An integrated circuit phase modulator package

Abstract

The utility model discloses an integrated circuit phase modulator tube shell cover plate, including the board body, be equipped with the window on the board body, the window bottom is equipped with the prompt mechanism, be equipped with the heat abstractor on the board body, the board body top is equipped with the identification board, the prompt mechanism includes the mounting seat, the mounting seat top fixedly connected with the fixed flange, the mounting seat top is equipped with the first sealing glass, belong to the phase modulator cover plate technical field. This integrated circuit phase modulator tube shell cover plate, through inert gas by the communicating pipe into the annular airbag inside, make multiple elastic film's arc end close to each other and form the round hole, through the window and the round hole can only see the first prompt block in the center, when the sealing failure, inert gas leaks, multiple elastic film restores original shape and is far away from each other by using self elasticity, through the window can see the first prompt block and the second prompt block simultaneously, and the staff can discover in time and replace and overhaul the modulator.

Description

Technical Field

[0001] This utility model relates to the field of phase modulator cover technology, specifically to an integrated circuit phase modulator housing cover. Background Technology

[0002] An integrated circuit phase modulator is an optoelectronic device that modulates signals by changing the phase of light waves. Its core material is lithium niobate crystal. It is suitable for high-speed optical fiber communication networks with speeds of 10G, 20G, and 40G, and improves signal transmission efficiency. In the existing technology, when the cover plate and shell of the phase modulator are packaged, the inside is filled with inert gas for protection. However, when the seal fails and the inert gas leaks, it is difficult for the staff to detect in time and repair or replace the phase modulator. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a housing cover for an integrated circuit phase modulator, which solves the problem that when inert gas leaks due to sealing failure, it is difficult for staff to detect and repair or replace the phase modulator in a timely manner.

[0004] To achieve the above objectives, this utility model is implemented through the following technical solution: an integrated circuit phase modulator housing cover plate, comprising a plate body, a viewing window on the plate body, a prompting mechanism at the bottom of the viewing window, a heat dissipation mechanism on the plate body, and an identification plate on the top of the plate body; The prompting mechanism includes a mounting base, a fixed flange fixedly connected to the top of the mounting base, a first sealing glass on the top of the mounting base, a sealing ring between the first sealing glass and the viewing window, a second sealing glass fixedly connected to the mounting base, an annular airbag fixedly connected inside the mounting base, a connecting pipe fixedly connected to the bottom of the annular airbag, multiple elastic films fixedly connected to the top of the inner side of the mounting base, the bottom of the elastic films having an arc end, a fixed block fixedly connected to the bottom of the inner side of the mounting base, a first prompting block located in the center of the fixed block, and a second prompting block located outside the first prompting block.

[0005] Preferably, the first sealing glass is disposed inside the viewing window, and the first sealing glass is bonded to the inner wall of the viewing window, so as to seal the panel.

[0006] Preferably, the top end of the connecting pipe is connected to the annular airbag, and the bottom end of the connecting pipe passes through the mounting base and is connected to the outside, so that the inert gas in the modulator can enter the interior of the annular airbag through the connecting pipe.

[0007] Preferably, the top ends of the plurality of elastic films are fixedly connected to the inner top end of the mounting base, and the bottom ends of the plurality of elastic films form a circular hole through the arc end, so that the fixing block can be observed through the formed circular hole.

[0008] Preferably, the cross-sectional shape of the second prompting block is set to an annular shape, and both the second prompting block and the first prompting block are adhered to the fixed block, so that the first prompting block and the second prompting block can be used for prompting.

[0009] Preferably, the fixing block is located at the center of the inner bottom surface of the mounting base, and the fixing block is located directly below multiple elastic sheets, so that part of the fixing block can be covered by the elastic sheets.

[0010] Preferably, the heat dissipation mechanism includes multiple heat dissipation fins and multiple contact protrusions. The multiple heat dissipation fins are disposed on the top surface of the plate, and the multiple contact protrusions are uniformly disposed on the bottom surface of the plate. Heat dissipation channels are formed between the multiple heat dissipation fins, which can improve the heat dissipation effect of the plate.

[0011] This invention provides a cover plate for an integrated circuit phase modulator. Compared with the prior art, it has the following advantages: 1. The housing cover of this integrated circuit phase modulator allows inert gas to enter the annular airbag through a connecting pipe, causing the arc ends of multiple elastic films to approach each other and form a circular hole. Through the viewing window and the circular hole, only the first indicator block in the center can be seen. When the seal fails, the inert gas leaks, and the multiple elastic films use their own elasticity to restore their original shape and move away from each other. Through the viewing window, the first indicator block and the second indicator block can be seen simultaneously, allowing the staff to promptly detect and replace or repair the modulator.

[0012] 2. The phase modulator housing cover of this integrated circuit increases the surface area through multiple contact protrusions, enabling the heat inside the modulator to quickly exchange with the board and be transferred to multiple heat dissipation fins through the board. The multiple heat dissipation fins increase the heat dissipation area, thereby improving the heat dissipation effect of the board. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the prompting mechanism structure of this utility model; Figure 3 This is a schematic diagram of the internal structure of the mounting base of this utility model; Figure 4 This is a schematic diagram of the heat dissipation mechanism of this utility model.

[0014] In the diagram: 1. Plate; 2. Indication mechanism; 201. Mounting base; 202. Fixing flange; 203. First sealing glass; 204. Sealing ring; 205. Second sealing glass; 206. Annular airbag; 207. Connecting pipe; 208. Elastic film; 209. Arc end; 210. Fixing block; 211. First indication block; 212. Second indication block; 3. Viewing window; 4. Heat dissipation mechanism; 401. Heat dissipation fins; 402. Contact protrusion; 403. Heat dissipation channel; 5. Identification plate. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Please see Figures 1-3 This utility model provides a technical solution: an integrated circuit phase modulator housing cover plate, including a plate body 1, a viewing window 3 on the plate body 1, a prompting mechanism 2 at the bottom of the viewing window 3, a heat dissipation mechanism 4 on the plate body 1, and an identification plate 5 on the top of the plate body 1. The identification plate 5 can easily mark the phase modulator parameters and can also provide some protection against dust. The prompting mechanism 2 can be observed through the viewing window 3. The prompting mechanism 2 can be used to provide a prompt when the seal fails and inert gas leaks, so that the staff can promptly detect and replace or repair the modulator.

[0017] The prompting mechanism 2 includes a mounting base 201, with a fixing flange 202 fixedly connected to the top of the mounting base 201. A first sealing glass 203 is provided on the top of the mounting base 201, located inside the viewing window 3 and bonded to the inner wall of the viewing window 3 to seal the plate 1. A sealing ring 204 is provided between the first sealing glass 203 and the viewing window 3 to increase airtightness and prevent leakage. A second sealing glass 205 is fixedly connected to the mounting base 201. An annular airbag 206 is fixedly connected inside the mounting base 201. A connecting tube 207 is fixedly connected to the bottom end of the airbag 206. The top end of the connecting tube 207 is connected to the annular airbag 206, and the bottom end of the connecting tube 207 passes through the mounting base 201 and is connected to the outside, allowing the inert gas in the modulator to enter the interior of the annular airbag 206 through the connecting tube 207. Multiple elastic films 208 are fixedly connected to the top end of the inner side of the mounting base 201. The bottom end of each elastic film 208 has an arc-shaped end 209. The top ends of the multiple elastic films 208 are fixedly connected to the top end of the inner side of the mounting base 201, and the bottom ends of the multiple elastic films 208 form a circle through the arc-shaped end 209. A hole is formed so that the fixing block 210 can be observed through the formed circular hole. An annular airbag 206 is disposed on the outer side of the multiple elastic sheets 208, so that when the annular airbag 206 inflates, it pushes the multiple elastic sheets 208 closer together. A fixing block 210 is fixedly connected to the inner bottom surface of the mounting base 201. The fixing block 210 is located in the center of the inner bottom surface of the mounting base 201, directly below the multiple elastic sheets 208, allowing the elastic sheets 208 to partially obscure the fixing block 210. A first indicator is provided in the center of the fixing block 210. Block 211, a second prompting block 212 is provided on the outside of the first prompting block 211. The cross-sectional shape of the second prompting block 212 is set as an annular shape. The second prompting block 212 and the first prompting block 211 are both bonded to the fixing block 210, so that the first prompting block 211 and the second prompting block 212 can be used for prompting. The first prompting block 211 and the second prompting block 212 have different colors for easy distinction. When the seal is effective, only the first prompting block 211 can be seen through the viewing window 3. When the seal fails, both the first prompting block 211 and the second prompting block 212 can be seen at the same time.

[0018] Please see Figure 1 and Figure 4 The heat dissipation mechanism 4 includes multiple heat dissipation fins 401 and multiple contact protrusions 402. The multiple heat dissipation fins 401 are disposed on the top surface of the plate 1, and the multiple contact protrusions 402 are evenly disposed on the bottom surface of the plate 1. Heat dissipation channels 403 are formed between the multiple heat dissipation fins 401. The surface area can be increased by the multiple contact protrusions 402, so that the heat inside the modulator can be quickly exchanged with the plate 1 and transferred to the multiple heat dissipation fins 401 through the plate 1. The heat dissipation area can be increased by the multiple heat dissipation fins 401, thereby improving the heat dissipation effect of the plate 1.

[0019] During operation, the inert gas filling the modulator enters the annular airbag 206 through the connecting pipe 207. The annular airbag 206 inflates and expands, causing multiple elastic films 208 to deform. This causes the arc ends 209 of the multiple elastic films 208 to approach each other, forming a circular hole. Through the viewing window 3 and the circular hole, only the first indicator block 211 in the center can be seen. At this time, the seal is effective. When the seal fails, the inert gas leaks, the gas inside the annular airbag 206 is discharged and retracts, releasing the constraint on the multiple elastic films 208. The multiple elastic films 208 use their own elasticity to return to their original shape and move away from each other. Through the viewing window 3, the first indicator block 211 and the second indicator block 212 can be seen simultaneously. The staff can promptly detect and replace or repair the modulator.

[0020] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

Claims

1. A housing cover for an integrated circuit phase modulator, comprising a plate body (1), characterized in that: The plate (1) is provided with a viewing window (3), the bottom of the viewing window (3) is provided with a prompting mechanism (2), the plate (1) is provided with a heat dissipation mechanism (4), and the top of the plate (1) is provided with an identification plate (5). The prompting mechanism (2) includes a mounting base (201), a fixed flange (202) is fixedly connected to the top of the mounting base (201), a first sealing glass (203) is provided on the top of the mounting base (201), a sealing ring (204) is provided between the first sealing glass (203) and the viewing window (3), a second sealing glass (205) is fixedly connected to the mounting base (201), an annular airbag (206) is fixedly connected inside the mounting base (201), a connecting pipe (207) is fixedly connected to the bottom end of the annular airbag (206), a plurality of elastic films (208) are fixedly connected to the top of the inner side of the mounting base (201), an arc end (209) is provided at the bottom end of the elastic film (208), a fixed block (210) is fixedly connected to the bottom surface of the inner side of the mounting base (201), a first prompting block (211) is provided in the center of the fixed block (210), and a second prompting block (212) is provided on the outer side of the first prompting block (211).

2. The integrated circuit phase modulator housing cover plate according to claim 1, characterized in that: The first sealing glass (203) is disposed inside the window (3), and the first sealing glass (203) is bonded to the inner wall of the window (3).

3. The integrated circuit phase modulator housing cover plate according to claim 1, characterized in that: The top end of the connecting pipe (207) is connected to the annular airbag (206), and the bottom end of the connecting pipe (207) passes through the mounting base (201) and is connected to the outside.

4. The integrated circuit phase modulator housing cover plate according to claim 1, characterized in that: The top ends of the multiple elastic films (208) are fixedly connected to the inner top end of the mounting base (201), and the bottom ends of the multiple elastic films (208) form a circular hole through the arc end (209).

5. The integrated circuit phase modulator housing cover plate according to claim 1, characterized in that: The cross-sectional shape of the second prompt block (212) is set to be annular, and both the second prompt block (212) and the first prompt block (211) are bonded to the fixing block (210).

6. The integrated circuit phase modulator housing cover plate according to claim 1, characterized in that: The fixing block (210) is located in the center of the bottom inner side of the mounting base (201), and the fixing block (210) is located directly below the multiple elastic films (208).

7. The integrated circuit phase modulator housing cover plate according to claim 1, characterized in that: The heat dissipation mechanism (4) includes multiple heat dissipation fins (401) and multiple contact protrusions (402), with the multiple heat dissipation fins (401) disposed on the top surface of the plate (1).

8. The integrated circuit phase modulator housing cover plate according to claim 7, characterized in that: Multiple contact protrusions (402) are evenly arranged on the bottom surface of the plate (1), and heat dissipation channels (403) are formed between multiple heat dissipation fins (401).

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