Pluggable optical fiber assemblies and optoelectronic transmission systems incorporating them

Abstract

This invention provides a pluggable optical cable assembly and a photoelectric transmission system therein. The optical cable assembly includes an optical module, an optical fiber array, and a first connector. The optical module is optically coupled to the optical fiber array. The optical module includes an optical engine for photoelectric conversion, a module circuit board electrically connected to the optical engine, and a high-speed connector electrically connected to the module circuit board. The optical engine and the high-speed connector are located on opposite sides of the module circuit board. The first connector is electrically connected to the module circuit board, and the high-speed connector and the first connector are respectively connected to external plugs. The optical module outputs or inputs high-speed electrical signals via the high-speed connector, and connects to a power source and inputs or outputs low-speed electrical signals via the first connector. In this way, the low-speed and high-speed electrical signals of the optical module are transmitted separately through different connectors, which can achieve a significant increase in speed in a small size and low cost, and also facilitates the operation and maintenance of the optical module.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, specifically to a pluggable optical cable assembly and an optoelectronic transmission system having the same. Background Technology

[0002] With the advent of AI and machine learning, optical modules face enormous challenges in terms of speed improvement. For example, the speed of optical modules needs to be increased from 100G and 200G to 400G, 800G, and even 1.6T.

[0003] There are two main ways to increase the speed of optical modules: one is to increase the speed of a single channel, for example, from 106Gbps to 212Gbps; the other is to increase the number of channels, for example, switching from an 8-channel optical module to a 16-channel optical module. However, the current mainstream QSFP-DD and OSFP packages cannot support 16-channel packaging, so increasing the speed of a single channel is an inevitable trend.

[0004] CPO technology has the advantage of reducing high-speed interconnect loss and cost, but it has a major drawback: in the CPO structure, the optical engine is soldered on the circuit board of the host (such as a server or optical switch), which makes it difficult to maintain and replace the optical engine. Once the optical engine fails, it needs to be returned to the factory for reflow soldering in order to replace it with a new optical engine.

[0005] The pluggable structure consisting of an optical engine and a connector is considered one of the methods to truly achieve mass production of CPO technology. In commonly used pluggable structures, the connector integrates both low-speed and high-speed electrical connections, resulting in a very large number of pins, such as nearly 100. However, with the demand for increased single-channel speeds, the connector of this commonly used pluggable structure inevitably needs to increase in size dramatically. For example, if the single-channel speed increases from 10Gbps to 200Gbps, the corresponding connector size needs to increase by 5 to 10 times. This not only leads to a significant reduction in the overall capacity of the host, making it difficult to meet the overall speed increase requirements, but also causes a sharp increase in connector costs. Utility Model Content

[0006] The purpose of this invention is to provide a pluggable optical cable assembly and an optoelectronic transmission system thereon, so as to at least solve the problems of the aforementioned optical engine being difficult to maintain and replace, and the difficulty in increasing the speed due to the increase in connector size and cost.

[0007] To achieve the above objectives, one embodiment provides a pluggable optical cable assembly. The optical cable assembly includes an optical module, an optical fiber array, and a first connector. The optical module is optically coupled to the fiber optic array. The optical module includes an optical engine for photoelectric conversion, a module circuit board electrically connected to the optical engine, and a high-speed connector electrically connected to the module circuit board. The optical engine and the high-speed connector are located on both sides of the module circuit board. The first connector is electrically connected to the module circuit board, and the high-speed connector and the first connector are respectively connected to external parts. The optical module outputs or inputs high-speed electrical signals via the high-speed connector, and connects to a power source and inputs or outputs low-speed electrical signals via the first connector.

[0008] In one implementation method, The first connector is electrically connected to the module circuit board via a cable, or it is fixedly mounted on the module circuit board and electrically connected to the module circuit board.

[0009] In one embodiment, the module circuit board has a first surface and a second surface that are opposite each other in the thickness direction; The high-speed connector is fixed to one side of the first surface, and the light engine is fixed to one side of the second surface; The first connector is electrically connected to the second surface.

[0010] In one embodiment, the optical module includes a microcontroller unit; The optical engine receives an optical signal from the fiber array, converts the optical signal into a high-speed electrical signal, and sends the high-speed electrical signal to the module circuit board; and / or, the optical engine receives a high-speed electrical signal from the module circuit board, converts the high-speed electrical signal into an optical signal, and sends the optical signal to the fiber array; The microcontroller unit is fixedly mounted on the module circuit board, electrically connected to the module circuit board, and used to control the light engine.

[0011] In one embodiment, the optical engine includes an electronic integrated chip and a photonic integrated chip; The electronic integrated chip and the photonic integrated chip are electrically connected to the microcontroller unit via the module circuit board.

[0012] In one embodiment, the optical engine includes a substrate, an electronic integrated chip, and a photonic integrated chip; The substrate is disposed on the module circuit board and is electrically connected to the module circuit board; The photonic integrated chip is fixedly mounted on the substrate and optically coupled to the fiber array. The electronic integrated chip is connected across the substrate and the photonic integrated chip, and is electrically connected at high speed to both the substrate and the photonic integrated chip.

[0013] In one embodiment, the electronic integrated chip includes a transimpedance amplifier, and the photonic integrated chip includes a photodetector; The photodetector receives optical signals from the fiber array and converts the optical signals into high-speed electrical signals. The transimpedance amplifier amplifies the high-speed electrical signal and sends it to the high-speed connector via the module circuit board.

[0014] In one embodiment, the electronic integrated chip includes a driver, and the photonic integrated chip includes an optical modulator; The driver amplifies the high-speed electrical signal received from the high-speed connector and sends the high-speed electrical signal to the optical modulator; The optical modulator converts the high-speed electrical signal into an optical signal and sends the optical signal to the fiber array.

[0015] In one embodiment, the light engine further includes a light source chip; The optical modulator modulates the emitted light from the light source chip to convert the high-speed electrical signal into an optical signal; The light source chip is integrated on the photonic integrated chip; Alternatively, the light source chip is connected to the photonic integrated chip via fiber optics.

[0016] In one embodiment, the microcontroller unit is fixedly mounted on the module circuit board via flip-chip bonding; The optical engine includes a substrate; The substrate is configured to be integrated with the module circuit board; or, the substrate is fixedly connected to the module circuit board by welding.

[0017] In one embodiment, the high-speed connector includes pins extending vertically out of a first surface of the module circuit board; The first connector includes a power connection terminal and a low-speed electrical pin; The optical module is connected to an external power source via a power connection terminal and inputs or outputs low-speed electrical signals to the outside via a low-speed electrical connector. The number of low-speed electrical pins shall not exceed 10.

[0018] To achieve the above objectives, one embodiment provides a photoelectric transmission system. The photoelectric transmission system includes a host computer and the optical cable assembly; The optical cable assembly is pluggably connected to the host; The host includes a main circuit board, a high-speed connection socket, and a first connection socket; The high-speed connection socket is electrically connected to the main circuit board and is plugged into the high-speed connection plug to enable the optical module to make a high-speed electrical connection with the main circuit board. The first connection socket is electrically connected to the main circuit board and is plugged into the first connection plug to allow the optical module to make low-speed electrical connection and power connection with the main circuit board.

[0019] In one embodiment, the main circuit board has a first main surface and a second main surface that are opposite each other in the thickness direction; The high-speed connector is fixedly disposed on the first main surface and has a socket facing away from the first main surface. The high-speed connector plug is inserted into the socket along the thickness direction of the main circuit board.

[0020] In one embodiment, the host is a server or an optical switch.

[0021] Compared with the prior art, the beneficial effects of one embodiment of this utility model are as follows: when the optical module communicates with the outside (such as the host), low-speed electrical signals and high-speed electrical signals are transmitted through different plugs. In this way, the transmission of low-speed electrical signals does not occupy the size of the high-speed connection plug, and the requirement of a significant increase in speed can be achieved in a small size and low cost; furthermore, the optical module is connected to the outside through the first connection plug and the high-speed connection plug, which facilitates the maintenance of the optical module. Attached Figure Description

[0022] Figure 1 A schematic diagram of the photoelectric transmission system according to Embodiment 1 of this utility model is shown; Figure 2 A schematic diagram of the optical module of Embodiment 1 of this utility model is shown; Figure 3 A schematic diagram of the optical engine structure of the optical module of Embodiment 1 of this utility model is shown; Figure 4 A connection diagram showing a portion of the structure of the photoelectric transmission system of Embodiment 1 of this utility model is provided. Figure 5 A schematic diagram of the optical module of Embodiment 2 of this utility model is shown; Figure 6 A connection diagram showing a portion of the structure of the photoelectric transmission system of Embodiment 3 of this utility model is shown. Detailed Implementation

[0023] The present application will be described in detail below with reference to the specific embodiments shown in the accompanying drawings. These embodiments are merely used to illustrate the present utility model, and do not limit the scope of the present application. Any structural, method, or functional changes made by those of ordinary skill in the art based on these embodiments are all included in the protection scope of the present application.

[0024] In each drawing of the present application, for the convenience of illustration, some dimensions of structures or parts may be exaggerated relative to other structures or parts, and thus the drawings are only used to illustrate the basic structure of the subject matter of the present application.

[0025] As used herein, spatially relative terms such as "upper", "above", "lower", "below" and the like are for the purpose of facilitating description to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation other than the orientation shown in the drawings. For example, if the device in the drawing is turned over, a unit described as being "below" or "beneath" other units or features will be oriented "above" the other units or features. Therefore, the exemplary term "below" can encompass both orientations of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein shall be interpreted accordingly.

[0026] Embodiment 1 Ref Figures 1 to 4 , the present embodiment provides a pluggable optical cable assembly 100.

[0027] It is applicable to scenarios of high baud rate data transmission, such as the pluggable optical cable assembly 100 for single-channel 200Gbps and single-channel 400Gbps.

[0028] The present embodiment further provides an optoelectronic transmission system, which includes a host and the pluggable optical cable assembly 100, and the pluggable optical cable assembly 100 is in plug-in fit with the host.

[0029] Ref Figure 1 , the pluggable optical cable assembly 100 includes an optical module 10, an optical fiber array 20 and a first connection plug 30.

[0030] The optical module 10 is connected to the optical fiber array 20 and is in optical coupling connection with the optical fiber array 20 for optical signal transmission.

[0031] For example, when the optical module 10 is used as an optical input device, it receives an optical signal from the optical fiber array 20.

[0032] For another example, when the optical module 10 is used as an optical output device, it emits an optical signal to the optical fiber array 20.

[0033] The optical module 10 is equipped with a high-speed connector 101.

[0034] The high-speed connector 101, also known as the RF-Socket connector, is used in conjunction with an external connector.

[0035] Here, “external” refers to a machine outside the pluggable optical cable assembly 100, such as the host machine.

[0036] The optical module 10 outputs or inputs high-speed electrical signals via the high-speed connector 101.

[0037] For example, when the optical module 10 is used as an optical input device (i.e., a receiver), it outputs high-speed electrical signals to the outside (e.g., the host) via the high-speed connector 101.

[0038] For example, when the optical module 10 is used as an optical output device (i.e., a transmitter), it receives high-speed electrical signals from an external source (e.g., the host computer) via a high-speed connector 101.

[0039] The first connector 30 is electrically connected to the optical module 10, and the first connector 30 is also plugged into an external machine (such as the host).

[0040] The optical module 10 is connected to a power source via a first connector 30, and it inputs or outputs low-speed electrical signals via the first connector 30.

[0041] In other words, the transmission of low-speed electrical signals is integrated into the power plug, rather than being integrated with high-speed electrical signals.

[0042] Thus, between the optical module 10 and the external device (such as the host), low-speed electrical signals and high-speed electrical signals are transmitted separately through different connectors. That is, high-speed electrical signals are transmitted through the high-speed connector 101, while low-speed electrical signals are transmitted through the first connector 30.

[0043] In this way, the transmission of low-speed electrical signals does not occupy the size of the high-speed connector 101. With the same single-channel rate (e.g., maintaining a rate of 106Gbps), the high-speed connector 101 is smaller and occupies less space on external machines, allowing for an increase in the number of channels (e.g., from 8 channels to 16 channels) to improve the overall system speed. Alternatively, with an increase in the single-channel rate (e.g., from 106Gbps to 200Gbps or 400Gbps), the size of the high-speed connector 101 will not increase excessively, thus avoiding a reduction in the number of channels (e.g., maintaining 8 channels) to improve the overall system speed.

[0044] As can be seen, this application adopts improved CPO technology to separate high-speed electrical connections and low-speed electrical connections, which can meet the requirement of a significant increase in speed in a small size and low cost. Furthermore, the optical module 10 is connected to an external host through the first connector 30 and the high-speed connector 101, which facilitates the operation and maintenance of the optical module 10.

[0045] Furthermore, the pluggable optical cable assembly 100 includes two optical modules 10.

[0046] One of the two optical modules 10 is mated to one opposite end of the fiber array 20, and the other is mated to the opposite end of the fiber array 20.

[0047] In one embodiment, both optical modules 10 are configured as optical transceiver modules, that is, they have both optical receiving and optical transmitting functions.

[0048] Thus, any one optical module 10 can function as an optical transmitter, acting as an optical output device (i.e., a transmitter), converting high-speed electrical signals received from the outside into optical signals and sending them to the fiber optic array 20. The optical signals then propagate along the fiber optic array 20. Any other optical module 10 can function as an optical receiver, acting as an optical input device (i.e., a receiver), receiving optical signals from the fiber optic array 20, converting them into high-speed electrical signals, and then sending them out.

[0049] In this way, the optical module 10 is set as an optical transceiver module, realizing the integration of transceiver. On the one hand, it can improve the ease of use of the pluggable optical cable assembly 100; on the other hand, it can improve the integration level, thereby merging some low-speed electrical pins and greatly reducing the size of the first connector 30.

[0050] Of course, this application is not limited to this. For example, the two optical modules 10 can be configured such that one optical module 10 is configured as an optical receiving module and the other optical module 10 is configured as an optical transmitting module.

[0051] In one embodiment, the fiber array 20 can be more than 100 meters long, meaning that the pluggable optical cable assembly 100 of this application is suitable for long-distance, high-speed transmission.

[0052] Thus, long-distance, high-speed transmission places higher demands and greater difficulty on the interaction between high-speed and low-speed signals. This application separates high-speed and low-speed connections (i.e., high-speed electrical signal transmission is carried out through the high-speed connection plug 101, while low-speed electrical signal transmission is carried out through the first connection plug 30), which gives it advantages over common CPO technology in terms of smaller size, easier speed increase, and easier operation and maintenance.

[0053] Furthermore, correspondingly, the number of first connectors 30 is also set to two, with each of the two first connectors 30 being connected to one of the two optical modules 10.

[0054] The number of hosts is also set to two, with each host corresponding to one of the two optical modules 10.

[0055] One optical module 10 is plugged into one of the host devices, and a corresponding first connector 30 is connected between the optical module 10 and the host device; another optical module 10 is plugged into another of the host devices, and a corresponding first connector 30 is connected between the optical module 10 and the host device.

[0056] Furthermore, the host can specifically be a server, such as an XPU server. Alternatively, the host can also specifically be an optical switch, such as a CPO switch.

[0057] In other words, the pluggable optical cable assembly of this application can be plugged into servers or optical switches, and can achieve high-speed single-channel interconnection, and is easy to operate and maintain.

[0058] Furthermore, the host includes a main circuit board 40, a high-speed connection socket 50, and a first connection socket 60.

[0059] The high-speed connector 50 is electrically connected to the main circuit board 40.

[0060] The high-speed connector 101 is plugged into the high-speed connector 50 to enable high-speed electrical connection between the optical module 10 and the main circuit board 40. That is, when the optical module 10 is plugged into or unplugged from the host, the high-speed connector 101 is plugged into the high-speed connector 50 to form a high-speed electrical signal transmission path.

[0061] For example, when the optical module 10 is used as an optical input device, the high-speed electrical signal in the optical module 10 enters the main circuit board 40 sequentially via the high-speed connector 101 and the high-speed connector 50.

[0062] For example, when the optical module 10 is used as an optical output device, the high-speed electrical signals in the main circuit board 40 enter the optical module 10 sequentially through the high-speed connector 50 and the high-speed connector 101.

[0063] In one embodiment, the main circuit board 40 has a first main surface 41 and a second main surface 42 that are opposite each other in the thickness direction.

[0064] A high-speed connector 50 is fixed to the first main surface 41 of the main circuit board 40, and has a socket facing away from the first main surface 41. A high-speed connector 101 is inserted into the socket along the thickness direction of the main circuit board 40.

[0065] In this way, the high-speed connector 101 on the optical module 10 is vertically plugged into the high-speed connector socket 50 on the main circuit board 40, which can effectively reduce the on-board area.

[0066] The high-speed connector 101 and the high-speed connector 50 together constitute a high-speed connector, which can also be called an RF-Socket connector.

[0067] Furthermore, the first connection socket 60 is electrically connected to the main circuit board 40.

[0068] The first connector 30 is inserted into the first connector socket 60 to provide low-speed electrical connection and power connection between the optical module 10 and the main circuit board 40. That is, when the optical module 10 is plugged into or unplugged from the host, the first connector 30 is inserted into the first connector socket 60 to form a power transmission path and a low-speed electrical signal transmission path.

[0069] In one embodiment, a first connector socket 60 is fixed to a first main surface 41 of a main circuit board 40. A first connector plug 30 is inserted into the first connector socket 60 along the thickness direction of the main circuit board 40.

[0070] Furthermore, the first connector 30 includes a power connection terminal and a low-speed electrical pin.

[0071] When the optical module 10 requires power, the optical module 10 can be powered from an external source (e.g., the host computer) via the power connection terminal.

[0072] Furthermore, the optical module 10 can also input low-speed electrical signals from the outside (e.g., the host) or output low-speed electrical signals to the outside (e.g., the host) via the low-speed electrical connector.

[0073] The first connector plug 30 and the first connector socket 60 together constitute the first connector, which integrates power connection and low-speed signal connection functions.

[0074] Furthermore, participants Figure 2 The optical module 10 includes a module circuit board 11.

[0075] In one embodiment, the first connector 30 can be electrically connected to the module circuit board 11 via a cable. This method facilitates the wiring layout on the module circuit board 11 and also improves the flexibility of plugging the first connector 30 into the first connector socket 60.

[0076] For example, one end of the cable is provided with a first connector 30, and the other end is plugged into the module circuit board 11 through another connector or directly fixed to the module circuit board 11.

[0077] Alternatively, in a variation, the first connector 30 can be directly fixed to the module circuit board 11. This variation can also achieve electrical connection between the first connector 30 and the module circuit board 11.

[0078] Furthermore, the module circuit board 11 has a first surface 111 and a second surface 112 that are opposite each other in the thickness direction.

[0079] The high-speed connector 101 is electrically connected to the module circuit board 11.

[0080] In one embodiment, a high-speed connector 101 is fixed to one side of the first surface 111 of the module circuit board 11.

[0081] The first connector 30 is electrically connected to the second surface 112 of the module circuit board 11.

[0082] In addition, the high-speed connector 101 may specifically include a number of pins extending vertically from the first surface 111 of the module circuit board 11. These pins can correspond one-to-one with the sockets in the high-speed connector 50 and be plugged in to achieve electrical connection with each other.

[0083] Continue to participate Figure 2 The optical module 10 also includes an optical engine 12 for photoelectric conversion.

[0084] The light engine 12 is electrically connected to the module circuit board 11, and it and the high-speed connection plug 101 are respectively located on both sides of the module circuit board 11.

[0085] For example, as mentioned above, the high-speed connector 101 is located on one side of the first surface 111 of the module circuit board 11, and correspondingly, the light engine 12 is fixedly located on one side of the second surface 112 of the module circuit board 11.

[0086] The optical engine 12 is connected to the fiber array 20, and is optically coupled to the fiber array 20.

[0087] In one embodiment, when the optical module 10 is an optical transceiver module: The optical engine 12 can receive optical signals from the fiber array 20, convert the optical signals into high-speed electrical signals, and send the high-speed electrical signals to the module circuit board 11; and the optical engine 12 can also receive high-speed electrical signals from the module circuit board 11, convert the high-speed electrical signals into optical signals, and send the optical signals to the fiber array 20.

[0088] That is, a high-speed electrical signal link is formed between the main circuit board 40 and the optical engine 12. For example, the high-speed electrical signal propagates sequentially along the main circuit board 40, the high-speed connector 50, the high-speed connector plug 101, the module circuit board 11, and the optical engine 12, or in reverse order along the optical engine 12, the module circuit board 11, the high-speed connector plug 101, the high-speed connector 50, and the main circuit board 40.

[0089] Of course, in a variation embodiment, when the optical module 10 is an optical receiver module: the optical engine 12 receives optical signals from the fiber array 20, converts the optical signals into high-speed electrical signals, and sends the high-speed electrical signals to the module circuit board 11.

[0090] Alternatively, in another variation, when the optical module 10 is an optical emitting module: the optical engine 12 can also receive high-speed electrical signals from the module circuit board 11, convert the high-speed electrical signals into optical signals, and send the optical signals to the fiber array 20.

[0091] Furthermore, the optical module 10 also includes a microcontroller unit (MCU) 13.

[0092] The microcontroller unit 13 is used to control the operation of the light engine 12.

[0093] For example, the microcontroller unit 13 provides power to the light engine 12, and / or the microcontroller unit 13 transmits low-speed electrical signals to the light engine 12.

[0094] Specifically, the microcontroller unit 13 can integrate functions such as analog-to-digital / digital-to-analog conversion, storage, timing, and clock.

[0095] The microcontroller unit 13 is fixedly mounted on the module circuit board 11 and electrically connected to the module circuit board 11.

[0096] In common technologies, the microcontroller unit 13 is usually located inside the host and transmits low-speed electrical signals to the light engine 12 via the main circuit board 40.

[0097] In this application, the microcontroller unit 13 is integrated into the optical module 10. When transmitting low-speed electrical signals (including control signals, communication signals, and feedback signals) between the microcontroller unit 13 and the optical engine 12, it does not need to pass through the main circuit board 40. This greatly reduces the transmission pressure of low-speed electrical signals between the optical module 10 and the main circuit board 40, and greatly reduces the number of low-speed electrical pins, thereby further reducing the size of the first connector 30.

[0098] In one embodiment, the number of low-speed electrical pins in the first connector 30 does not exceed 10.

[0099] Specifically, the transmission of low-speed electrical signals (including control signals, communication signals, and feedback signals) between the microcontroller unit 13 and the light engine 12 can be simplified to a connection using nearly 100 low-speed electrical pins in common technologies, requiring only power and I-C communication.

[0100] For example, in the first connector 30, the number of low-speed electrical pins is six. Accordingly, the first connector is configured as a 6-pin connector.

[0101] Continue to participate Figure 2 The microcontroller unit 13 can be powered via the module circuit board 11 from the first connector 30, for example... Figure 2 The power supply path V is shown in the diagram.

[0102] Furthermore, the light engine 12 can also be powered via the module circuit board 11 from the first connector 30, for example... Figure 2 The power supply path V is shown in the diagram.

[0103] Of course, the light engine 12 can also be powered from the microcontroller unit 13, forming a power transmission path that passes through the first connector 30, the module circuit board 11, the microcontroller unit 13, and the light engine 12 in sequence.

[0104] Additionally, the light engine 12 can be connected to the microcontroller unit 13 via the module circuit board 11 at low speed, for example... Figure 2 The path C1 of the low-speed electrical signal is shown in the diagram.

[0105] Of course, the light engine 12 can also be directly connected to the microcontroller 13 at low speed. For example, the light engine 12 can be electrically connected to the microcontroller 13 via bonding wires to achieve a low-speed electrical connection.

[0106] Since the microcontroller unit 13 is integrated into the optical module 10, the low-speed electrical connection between the optical engine 12 and the microcontroller unit 13 described here does not need to be relayed through the main circuit board 40 as in common technologies. Instead, it only needs to be relayed through the module circuit board 11 or transmitted directly, which greatly reduces the number of low-speed electrical pins between the optical module 10 and the main circuit board 40.

[0107] Alternatively, the light engine 12 can also be connected to the main circuit board 40 via the module circuit board 11, the first connector 30, and at a low speed, for example... Figure 2 The path C2 of the low-speed electrical signal is shown in the diagram.

[0108] Furthermore, the microcontroller unit 13 is fixedly mounted on the module circuit board 11 via flip-chip bonding. However, this application is not limited to this.

[0109] Next, participants Figure 3The light engine 12 includes a substrate 121.

[0110] In one embodiment, the substrate 121 is fixedly connected to the module circuit board 11 by soldering.

[0111] For example, the substrate 121 can be fixedly mounted on the module circuit board 11 using flip-chip bonding technology.

[0112] Furthermore, the light engine 12 includes an electronic integrated circuit (EIC) 123 and a photonic integrated circuit (PIC) 122.

[0113] The photonic integrated chip 122 is fixedly mounted on the substrate 121.

[0114] For example, the photonic integrated chip 122 can be fixedly mounted on the substrate 121 by means of welding, bonding or other methods.

[0115] The photonic integrated chip 122 is coupled and docked with the fiber optic array 20, thereby enabling optical signal interaction with the fiber optic array 20.

[0116] The photonic integrated chip 122 is electrically connected to the microcontroller unit 13 at low speed.

[0117] The electronic integrated chip 123 is connected across the substrate 121 and the photonic integrated chip 122.

[0118] For example, the electronic integrated chip 123 is fixedly connected to the substrate 121 via flip-chip bonding, and the photonic integrated chip 122 is fixedly connected via flip-chip bonding. Of course, this application is not limited to this.

[0119] The electronic integrated chip 123 is electrically connected to the microcontroller unit 13 at low speed.

[0120] Furthermore, the electronic integrated chip 123 is electrically connected at high speed to both the substrate 121 and the photonic integrated chip 122.

[0121] In one embodiment, the reference Figure 4 When the optical module 10 is an optical transceiver module or an optical receiver module, the electronic integrated chip 123 includes a transimpedance amplifier 123b, and the photonic integrated chip 122 includes a photodetector 122b.

[0122] The photodetector 122b receives optical signals from the fiber array 20 and converts the optical signals into high-speed electrical signals.

[0123] The transimpedance amplifier 123b receives a high-speed optical signal from the photodetector 122b, amplifies the high-speed electrical signal, transmits it to the high-speed connection plug 101 via the module circuit board 11, and then transmits it to the main circuit board 40.

[0124] In the case where the optical module 10 is an optical transceiver module or an optical transmitting module, the electronic integrated chip 123 includes a driver 123a, and the photonic integrated chip 122 includes an optical modulator 122a.

[0125] The main circuit board 40 transmits the high-speed optical signal to the high-speed connection plug 101; the driver 123a amplifies the high-speed electrical signal received from the high-speed connection plug 101, and transmits the high-speed electrical signal to the optical modulator 122a.

[0126] The optical modulator 122a converts the high-speed electrical signal into an optical signal, and transmits the optical signal to the optical fiber array 20.

[0127] Further, the optical engine 12 further includes a light source chip 124.

[0128] The optical modulator 122a modulates the emission light of the light source chip 124 to convert the high-speed electrical signal into an optical signal.

[0129] Reference Figure 3 and Figure 4 , in one embodiment, the light source chip 124 is fixedly integrated on the photonic integrated chip 122. In this way, the number requirement of low-speed electrical pins can be further reduced.

[0130] Specifically, the light source chip 124 may be configured as a continuous wave laser (Continuous Wave Laser in English), but is not limited thereto.

[0131] The micro control unit 13 may also be configured to control the light source chip 124.

[0132] Further, the optical engine 12 further includes an optical fiber array unit 120.

[0133] The optical fiber array 20 is connected in the optical fiber array unit 120 and is optically coupled with the optical fiber array unit 120. In this way, the optical connection between the optical fiber array 20 and the photonic integrated chip 122 is realized via the optical fiber array unit 120.

[0134] The optical engine 12 may further include heat dissipating bodies 126 and 127, configured to dissipate heat for the electronic integrated chip 123 and the light source chip 124.

[0135] Certainly, the optical engine 12 may further include other devices, which will not be described in detail.

[0136] Further, as shown in Figure 2As shown, the optical module 10 may also include a housing 14.

[0137] The housing 14 has an internal cavity, in which the module circuit board 11, microcontroller unit 13, and light engine 12 are encapsulated.

[0138] The pins of the high-speed connector 101 are at least partially exposed outside the housing 14.

[0139] Furthermore, the first connector 30 is located outside the housing 14 and is connected to the receiving cavity inside the housing 14 via a cable for electrical connection with the module circuit board 11.

[0140] In summary, the beneficial effects of this embodiment include: Between the optical module 10 and an external device (such as the host), low-speed electrical signals and high-speed electrical signals are transmitted separately through different connectors. In this way, the transmission of low-speed electrical signals does not occupy the size of the high-speed connector 101, and a significant increase in data transmission rate can be achieved with small size and low cost. Furthermore, the optical module 10 is connected to the external machine through the first connector 30 and the high-speed connector 101, which facilitates the maintenance of the optical module 10. Compared to common technologies, the microcontroller unit 13 is integrated into the optical module 10. When transmitting low-speed electrical signals between the microcontroller unit 13 and the optical engine 12, it does not need to go through the main circuit board 40, which greatly reduces the transmission pressure of low-speed electrical signals between the optical module 10 and the main circuit board 40, and greatly reduces the number of low-speed electrical pins, thereby further reducing the size of the first connector 30.

[0141] Example 2 This embodiment 2 provides a pluggable optical cable assembly and an optoelectronic transmission system having the pluggable optical cable assembly.

[0142] The only difference between Embodiment 2 and Embodiment 1 is the relationship between the substrate and the circuit board of the light engine. This difference will be described below; all other technical aspects are the same as in Embodiment 1 and will not be repeated here.

[0143] In the previous embodiment 1, the substrate 121 of the light engine 12 is fixedly mounted on the module circuit board 11.

[0144] Unlike Example 1, the reference Figure 5 In this second embodiment, the substrate 121 of the light engine 12 is integrated with the module circuit board 11. That is, the substrate 121 and the module circuit board 11 are the same component. It can be a ceramic circuit board, a traditional printed circuit board, or a silicon substrate.

[0145] Apart from the above, the technical content of this embodiment 2 is exactly the same as that of the previous embodiment 1, and will not be repeated here.

[0146] Example 3 This embodiment 3 provides a pluggable optical cable assembly and an optoelectronic transmission system having the pluggable optical cable assembly.

[0147] The only difference between Embodiment 3 and Embodiment 1 is the location of the light source chip. This difference will be described below; all other technical aspects are the same as in Embodiment 1 and will not be repeated here.

[0148] In the previous embodiment 1, the light source chip 124 was fixedly integrated on the photonic integrated chip 122.

[0149] Unlike Example 1, the reference Figure 6 In this embodiment 3, the light source chip 124 is configured as an external light source, which is connected to the photonic integrated chip 122 via fiber optics.

[0150] Specifically, the light source chip 124 can be a side-emitting laser.

[0151] In this way, compared with Embodiment 1, the technical difficulty can be reduced and the problem of increased failure rate can be avoided.

[0152] Apart from the above, the technical content of this embodiment 3 is exactly the same as that of the previous embodiment 1, and will not be repeated here.

[0153] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0154] The detailed descriptions listed above are merely specific descriptions of feasible implementation methods of this utility model and are not intended to limit the scope of protection of this utility model. All equivalent implementation methods or modifications made without departing from the spirit of this utility model should be included within the scope of protection of this utility model.

Claims

1. A pluggable optical cable assembly, characterized in that, Includes optical modules, fiber arrays, and a first connector; The optical module is optically coupled to the fiber array; The optical module includes an optical engine for photoelectric conversion, a module circuit board electrically connected to the optical engine, and a high-speed connector electrically connected to the module circuit board. The optical engine and the high-speed connector are located on both sides of the module circuit board. The first connector is electrically connected to the module circuit board, and the high-speed connector and the first connector are respectively connected to external plugs. The optical module outputs or inputs high-speed electrical signals via the high-speed connector, and connects to a power source and inputs or outputs low-speed electrical signals via the first connector.

2. The pluggable optical cable assembly according to claim 1, characterized in that, The first connector is electrically connected to the module circuit board via a cable, or it is fixedly mounted on the module circuit board and electrically connected to the circuit board.

3. The pluggable optical cable assembly according to claim 2, characterized in that, The module circuit board has a first surface and a second surface that are opposite each other in the thickness direction; The high-speed connector is fixed to one side of the first surface, and the light engine is fixed to one side of the second surface; The first connector is electrically connected to the second surface.

4. The pluggable optical cable assembly according to claim 3, characterized in that, The optical module also includes a microcontroller unit; The optical engine receives an optical signal from the fiber array, converts the optical signal into a high-speed electrical signal, and sends the high-speed electrical signal to the module circuit board; and / or, the optical engine receives a high-speed electrical signal from the module circuit board, converts the high-speed electrical signal into an optical signal, and sends the optical signal to the fiber array; The microcontroller unit is fixedly mounted on the module circuit board, electrically connected to the module circuit board, and used to control the operation of the light engine.

5. The pluggable optical cable assembly according to claim 4, characterized in that, The optical engine includes an electronic integrated chip and a photonic integrated chip; The electronic integrated chip and the photonic integrated chip are electrically connected to the microcontroller unit via the module circuit board.

6. The pluggable optical cable assembly according to claim 4, characterized in that, The optical engine includes a substrate, an electronic integrated chip, and a photonic integrated chip; The microcontroller unit is fixedly mounted on the module circuit board by flip-chip bonding. The substrate is disposed on the module circuit board and electrically connected to the module circuit board; the substrate is integrally disposed with the module circuit board, or is fixedly connected to the module circuit board by soldering. The photonic integrated chip is fixedly mounted on the substrate and optically coupled to the fiber array. The electronic integrated chip is connected across the substrate and the photonic integrated chip, and is electrically connected at high speed to both the substrate and the photonic integrated chip.

7. The pluggable optical cable assembly according to claim 6, characterized in that, The electronic integrated chip includes a transimpedance amplifier, and the photonic integrated chip includes a photodetector; the photodetector receives optical signals from the fiber array and converts the optical signals into high-speed electrical signals; the transimpedance amplifier amplifies the high-speed electrical signals and sends them to the high-speed connector via the module circuit board; And / or, the electronic integrated chip includes a driver, and the photonic integrated chip includes an optical modulator; the driver amplifies the high-speed electrical signal received from the high-speed connector and sends the high-speed electrical signal to the optical modulator; the optical modulator converts the high-speed electrical signal into an optical signal and sends the optical signal to the fiber array.

8. The pluggable optical cable assembly according to claim 7, characterized in that, The light engine also includes a light source chip; The optical modulator modulates the emitted light from the light source chip to convert the high-speed electrical signal into an optical signal; The light source chip is integrated on the photonic integrated chip; Alternatively, the light source chip is connected to the photonic integrated chip via fiber optics.

9. The pluggable optical cable assembly according to claim 4, characterized in that, The high-speed connector includes pins that extend vertically out of a first surface of the module circuit board; The first connector includes a power connection terminal and a low-speed electrical pin; The optical module is connected to an external power source via a power connection terminal and inputs or outputs low-speed electrical signals to the outside via a low-speed electrical connector. The number of low-speed electrical pins shall not exceed 10.

10. A photoelectric transmission system, characterized in that, Includes a host and the pluggable optical cable assembly as described in any one of claims 1 to 9; The optical cable assembly is pluggably connected to the host; The host includes a main circuit board, a high-speed connection socket, and a first connection socket; The high-speed connection socket is electrically connected to the main circuit board and is plugged into the high-speed connection plug to enable the optical module to make a high-speed electrical connection with the main circuit board. The first connection socket is electrically connected to the main circuit board and is plugged into the first connection plug to allow the optical module to make low-speed electrical connection and power connection with the main circuit board.

11. The photoelectric transmission system according to claim 10, characterized in that, The main circuit board has a first main surface and a second main surface that are opposite each other in the thickness direction; The high-speed connector is fixedly disposed on the first main surface and has a socket facing away from the first main surface. The high-speed connector plug is inserted into the socket along the thickness direction of the main circuit board.

12. The photoelectric transmission system according to claim 10, characterized in that, The host is a server or an optical switch.

Images