A lamp panel and display device

Abstract

The application relates to the technical field of display, and specifically discloses a lamp panel and a display device. The lamp panel comprises: a circuit board, which comprises: a substrate; a conductive connecting part arranged on the substrate; an insulating layer covering one side of the conductive connecting part away from the substrate; and a plurality of light-emitting units, each of which comprises: a plurality of light-emitting chips, at least two of which are used for emitting light rays of different colors, and each of the light-emitting chips is provided with a positive electrode pin and a negative electrode pin; the positive electrode pins and the negative electrode pins of the light-emitting chips are arranged along a first direction, the plurality of light-emitting chips are arranged into at least two columns along the first direction, and the number of light-emitting chips in each column is at least one. The plurality of light-emitting chips of the same light-emitting unit can be arranged more densely, the light rays can be more fully fused after being emitted, and the color mixing uniformity of the light-emitting unit is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a light panel and display device. Background Technology

[0002] As people's demands for home audio-visual entertainment experiences continue to increase, they are placing higher demands on the clarity, color, and realism of images on display devices such as televisions.

[0003] Display devices typically include a display panel capable of displaying image information. The display panel may include a backlight board, which serves as the light source for the display panel. The backlight board may include a substrate and multiple light-emitting units disposed on the substrate. The backlight board may also include power traces disposed on the substrate and connected to the light-emitting units for supplying power to the light-emitting units.

[0004] Each light-emitting unit comprises multiple light-emitting chips, at least two of which emit light of different colors, thereby improving the color gamut of the display panel. Different colored light-emitting chips achieve different light effects through color mixing, but uneven chip arrangement may prevent different colors of light from fully blending during propagation, resulting in some colors being too strong and others too weak, ultimately leading to poor color mixing and affecting the color uniformity and accuracy of the light emitted from the lamp panel. Utility Model Content

[0005] This application discloses a lamp board and display device, in which multiple light-emitting chips in the same light-emitting unit can be arranged more densely, and the light can be more fully integrated after emission, thereby improving the color mixing uniformity of the light-emitting unit.

[0006] To achieve the above objectives, in a first aspect, some embodiments of this application provide a lamp board, comprising: a circuit board, the circuit board including: a substrate; a conductive connection portion disposed on the substrate; an insulating layer covering the side of the conductive connection portion away from the substrate; and a plurality of light-emitting units, each light-emitting unit including: a plurality of light-emitting chips disposed on the circuit board, at least two of the plurality of light-emitting chips being used to emit light of different colors, each light-emitting chip having a positive electrode pin and a negative electrode pin; a driving chip connected to the negative electrode pin of the plurality of light-emitting chips for driving the plurality of light-emitting chips to emit light; a power supply trace group disposed between the substrate and the insulating layer, the power supply trace group being connected to the positive electrode pin of the plurality of light-emitting chips through the conductive connection portion; and a ground trace group disposed between the substrate and the insulating layer, the ground trace group being electrically connected to the driving chip; the positive electrode pin and the negative electrode pin of each light-emitting chip being arranged along a first direction, the plurality of light-emitting chips being arranged along the first direction in at least two columns, and the number of light-emitting chips in each column being at least one.

[0007] If light-emitting chips of different colors are arranged in a single column along a single direction, the colored light emitted by each chip will remain relatively independent along the propagation path. However, an arrangement of at least two columns allows the chips of different colors to be spatially staggered, shortening the mixing distance of each color. After emission, the light can quickly fuse through the optical film layer, reducing local color imbalance caused by spatial isolation and making the overall output color accuracy of the synthesized light from the light-emitting unit more stable. At the same time, the positive and negative leads of each light-emitting chip are arranged along the first direction. Since most light-emitting chips are square, the extension direction of the positive and negative leads is the length direction of the light-emitting chip. The length of the light-emitting chip extends along the first direction, which is compatible with the multi-column layout along the first direction. This ensures the regularity of the light-emitting chip arrangement and improves the color mixing uniformity of the light-emitting unit by arranging the chips more concentratedly, providing a more stable synthesized light effect for the lamp board.

[0008] As an optional implementation, the conductive connection portion has multiple portions, and the multiple conductive connection portions form multiple conductive connection groups. Each conductive connection group includes two pairs of conductive connection portions. The conductive connection portions in each conductive connection group are correspondingly arranged with each light-emitting chip. The two conductive connection portions of each conductive connection group are respectively soldered to the positive electrode pin and the negative electrode pin in the light-emitting chip. The conductive connection portions of the conductive connection groups corresponding to the light-emitting chips in a column are arranged at intervals along the first direction. The insulating layer is provided with windows, which are correspondingly arranged with the conductive connection portions along the thickness direction of the circuit board. The area of ​​the windows is smaller than the area of ​​the corresponding conductive connection portion. The positive electrode pin and the negative electrode pin are both soldered to the conductive connection portion through the corresponding windows. The windows corresponding to the light-emitting chips in the same column are arranged along the first direction.

[0009] Thus, each light-emitting chip corresponds to an independent conductive connection group (including positive and negative electrode connections), and the conductive connection groups of the same column of light-emitting chips are arranged at intervals along the first direction. The two conductive connection parts of each conductive connection group are also arranged at intervals along the first direction. The conductive connection parts are arranged in a regular manner, which can ensure the effective connection between the pins and the traces.

[0010] Secondly, the openings provide a precise positioning area for chip pin soldering, while the larger conductive connection area ensures both the contact area between the solder joint and the conductive connection (reducing the risk of cold solder joints) and allows space for solder flow. The windows in the same column are arranged in an orderly manner along the first direction, corresponding to the relative positions of different color light-emitting chips, avoiding uneven color distribution caused by chip misalignment, and ensuring that the light emitted by multiple columns of chips can be fully mixed according to the design ratio. The column-spaced conductive connections and openings achieve compact circuit connections and light-emitting chip layout within the limited substrate space.

[0011] As an optional implementation, each light-emitting unit contains three light-emitting chips, each of which can emit light of a different color. Two of the light-emitting chips are arranged in a first column along the first direction, and the other light-emitting chip is arranged in a second column along the first direction. The light-emitting chip in the second column is located between the two light-emitting chips in the first column along the first direction.

[0012] In this way, with three chips of different colors (such as RGB), two chips are arranged in the first column along the first direction, and a single chip in the second column is placed in the middle position along the first direction, so that the emission points of the three colors of light form a staggered distribution in space (rather than a linear arrangement). This layout shortens the propagation distance of any two colors of light (for example, the light from the second column of chips can diffuse simultaneously in the direction of the two chips above and below the first column), allowing the light to converge and merge more quickly after emission, avoiding the local color shift caused by color segmentation when arranged in a single column.

[0013] Different colored light-emitting chips (such as blue chips, which are typically brighter than red chips) have different emission angles and light intensity distributions. Placing the second column of chips between the two chips in the first column can compensate for and balance these light intensity differences. For example, if the second column contains lower-brightness red chips, placing them in the middle allows their light to more evenly cover the illumination area of ​​the two chips in the first column (such as high-brightness blue or green chips), avoiding color imbalance caused by brightness differences. Combined with independent control of the driver chip, more precise color ratio matching can be achieved. In addition, the compact staggered column layout optimizes space utilization while ensuring color mixing effects.

[0014] As an optional implementation, the two conductive connections corresponding to the light-emitting chip extend at least partially to opposite sides of the corresponding two openings along the first direction.

[0015] The conductive connection is a key path for heat conduction in the chip. As it extends to both sides of the opening, the heat dissipation area increases significantly, enabling the heat generated during chip operation to be conducted to the substrate or surrounding structure more quickly.

[0016] Among them, the two conductive connection portions corresponding to the light-emitting chip extend at least partially to the opposite sides of the corresponding two openings along the first direction, which means that at least one of the two conductive connection portions of the same conductive connection group extends away from its corresponding opening along the first direction, so that the solder at the opening provides a flow path along the first direction (the arrangement direction of the positive and negative pins).

[0017] As an optional implementation, each of the conductive connecting portions has a first edge extending along the first direction. The first edge is disposed on the side of the conductive connecting portion opposite to another row of conductive connecting portions. The opening is disposed close to the first edge, and the conductive connecting portion extends in a direction away from the opening.

[0018] A larger copper foil area is formed between the window and the conductive connection part far away from the edge of the window. This extra copper foil area can conduct the heat conducted by the light-emitting chip through the solder joint (window), and disperse the heat to the substrate or surrounding air through the larger surface area, avoiding the accumulation of heat near the window solder joint.

[0019] Because the traces (such as power traces, connections between driver chips and conductive connectors) are integrally formed with the conductive connectors, and the traces are connected to the conductive connectors on the side far away from the window, the connection strength between the traces and the conductive connectors is high and they are not easy to break. In addition, the connection between the pads and the traces can maintain a certain distance, so it is not easy for the solder joints to fall off or become cold-soldered, thus ensuring the stability of the current path of each light-emitting chip.

[0020] As an optional implementation, at least a portion of the edges of each of the conductive connections are complementary in shape to the corresponding edges of adjacent conductive connections.

[0021] In this way, the complementary edge shapes can maintain the spacing between adjacent connections to a smaller insulation distance, and form physical isolation through shape adaptation, eliminating problems such as solder overflow short circuits and signal crosstalk caused by excessively close spacing, ensuring that the current path of each connection is independent (such as the positive connection and the negative connection, and the connection of different chips do not affect each other), and ensuring the precise control of the driver chip on a single chip.

[0022] On the other hand, while the complementary edge shapes avoid adjacent connecting parts, the conductive connecting parts of multiple rows and multiple light-emitting chips can be compactly arranged on the substrate.

[0023] As an optional implementation, each light-emitting unit contains four light-emitting chips, and one of the light-emitting chips can emit light of the same color as one of the other three light-emitting chips; two of the light-emitting chips are arranged in a third column along the first direction, and the other two light-emitting chips are arranged in a fourth column along the first direction, and the light-emitting chips in the third and fourth columns are correspondingly arranged along a second direction, which is perpendicular to the first direction.

[0024] Increasing the number of light-emitting chips of the same color enhances the output power of that color. For example, in scenarios where the red component of white light needs to be strengthened to improve warm-toned performance, the additional red light chip can compensate for the insufficient brightness of a single chip. Simultaneously, the synergistic emission of the fourth chip with the existing chips of the same color allows for a more uniform distribution of that color light on the light panel, avoiding localized brightness peaks or dark areas caused by single-chip emission. This is particularly suitable for backlight modules in display devices with high requirements for color saturation and brightness.

[0025] In this way, the two columns of corresponding arrangement allow the four light-emitting chips to be evenly distributed in space, shortening the mixing path of each color light and reducing local color shift.

[0026] As an alternative implementation, the light-emitting chips capable of emitting the same color are located in the same column along the first direction.

[0027] This design creates a concentrated and uniform emission area for light of the same color along the column direction. Simultaneously, the two columns correspond along the second direction, ensuring that each color light is evenly covered in the lateral direction (second direction) according to the designed proportions. Combined with the optical film layer, the color accuracy deviation of the synthesized light can be controlled within a smaller range. Furthermore, it simplifies the circuit control logic. Arranging chips of the same color in the same column allows the conductive connections in the same column to share part of the drive link (e.g., the negative pins of red light chips in the same column can be connected to the driver chip through the same set of branches). This reduces the number of traces and facilitates synchronous brightness control of chips of the same color by the driver chip, avoiding control delays or accuracy differences caused by the dispersed arrangement of chips of the same color.

[0028] As an optional implementation, the conductive connection portion includes: a first side edge located on a first side of the window; a second side edge located on a second side of the window, wherein at least one of the first side edge and the second side edge is disposed adjacent to the conductive connection portions of other conductive connection groups; a third side edge connected between the first side edge and the second side edge, wherein the third side edge is located at the end of the first side edge and the second side edge away from the window edge, and the power supply wiring group or the driving chip is connected to the light-emitting chip through the third side edge; the distance between the first side edge and the second side edge gradually increases along the direction away from the window edge, and the third side edge is an arc-shaped edge.

[0029] The two sides are located on either side of the window, with at least one adjacent to other conductive connection groups, forming a lateral boundary constraint on the solder and preventing solder from diffusing into adjacent conductive structures. The outward extension of the first and second sides increases the overall copper foil area of ​​the conductive connection, allowing chip heat to be transferred to the conductive connection through the solder joints, accelerating heat conduction to the external environment and improving heat dissipation. Furthermore, the third side is ensured to be sufficiently long, resulting in a more reliable connection with the traces and a more stable connection between the traces and the conductive connection, guaranteeing signal transmission.

[0030] The third side is curved, which reduces the space occupied by the conductive connection. Compared with right angles or broken lines, the curved edge can naturally transition the outward angle between the first and second sides. This compact contour design means that the conductive connection in the area away from the window (the part connected to the power supply line group or driver chip) does not need to reserve extra space to accommodate the corner structure. Thus, within the limited substrate area, more layout space is freed up for adjacent conductive connection groups or other components, which is beneficial for the dense arrangement of multiple light-emitting chips.

[0031] Secondly, embodiments of this application also provide a display device, the display device including a backlight module, the backlight module including: a lamp panel as described in any of the first aspects; an optical film layer disposed on the light-emitting side of the lamp panel; and a liquid crystal panel disposed on the side of the optical film layer away from the lamp panel.

[0032] The first aspect of the lamp board solves the problem of color mixing in the arrangement of single-row light-emitting chips, and can output uniform and stable multi-color synthesized light. As the core of the backlight module, the uniform light of this lamp board, after being optimized by the optical film layer, can make the colors of the LCD panel display more balanced and free from local color deviation, improve the accuracy of display colors, and provide users with a better visual experience. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of a display device provided in some embodiments of this application;

[0035] Figure 2 This is a schematic diagram of the structure of a display panel provided in some embodiments of this application;

[0036] Figure 3 Schematic block diagrams of the structure of a display device provided in some embodiments of this application;

[0037] Figure 4 This is a schematic diagram of the structure of the lamp panel provided in some embodiments of this application;

[0038] Figure 5 Simplified structural diagrams of circuit boards provided in some embodiments of this application;

[0039] Figure 6 A schematic diagram of a light-emitting unit including three light-emitting chips and their corresponding conductive connections, provided for some embodiments of this application;

[0040] Figure 7 A schematic diagram of a light-emitting unit including four light-emitting chips and their corresponding conductive connections, provided for some embodiments of this application;

[0041] Figure 8 This is a schematic diagram of the structure of conductive connection parts, windows and pins provided in some embodiments of this application;

[0042] Figure 9 This is a schematic diagram of the structure of the conductive connection portion provided in some embodiments of this application.

[0043] Explanation of reference numerals in the attached figures:

[0044] 100 - Lamp board; 101 - Power supply circuit; 110 - Circuit board; 111 - Substrate; 112 - Conductive connection group; 1121 - Conductive connection part; 11211 - First positive conductive connection part; 11212 - First negative conductive connection part; 11213 - Third positive conductive connection part; 11214 - Third negative conductive connection part; 1122 - First edge; 1125 - First side; 1126 - Second side; 1127 - Third side; 113 - Insulating layer; 1131 - Window; 123 - Light-emitting unit; 123a - Light-emitting chip; 123b - Positive pin ; 123c - Negative pin; 1231 - First light-emitting chip; 1232 - Second light-emitting chip; 1233 - Third light-emitting chip; 1234 - Fourth light-emitting chip; 130 - Driver chip; 140 - Power supply wiring group; 150 - Grounding wiring group; 200 - Display device; 201 - Motherboard; 202 - Central control board; 203 - Driver board; 210 - Display panel; 211 - Backlight module; 2111 - Optical film layer; 212 - Liquid crystal panel; 212a - Liquid crystal molecule; 213 - Color filter; 220 - Housing; 230 - Bracket; X - First direction; Y - Second direction. Detailed Implementation

[0045] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0046] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0047] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0048] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0049] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0050] As people's demands for home audio-visual entertainment experiences continue to increase, they are placing higher demands on the clarity, color, and realism of images on display devices such as televisions. Figure 1 This is a schematic diagram of the structure of a display device provided in some embodiments of this application. For example... Figure 1 As shown, an embodiment of this application provides a display device 200, which has an image display function.

[0051] The display device 200 can be a television, laptop computer, tablet computer, in-vehicle computer, smartphone, smartwatch, projection device, head-up display (HDU), augmented reality (AR) glasses, etc. The embodiments of this application do not further limit the specific form of the display device 200.

[0052] like Figure 1 As shown, the display device 200 may include a display panel 210 and a housing 220. The display panel 210 is used to display image information. The display panel 210 may be a light-emitting diode (LED) display panel, for example, the display panel 210 may be at least one of a micro light-emitting diode (Micro LED) display panel and a mini light-emitting diode (Mini LED) display panel.

[0053] Understandably, Mini LED and Micro LED display panels have advantages such as self-illumination, high brightness, high contrast, high resolution, high color saturation, long lifespan, fast response speed, and low power consumption.

[0054] The display panel 210 includes a light-emitting side and a backlight side disposed opposite to each other. The housing 220 is disposed on the backlight side and connected to the display panel 210, so that the housing 220 can protect the display panel 210 and reduce the impact of the housing 220 on the light emitting side of the display panel 210.

[0055] The housing 220 can be connected to the display panel 210 by snap-fit ​​or by adhesive bonding. The embodiments of this application do not further limit this.

[0056] For example, such as Figure 1 As shown, the display device 200 may also include a bracket 230, which is located on one side of the housing 220 and connected to the housing 220, serving to support the housing 220 and the display panel 210.

[0057] Figure 2 This is a schematic diagram of the structure of a display panel provided in some embodiments of this application. The display panel 210 is described below as an example.

[0058] In some examples, such as Figure 2 The display panel 210 includes a backlight module 211 and a liquid crystal panel 212. That is, the display device 200 includes a backlight module 211 and a liquid crystal panel 212.

[0059] The backlight module 211 includes a lamp panel 100 and an optical film layer 2111. Understandably, the lamp panel 100 serves as the light source for the display panel 210, and includes multiple light-emitting units capable of emitting light. The light-emitting side of the lamp panel 100 is the light-emitting side of the display panel 210. The optical film layer 2111 is disposed on the light-emitting side of the lamp panel 100, allowing the light emitted from the lamp panel 100 to pass through the optical film layer 2111, thereby enabling the optical film layer 2111 to perform optical processing on the light emitted from the lamp panel 100.

[0060] For example, the number of optical film layers 2111 can be one or more. When the number of optical film layers 2111 is multiple, the multiple optical film layers 2111 can be stacked on the light-emitting side of the lamp panel 100. The optical film layer 2111 can include at least one of a light-diffusing sheet, a prism sheet, and a diffuser sheet. Understandably, the light-diffusing sheet is used to uniformly distribute light, the prism sheet is used to refract or reflect light to improve the brightness of the display panel 210, and the diffuser sheet is used to diffuse the light.

[0061] It is understood that the optical film layer 2111 may also include other light processing films besides light sheets, prism sheets and diffusers. The embodiments of this application do not further limit the specific form of the optical film layer 2111.

[0062] Continue to refer to Figure 2 In some examples, the liquid crystal panel 212 is disposed on the side of the optical film layer 2111 away from the lamp panel 100. For example, the liquid crystal panel 212 may include a liquid crystal driving circuit (not shown) and a plurality of liquid crystal molecules 212a. The liquid crystal driving circuit can apply a voltage to the liquid crystal molecules 212a, so that the liquid crystal molecules 212a can be deflected to transmit or block the light emitted by the backlight module 211.

[0063] Continue to refer to Figure 2 For example, the display device 200 may also include a color filter 213, which is disposed on the side of the liquid crystal panel 212 away from the backlight module 211. The color filter 213 has red pixel blocks, green pixel blocks and blue pixel blocks, where the red pixel blocks are used to transmit red light, the green pixel blocks are used to transmit green light and the blue pixel blocks are used to transmit blue light.

[0064] Understandably, the light passing through the color filter 213 is red, green and blue light of different intensities, enabling the display panel 210 to achieve full-color display.

[0065] Figure 3 This is a schematic block diagram illustrating the structure of a display device provided in some embodiments of this application. Referring below... Figure 3 An example is given of the method for displaying images on the display panel 210.

[0066] For example, such as Figure 3 As shown, the display device 200 may include a motherboard 201, a central control board 202, and a driver board 203. The motherboard 201, the central control board 202, and the driver board 203 are respectively disposed within the receiving space enclosed by the housing 220.

[0067] The motherboard 201, the central control board 202, and the driver board 203 may include at least one of printed circuit board (PCB), flexible printed circuit board (FPC), and flexible printed circuit board (FPCB). The specific forms of the motherboard 201, the central control board 202, and the driver board 203 may be the same or different, and the embodiments of this application do not further limit them.

[0068] For example, the display device 200 may also include a main chip, a backlight control chip (bcon chip), and a timing control chip (tcon chip). The main chip is located on the motherboard 201, the backlight control chip is located on the central control board 202, and the timing control chip is located on the driver board 203.

[0069] Alternatively, the display device 200 may only include the motherboard 201, with the main chip, backlight control chip, and timing control chip all located on the motherboard. This application's embodiments use the example of the display device 200 including the motherboard 201, central control board 202, and driver board 203 as an example for further illustration.

[0070] Continue to refer to Figure 3 For example, the motherboard 201 is connected to the central control board 202 and the driver board 203 respectively, so that the main chip can transmit signals to the backlight control chip and the timing control chip respectively.

[0071] For example, the main chip can receive external video sources and decode them. After decoding the video source, the main chip can send some data to the timing control chip. The timing control chip is connected to the liquid crystal driving circuit of the liquid crystal panel 212, enabling the timing control chip to control the deflection of the liquid crystal molecules 212a.

[0072] The main chip can send another part of the data to the backlight control chip. The backlight control chip is connected to the driver chip 130, and the driver chip 130 is connected to the light-emitting unit 123, so that the backlight control chip can control the light-emitting unit 123 to emit light through the driver chip 130.

[0073] Continue to refer to Figure 3 The display device 200 also includes a power supply circuit 101, which is connected to the light-emitting unit 123 and is used to supply power to the light-emitting unit 123. The driver chip 130 can receive the light-emitting state of the light-emitting unit 123 and generate a first feedback signal based on the light-emitting state of the light-emitting unit 123, feeding the first feedback signal back to the backlight control chip. The backlight control chip can generate a second feedback signal based on the first feedback signal and feed the second feedback signal back to the power supply circuit 101. The power supply circuit 101 can supply power to the light-emitting unit 123 based on the second feedback signal to achieve closed-loop control.

[0074] For example, the light-emitting unit 123 may include a plurality of light-emitting chips 123a, at least two of which are capable of emitting light of different colors.

[0075] Understandably, in order to simplify the structure of the accompanying drawings, Figure 3 Only one light-emitting chip 123a is shown in the figure, and the number of light-emitting chips 123a in the light-emitting unit 123 is not limited.

[0076] When there are multiple light-emitting chips 123a in the light-emitting unit 123, the power supply circuit 101 can be connected to the multiple light-emitting chips 123a one-to-one through multiple power supply lines, or at least two light-emitting chips 123a can be connected to the power supply circuit 101 through the same power supply line.

[0077] Understandably, in order to simplify the structure of the accompanying drawings, Figure 3 Only one power supply trace connecting the light-emitting unit 123 and the power supply circuit 101 is shown in the diagram, and the number of power supply traces is not limited.

[0078] Each light-emitting unit 123 includes multiple light-emitting chips 123a, at least two of which emit light of different colors, thereby improving the color gamut of the display panel. Different colored light-emitting chips 123a achieve different light effects through color mixing, but uneven chip arrangement may prevent different colors of light from fully blending during propagation, resulting in some colors being too strong and others too weak, ultimately leading to poor color mixing and affecting the color uniformity and accuracy of the light emitted from the lamp panel.

[0079] To address the aforementioned issues, this application provides a lamp board and display device in which multiple light-emitting chips in the same light-emitting unit can be arranged more densely, and the light can be more fully integrated after emission, thereby improving the color mixing uniformity of the light-emitting unit.

[0080] The present technical solution will be further described below with reference to the embodiments and accompanying drawings.

[0081] Please see Figure 5 , Figure 5 The following is a simplified structural diagram of the circuit board 110 provided in some embodiments of this application. In a first aspect, embodiments of this application provide a lamp board 100, which includes a circuit board 110. The circuit board 110 typically includes a substrate 111, a conductive connection portion 1121, and an insulating layer 113. The conductive connection portion 1121 is disposed on the substrate 111, and the insulating layer 113 covers the side of the conductive connection portion 1121 that is away from the substrate 111.

[0082] The substrate 111 is mostly a sheet-like substrate made of insulating material. It has a flat surface and a certain mechanical strength, which can support all components such as conductive connection part 1121, light-emitting chip 123a, and driving chip 130. It avoids structural damage or connection breakage caused by external force deformation of the circuit. Its own insulation properties can isolate conductive structures of different layers (such as copper foil of double-sided or multi-layer boards) to prevent short circuits and ensure electrical safety. Some high thermal conductivity materials (such as ceramic substrates) can conduct the heat generated by the components during operation to the outside, avoiding local overheating that affects the life of the components.

[0083] A thin copper foil layer is attached to the surface of the substrate 111, which is etched into specific shapes (such as traces and pads). The insulating layer 113 of the circuit board 110 on the lamp board 100 is usually white solder resist (white oil), mainly used for solder protection and circuit insulation. By covering the circuit (thin copper foil layer), it prevents high temperatures from damaging components during soldering, and at the same time, it acts as insulation to avoid short circuits. White oil has good reflectivity; the higher the whiteness of the white oil, the better the reflectivity, and the higher the energy utilization rate, thus making the energy-saving effect more significant.

[0084] Normally, the area corresponding to the component pins (such as the positive and negative pins 123c of the light-emitting chip 123a) is soldered to a pad shape, and the remaining area is wire-shaped. In this embodiment, the conductive connection portion 1121 is a copper foil area connected between the wire-shaped copper foil and the pad. The conductive connection portion 1121 is configured to allow solder to flow on the conductive connection portion 1121.

[0085] In some embodiments, combined with Figure 4 , Figure 6 and Figure 7 , Figure 6 This application provides a schematic diagram of a light-emitting unit 123 including three light-emitting chips 123a and their corresponding conductive connection portions 1121, according to some embodiments. Figure 7 This is a schematic diagram of a light-emitting unit 123 including four light-emitting chips 123a and its corresponding conductive connection portion 1121 provided in some embodiments of this application. The lamp board 100 also includes multiple light-emitting units 123. Each light-emitting unit 123 includes multiple light-emitting chips 123a and is disposed on a circuit board 110. Each light-emitting chip 123a is provided with a positive electrode pin 123b and a negative electrode pin 123c. The positive electrode pin 123b and the negative electrode pin 123c of the light-emitting chip 123a are connected to the pad.

[0086] In some embodiments, the lamp board 100 further includes a driver chip 130, a power supply trace group 140, and a ground trace group 150. The driver chip 130 is connected to the negative pin 123c of a plurality of light-emitting chips 123a to drive the plurality of light-emitting chips 123a to emit light. The power supply trace group 140 and the ground trace group 150 are both formed by etching a thin copper foil layer and are both disposed between the substrate 111 and the insulating layer 113.

[0087] The driver chip 130 is the "core controller" in electronic devices such as the lamp board 100 that controls the operation of the light-emitting unit 123. It is usually connected to the negative pin 123c of the light-emitting chip 123a. It can receive external control signals and convert them into driving current, and accurately adjust the lighting, extinguishing and brightness of the light-emitting chip 123a. It can realize the coordinated operation of multiple light-emitting chips 123a, such as controlling the light emission sequence of different color chips to ensure the consistency of display or lighting effects.

[0088] The power trace assembly 140 is connected to the positive pins 123b of multiple light-emitting chips 123a via conductive connectors 1121. The power trace assembly 140 includes multiple power traces connected to each light-emitting chip 123a, stably delivering external power to each chip 123a and providing continuous and sufficient power support for chip illumination. During design, appropriate trace width and material must be matched according to the power requirements of the light-emitting chips 123a to reduce power loss during transmission and ensure that all light-emitting chips 123a receive stable operating voltage and current.

[0089] The grounding trace group 150 is electrically connected to the driver chip 130, which can form a stable potential reference point and ensure the stable operating voltage of the driver chip 130.

[0090] In some embodiments, combined with Figure 6 and Figure 7 The positive electrode pin 123b and negative electrode pin 123c of each light-emitting chip 123a are arranged along the first direction X. The multiple light-emitting chips 123a are arranged along the first direction X in at least two columns, and the number of light-emitting chips 123a in each column is at least one.

[0091] If the light-emitting chips 123a of different colors are arranged in a single column along a single direction, the colored light emitted by each chip will remain relatively independent along the propagation path. However, the arrangement of at least two columns allows the chips of different colors to be spatially staggered, shortening the mixing distance of each color light. After the light is emitted, it can be quickly fused through the optical film layer 2111, reducing local color imbalance caused by spatial isolation and making the overall color accuracy of the synthesized light output by the light-emitting unit 123 more stable. Meanwhile, the positive and negative pins 123c of each light-emitting chip 123a are arranged along the first direction X. Since most of the light-emitting chips 123a are square, the extension direction of the positive and negative pins 123c of the light-emitting chip 123a is the length direction of the light-emitting chip 123a. The length of the light-emitting chip 123a extends along the first direction X, which is compatible with the multi-column layout along the first direction X. This not only ensures the regularity of the arrangement of the light-emitting chips 123a, but also improves the color mixing uniformity of the light-emitting unit 123 by arranging each light-emitting chip 123a more concentratedly, thus providing a more stable synthesized light effect for the lamp board 100.

[0092] The number of light-emitting chips 123a varies. In order to arrange the chips more centrally, they can be arranged in two columns, three columns, four columns, etc. This embodiment does not limit this.

[0093] In some embodiments, combined with Figures 6 to 8 , Figure 8The diagram below shows the structure of the conductive connection portion 1121, the window 1131, and the pins provided in some embodiments of this application. There are multiple conductive connection portions 1121, and the multiple conductive connection portions 1121 are spaced apart to form multiple conductive connection groups 112. Each conductive connection group 112 includes two pairs of conductive connection portions 1121 that are arranged in pairs and spaced apart. The conductive connection portions 1121 in each conductive connection group 112 are arranged in a one-to-one correspondence with each light-emitting chip 123a, that is, each conductive connection group 112 corresponds to one light-emitting chip 123a. The two conductive connection portions 1121 of each conductive connection group 112 are respectively soldered to the positive electrode pin 123b and the negative electrode pin 123c in the light-emitting chip 123a.

[0094] In some embodiments, the insulating layer 113 is provided with a plurality of openings 1131, and the openings 1131 and the conductive connection portions 1121 are arranged one-to-one along the thickness direction of the circuit board 110. The area of ​​the opening 1131 is smaller than the area of ​​the corresponding conductive connection portion 1121. Along the thickness direction of the circuit board 110, the conductive connection portion 1121 corresponding to the area of ​​the opening 1131 is a pad, that is, the exposed area of ​​the conductive connection portion 1121. The positive electrode pin 123b and the negative electrode pin 123c are both soldered to the conductive connection portion 1121 (pad) through the corresponding opening 1131.

[0095] Each light-emitting chip 123a corresponds to an independent conductive connection group 112 (including positive and negative connection parts), and the conductive connection groups 112 of the same column of light-emitting chips 123a are arranged at intervals along the first direction X. The two conductive connection parts 1121 of each conductive connection group 112 are also arranged at intervals along the first direction X. The conductive connection parts 1121 are arranged in a regular manner, and the conductive connection parts 1121 can ensure the effective connection between the pins and the traces.

[0096] Secondly, the window 1131 provides a precise positioning area for chip pin soldering, while the larger conductive connection portion 1121 ensures both the contact area between the solder joint and the conductive connection portion 1121 (reducing the risk of cold solder joints) and reserves space for solder flow. The windows 1131 in the same column are arranged in an orderly manner along the first direction X, corresponding to the relative positions of different color light-emitting chips 123a, avoiding uneven color distribution caused by chip misalignment, and ensuring that the light emitted by multiple columns of chips can be fully mixed according to the design ratio. The column-spaced conductive connection portions 1121 and windows 1131 achieve a compact layout of circuit connections and light-emitting chips 123a within the limited substrate space.

[0097] In some embodiments, combined with Figure 6Each light-emitting unit 123 contains three light-emitting chips 123a, and the three light-emitting chips 123a can emit light of different colors. Two of the light-emitting chips 123a are arranged in the first column along the first direction X, and the other light-emitting chip 123a is arranged in the second column along the first direction X. The light-emitting chip 123a in the second column is located between the two light-emitting chips 123a in the first column along the first direction X.

[0098] Specifically, the plurality of light-emitting chips 123a includes a first light-emitting chip 1231, a second light-emitting chip 1232 and a third light-emitting chip 1233. The first light-emitting chip 1231 and the second light-emitting chip 1232 are arranged in a first column along a first direction X, and the third light-emitting chip 1233 is arranged in a second column. The first column and the second column are spaced apart along a second direction Y, and the second direction Y is perpendicular to the first direction X.

[0099] In a configuration of three different colored chips (such as RGB), two chips are arranged in the first column along the first direction X, and a single chip in the second column is positioned in the middle along the first direction X. This arrangement creates a staggered spatial distribution of the emission points of the three colors of light (rather than a linear arrangement). This layout shortens the propagation distance of any two colors of light (e.g., the light from the second column of chips can simultaneously diffuse towards the two chips above and below in the first column), allowing the light to converge and merge more quickly after emission, thus avoiding the local color shift caused by color segmentation in a single-column arrangement.

[0100] Different colored light-emitting chips 123a (e.g., blue light chips are typically brighter than red light chips) have different emission angles and light intensity distributions. Placing the second column of chips between the two chips in the first column can compensate for and balance these light intensity differences. For example, if the second column contains lower-brightness red light chips, placing them in the middle allows their light to more evenly cover the illumination area of ​​the two chips in the first column (e.g., high-brightness blue or green light chips), avoiding color imbalance caused by brightness differences. Combined with the independent control of the driver chip 130, more precise color ratio matching can be achieved. In addition, the compact staggered column layout optimizes space utilization while ensuring color mixing effects.

[0101] It should be noted that the trace connecting the negative pin 123c of the first light-emitting chip 1231 to the driver chip 130 can be arranged using the gap between the third light-emitting chip 1233 and the second light-emitting chip 1232, or it can be led out through the edge of the conductive connection part 1121 of the second light-emitting chip 1232 away from the window 1131. This embodiment does not limit this.

[0102] In some embodiments, combined with Figure 6 The two conductive connection portions 1121 corresponding to the light-emitting chip 123a extend at least partially to the opposite sides of the corresponding two openings 1131 along the first direction X.

[0103] The conductive connection portion 1121 is a key path for heat conduction of the chip. After it extends to both sides of the window 1131, the heat dissipation area is significantly increased, which can conduct the heat generated by the chip during operation to the substrate or surrounding structure more quickly.

[0104] In this configuration, the two conductive connection portions 1121 corresponding to the light-emitting chip 123a extend at least partially to opposite sides of the corresponding two openings 1131 along the first direction X. This means that at least one of the two conductive connection portions 1121 in the same conductive connection group 112 extends away from its corresponding opening 1131 along the first direction X, providing a flow path for the solder at the opening 1131 along the first direction X (the arrangement direction of the positive electrode pin 123b and the negative electrode pin 123c). The positive and negative electrode pins 123c of each light-emitting chip 123a are arranged along the first direction X. One of the two conductive connection portions 1121 has an extension space along the first direction X, but the other may or may not have an extension space.

[0105] It should be noted that the conductive connection part 1121 is usually a copper sheet. During soldering, the solder flows in the conductive connection part 1121 and will not flow to areas without copper foil.

[0106] Combination Figure 6 Taking the two conductive connection portions 1121 of the first light-emitting chip 1231 as an example, the conductive connection portion 1121 corresponding to the positive electrode pin 123b is the first positive electrode conductive connection portion 11211, and the conductive connection portion 1121 corresponding to the negative electrode pin 123c is the first negative electrode conductive connection portion 11212. Since the first positive conductive connection portion 11211 is located at the edge along the first direction X, it can extend away from the window 1131 along the first direction X to provide a flow path for the solder in the direction opposite to the negative pin 123c along the first direction X. The first negative conductive connection portion 11212 is adjacent to the conductive connection portion 1121 of the second light-emitting chip 1232 along the first direction X, so there is no extra space to provide an extension space for the first negative conductive connection portion 11212. At this time, the distance between the two opposite edges of the first negative conductive connection portion 11212 along the first direction X at the window 1131 matches the size of the window 1131 to avoid the solder on the first positive conductive connection portion 11211 causing the first light-emitting chip 1231 to shift along the first direction X when it flows along the first direction X. The same applies to the second light-emitting chip 1232, which will not be described in detail here.

[0107] Taking the two conductive connection portions 1121 of the third light-emitting chip 1233 as an example, the conductive connection portion 1121 corresponding to the positive electrode pin 123b is the third positive electrode conductive connection portion 11213, and the conductive connection portion 1121 corresponding to the negative electrode pin 123c is the third negative electrode conductive connection portion 11214. Since only one third light-emitting chip 1233 is arranged in the second column, both the third positive electrode conductive connection portion 11213 and the third negative electrode conductive connection portion 11214 have an extension space along the first direction X. Both can provide a flow path for the solder at the opening 1131 away from the window 1131 along the first direction X. The extension area along the first direction X guides the flow of solder, so that when soldering the light-emitting chip 123a, the positive electrode pin 123b and the negative electrode pin 123c are subjected to opposite directions of solder tension, which cancel each other out, reducing the risk of chip displacement due to solder tension and ensuring that the light-emitting chip 123a is accurately fixed in the preset position.

[0108] In some embodiments, combined with Figure 6 and Figure 8 Each conductive connection portion 1121 has a first edge 1122 extending along the first direction X. The first edge 1122 is disposed on the side of the conductive connection portion 1121 opposite to another column of conductive connection portions 1121. The window 1131 is disposed close to the first edge 1122, and the conductive connection portion 1121 extends in a direction away from the window 1131.

[0109] A larger copper foil area is formed between the window 1131 and the conductive connection portion 1121, which is far away from the edge of the window 1131. This additional copper foil area can conduct the heat conducted by the light-emitting chip 123a through the solder joint (at the window 1131) and disperse the heat to the substrate 111 or the surrounding air through the larger surface area, thus avoiding the accumulation of heat near the solder joint of the window 1131.

[0110] Since the traces (such as the power trace group 140, the connection between the driver chip 130 and the conductive connection part 1121) are integrally formed with the conductive connection part 1121, and the traces are connected to the conductive connection part 1121 on the side far away from the window 1131, the connection strength between the traces and the conductive connection part 1121 is high and not easy to break. In addition, the connection between the pad and the trace can maintain a certain distance, and the phenomenon of solder joint detachment or cold solder joint is not easy to occur, thus ensuring the stability of the current path of each light-emitting chip 123a.

[0111] In some embodiments, combined with Figure 6 At least a portion of the edge of each conductive connection portion 1121 has a shape complementary to the corresponding edge of the adjacent conductive connection portion 1121.

[0112] Complementary edge shapes can maintain the spacing between adjacent connections to a smaller insulation distance, and form physical isolation through shape adaptation, eliminating problems such as solder overflow short circuits and signal crosstalk caused by excessively close spacing, ensuring that the current path of each connection is independent (such as the positive connection and the negative connection, and the connection of different chips do not affect each other), and ensuring the precise control of the driver chip 130 on a single chip.

[0113] On the other hand, while the complementary edge shapes avoid adjacent connecting parts, the conductive connecting parts 1121 of multiple rows and multiple light-emitting chips 123a can be compactly arranged on the substrate.

[0114] It is understood that the edges of two adjacent conductive connection portions 1121 may be convex arcs on one side and concave arcs on the adjacent side, or right-angle notches on one side and right-angle protrusions on the adjacent side. This embodiment does not limit this.

[0115] In some embodiments, combined with Figure 7 Each light-emitting unit 123 contains four light-emitting chips 123a, and one of the light-emitting chips 123a can emit light of the same color as one of the other three light-emitting chips 123a. Two of the light-emitting chips 123a are arranged in the third column along the first direction X, and the other two light-emitting chips 123a are arranged in the fourth column along the first direction X. The light-emitting chips 123a in the third and fourth columns are correspondingly arranged along the second direction Y, which is perpendicular to the first direction X.

[0116] Specifically, each light-emitting unit 123 also includes a fourth light-emitting chip 1234. The fourth light-emitting chip 1234 is the same color as an existing light-emitting chip 123a (such as a red light chip), which means that the number of light-emitting chips 123a of that color increases, thereby enhancing the light output power of the corresponding color. For example, in scenarios where it is necessary to enhance the red light component in white light to improve the warm tone performance, the additional red light chip can compensate for the insufficient brightness of a single chip. At the same time, the synergistic light emission of the fourth chip and the original chip of the same color can make the distribution of the light of that color on the lamp board 100 more uniform, avoiding local brightness peaks or dark areas caused by single chip light emission. This is especially suitable for backlight modules 211 of display devices 200 with high requirements for color saturation and brightness.

[0117] In this way, the two columns of corresponding arrangement allow the four light-emitting chips 123a to be evenly distributed in space, shortening the mixing path of each color light and reducing local color shift.

[0118] In some embodiments, light-emitting chips 123a capable of emitting the same color are located in the same column along the first direction X.

[0119] This design allows for a concentrated and uniform emission area of ​​the same color light along the column direction. Simultaneously, the two columns correspond along the second direction Y, ensuring that each color light is uniformly covered in the lateral direction (second direction Y) according to the designed proportions. Combined with the optical film layer 2111, the color accuracy deviation of the synthesized light can be controlled within a smaller range. Furthermore, it simplifies the circuit control logic. Arranging chips of the same color in the same column allows the conductive connection parts 1121 in the same column to share a portion of the drive link (e.g., the negative pin 123c of the red light chip in the same column can be connected to the driver chip 130 through the same set of branches). This reduces the number of traces and facilitates synchronous brightness control of the same color chips by the driver chip 130, avoiding control delays or accuracy differences caused by the dispersed arrangement of the same color chips.

[0120] In some embodiments, combined with Figure 9 , Figure 9 This is a schematic diagram of the structure of a conductive connection portion provided in some embodiments of this application. The conductive connection portion 1121 further includes a first side 1125, a second side 1126, and a third side 1127. The first side 1125 is located on the first side of the opening 1131, and the second side 1126 is located on the second side of the opening 1131. At least one of the first side 1125 and the second side 1126 is disposed adjacent to the conductive connection portion 1121 of other conductive connection groups 112. The third side 1127 is connected to the first side 1125 and the second side 1126. Between the second side 1126, the third side 1127 is located at one end of the first side 1125 and the second side 1126 away from the window 1131, and the power supply line group 140 or the driver chip 130 is connected to the light-emitting chip 123a through the third side 1127. That is, the third side 1127 of the conductive connection part 1121 corresponding to the positive electrode pin 123b is connected to the power supply line group 140, and the third side 1127 of the conductive connection part 1121 corresponding to the negative electrode pin 123c is connected to the driver chip 130.

[0121] In some embodiments, the distance between the first side 1125 and the second side 1126 gradually increases along the direction away from the window 1131. The two sides are located on either side of the window 1131, and at least one is adjacent to other conductive connection groups 112, forming a lateral boundary constraint on the solder and preventing the solder from diffusing to adjacent conductive structures. The outward extension of the first and second sides 1126 increases the overall copper foil area of ​​the conductive connection portion 1121, allowing chip heat to be transferred to the conductive connection portion 1121 through the solder joints, accelerating heat conduction to the external environment and improving heat dissipation. Furthermore, it ensures that the third side 1127 is sufficiently long, making the connection with the trace more reliable, and the connection between the trace and the conductive connection portion 1121 more stable, ensuring signal transmission.

[0122] The third side 1127 is an arc-shaped edge, which reduces the space occupied by the conductive connection portion 1121. Compared with right angles or broken edges, the arc-shaped edge can naturally transition the outward expansion angle between the first side 1125 and the second side 1126. This compact contour design means that the conductive connection portion 1121 does not need to reserve extra space to accommodate corner structures in the area away from the window 1131 (the part connected to the power trace group 140 or the driver chip 130). Thus, within the limited substrate area, more layout space is freed up for adjacent conductive connection groups 112 or other components, which is beneficial for the dense arrangement of multiple light-emitting chips 123a.

[0123] The conductive connection portion 1121 located at the edge along the first direction X can extend away from the window 1131 along the first direction X to provide a flow path for the solder in the direction opposite to the negative electrode pin 123c along the first direction X. Since there is no extra space for the other conductive connection portions 1121 along the first direction X to provide extension space for the conductive connection portions 1121 along the first direction X, the spacing between the two opposite edges of the conductive connection portions 1121 at the window 1131 along the first direction X matches the size of the window 1131 to avoid the solder on the middle conductive connection portion 1121 causing the first light-emitting chip 1231 to shift along the first direction X when it flows along the first direction X.

[0124] Each conductive connection portion 1121 is approximately fan-shaped, and each third side 1127 is an arc-shaped edge. The shape formed by the arc-shaped edges is approximately circular. This ensures that the position of the light-emitting chip 123a does not shift during welding, thereby improving space utilization.

[0125] Secondly, combining Figure 1 This application also discloses a display device 200, which includes a backlight module 211 and a liquid crystal panel 212. The backlight module 211 includes an optical film layer 2111 and a lamp board 100 as described in any of the first aspects. The optical film layer 2111 is disposed on the light-emitting side of the lamp board 100, and the liquid crystal panel 212 is disposed on the side of the optical film layer 2111 away from the lamp board 100.

[0126] The first aspect of the lamp board 100 solves the problem of color mixing difference in the arrangement of single-row light-emitting chips 123a, and can output uniform and stable multi-color composite light. As the core of the backlight module 211, the uniform light of the lamp board 100, after being optimized by the optical film layer 2111, can make the colors of the picture displayed on the LCD panel 212 more balanced and without local color deviation, improve the accuracy of display colors, and provide users with a better visual experience.

[0127] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A light panel, characterized in that, include: Circuit board, the circuit board comprising: Substrate; A conductive connection portion is disposed on the substrate. An insulating layer covers the side of the conductive connection portion opposite to the substrate. Light-emitting units, wherein there are multiple light-emitting units, and each light-emitting unit includes: Multiple light-emitting chips are disposed on the circuit board, and at least two of the multiple light-emitting chips are used to emit light of different colors. Each light-emitting chip is provided with a positive electrode pin and a negative electrode pin. A driver chip is connected to the negative pin of the plurality of light-emitting chips to drive the plurality of light-emitting chips to emit light; A power trace group is disposed between the substrate and the insulating layer, and the power trace group is connected to the positive pin of the plurality of light-emitting chips through the conductive connection portion; A grounding trace group is disposed between the substrate and the insulating layer, and the grounding trace group is electrically connected to the driver chip; The positive and negative pins of each of the light-emitting chips are arranged along a first direction, and the plurality of light-emitting chips are arranged in at least two columns along the first direction, with each column containing at least one light-emitting chip.

2. The lamp panel according to claim 1, characterized in that, The conductive connection portion has multiple portions, and the multiple conductive connection portions form multiple conductive connection groups. Each conductive connection group includes two pairs of conductive connection portions. The conductive connection portions in each conductive connection group are correspondingly arranged with each light-emitting chip. The two conductive connection portions of each conductive connection group are respectively soldered to the positive electrode pin and the negative electrode pin in the light-emitting chip. The conductive connection portions of the conductive connection group corresponding to a column of light-emitting chips are arranged at intervals along the first direction. The insulating layer is provided with: Windows are provided, each corresponding to a conductive connection portion along the thickness direction of the circuit board. The area of ​​each window is smaller than the area of ​​the corresponding conductive connection portion. Both the positive and negative pins are soldered to the conductive connection portion through their respective windows. The windows corresponding to the light-emitting chips in the same column are arranged along the first direction.

3. The lamp panel according to claim 2, characterized in that, Each light-emitting unit contains three light-emitting chips, all of which can emit light of different colors. Two of the light-emitting chips are arranged in a first column along the first direction, and the other light-emitting chip is arranged in a second column along the first direction. The light-emitting chip in the second column is located between the two light-emitting chips in the first column along the first direction.

4. The lamp panel according to claim 3, characterized in that, The two conductive connections corresponding to the light-emitting chip extend at least partially to the opposite sides of the two corresponding windows along the first direction.

5. The lamp panel according to claim 4, characterized in that, Each of the conductive connection portions has a first edge extending along the first direction. The first edge is disposed on the side of the conductive connection portion opposite to another column of conductive connection portions. The window is disposed close to the first edge, and the conductive connection portion extends in a direction away from the window.

6. The lamp panel according to claim 4, characterized in that, At least a portion of the edge of each of the conductive connections has a shape complementary to the corresponding edge of the adjacent conductive connection.

7. The lamp panel according to claim 2, characterized in that, Each light-emitting unit contains four light-emitting chips, and one of the light-emitting chips can emit light of the same color as one of the other three light-emitting chips; Two of the light-emitting chips are arranged in a third column along the first direction, and the other two light-emitting chips are arranged in a fourth column along the first direction. The light-emitting chips in the third and fourth columns are arranged in a corresponding second direction, which is perpendicular to the first direction.

8. The lamp panel according to claim 7, characterized in that, The light-emitting chips capable of emitting the same color are located in the same column along the first direction.

9. The lamp panel according to claim 7, characterized in that, The conductive connection portion includes: The first side is located on the first side of the window opening; The second side is located on the second side of the window, and at least one of the first side and the second side is disposed adjacent to the conductive connection portion of the other conductive connection group; The third side is connected between the first side and the second side. The third side is located at the end of the first side and the second side that is away from the window. The power supply wiring group or the driver chip is connected to the light-emitting chip through the third side. Along the direction away from the window opening, the distance between the first side and the second side gradually increases, and the third side is an arc-shaped edge.

10. A display device, characterized in that, include: Backlight module, the backlight module comprising: The lamp panel as described in any one of claims 1-9; An optical film layer is disposed on the light-emitting side of the lamp panel; The liquid crystal panel is disposed on the side of the optical film layer away from the lamp panel.

Images