier 410a. The first ground layer 416 is located on one side of the high-frequency line 413, and the second ground layer 417 is located on the other side of the high-frequency line 413. Exemplarily, the first ground layer 416 can extend from one end of the first carrier 410a to the other end of the first carrier 410a, and the second ground layer 417 can extend from the edge of the notch 414 to the other end of the first carrier 410a.

[0100] In some embodiments, the high-frequency line 413 includes a first connecting portion 4131, an extension portion 4132, and a second connecting portion 4133. The first connecting portion 4131 is located at one end of the high-frequency line 413, and the second connecting portion 4133 is located at the other end of the high-frequency line 413. One end of the extension portion 4132 is connected to the first connecting portion 4131, and the other end of the extension portion 4132 is connected to the second connecting portion 4133. The first connecting portion 4131 can be wire-connected to a laser chip 420, etc., and the second connecting portion 4133 is used for wire-connecting to a circuit board 300. The second connecting portion 4133 has a relatively large width, providing sufficient space for the second connecting portion 4133 to wire-connect to the circuit board 300.

[0101] In some embodiments, the distance between one side of the second connection portion 4133 and the first ground layer 416 is greater than the distance between one side of the extension portion 4132 and the first ground layer 416, and the distance between the other side of the second connection portion 4133 and the second ground layer 417 is greater than the distance between the other side of the extension portion 4132 and the second ground layer 417, so that there is a relatively large space between the second connection portion 4133 and the ground layer on the first carrier 410a, so as to reduce the influence of the ground layer on the first carrier 410a on the electrical connection wire between the second connection portion 4133 and the circuit board 300.

[0102] In some embodiments, one end of the first connecting portion 4131 is connected to the extension portion 4132, and the other end of the first connecting portion 4131 is close to the laser chip 420. The width of the other end of the first connecting portion 4131 is greater than the width of one end of the first connecting portion 4131, so as to increase the parasitic capacitance of the first connecting portion 4131 and ensure the resonance effect between the first connecting portion 4131 and the matching circuit 430. The shape of the first connecting portion 4131 can be fan-shaped, but of course, the shape of the first connecting portion 4131 in this embodiment is not limited to a fan shape.

[0103] In some embodiments, the first connecting portion 4131 is T-shaped, with one end connected to one end of the extension portion 4132, and the other end located on the side of the first limiting portion 4151, allowing the first connecting portion 4131 to conveniently connect to the second electrode 422 and the matching circuit 430. The other end of the first limiting portion 4151 can extend along the side of the first limiting portion 4151. Exemplarily, the other end of the first connecting portion 4131 is wire-connected to the second electrode 422, and the side of the other end of the first connecting portion 4131 is electrically connected to the matching circuit 430.

[0104] In some embodiments, a pad 433 is provided on the side of the other end of the first limiting portion 4151. One end of the resistor 431 is electrically connected to the side of the first limiting portion 4151, and the other end of the resistor 431 is electrically connected to the pad 433. The pad 433 is wired to the inductor 432. Exemplarily, the other end of the first limiting portion 4151 can be electrically connected to the second electrode 422 via a wire 3, and the pad 433 can be electrically connected to the inductor 432 via a wire 4.

[0105] In some embodiments, a third ground layer 418 is disposed on the top surface of the second carrier 410b. A chip mounting surface 411 is formed at one edge of the third ground layer 418. The third ground layer 418 can be electrically connected to the first ground layer 416 and the second ground layer 417.

[0106] In some embodiments, a via is formed on the first carrier 410a, through which the first formation 416 and the third formation 418 are electrically connected, or through which the second formation 417 and the third formation 418 are electrically connected.

[0107] In some embodiments, a via 419 is provided on the edge of the first carrier 410a. The via 419 can be a half-hole. For example, multiple vias 419 can be provided on one side of the first carrier 410a, and multiple vias 419 can also be provided on the other side of the first carrier 410a. The vias 419 are provided on the edge of the first carrier 410a, which helps to reduce the impact of the vias 419 on the devices on the top surface of the first carrier 410a. Combined with the half-hole shape of the vias 419, it is easier to reduce the width of the first carrier 410a, so that the width of the carrier 410a is relatively small.

[0108] Figure 10 This is a partially enlarged view of a carrier according to some embodiments. Figure 10 As shown, in some embodiments, the first connecting portion 4131 includes a first segment 4131a and a second segment 4131b. The second segment 4131b is located where the first segment 4131a is located in the first connecting portion 4131. The first segment 4131a is located at the edge of the first limiting portion 4151, and the second segment 4131b is located on the side of the first segment 4131a away from the first limiting portion 4151. The second segment 4131b can connect the extension portion 4132 and the first segment 4131a.

[0109] In some embodiments, the width S1 of the first segment 4131a is greater than the width S2 of the second segment 4131b.

[0110] In some embodiments, the angle between the extension direction of the first limiting part 4151 and the axial direction of the carrier 410 can be 3-10°, so that the extension direction of the first limiting part 4151 is not parallel to the axial direction of the carrier 410, which facilitates the first limiting part 4151 to adapt to the inclined laser chip 420, thereby facilitating the first limiting part 4151 to position the laser chip 420 from the side of the laser chip 420.

[0111] In some embodiments, the first segment 4131a may extend along the extension direction of the first limiting portion 4151, facilitating the selection of wire bonding positions on the first segment 4131a based on the configuration of the laser chip 420, so that the wire bonding between the first segment 4131a and the laser chip 420 can be shortened as much as possible. For example, the middle portion of the first segment 4131a may be wire-connected to the second electrode 422, and the side edges of the first segment 4131a may be connected to the matching circuit 430. The matching circuit 430 may be distributed along the extension direction of the first segment 4131a, facilitating full utilization of the upper space in the width direction of the carrier 410, thereby reducing the width of the carrier 410.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, characterized in that, include: Circuit board; Light-emitting components, including laser assemblies; The laser component is electrically connected to the circuit board and is used to emit optical signals; The laser component includes: Laser chips are used to generate optical signals; A carrier has a high-frequency line on its top surface and a notch at one end of its edge. One end of the notch extends to one end of the carrier, and one side of the notch extends to the edge of one side of the carrier. A chip mounting surface is formed at the bottom of the notch, and the chip mounting surface is lower than the top surface of the carrier and is connected to the laser chip. A first connecting portion is formed at one end of the high-frequency line, and a second connecting portion is formed at the other end. One end of the first connecting portion is connected to the second connecting portion, and the other end of the first connecting portion extends along the edge of the notch, with the width of the other end of the first connecting portion being greater than the width of the first end of the first connecting portion. The other end of the first connecting portion is electrically connected to the laser chip, and the second connecting portion is electrically connected to the circuit board. A matching circuit is located between the high-frequency line and the laser chip, and is located on the side of the first connection part, and is electrically connected to the first connection part.

2. The optical module according to claim 1, characterized in that, The carrier includes a first carrier and a second carrier; the notch penetrates the top and bottom surfaces of the first carrier, the high-frequency line extends from the edge of the notch to the other end of the first carrier, a first ground layer is provided on one side of the high-frequency line, a second ground layer is provided on the other side of the high-frequency line, the first ground layer extends to the edge of the first carrier, and the second ground layer extends to the edge of the first carrier. A third ground layer is disposed on the top surface of the second carrier, and the chip mounting surface is located on the third ground layer; A via is provided at the edge of the first carrier, and the via is electrically connected to the first ground layer and the third ground layer, or the via is electrically connected to the second ground layer and the third ground layer.

3. The optical module according to claim 1, characterized in that, The first connecting portion includes a first segment and a second segment, the second segment being located at one end of the first connecting portion and the first segment being located at the other end of the first connecting portion; the width of the first segment is greater than the width of the second segment, and the first segment extends along the edge of the notched corner; The matching circuit includes a resistor and an inductor, which are arranged along the extension direction of the first segment; the laser chip is connected to the middle of the first segment by a wire, one end of the resistor is electrically connected to the first segment, and the other end of the resistor is connected in series with the inductor.

4. The optical module according to claim 2, characterized in that, The high-frequency line also includes an extension, one end of which is connected to one end of the first connection portion, and the other end of which is connected to the second connection portion. The width of the second connecting portion is greater than the width of the extension portion, the distance between one side of the second connecting portion and the first stratum is greater than the distance between one side of the extension portion and the first stratum, and the distance between the other side of the second connecting portion and the second stratum is the same as the distance between the other side of the extension portion and the second stratum.

5. The optical module according to claim 4, characterized in that, The distance between the other end of the extension and one side edge of the first carrier is greater than the distance between one end of the extension and one side edge of the first carrier.

6. The optical module according to claim 1, characterized in that, The angle between the axis of the laser chip and the axis of the carrier is 3-10°; The top of the laser chip has a first electrode, a second electrode, and a third electrode; the third electrode is near one end of the laser chip, the first electrode is near the other end of the laser chip, and the second electrode is located between the first electrode and the third electrode; the second electrode is electrically connected to the first connection portion. The laser assembly further includes a first capacitor and a second capacitor. Both the first capacitor and the second capacitor are arranged along a direction parallel or approximately parallel to the axis of the laser chip. The second capacitor is closer to the laser chip than the first capacitor. The first capacitor is wired to the first electrode, and the second capacitor is wired to the third electrode.

7. The optical module according to claim 1, characterized in that, A groove is provided on the chip mounting surface, and the groove is located below the light emission direction of the laser chip.

8. The optical module according to claim 1, characterized in that, A limiting surface is formed within the notch, and the limiting surface includes a first limiting part and a second limiting part; the angle between the extending direction of the first limiting part and the axis of the carrier is 3-10°. The first limiting part is located on the other side of the laser chip, and the second limiting part is located at the other end of the laser chip. The first limiting part and the second limiting part limit the laser chip.

9. An optical module, characterized in that, include: Circuit board; Light-emitting components, including laser assemblies; The laser component is electrically connected to the circuit board and is used to generate optical signals; The laser component includes: A first carrier has a high-frequency line and a ground plane on its top surface, with a notch formed at one end of its edge; one end of the notch extends to one end of the first carrier, and one side of the notch extends to the edge of one side of the first carrier; one end of the high-frequency line is located on the side of the notch, and the other end of the high-frequency line extends to the other end of the first carrier, and the other end of the high-frequency line is electrically connected to the circuit board; the ground plane is located on the side of the high-frequency line and extends to the side of the first carrier; a plurality of vias are formed on the side of the first carrier. The second carrier has a third ground layer formed on its top surface, and the top surface is connected to the first carrier; the third ground layer is electrically connected to the ground layer on the first carrier through the via. A laser chip is disposed on the third ground layer; the side of the laser chip is close to the edge of the notched corner, and the laser chip is electrically connected to one end of the high-frequency line.

10. The optical module according to claim 9, characterized in that, A first ground layer is formed on one side of the high-frequency line, and the first ground layer extends from one end of the first carrier to the other end of the first carrier; One end of the high-frequency line has a first segment and a second segment. The first segment is located on the side of the laser chip and extends along the side of the notched corner. The second segment connects to the middle of the first segment and is located on the side of the first segment away from the laser chip. A second ground layer is formed on the other side of the high-frequency line, and the second ground layer extends from the sides of the first segment and the second segment to the other end of the first carrier.

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