Integrated microscopic system with naked eye 3D observation and super depth of field 3D function

Abstract

The disclosure provides a comprehensive microscopic system with naked-eye 3D observation and super-depth-of-field 3D function, and relates to the field of photoelectric nondestructive testing technology. The comprehensive microscopic system comprises a first microscopic imaging module, a second microscopic imaging module and a processor. The first microscopic imaging module comprises a double imaging light path module in a stereoscopic microscope and a first image acquisition device. The second microscopic imaging module comprises an optical microscopic imaging module and a second image acquisition device. The processor is used for receiving images of two imaging light paths in the double imaging light path module collected by the first image acquisition device and an image sequence collected by the second image acquisition device, and outputting an image processing result to a display, so that a user can observe a three-dimensional image through the display. Through the above device, the needs of the user for real-time and dynamic naked-eye 3D microscopic observation of a sample and the needs of the user for static 3D modeling observation of the sample can be met, and the sample observation experience of the user is improved.

Description

Technical Field

[0001] This disclosure relates to the field of optoelectronic nondestructive testing technology, and in particular to a comprehensive microscopy system with naked-eye 3D observation and ultra-depth-of-field 3D functions. Background Technology

[0002] Stereo microscopes, also known as stereomicroscopes or dissecting microscopes, are widely used due to their strong stereoscopic effect, long working distance, and large field of view. Stereo microscopes form three-dimensional images based on the principle of binocular parallax. Specifically, a stereo microscope uses two optical microscopic systems (each with independent objectives and eyepieces) to create images. Because the two independent optical paths formed by the two systems are at a certain angle, the observer can obtain two images with slightly different angles through the binoculars. The observer's brain fuses these two slightly angularly different images to create a stereoscopic image with depth.

[0003] Stereo microscopes limit the user's ability to perceive depth by observing samples through binoculars. However, with technological advancements, naked-eye 3D (3D) microscopy systems have emerged. Unlike stereo microscopes, these systems employ a dual-optical-path design and include an image acquisition unit, processor, and 3D display. By combining optical and digital imaging technologies, naked-eye 3D microscopy allows observers to directly view realistic stereoscopic images on a 3D display.

[0004] In addition to naked-eye 3D microscopy systems, related technologies also include 3D microscopic imaging systems based on a single viewing angle. Although such systems have only one imaging optical path and a limited observation angle, they can reconstruct 3D stereoscopic images from a single viewing angle using auxiliary tools such as electrically driven motion mechanisms and processing chips. For example, related technologies can utilize microscopy multi-scanning technology, image fusion, and 3D modeling techniques to achieve ultra-large depth-of-field observation and 3D modeling of sample surfaces.

[0005] The following shortcomings exist in the related 3D microscopy imaging systems: First, although naked-eye 3D microscopy systems can perform real-time and effective 3D observation of samples, when the height of the sample's 3D undulations exceeds the physical depth of field of the stereo microscope, the image on the monitor will appear locally blurred, thus affecting the imaging observation effect. Moreover, in practical applications such as scientific research and production, it is often necessary to perform accurate 3D measurements of samples, and current naked-eye 3D microscopy systems cannot solve this problem. Second, 3D microscopy imaging systems based on a single perspective require motion control and a large amount of computation to reconstruct 3D images, making real-time 3D observation impossible and failing to meet the needs of observing moving samples. Furthermore, since such systems observe samples from a single perspective, information in specific areas will be lost, resulting in local blurring in the reconstructed 3D image. Utility Model Content

[0006] To address at least one problem existing in three-dimensional microscopic imaging systems in related technologies, this disclosure provides an integrated microscopic system with naked-eye 3D observation and super-depth-of-field 3D capabilities.

[0007] According to a first aspect of this disclosure, a comprehensive microscopy system is provided, comprising:

[0008] The first microscopic imaging module includes: a dual imaging optical path module in a stereomicroscope, wherein each imaging optical path in the dual imaging optical path module includes an eyepiece or does not include an eyepiece; and a first image acquisition device disposed at the imaging end of each imaging optical path for acquiring images of each imaging optical path.

[0009] The second microscopic imaging module includes: an optical microscopic imaging module configured as a single imaging optical path; and a second image acquisition device for acquiring image sequences of different focus positions relative to the sample under the same field of view, formed by the optical microscopic imaging module.

[0010] The processor, connected to the first image acquisition device and the second image acquisition device, is used to receive the images from the two imaging optical paths in the dual imaging optical path module and the image sequence, and output the image processing results to the display so that the user can observe the three-dimensional image through the display.

[0011] In some embodiments, the processor includes a first processor and a second processor, and the display includes a first display and a second display; the first processor, connected to the first image acquisition device, is used to receive images from the two imaging optical paths in the dual imaging optical path module and output the processed image information to the first display so that the user can observe a first three-dimensional image through the first display; the second processor, connected to the second image acquisition device, is used to receive the image sequence and output a second three-dimensional image or a fused image to the second display so that the user can observe the second three-dimensional image or the fused image through the second display, wherein the second three-dimensional image is a three-dimensional image obtained by processing the image sequence, and the fused image is a two-dimensional image obtained by processing the image sequence.

[0012] In some embodiments, the integrated microscopy system further includes the first display and the second display, which are independently configured, or the first display and the second display share a single display.

[0013] In some embodiments, the two optical axes of the dual imaging optical path module in the stereomicroscope passing through the sample are located in a first plane, and the optical axis of the optical microscopy imaging module passing through the sample forms a first angle with the first plane, wherein the first angle is greater than or equal to 0° and less than 90°.

[0014] In some embodiments, the two optical axes passing through the sample in the dual imaging optical path module of the stereomicroscope are located in different planes, and the optical axis passing through the sample in the optical microscopic imaging module has a second angle with the second plane, the second plane being a plane perpendicular to a specified straight line, the specified straight line being a straight line perpendicular to the two optical axes passing through the sample, and the second angle being greater than or equal to 0° and less than 90°.

[0015] In some embodiments, the second microscopic imaging module further includes a lifting mechanism, which is fixedly connected to the optical microscopic imaging module and is used to drive the optical microscopic imaging module and the second image acquisition device to move together along the longitudinal direction to change the focus position relative to the sample.

[0016] In some embodiments, the lifting mechanism is also fixedly connected to the dual imaging optical path module, and is used to drive the dual imaging optical path module and the first image acquisition device to move together along the longitudinal direction.

[0017] In some embodiments, the second microscopic imaging module further includes: a lifting mechanism connected to the image acquisition chip in the second image acquisition device, used to drive the image acquisition chip to move along the longitudinal direction to change the focus position relative to the sample; or, a lifting mechanism fixedly connected to the stage, used to drive the sample on the stage to move along the longitudinal direction to change the focus position relative to the sample.

[0018] In some embodiments, the optical microscopy imaging module includes an objective lens and a mirror body, and an optical lens is mounted in the mirror body. The second microscopy imaging module further includes a lifting mechanism, which is fixedly connected to the optical lens and is used to drive the optical lens to move longitudinally to change the focus position relative to the sample. Alternatively, the optical microscopy imaging module includes an objective lens and a mirror body, and a liquid lens is mounted in the mirror body. The second microscopy imaging module further includes a driving mechanism, which is used to drive the liquid lens to change its shape to change the focus position relative to the sample. Alternatively, the optical microscopy imaging module includes an objective lens and a mirror body, and a lens array is mounted in the mirror body. The second microscopy imaging module further includes a driving mechanism, which is used to drive the lens units in the lens array to change their pose in order to change the focus position relative to the sample.

[0019] In some embodiments, the integrated microscopy system further includes: a reflector disposed between the sample and the dual imaging optical path module, for reflecting light illuminating the sample back to the dual imaging optical path module; and an adjustment mechanism for adjusting the position or orientation of the reflector.

[0020] In some embodiments, the integrated microscopy system further includes: a first mirror disposed between the sample and the dual imaging optical path module, and whose installation position does not affect the imaging of the dual imaging optical path module, for reflecting a portion of the light irradiating the sample to a second mirror, wherein another portion of the light irradiating the sample enters the dual imaging optical path module; and a second mirror disposed between the sample and the optical microscopy imaging module, for reflecting light from the first mirror to the optical microscopy imaging module.

[0021] In some embodiments, the integrated microscopy system further includes: a base plate for supporting a stage; a rotatable bracket mounted on the base plate and connected to the first microscopic imaging module and the second microscopic imaging module, for driving the first microscopic imaging module and the second microscopic imaging module to rotate, thereby adjusting the observation angle of the sample; and a locking mechanism connected to the rotatable bracket for locking the rotatable bracket when it rotates to a specified angle.

[0022] Other features and advantages of this disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0023] The accompanying drawings, which form part of this specification, illustrate embodiments of this disclosure and, together with the specification, serve to explain the principles of this disclosure.

[0024] Figure 1 This is a schematic diagram of the structure of an integrated microscopy system according to some embodiments of the present disclosure;

[0025] Figure 2 This is a schematic diagram of a dual imaging optical path module in a first microscopic imaging module according to some embodiments of the present disclosure;

[0026] Figure 3 This is a schematic diagram of an optical microscopy module in a second microscopy imaging module according to some embodiments of the present disclosure;

[0027] Figure 4 This is a schematic diagram showing the optical axis position relationship between two microscopic imaging modules according to some embodiments of this disclosure;

[0028] Figure 5 This is a schematic diagram of the structure of an integrated microscope system according to other embodiments of this disclosure;

[0029] Figure 6 This is a schematic diagram of the structure of an integrated microscope system according to other embodiments of this disclosure;

[0030] Figure 7 This is a schematic diagram of the optical path principle of the dual imaging optical path module in the first microscopic imaging module according to other embodiments of this disclosure;

[0031] Figure 8 This is a schematic diagram of the optical path principle of the optical microscopy module in a second microscopy imaging module according to other embodiments of this disclosure;

[0032] Figure 9 This is a schematic diagram of the structure of an integrated microscopy system according to some embodiments of the present disclosure;

[0033] Figure 10 This is a schematic diagram of the structure of an integrated microscopy system according to some embodiments of the present disclosure;

[0034] Figure 11 This is a flowchart illustrating a three-dimensional modeling method according to some embodiments of the present disclosure;

[0035] Figure 12 This is a flowchart illustrating a three-dimensional modeling method according to other embodiments of this disclosure;

[0036] Figure 13This is a partial optical path schematic diagram of two microscopic imaging modules according to some embodiments of the present disclosure;

[0037] Figure 14 This is a schematic diagram of initial three-dimensional images according to some embodiments of the present disclosure;

[0038] Figure 15 This is a schematic diagram of a modified three-dimensional image according to some embodiments of the present disclosure;

[0039] Figure 16 This is a schematic diagram of the structure of a three-dimensional modeling apparatus according to some embodiments of the present disclosure.

[0040] This disclosure can be more clearly understood with reference to the accompanying drawings and the following detailed description. Detailed Implementation

[0041] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.

[0042] At the same time, it should be understood that, for ease of description, the dimensions of the various parts shown in the accompanying drawings are not drawn according to actual scale.

[0043] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this disclosure or its application or use.

[0044] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0045] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0046] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0047] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0048] To address at least one problem existing in 3D microscopic imaging systems in related technologies, this disclosure provides an integrated microscopic system and 3D modeling method with naked-eye 3D observation and super-depth-of-field 3D capabilities.

[0049] Figure 1 This is a schematic diagram of the structure of an integrated microscopy system according to some embodiments of the present disclosure. For example... Figure 1 As shown, the integrated microscopy system includes a first microscopy imaging module 10, a second microscopy imaging module 20, and a processor 30.

[0050] The first microscopic imaging module 10, also known as the naked-eye 3D microscopic imaging module, can work simultaneously with the second microscopic imaging module 20 or independently. The naked-eye 3D microscopic imaging module, based on the principle of dual-optical-path stereomicroscopy and combined with digital imaging and a display, achieves three-dimensional imaging, allowing the observer to directly observe the three-dimensional image of the sample through the display without any auxiliary instruments. The first microscopic imaging module 10 includes a dual-imaging optical path module 11 and a first image acquisition device 12, both found in stereomicroscopes. The dual-imaging optical path module may or may not include an eyepiece. The first image acquisition device 12 is located at the imaging end of each imaging optical path in the dual-imaging optical path and is used to acquire images from each imaging optical path.

[0051] The dual-imaging optical path module 11 can have various structures. Two exemplary structures are described below. In the first exemplary structure, the dual-imaging optical path module 11 is a dual-optical-path imaging module in a stereomicroscope based on the Greenough Design principle. For example, as... Figure 2 As shown in Figure (a), the dual-imaging optical path module 11 employs a dual-optical-path imaging module based on the Greenough Design in a stereomicroscope, specifically including an eyepiece 111 and an objective lens 112 located on each of the two optical paths. Furthermore, the two optical paths of the dual-imaging optical path module 11 are focused onto the sample 71, and there is a certain angle between the two optical paths. One of the optical paths passes through the first optical axis 113 and forms a first image through the objective lens and eyepiece on that optical path; the other optical path passes through the second optical axis 114 and forms a second image through the objective lens and eyepiece on that optical path.

[0052] In the second exemplary structure, the dual-imaging optical path module 11 is a dual-optical-path imaging module in a stereomicroscope based on the Common Main Objective (CMO) principle. For example, as... Figure 2As shown in Figure (b), the dual-imaging optical path module 11 adopts a dual-optical-path imaging module in a stereomicroscope based on the principle of a common primary objective lens. Specifically, it includes a primary objective lens 112 and eyepieces 111 located on each of the two optical paths. The two optical paths of the dual-imaging optical path module 11 are focused on the sample 71, and there is a certain angle between the two optical paths. One of the optical paths passes through the first optical axis 113 and forms a first image through the primary objective lens and the eyepieces on that optical path; the other optical path passes through the second optical axis 114 and forms a second image through the primary objective lens and the eyepieces on that optical path.

[0053] In both of the above exemplary structures, the dual-imaging optical path module may further include an illumination source. The illumination source can be fixedly mounted at the objective lens end of the dual-imaging optical path module 11 for illuminating the sample. Specifically, the illumination source can be a ring-shaped illumination source, a coaxial illumination source, or a hybrid illumination source, etc. Furthermore, in both of the above exemplary structures, the stereomicroscope can be a fixed-magnification microscope, a non-continuous variable-magnification stereomicroscope, or a continuous variable-magnification stereomicroscope. Additionally, in some other examples, a photographic macro lens with the same magnification, working distance, and field of view can be used instead of a stereomicroscope.

[0054] The first image acquisition device can be installed in several ways. Two examples are provided below. In the first example, the dual-imaging optical path module eliminates the binoculars. In this example, one first image acquisition device is installed in one of the two imaging optical paths, and the first image acquisition device is fixed in the original position of the eyepiece in that optical path; another first image acquisition device is installed in the other of the two imaging optical paths, and the first image acquisition device is fixed in the original position of the eyepiece in that optical path.

[0055] In the second example, the dual-imaging optical path module retains binoculars. In this example, a first image acquisition device (e.g., camera 1) is installed in one of the two imaging optical paths, and the first image acquisition device is located at a reasonable position on that optical path where the eyepiece points towards the area to be observed by the naked eye; another first image acquisition device (e.g., camera 2) is installed in the other of the two imaging optical paths, and the first image acquisition device is located at a reasonable position on that optical path where the eyepiece points towards the area to be observed by the naked eye.

[0056] The second microscopic imaging module 20, also known as the ultra-depth-of-field microscopic imaging module, can work simultaneously with the first microscopic imaging module 10 or independently. The ultra-depth-of-field microscopic imaging module acquires image sequences relative to different focus positions on the sample, and obtains a fused image with expanded depth of field by fusing the image sequences. Then, it performs 3D modeling based on the fused image to obtain a 3D image, thereby achieving 3D observation and 3D measurement. In this embodiment, by integrating the first and second microscopic imaging modules on the same device, the need for real-time, dynamic naked-eye 3D microscopic observation of samples can be met, as well as the user's need for static 3D modeling and observation of samples, thus improving the user's sample observation experience.

[0057] The second microscopic imaging module 20 includes an optical microscopic imaging module 21 and a second image acquisition device 22. The optical microscopic imaging module 21 is configured as a single imaging optical path. The second image acquisition device 22 is used to acquire image sequences formed by the optical microscopic imaging module 21 at different focus positions relative to the sample within the same field of view.

[0058] The optical microscopic imaging module 21 and the second image acquisition device 22 can be installed in various ways, which will be explained below with two examples.

[0059] The first example regarding installation methods is as follows: Figure 1 As shown. In this example, the optical path of the optical microscopy imaging module 21 does not overlap with either of the two optical paths of the dual imaging optical path module, and the optical path of the second image acquisition device does not overlap with the optical path of the first image acquisition device. That is to say, the optical microscopy imaging module 21 and the dual imaging optical path module coexist and are connected by a supporting connection structure. The first image acquisition device and the second image acquisition device are different structures that coexist.

[0060] In the first example regarding the installation method, the optical microscopy imaging module 21 can be adopted as follows: Figure 3 The structure is shown. Specifically, the optical microscopy imaging module 21 may include a mirror body 211 and an objective lens 212. The optical microscopy imaging module 21 is a single imaging optical path, which passes through a third optical axis 213 and forms an image of the sample 71 via the objective lens, mirror body, etc. By changing the focus position of the second microscopy imaging module relative to the sample through scanning or other means, an image sequence with different focus positions relative to the sample in the same field of view can be obtained.

[0061] In some examples, the microscope body in the optical microscopy imaging module 21 adopts a straight cylindrical structure. This structure offers continuous variable magnification observation, a uniform field of view, and supports both annular and coaxial illumination, thus enhancing the user's experience in three-dimensional microscopic observation. Alternatively, the microscope body in the optical microscopy imaging module can also employ an L-shaped reflective structure. Using this structure not only achieves similar imaging effects to the straight cylindrical structure but also helps reduce the overall height of the second microscopy imaging module, facilitating equipment integration.

[0062] In addition, the optical microscopy imaging module 21 may also include an illumination source. The illumination source can be fixedly mounted on the objective lens end of the optical microscopy imaging module 21 for illuminating the sample. In specific implementations, the illumination source can be a ring illumination source, a coaxial illumination source, or a hybrid illumination source, etc.

[0063] In the first example, the optical axes of the first microscopic imaging module 10 and the second microscopic imaging module 20 can satisfy the following: Figure 4 The relationships shown in (a) to (c) are as follows: the two optical axes passing through the sample of the dual imaging optical path module (i.e., the first optical axis 113 and the second optical axis 114) are located in the first plane 115, and the optical axis passing through the sample of the optical microscopy imaging module (i.e., the third optical axis 213) forms a first angle with the first plane 115, which is greater than or equal to 0° and less than 90°. By making the first and second optical axes coplanar and making the third optical axis located in the first plane or at an acute angle to the first plane, it helps to improve the quality of naked-eye 3D imaging and the quality of ultra-depth-of-field 3D imaging.

[0064] Alternatively, the optical axes of the first microscopic imaging module 10 and the second microscopic imaging module 20 can satisfy the following: Figure 4 The relationships shown in (d) to (f) are as follows: the two optical axes passing through the sample in the dual-imaging optical path module (i.e., the first optical axis 113 and the second optical axis 114) are located in different planes, and the optical axis passing through the sample in the optical microscopy imaging module (i.e., the third optical axis 213) has a second angle with the second plane 116. The second plane 116 is a plane perpendicular to a specified straight line, which is a straight line perpendicular to the two optical axes passing through the sample (i.e., the first optical axis 113 and the second optical axis 114), and the second angle is greater than or equal to 0° and less than 90°. By making the first and second optical axes coplanar and making the third optical axis located in the second plane or at an acute angle to the second plane, the manufacturing difficulty of the integrated microscopy system can be reduced while meeting the requirements of three-dimensional imaging.

[0065] Furthermore, in the first example, the focus position of the second microscopic imaging module relative to the sample can be changed in various ways. Six such methods are illustrated below.

[0066] The first method can be applied to, for example... Figure 1In the integrated microscopy system shown, in the first approach, the sample is fixed, and the optical microscopy imaging module moves synchronously with the first image acquisition device. Specifically, in this approach, the second microscopy imaging module has the following structure: the second microscopy imaging module also includes a lifting mechanism. The lifting mechanism is fixedly connected to the optical microscopy imaging module and is used to drive the optical microscopy imaging module and the second image acquisition device to move together along the longitudinal direction to change the focusing position of the second microscopy imaging module relative to the sample. For example, the lifting mechanism includes... Figure 1 The electric lifting shaft 91 and motion controller 92 are shown. The electric lifting shaft 91 is connected to the motion controller 92, and the optical microscopy imaging module can be connected to the slider of the electric lifting shaft 91 through the transverse connecting plate 61. Under the control of the motion controller 92, the electric lifting shaft 91 can drive the optical microscopy imaging module and the second image acquisition device to move longitudinally, thereby changing the focus position of the second microscopy imaging module relative to the sample.

[0067] In the first approach, the second microscopic imaging module may also have the following structure: In addition to being fixedly connected to the optical microscopic imaging module, the lifting mechanism may also be fixedly connected to the dual-imaging optical path module, used to simultaneously drive the optical microscopic imaging module and the second image acquisition device to move longitudinally together, and also drive the dual-imaging optical path module and the first image acquisition device to move longitudinally together. For example, as... Figure 1 As shown, the lifting mechanism includes an electric lifting shaft 91 and a motion controller 92; the first microscopic imaging module 10 and the second microscopic imaging module 20 are connected to the slider of the electric lifting shaft via a transverse connecting plate 61. By connecting the lifting mechanism to the first and second microscopic imaging modules, synchronous control of the first and second microscopic imaging modules can be achieved. Compared to setting up an independent lifting mechanism for each module, this simplifies the product structure and improves the convenience of user operation.

[0068] The second to sixth methods can be applied to three-dimensional microscopic imaging devices with other structures. In the second method, the sample, optical microscopic imaging module, and first image acquisition device are all fixed, while the image acquisition chip in the image acquisition device is moved. Specifically, in this method, the second microscopic imaging module has the following structure: the second microscopic imaging module also includes a lifting mechanism, which is connected to the image acquisition chip in the second image acquisition device and is used to drive the image acquisition chip to move longitudinally to change its focus position relative to the sample. For example, the lifting mechanism drives the image acquisition chip in the image acquisition device to move along the optical axis. Different positions of the image acquisition chip in the optical path correspond to different focal planes at the objective lens end, thereby realizing the movement of the focal plane of the second microscopic imaging system relative to the sample.

[0069] In the third approach, the optical microscopy imaging module and the first image acquisition device are kept stationary while the sample is moved. Specifically, in this approach, the second microscopy imaging module has the following structure: the second microscopy imaging module further includes a lifting mechanism, wherein the lifting mechanism is fixedly connected to the stage and is used to drive the sample on the stage to move longitudinally to change the focus position of the second microscopy imaging system relative to the sample.

[0070] In the fourth approach, the sample, the optical microscopy imaging module, and the first image acquisition device are kept stationary; instead, the optical components within the optical microscopy imaging module are moved. Specifically, in this approach, the second microscopy imaging module has the following structure: the optical microscopy imaging module includes an objective lens and a lens body, with an optical lens mounted within the lens body; the second microscopy imaging module also includes a lifting mechanism, which is fixedly connected to the optical lens and used to drive the optical lens to move longitudinally to change its focusing position relative to the sample.

[0071] In the fifth approach, the sample, optical microscopy imaging module, and first image acquisition device are kept stationary; instead, the shape of the optical component (e.g., a liquid lens) is changed. Specifically, in this approach, the second microscopy imaging module has the following structure: the optical microscopy imaging module includes an objective lens and a lens body, and a liquid lens is mounted in the lens body; the second microscopy imaging module also includes a driving mechanism for driving the liquid lens to change its shape to change its focusing position relative to the sample.

[0072] In the sixth approach, the sample, optical microscopy imaging module, and first image acquisition device are kept stationary. Instead, the angles and orientations of the optical components in the optical component array (e.g., a lens array) in the optical path are changed. Specifically, in this approach, the second microscopy imaging module needs to have the following structure: the optical microscopy imaging module includes an objective lens and a lens body, and a lens array is installed in the lens body; the second microscopy imaging module also includes a driving mechanism, which is used to drive the lens units in the lens array to change their pose in order to change the focus position relative to the sample.

[0073] In addition to the six methods mentioned above for changing the focus position relative to the sample, other methods can also be used to change the focus position relative to the sample. For example, the second image acquisition device in the second microscopic imaging module can be a light field camera. A light field camera has the physical characteristic of multifocal imaging, and can acquire a sequence of images with different focus positions relative to the sample in a single photograph.

[0074] In the second example regarding the installation method, the optical microscopy imaging module 21 is obtained by reusing components from one optical path in the dual imaging optical path module, and the second image acquisition device 22 is obtained by reusing the first image acquisition device on that optical path. For example, the objective lens and lens body forming a whole in one optical path of the dual imaging optical path module can be used as the optical microscopy imaging module, and the first image acquisition device on that optical path can be used as the second image acquisition device.

[0075] The processor 30, connected to the first image acquisition device 12 and the second image acquisition device 22, is used to receive images from the two imaging optical paths in the dual imaging optical path module 11 and the aforementioned image sequence, and output the image processing results to a display (not shown in the figure) so that the user can observe the three-dimensional image through the display. In specific implementations, the processor can be integrated with the display; or, the processor can be integrated with the first image acquisition device or the second image acquisition device; or, the processor can be set independently.

[0076] In some examples, processor 30 includes a first processor 31 and a second processor 32, and the display includes a first display and a second display. The first processor 31, connected to the first image acquisition device 12, receives images from the two imaging optical paths in the dual imaging optical path module and outputs the processed image information to the first display, allowing the user to observe a first three-dimensional image through the first display. The second processor 32, connected to the second image acquisition device, receives an image sequence and outputs a second three-dimensional image or a fused image to the second display, allowing the user to observe a second three-dimensional image through the second display. The second three-dimensional image is obtained by fusing the image sequence and performing three-dimensional modeling; the fused image is obtained by fusing the image sequence, and the depth of field of the sample (image) in the fused image is expanded. In specific implementations, the first and second displays can be set independently, or the first and second displays can share a single display.

[0077] It should be noted that when using a first microscopic imaging module to achieve naked-eye 3D microscopic observation, the first processor can use existing and mature processing methods in related technologies to process the dual-optical-path images; when using a second microscopic imaging module to achieve ultra-depth-of-field 3D microscopic imaging, the second processor can use existing and mature processing methods in related technologies to process the image sequence. In this embodiment, by using the first microscopic imaging module, the first processor, and the first display, the user's need for real-time, dynamic naked-eye 3D microscopic observation of samples can be met; by using the second microscopic imaging module, the second processor, and the second display, the user's need for static 3D modeling and observation of samples can be met, improving the user's sample observation experience.

[0078] In some embodiments, the integrated microscopy system further includes a base plate 51, a rotatable support 41, and a locking mechanism 42. The base plate 51 supports the stage 52. The rotatable support 41 is mounted on the base plate 51 and connected to the first microscopic imaging module 10 and the second microscopic imaging module 20, and is used to rotate the first microscopic imaging module 10 and the second microscopic imaging module 20 to adjust the observation angle of the sample. The locking mechanism 42 is connected to the rotatable support 41 and is used to lock the rotatable support when it rotates to a specified angle. By providing the rotatable support and locking device, it is convenient to observe the sample from multiple angles, improving the comprehensiveness of three-dimensional microscopic observation.

[0079] In this embodiment, by integrating a first microscopic imaging module, a second microscopic imaging module, and a processor on the same device, the user's needs for real-time, dynamic naked-eye 3D microscopic observation of samples can be met, as well as the user's needs for static 3D modeling observation of samples, thus improving the user's sample observation experience. This helps researchers and testing personnel to quickly and comprehensively observe the fine 3D structure and 3D measurement of minute dimensions of samples, achieving a unification of dynamic and static 3D microscopic observation, as well as qualitative and quantitative observation.

[0080] Figure 5 and Figure 6 This is a schematic diagram of the structure of an integrated microscope system according to other embodiments of this disclosure. For example... Figure 5 and Figure 6 As shown, the integrated microscopy system in this embodiment of the present disclosure is... Figure 1 The difference in the device shown is that the integrated microscopy system also includes a reflector 81 and a support 82. The reflector 81, positioned between the sample and the dual-imaging optical path module, reflects light incident on the sample back to the dual-imaging optical path module. The support 82 supports the reflector 81.

[0081] In some examples, such as Figure 7 As shown, the dual-imaging optical path module 11 adopts a dual-optical-path imaging module based on the Greenough Design in a stereomicroscope, specifically including an eyepiece 111 and an objective lens 112 located on each of the two optical paths. Furthermore, the two optical paths are focused onto the sample 71, and there is a certain angle between the two optical paths. One of the optical paths passes through the first optical axis 113 and forms a first image of the sample via a reflecting mirror 81, the objective lens on that optical path, and the eyepiece; the other optical path passes through the second optical axis 114 and forms a second image of the sample via a reflecting mirror 81, the objective lens on that optical path, and the eyepiece.

[0082] further, Figure 5 and Figure 6The integrated microscopy system shown may also include an adjustment mechanism (not shown in the figure). The adjustment mechanism is used to adjust the position and / or orientation of the mirror. For example, the adjustment mechanism is a rotation mechanism or a translation structure, used to quickly move the mirror 81 into or out of the optical path of the dual imaging optical path module. When the mirror 81 moves out of the optical path, the fields of view centers observed by the first microscopic imaging module and the second microscopic imaging module are not aligned; when the mirror 81 moves into the optical path, the fields of view centers observed by the first microscopic imaging module and the second microscopic imaging module can be aligned. In this embodiment of the disclosure, by setting up the mirror and the adjustment mechanism, it is convenient for the user to adjust the two microscopic imaging modules, which helps to improve the user's experience in three-dimensional microscopic observation.

[0083] In some embodiments of this disclosure, the reflector 81 is not disposed between the sample and the dual-imaging optical path module, but rather between the sample and the optical microscopy imaging module, for reflecting light illuminating the sample to the optical microscopy imaging module. For example, as... Figure 8 As shown, the optical microscopy imaging module 21 may include a mirror body 211 and an objective lens 212. The optical microscopy imaging module 21 is a single imaging optical path, which passes through a third optical axis 213 and forms an image of the sample 71 via a reflecting mirror 81, an objective lens 212, a mirror body 211, etc. By changing the focus position of the second microscopy imaging module relative to the sample through scanning or other means, an image sequence with different focus positions relative to the sample in the same field of view can be obtained.

[0084] In some embodiments of this disclosure, both the dual-imaging optical path module and the optical microscopy imaging module are equipped with an illumination source. For example, the illumination source may be an LED ring light source, which, due to its uniform illumination, long lifespan, and low heat generation, helps improve the user's experience in three-dimensional microscopic observation. Alternatively, a coaxial illumination source may be used, which solves the problem that ring illumination cannot clearly see smooth surfaces (such as mirrors, metallographic surfaces, etc.), improving the clarity of three-dimensional microscopic observation. Yet another example is that the illumination source may be a hybrid illuminator comprising a ring illuminator and a coaxial illuminator.

[0085] In some embodiments of this disclosure, the integrated microscopy system further includes a first display and a second display. The first display and the first processor can be integrated into one unit, for example, in an industrial computer, desktop computer, or other device. The second display and the second processor can also be integrated into one unit, for example, in an industrial computer, desktop computer, or other device.

[0086] Figure 9 and Figure 10 This is a schematic diagram of the structure of an integrated microscopy system according to some embodiments of the present disclosure. Figure 9 and Figure 10The illustrated mechanism is a preferred mechanism for implementing the 3D modeling method proposed in this disclosure, such as... Figure 9 and Figure 10 As shown, the integrated microscopy system in this embodiment of the present disclosure is... Figure 1 The difference in the device shown is that the integrated microscopy system also includes a first mirror 83, a second mirror 85, a first support 84, and a second support 86.

[0087] A first reflecting mirror 83 is disposed between the sample and the dual-imaging optical path module 11, and its installation position does not affect the imaging of the dual-imaging optical path module. It is used to reflect a portion of the light illuminating the sample 71 to the second reflecting mirror 85, wherein another portion of the light illuminating the sample enters the dual-imaging optical path module 11. A first support member 84 is used to support the first reflecting mirror.

[0088] The second reflector 85 is disposed between the sample 71 and the optical microscopy imaging module 21, and is used to reflect light from the first reflector 83 to the optical microscopy imaging module 21. The second support member 86 is used to support the second reflector. Exemplarily, the first support member 84 and the second support member can be connected to the transverse connecting plate 61 respectively, so that they can move together with the dual imaging optical path module and the optical microscopy imaging module under the drive of the lifting mechanism connected to the transverse connecting plate.

[0089] In some examples, the installation positions of the first and second reflectors satisfy the condition that the first and second optical axes of the first microscopic imaging module and the third optical axis of the second microscopic imaging module are located in the same plane. For example, the first and second reflectors are arranged relatively parallel to each other, and they are tilted at a 45° angle relative to the horizontal plane.

[0090] In this embodiment of the disclosure, by setting a first reflecting mirror and a second reflecting mirror, it is convenient to adjust the positional relationship between the optical axes of the two microscopic imaging modules, which helps to improve the clarity of three-dimensional microscopic imaging and thus improve the user's experience in three-dimensional microscopic observation.

[0091] Figure 11 This is a flowchart illustrating a three-dimensional modeling method according to some embodiments of the present disclosure. Figure 11 As shown, the three-dimensional modeling method of some embodiments of this disclosure can be applied to the integrated microscopy system as described above, and the method includes steps S111 to S113.

[0092] In step S111, the first microscopic imaging module and the second microscopic imaging module are controlled to move longitudinally in order to acquire the first image sequence, the second image sequence and the third image sequence.

[0093] In some embodiments, the integrated microscopy system employs, for example... Figure 1 , Figure 5 or Figure 9 The structure is shown. In these embodiments, the integrated microscopy system can have multiple operating modes, including: a first operating mode, i.e., the first microscopic imaging module operates alone; a second operating mode, i.e., the second microscopic imaging module operates alone; and a third operating mode, i.e., the first microscopic imaging module and the second microscopic imaging module operate together. In the third operating mode, the following can be used: Figure 11 The process shown is used for 3D modeling.

[0094] Furthermore, in the above embodiments, step S111 may include: controlling the first microscopic imaging module and the second microscopic imaging module to move along the optical axis (i.e. the third optical axis) of the second microscopic imaging module so as to acquire a corresponding first image sequence in one of the dual optical paths and a corresponding second image sequence in the other of the dual optical paths through the first image acquisition device, and to acquire a third image sequence through the second image acquisition device.

[0095] In some embodiments, the 3D modeling method further includes: before step S111, aligning the field of view center of the first microscopic imaging module and the field of view center of the second microscopic imaging module, wherein the field of view center of the first microscopic imaging module is the midpoint of the line connecting the two field of view centers of the dual imaging optical path. Specifically, the field of view centers of the two microscopic imaging modules can be aligned manually or automatically. Performing the above-mentioned field of view center adjustment operation helps reduce the image processing operations required subsequently due to field of view center offset, thereby improving the efficiency of 3D modeling.

[0096] In step S112, the first image sequence, the second image sequence, and the third image sequence are fused according to their sharpness to obtain a first fused image, a second fused image, and a third fused image. The depth of field of the sample images in the first to third fused images is expanded.

[0097] Step S112 can be implemented in several ways. Two exemplary implementations are described below.

[0098] In a first embodiment, step S112 includes: performing pixel offset compensation on the first image sequence and the second image sequence to obtain the compensated first image sequence and the second image sequence; and performing fusion processing on the compensated first image sequence, the compensated second image sequence, and the third image sequence according to the sharpness.

[0099] In the above embodiment, considering that the optical axes of the first and second microscopic imaging modules are not parallel, when the two microscopic imaging modules are moved along the optical axis of the second microscopic imaging module by the lifting mechanism, a horizontal offset will occur between the acquired first and second image sequences. Therefore, to improve the final three-dimensional imaging effect, offset compensation is performed on the first and second image sequences before fusing them.

[0100] In some examples, offset compensation is performed as follows: pixel offset data of the first image sequence relative to the third image sequence at different magnifications and pixel offset data of the second image sequence relative to the third image sequence at different magnifications are pre-calculated and saved; pixel offset compensation is performed on the first image sequence and the second image sequence based on the aforementioned pixel offset data.

[0101] In the above example, pixel offset data can be calculated as follows: based on the unit movement distance of the lifting mechanism (i.e., the distance the lifting mechanism needs to move during the acquisition of two images), the angle between the first optical axis and the second optical axis, calculate the unit offset distance corresponding to the same point on the sample; based on the unit offset distance corresponding to the same point on the sample, and the camera intrinsic and extrinsic parameters, calculate the pixel offset between two adjacent images in the first image sequence and the pixel offset between two adjacent images in the second image sequence.

[0102] In the second embodiment, instead of performing offset compensation processing on the first and second image sequences, the first to third image sequences are directly fused based on their sharpness to expand the depth of field of the sample imaging. Regarding how to specifically fuse the first to third image sequences based on their sharpness, existing processing methods in related technologies can be used.

[0103] In step S113, a three-dimensional model is performed based on the first fusion image, the second fusion image, and the third fusion image to obtain a three-dimensional image.

[0104] In some embodiments, step S113 includes: performing 3D modeling based on a third fusion image to obtain an initial 3D image; selecting target image blocks from the third fusion image, wherein the target image blocks are image blocks with a sharpness less than a sharpness threshold; selecting the image block with the highest sharpness from the target image blocks, and image blocks located at the same position as the target image blocks in the first and second fusion images, and using the image block with the highest sharpness as the final replacement image block corresponding to the target image block; correcting the initial 3D image based on the final replacement image block corresponding to the target image block, and using the corrected image as the 3D image.

[0105] In some embodiments, the 3D modeling method further includes: before performing step S113, registering the first fused image and the second fused image with the center of the third fused image as a reference point, so that the actual regions corresponding to the centers of the first to third fused images remain consistent. This process helps to further improve the subsequent 3D imaging effect.

[0106] In this embodiment of the disclosure, the above process not only enables multi-view three-dimensional microscopic observation and improves the comprehensiveness of microscopic observation, but also improves the local clarity of the constructed three-dimensional model, thereby helping to improve the accuracy of 3D observation and 3D measurement.

[0107] Figure 12 This is a flowchart illustrating a three-dimensional modeling method according to other embodiments of this disclosure. For example... Figure 12 As shown, the three-dimensional modeling method of some other embodiments of this disclosure includes steps S121 to S131.

[0108] In step S121, the integrated microscopy system is adjusted.

[0109] In some embodiments, the integrated microscopy system employs a third operating mode, namely, a mode in which the first and second microscopy imaging modules operate simultaneously. In this third operating mode, the following can be used: Figure 12 The process shown is used for 3D modeling.

[0110] In some examples, step S121 includes adjusting the dual-optical-path microscopy module and the optical microscopy module so that the fields of view centers of the two microscopy modules coincide. The field of view center of the dual-optical-path microscopy module can be understood as the midpoint of the line connecting the fields of view centers of the two optical paths.

[0111] In step S122, the first and second microscopic imaging modules are controlled to move longitudinally in order to acquire the first to third image sequences.

[0112] In some examples, step S122 includes: controlling the first microscopic imaging module and the second microscopic imaging module to move along the optical axis (i.e. the third optical axis) of the second microscopic imaging module so as to acquire a corresponding first image sequence in one of the dual optical paths and a corresponding second image sequence in the other of the dual optical paths through the first image acquisition device, and to acquire a third image sequence through the second image acquisition device.

[0113] In step S123, pixel offset compensation is performed on the first and second image sequences.

[0114] For instructions on how to perform pixel offset compensation, please refer to the relevant descriptions in the embodiments described above.

[0115] In step S124, the compensated first and second image sequences are fused to obtain a first fused image and a second fused image.

[0116] In the first fused image, the depth of field of the sample image is greater than that of the sample image in the first image sequence; in the second fused image, the depth of field of the sample image is greater than that of the sample image in the second image sequence.

[0117] In step S125, the third image sequence is fused to obtain a third fused image.

[0118] In the third fused image, the depth of field of the sample image is greater than that of the sample image in the third image sequence. Regarding the specific method for fusing the compensated first to second image sequences and the third image sequence, existing methods in related technologies can be used.

[0119] In this embodiment of the disclosure, three fused images from different viewing angles are obtained through steps S121 to S125, and the depth of field and sharpness of the image are improved. Figure 13 As shown, the A, B and C surfaces of sample 71 can be observed through the first to the third fusion images.

[0120] In step S126, pixel alignment is performed on the first to third fused images.

[0121] In some examples, the first and second fused images are registered (or aligned) using the center point of the third fused image as a reference point, so that the three fused images are aligned at the pixel level.

[0122] In step S127, the first to third fused images are cropped.

[0123] In some examples, to reduce the workload of subsequent image processing, the three fused images were cropped to obtain three images with consistent field of view and resolution.

[0124] In step S128, the sharpness of image blocks in the first to third fused images is compared, and replacement image blocks are determined based on the comparison results.

[0125] In some embodiments, the cropped third fused image is divided into multiple image blocks, and the sharpness of each image block is calculated. Then, the sharpness of each image block is compared with a set threshold. Based on the comparison results, image blocks with sharpness lower than the set sharpness threshold are selected from all image blocks, and these selected image blocks are used as target image blocks. Next, the sharpness of the target image block, the corresponding image block in the cropped first fused image, and the corresponding image block in the cropped second fused image are compared, and the image block with the highest sharpness among these three image blocks is determined based on the comparison results. This image block with the highest sharpness is the final replacement image block.

[0126] In step S129, a three-dimensional model is performed based on the third fusion image to obtain an initial three-dimensional image.

[0127] In practical implementation, existing 3D modeling methods in related technologies can be used to perform 3D modeling in order to obtain an initial 3D image.

[0128] In some examples, the initial 3D image is as follows: Figure 14 As shown. From Figure 14 As can be seen, some areas of sample image 72 in the initial 3D image are unclear. This is because the fused image obtained through depth-of-field expansion can only clearly see the sample surface, while the protrusions and depressions on the sample surface, as well as the sample sidewalls parallel or nearly parallel to the third optical axis, cannot be directly seen. Furthermore, the blurred image caused by microscope defocusing is also carried into the image sequence fusion process, resulting in a blurred area around the sidewalls in the synthesized planar image. This, in turn, leads to blurred areas in the final 3D image obtained through 3D modeling. To improve the clarity of the 3D image, this embodiment of the disclosure performs correction processing on the 3D image based on subsequent steps.

[0129] In step S130, the initial three-dimensional image is cropped to obtain a cropped three-dimensional image.

[0130] By cropping the initial 3D image, the size of the 2D image mapped onto the horizontal plane (e.g., the XY direction) is made consistent with the size of the three-dimensional image after cropping and merging.

[0131] In step S131, the cropped 3D image is corrected according to the replacement image block to obtain the corrected 3D image.

[0132] In some examples, the final replacement image is mapped onto the cropped 3D image to obtain the corrected 3D image.

[0133] Figure 15 This is a schematic diagram of the corrected 3D image. (For example...) Figure 15As shown, the corrected 3D image provides a clearer view of the top and side details of sample image 72 compared to the initial 3D image. This is because the 3D image incorporates three images from different viewing angles, allowing the corrected 3D image to show the top and side details more clearly.

[0134] In this embodiment, the above-described three-dimensional microscopic imaging system not only enables dynamic naked-eye 3D microscopic observation and static 3D modeling observation on a single device, providing a more comprehensive observation experience compared to single-type microscopic observation, but also allows for 3D model observation from multiple perspectives, improving the comprehensiveness of microscopic observation. Furthermore, through the aforementioned three-dimensional modeling process, the clearest local image can be selected from multiple images and mapped into the model, improving the local clarity of the three-dimensional image.

[0135] Figure 16 This is a schematic diagram of the structure of a three-dimensional modeling apparatus according to some embodiments of the present disclosure. For example... Figure 16 As shown, the 3D modeling apparatus 160 includes a memory 161 and a processor 162 coupled to the memory 161. The memory 161 is used to store instructions corresponding to embodiments of the 3D modeling method. The processor 162 is configured to execute the 3D modeling method in any of the embodiments of this disclosure based on the instructions stored in the memory 161.

[0136] Hereinafter, various aspects of this disclosure are described with reference to flowchart illustrations and / or block diagrams of an integrated microscopy system, 3D modeling method, and computer program product having naked-eye 3D observation and super-depth-of-field 3D capabilities according to embodiments of this disclosure. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations thereof, can be implemented by computer-readable program instructions.

[0137] These computer-readable program instructions are provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable device to produce a machine, such that execution of the instructions by the processor produces means for implementing the functions specified in one or more boxes of the flowchart and / or block diagram.

[0138] These computer-readable program instructions may also be stored in a computer-readable storage medium. These instructions cause a computer to work in a particular manner to produce an article of manufacture, including instructions that implement the functions specified in one or more boxes in a flowchart and / or block diagram.

[0139] This disclosure may take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects.

[0140] This concludes the detailed description of the integrated microscopy system and 3D modeling method with naked-eye 3D observation and super-depth-of-field 3D capabilities according to this disclosure. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art will fully understand how to implement the technical solutions disclosed herein based on the above description.

Claims

1. A comprehensive microscopy system, characterized in that, include: The first microscopic imaging module includes: a dual imaging optical path module in a stereomicroscope, wherein each imaging optical path in the dual imaging optical path module includes an eyepiece or does not include an eyepiece; and a first image acquisition device disposed at the imaging end of each imaging optical path for acquiring images of each imaging optical path. The second microscopic imaging module includes: an optical microscopic imaging module configured as a single imaging optical path; and a second image acquisition device for acquiring image sequences of different focus positions relative to the sample under the same field of view, formed by the optical microscopic imaging module. The processor, connected to the first image acquisition device and the second image acquisition device, is used to receive the images from the two imaging optical paths in the dual imaging optical path module and the image sequence, and output the image processing results to the display so that the user can observe the three-dimensional image through the display.

2. The integrated microscopy system according to claim 1, characterized in that, The processor includes a first processor and a second processor, and the display includes a first display and a second display; The first processor, connected to the first image acquisition device, is used to receive images from the two imaging optical paths in the dual imaging optical path module and output the processed image information to the first display so that the user can observe the first three-dimensional image through the first display. The second processor, connected to the second image acquisition device, is used to receive the image sequence and output the second three-dimensional image or fused image to the second display so that the user can observe the second three-dimensional image or fused image through the second display, wherein the second three-dimensional image is a three-dimensional image obtained by processing the image sequence.

3. The integrated microscopy system according to claim 2, characterized in that, The integrated microscopy system further includes the first display and the second display, which are set independently, or the first display and the second display share a single display.

4. The integrated microscopy system according to claim 1, characterized in that, The two optical axes of the dual imaging optical path module in the stereomicroscope are located on the first plane, and the optical axis of the optical microscopic imaging module that passes through the sample forms a first angle with the first plane, wherein the first angle is greater than or equal to 0° and less than 90°.

5. The integrated microscopy system according to claim 1, characterized in that, The two optical axes passing through the sample in the dual imaging optical path module of the stereomicroscope are located in different planes, and the optical axis passing through the sample in the optical microscopic imaging module has a second angle with the second plane, the second plane being a plane perpendicular to a specified straight line, the specified straight line being a straight line perpendicular to the two optical axes passing through the sample, and the second angle being greater than or equal to 0° and less than 90°.

6. The integrated microscope system according to claim 1, characterized in that, The second microscopic imaging module also includes: The lifting mechanism is fixedly connected to the optical microscopy imaging module and is used to drive the optical microscopy imaging module and the second image acquisition device to move together along the longitudinal direction to change the focus position relative to the sample.

7. The integrated microscopy system according to claim 6, characterized in that, The lifting mechanism is also fixedly connected to the dual imaging optical path module, and is used to drive the dual imaging optical path module and the first image acquisition device to move together along the longitudinal direction.

8. The integrated microscopy system according to claim 1, characterized in that, The second microscopic imaging module also includes: A lifting mechanism, connected to the image acquisition chip in the second image acquisition device, is used to drive the image acquisition chip to move longitudinally to change its focus position relative to the sample; or, The lifting mechanism, fixedly connected to the stage, is used to move the sample on the stage along the longitudinal direction to change the focus position relative to the sample.

9. The integrated microscopy system according to claim 1, characterized in that: The optical microscopy imaging module includes an objective lens and a microscope body, with an optical lens mounted in the microscope body. The second microscopy imaging module also includes a lifting mechanism, which is fixedly connected to the optical lens and used to drive the optical lens to move longitudinally to change its focusing position relative to the sample; or... The optical microscopy imaging module includes an objective lens and a mirror body, with a liquid lens mounted in the mirror body. The second microscopy imaging module further includes a driving mechanism for driving the liquid lens to change its shape to alter its focusing position relative to the sample; or... The optical microscopy imaging module includes an objective lens and a lens body, and a lens array is installed in the lens body. The second microscopy imaging module also includes a driving mechanism, which is used to drive the lens units in the lens array to change their pose so as to change the focus position relative to the sample.

10. The integrated microscopy system according to claim 1, characterized in that, The integrated microscopy system also includes: A reflector is disposed between the sample and the dual imaging optical path module to reflect light illuminating the sample back to the dual imaging optical path module; An adjustment mechanism is used to adjust the position and / or orientation of the reflector.

11. The integrated microscopy system according to claim 1, characterized in that, The integrated microscopy system also includes: A first reflecting mirror is disposed between the sample and the dual imaging optical path module, and its installation position does not affect the imaging of the dual imaging optical path module. It is used to reflect a portion of the light irradiating the sample to the second reflecting mirror, wherein another portion of the light irradiating the sample enters the dual imaging optical path module. A second reflecting mirror is disposed between the sample and the optical microscopy imaging module to reflect light from the first reflecting mirror to the optical microscopy imaging module.

12. The integrated microscopy system according to claim 1, characterized in that, The integrated microscopy system also includes: The base plate is used to support the platform. A rotatable bracket is mounted on the base plate and connected to the first microscopic imaging module and the second microscopic imaging module, used to drive the first microscopic imaging module and the second microscopic imaging module to rotate, so as to adjust the observation angle of the sample. A locking mechanism, connected to the rotatable bracket, is used to lock the rotatable bracket when it rotates to a specified angle.

Images