Light-emitting assembly, backlight module and display device

Abstract

The application relates to the technical field of display devices, in particular to a light-emitting assembly, a backlight module and a display device. The light-emitting assembly comprises a light-emitting unit, the light-emitting unit comprises a chip support and a light-emitting chip, one side of the chip support towards a first direction is provided with a mounting groove, and the light-emitting chip is arranged in the mounting groove; and a fluorescent light-emitting body is arranged in the mounting groove. The fluorescent light-emitting body arranged in the mounting groove for mounting the light-emitting chip enhances the light-emitting intensity of the light-emitting unit, so that the power of the light-emitting unit is reduced under the condition of the same light-emitting intensity, and the problem of low light efficiency of the display device is improved. The fluorescent light-emitting body is arranged, the light-emitting volume of the light-emitting unit is increased, the light radiated by the light-emitting assembly to the liquid crystal display panel is more uniform, and the problem of uneven brightness of the displayed picture of the display device is improved.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a light-emitting component, a backlight module, and a display device. Background Technology

[0002] Liquid crystal displays (LCDs) have gained widespread use due to their advantages such as thinness, energy efficiency, and low radiation. An LCD typically consists of a back panel, a backlight strip, a reflective film, a diffuser plate, an optical film, and the LCD panel. Light emitted from the backlight strip passes sequentially through the diffuser plate, optical film, and LCD panel; some light is reflected by the reflective film before entering the diffuser plate. Each pixel on the LCD panel can control the transmission of red, green, and blue colors, enabling the development of various colors. The development of color images is achieved through the independent control of multiple pixels.

[0003] The luminous efficacy of an LCD monitor is affected by the lamp strip, reflector, diffuser, optical film, and LCD panel. When the luminous efficacy is low, the LCD monitor requires higher power consumption to display the same brightness, resulting in poor energy efficiency and making it difficult to achieve Level 1 energy efficiency. Utility Model Content

[0004] The embodiments of this application aim to provide a light-emitting component, a backlight module, and a display device, so as to at least improve the problem of low light efficiency of the display device.

[0005] In order to solve the above-mentioned technical problems, the embodiments of this application adopt the following technical solutions: In a first aspect, embodiments of this application provide a light-emitting component, the light-emitting component including a light-emitting unit, the light-emitting unit including a chip holder and a light-emitting chip, the chip holder having a mounting groove on one side facing a first direction, the light-emitting chip being disposed in the mounting groove; a fluorescent light emitter being disposed in the mounting groove.

[0006] The light-emitting component of this application enhances the luminous intensity of the light-emitting unit by providing a phosphor within the mounting slot for mounting the light-emitting chip. This reduces the power consumption of the light-emitting unit under the same luminous intensity conditions, thus improving the low luminous efficiency of the display device. By providing a phosphor, the luminous volume of the light-emitting unit is increased, resulting in more uniform light irradiation of the liquid crystal display panel and improving the uneven brightness of the displayed image.

[0007] In some embodiments, the side of the light-emitting chip facing the first direction includes a light-emitting surface, which is rectangular and has a length and width greater than 40 mils. Increasing the area of ​​the light-emitting chip and reducing its resistance increases the luminous power when the same input current is applied.

[0008] In some embodiments, at least one of the length and width of the light-emitting surface is 48 mils; or, at least one of the length and width of the light-emitting surface is 52 mils.

[0009] In some embodiments, the mounting groove has a circular light-emitting port on the side facing the first direction, and the inner diameter of the light-emitting port is greater than 2.1 mm; or, the top of the mounting groove has a rectangular light-emitting port, and the length and width of the light-emitting port are both greater than 2.1 mm; or, the light-emitting port is circular, and the inner diameter of the light-emitting port is 2.4 mm. This increases the amount of light emitted from the light-emitting port.

[0010] In some embodiments, the light-emitting chip has a reflective layer on the side facing away from the first direction. The reflective layer can reflect light emitted from the light-emitting chip toward the bottom of the mounting groove, so that at least part of the light is reflected and emitted from the light outlet, thereby increasing the amount of light emitted from the light outlet.

[0011] In some embodiments, the reflective layer includes a silver reflective layer. The silver reflective layer has a wider reflection range, improving reflectivity and thus increasing the brightness of the light-emitting unit.

[0012] Secondly, embodiments of this application provide a backlight module, the backlight module including a back panel, an optical film layer, and a light-emitting component as described in any embodiment of the first aspect; the optical film layer is disposed on the light-emitting side of the back panel; the light-emitting component is disposed on the back panel and located between the back panel and the optical film layer. The backlight module employs the aforementioned light-emitting component, thereby improving the luminous efficiency of the display device using this backlight module.

[0013] In some embodiments, the backlight module further includes a reflective sheet disposed on the back panel and located between the back panel and the light-emitting component. This improves the utilization rate of light from the light-emitting component.

[0014] Thirdly, embodiments of this application provide a display device, the display device including a liquid crystal display panel and a backlight module as described in any embodiment of the second aspect; the liquid crystal display panel is disposed on the light-emitting side of the backlight module. The display device employs the aforementioned backlight module to improve the luminous efficiency of the display device.

[0015] In some embodiments, the transmittance of the liquid crystal display panel is greater than 5.4%; or, the transmittance of the liquid crystal display panel is 6.3%. By increasing the transmittance of the liquid crystal display panel, the luminous efficacy of the display device can be improved.

[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description

[0017] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0018] Figure 1 This is a cross-sectional view of a light-emitting unit according to an embodiment of this application; Figure 2 This is a schematic diagram of the planar structure of the chip holder and the light-emitting chip according to an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a display device according to an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a light-emitting chip according to an embodiment of this application; Figure 5 This is a schematic diagram of the arrangement of light-emitting components on a backplate according to an embodiment of this application.

[0019] The reference numerals in the detailed embodiments are as follows: 100. Light-emitting component; 1. Light-emitting unit; 11. Chip support; 111. Mounting slot; 112. Light emission port; 12. Light-emitting chip; 121. Light-emitting surface; 122. Sapphire substrate; 123. N-type GaN layer; 124. Active layer; 125. P-type GaN layer; 13. Phosphor; 14. Reflective layer; 2. Lens; 3. Circuit board; 200. Backlight module; 210. Backplate; 211. Mounting cavity; 220. Optical film; 221. Optical film sheet; 222. Diffuser plate; 230. Reflector; 231. First plate; 232. Second plate; 300. Display device; 310. LCD display panel; 320. Protective layer; X, the first direction. Detailed Implementation

[0020] To facilitate understanding of this application, the following description, in conjunction with the accompanying drawings and specific embodiments, will provide a more detailed account. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0022] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0023] In the description of the embodiments of this application, the terms "first," "second," etc., are used to define components merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0024] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0025] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0026] Display devices typically include a back panel, a light-emitting element, a reflective sheet, a diffuser plate, an optical film, and a liquid crystal display panel. Light emitted from the light-emitting element passes sequentially through the diffuser plate, optical film, and liquid crystal display panel; some light is reflected by the reflective sheet before entering the diffuser plate, optical film, and liquid crystal display panel. The luminous efficacy of a display device is affected by the light-emitting element, reflective sheet, diffuser plate, optical film, and liquid crystal display panel. Lower luminous efficacy requires higher power consumption to achieve the same brightness, resulting in poor energy efficiency and making it difficult to achieve Level 1 energy efficiency.

[0027] In this embodiment, by providing a fluorescent light emitter in the mounting slot for mounting the light-emitting chip, the luminous intensity of the light-emitting unit is enhanced, thereby reducing the power of the light-emitting component under the same luminous intensity conditions and improving the problem of low luminous efficiency of the display device.

[0028] In a first aspect, embodiments of this application provide a light-emitting component 100, please refer to... Figure 1 and Figure 2 The light-emitting component 100 includes a light-emitting unit 1, which includes a chip holder 11 and a light-emitting chip 12. The chip holder 11 has a mounting groove 111 on its side facing the first direction X, and the light-emitting chip 12 is disposed within the mounting groove 111. The first direction X is the light-emitting direction of the light-emitting component 100. Please refer to [link to relevant documentation]. Figure 3 When the light-emitting component 100 is mounted on the backplate 210, the first direction X is the direction from the backplate 210 toward the light-emitting component 100. The light-emitting chip 12 is small in size and is mounted on the carrier via the chip holder 11, for example, see [reference needed]. Figure 3 The light-emitting chip 12 is mounted on the back plate 210 via the chip bracket 11, facilitating its installation. The light-emitting chip 12 is located within the mounting groove 111 for protection. Optionally, along the first direction X, the light-emitting chip 12 is positioned at the bottom of the mounting groove 111. Optionally, the light-emitting chip 12 is an LED lamp bead (LED light-emitting chip).

[0029] In some embodiments, please refer to Figure 1 A fluorescent light emitter 13 is provided in the mounting slot 111. The fluorescent light emitter 13 can enhance the luminous intensity of the light-emitting unit 1, so that the power of the light-emitting unit 1 is reduced under the same luminous intensity conditions.

[0030] In the embodiments of this application, please refer to Figure 3Taking the application of the light-emitting unit 1 in the display device 300 as an example, the display device 300 includes a liquid crystal display panel 310, which uses the light emitted by the light-emitting unit 1 as backlight to achieve image development. When the light-emitting unit 1 is applied to the display device 300, the problem of low light efficiency of the display device 300 is improved. The phosphor emitting element 13 can be phosphor powder, which can be mixed with adhesive and filled into the mounting groove 111. By setting the phosphor emitting element 13, the light-emitting volume of the light-emitting unit 1 is increased, and the light illuminating the liquid crystal display panel 310 by the light-emitting unit 1 is more uniform, thus improving the problem of uneven brightness of the screen displayed by the display device 300.

[0031] In some embodiments, please refer to Figure 1 and Figure 2 The light-emitting chip 12 includes a light-emitting surface 121 on the side facing the first direction X. The light-emitting surface 121 is rectangular, and both its length and width are greater than 40 mils. 1 mil = 25.4 micrometers. In related technologies, the light-emitting chip 12 is a 40*40 mil cuboid, meaning that both the length and width of the light-emitting surface 121 are 40 mils, resulting in a higher resistance and lower luminous power. In this embodiment, both the length and width of the light-emitting surface 121 are greater than 40 mils. For example, at least one of the length and width of the light-emitting surface 121 is 48 mils; or, at least one of the length and width of the light-emitting surface 121 is 52 mils. This increases the area of ​​the light-emitting chip 12, reduces the resistance, and increases the luminous power when the same input current is applied. Furthermore, under the same luminous intensity conditions, the power of the light-emitting component 100 is reduced, improving the problem of low luminous efficiency in the display device 300. Optionally, the length and width of the light-emitting surface 121 are both 48 mils or 52 mils, or the length and width of the light-emitting surface 121 are 52 mils and 48 mils, respectively.

[0032] In some embodiments, please refer to Figure 2 The mounting groove 111 has a circular light-emitting port 112 on the side facing the first direction X, and the inner diameter of the light-emitting port 112 is greater than 2.1 mm; or, the top of the mounting groove 111 has a rectangular light-emitting port 112, and the length and width of the light-emitting port 112 are both greater than 2.1 mm. The light emitted by the light-emitting chip 12 exits the chip support 11 through the light-emitting port 112. By increasing the inner diameter of the light-emitting port 112, more light is emitted from the light-emitting port 112, increasing the brightness of the light-emitting unit 1. Furthermore, under the same luminous intensity conditions, the power of the light-emitting component 100 is reduced, improving the problem of low luminous efficiency of the display device 300. Optionally, the light-emitting port 112 is circular, and the inner diameter of the light-emitting port 112 is 2.4 mm. Optionally, the light-emitting port 112 is rectangular, and the length and width of the light-emitting port 112 are both 2.4 mm.

[0033] In some embodiments, please refer to Figure 1and Figure 2 The mounting groove 111 is in the shape of an inverted frustum cone. That is, the mounting groove 111 faces the light outlet 112 in a funnel shape, which does not affect the amount of light emitted from the light outlet 112, while enhancing the strength of the chip holder 11 and improving the problem of low strength and easy damage of the chip holder 11 due to the increased inner diameter of the light outlet 112.

[0034] In some embodiments, please refer to Figure 1 A reflective layer 14 is provided on the side of the light-emitting chip 12 facing away from the first direction X. For example, the reflective layer 14 is disposed on the light-emitting chip 12, or attached to the light-emitting chip 12 by a coating technology. The reflective layer 14 can reflect the light emitted from the light-emitting chip 12 toward the bottom of the mounting groove 111, so that at least part of the light is reflected and emitted from the light outlet 112, thereby increasing the amount of light emitted from the light outlet 112. The reflective layer 14 may include a non-metallic reflective layer formed by a distributed Bragg reflector (DBR). A DBR is a periodic layered structure formed by alternating dielectric layers, which can be used to achieve near total internal reflection within a certain frequency range.

[0035] In some embodiments, the reflective layer 14 includes a silver reflective layer. For example, silver is plated onto the surface of the light-emitting chip 12 to form a silver reflective layer, or a smooth silver mirror is attached to the light-emitting chip 12. The silver reflective layer has a wider reflection band, improving reflectivity and increasing the amount of light emitted from the light outlet 112. Optionally, the reflective layer 14 may also include an aluminum reflective layer. Optionally, the reflective layer 14 is a combination of DBR and a metallic material, such as a combination of DBR and silver.

[0036] In some embodiments, the light-emitting chip 12 is a flip chip. That is, the electrode structure of the light-emitting chip 12 is inverted, and the electrode structure is directly connected to the substrate, eliminating the wire bonding process of traditional upright chips. This improves the problem of the light-emitting efficiency of the light-emitting chip 12 being affected by the electrodes occupying the light-emitting area.

[0037] Please refer to Figure 4 The reflective layer 14 can be disposed on the epitaxial layer of the light-emitting chip 12. For example, the light-emitting chip 12 includes a sapphire substrate 122, on which an epitaxial layer is disposed. The epitaxial layer includes an N-type GaN layer 123, an active layer 124, and a P-type GaN layer 125 sequentially disposed. The reflective layer 14 is disposed on the side of the P-type GaN layer 125 facing away from the N-type GaN layer 123, so as to reflect light irradiated to the reflective layer 14 back to the sapphire substrate 122 and emitted from the sapphire substrate 122. Other structures that the epitaxial layer may include... Figure 4The image is not shown. The N-type GaN layer 123 provides electrons, the P-type GaN layer 125 provides holes, and the active layer 124 is a quantum trap used for electron-hole recombination to emit light. The reflective layer 14 can be directly disposed on the P-type GaN layer 125, for example, the reflective layer 14 can be attached to the surface of the P-type GaN layer 125 by a coating technique.

[0038] In some embodiments, please refer to Figure 3 The light-emitting component 100 also includes a lens 2, which is disposed on the back plate 210 and covers the light-emitting unit 1. The lens 2 is used to diffuse the light emitted by the light-emitting unit 1, transforming the point light source into a surface light source, fully scattering the light, making the light more uniform and softer, and improving the problem of uneven brightness of the screen displayed by the display device 300. Specifically, interface reflection occurs at the interface between the lens 2 and the air. Interface reflection is a physical phenomenon where some light is reflected when passing through the interface between two transparent media. This causes some light to directly hit the liquid crystal display panel 310 of the display device 300, while the other part of the light is first reflected at the interface between the lens 2 and the air, and then reflected by the reflective sheet 230 before hitting the liquid crystal display panel 310 of the display device 300, enhancing the light diffusion effect and improving the problem of uneven brightness of the screen displayed by the display device 300. Optionally, the lens 2 is made of PMMA (polymethyl methacrylate). Specifically, when light travels from PMMA (refractive index approximately 1.49) into the air, total internal reflection occurs at a specific angle, approximately 42°, thereby increasing the amount of light reflected at the interface between lens 2 and the air.

[0039] In some embodiments, please refer to Figure 5 For example, the light-emitting component 100 further includes a circuit board 3 for powering the light-emitting unit 1. The light-emitting unit 1 may be disposed on and electrically connected to the circuit board 3, or disposed on the back plate 210 and electrically connected to the circuit board 3. Optionally, a single circuit board 3 may power multiple light-emitting units 1, for example, multiple light-emitting units 1 may be electrically connected to the same circuit board 3. Optionally, the circuit board 3 may be disposed on the back plate 210. Optionally, the circuit board 3 may be a flexible circuit board.

[0040] Secondly, this application provides a backlight module 200, please refer to... Figure 3The backlight module 200 includes a backplate 210, an optical film layer 220, and a light-emitting component 100. The optical film layer 220 is disposed on the light-emitting side of the backplate 210. The light-emitting component 100 is disposed on the backplate 210 and located between the backplate 210 and the optical film layer 220. The backplate 210 has a mounting cavity 211. The optical film layer 220 is connected to the backplate 210 and covers the mounting cavity 211. The light-emitting component 100 is disposed within the mounting cavity 211, so that the light from the light-emitting component 100 only exits the backlight module 200 through the optical film layer 220, minimizing light leakage. The optical film layer 220 is used to enhance the brightness of the light or improve the brightness uniformity of the light after passing through the optical film layer 220. The light-emitting side of the backplate 210 is either the side with the mounting cavity 211 or the side with the light-emitting component 100. The backlight module 200 employs the aforementioned light-emitting component 100, thereby improving the luminous efficiency of the backlight module 200 and the display device 300 employing this backlight module 200. Optionally, the light-emitting component 100 is disposed facing the optical film layer 220, meaning that the light emitted by the light-emitting component 100 mainly illuminates the optical film layer 220, improving the light utilization rate of the backlight module 200. Optionally, the optical film layer 220 is connected to the edge of the backplate 210.

[0041] The backplate 210 can be made of a metal alloy such as aluminum alloy to enhance the heat dissipation effect on the light-emitting component 100; the backplate 210 can be provided with reinforcing ribs to enhance the strength of the backplate 210 and improve the support stability of the backplate 210 for the optical film layer 220 and the light-emitting component 100.

[0042] In some embodiments, please refer to Figure 3 The optical film layer 220 includes an optical film 221. The optical film 221 can be a composite film including a prism film and a diffusion film, which improves the light output brightness and light output uniformity of the backlight module 200 by refracting and reflecting light. When the backlight module 200 is applied to the display device 300, it improves the brightness of the display screen of the display device 300.

[0043] In some embodiments, please refer to Figure 3 The optical film layer 220 also includes a diffuser plate 222. The diffuser plate 222 is used to change the beam angle of light. After passing through the diffuser plate 222, the beam angle becomes 160-176 degrees, atomizing the light emitted from the backlight module 200 and transforming the point light source into a surface light source, thus fully scattering the light and making it more uniform and softer. When the backlight module 200 is applied to the display device 300, it improves the uniformity of the displayed image. Optionally, the diffuser plate 222 is located on the side of the optical film 221 facing the backplate 210.

[0044] In some embodiments, please refer to Figure 3The backlight module 200 also includes a reflective sheet 230, which is disposed on the back plate 210 and located between the back plate 210 and the light-emitting component 100. The reflective sheet 230 is used to reflect the light emitted by the light-emitting component 100 toward the back plate 210, for example, to the diffuser plate 222; or to reflect it to the reflective sheet 230 and finally to the diffuser plate 222, thereby improving the utilization rate of the light from the light-emitting component 100. In this embodiment, the light-emitting component 100 may not be positioned toward the optical film layer 220, that is, the light emitted by the light-emitting component 100 may mainly irradiate toward the optical film layer 220, or it may mainly irradiate in other directions, such as toward the reflective sheet 230.

[0045] In some embodiments, please refer to Figure 3 The reflective sheet 230 is laid within the mounting cavity 211 on the surface of the back plate 210 facing the optical film layer 220. For example, the reflective sheet 230 can be laid on the bottom wall of the mounting cavity 211, or it can be laid on each side wall of the mounting cavity 211 (each side wall is inclined and can also be considered to be facing the optical film layer 220). Optionally, the reflective sheet 230 includes a first plate 231 and a second plate 232. The first plate 231 is laid on the bottom wall of the mounting cavity 211, and the first end of the second plate 232 is connected to the first plate 231, and the other end of the second plate 232 is connected to the optical film layer 220. The angle between the first plate 231 and the second plate 232 is greater than the angle between the side wall and the bottom wall of the mounting cavity 211, reducing the number of times light is reflected on the reflective sheet 230, thereby reducing the energy loss of reflected light and improving the utilization rate of light from the backlight module 200 to the light-emitting component 100.

[0046] In some embodiments, please refer to Figure 5 Multiple light-emitting units 1 are spaced apart on the back plate 210. Figure 5In this configuration, the light-emitting unit 1 is located below the lens 2 and is shielded by the lens 2. When the size of the liquid crystal display panel 310 is 86 inches, the light-emitting units 1 are arranged in a 14*7 pattern. That is, along the length of the back panel 210, the light-emitting units 1 have 14 columns, and along the width of the back panel 210, the light-emitting units 1 have 7 rows. For example, each circuit board 3 has 7 light-emitting units 1, and the circuit board 3 extends along the width of the back panel 210; the number of light-emitting components 100 is 14, and the 14 light-emitting components 100 are arranged at intervals along the length of the back panel 210. Optionally, the interval d1 of the light-emitting units 1 on the circuit board 3 is 151 mm. Optionally, the intervals of the light-emitting components 100 along the length of the back panel 210 are 135-135-134-132-132-132-124-132-132-132-134-135-135 mm. In related technologies, due to the low luminous efficacy of the light-emitting unit 1 and the small spacing between the light-emitting units 1, when the size of the liquid crystal display panel 310 is 86 inches, the light-emitting units 1 are usually arranged in a 16*10 pattern, requiring a larger number of light-emitting units 1. In this application, by enhancing the luminous efficacy of a single light-emitting unit 1, the spacing between the light-emitting units 1 is increased, thereby reducing the number of light-emitting units 1 used.

[0047] Thirdly, this application provides a display device 300, please refer to... Figure 3 The display device 300 includes a backlight module 200 and a liquid crystal display panel 310, with the liquid crystal display panel 310 disposed on the light-emitting side of the backlight module 200. The light-emitting side of the backlight module 200 is either the side where the optical film layer 220 is provided, or the side of the backplate 210 where the light-emitting component 100 is provided. By disposing the liquid crystal display panel 310 on the light-emitting side of the backlight module 200, the light emitted from the backlight module 200 illuminates the liquid crystal display panel 310, thereby enabling image development on the liquid crystal display panel 310. The display device 300 utilizes the aforementioned backlight module 200 to improve its luminous efficiency. Optionally, the liquid crystal display panel 310 is edge-connected to the backplate 210.

[0048] In this design, the light emitted by the backlight module 200 passes through the liquid crystal display panel 310. Each pixel of the liquid crystal display panel 310 can control the transmission of red, green, and blue colors, thereby controlling the color of the light emitted by the light-emitting component 100 after passing through the pixel, achieving the development of various colors. The liquid crystal display panel 310 has multiple pixels arranged in a matrix, and the development of color images is achieved through the independent control of multiple pixels. In other embodiments, the backlight module 200 can also be applied to devices requiring backlighting, such as advertising boards and display panels.

[0049] This application does not limit the type of liquid crystal display panel 310. It can be a vertical electric field type liquid crystal display panel 310, such as a twisted nematic (TN) type liquid crystal display panel 310 or a vertical alignment (VA) type liquid crystal display panel 310; it can also be a horizontal electric field type liquid crystal display panel 310, such as a fringe field switching (FFS) type liquid crystal display panel 310 or an in-plane switching (IPS) type liquid crystal display panel 310. The liquid crystal display panel 310 includes an array substrate and a counter substrate disposed opposite to each other, and a liquid crystal layer disposed between the array substrate and the counter substrate. Optionally, the array substrate is a thin film transistor (TFT) substrate, and the counter substrate is a color filter substrate. This application also does not limit the types of array substrate and counter substrate. In other embodiments of this application, the array substrate and the counter substrate can be COA (Colorfilter OnArray) type array substrate and counter substrate. The LCD panel 310 can also undergo processes such as back screen printing ink, front spraying AG coating and AF coating to achieve anti-fingerprint and anti-scratch effects.

[0050] In some embodiments, the transmittance of the liquid crystal display panel 310 is greater than 5.4%. In related technologies, the transmittance of the liquid crystal display panel 310 is 5.4%, which is relatively low, resulting in low luminous efficacy of the display device 300. Increasing the transmittance of the liquid crystal display panel 310 can improve the luminous efficacy of the display device 300. Optionally, the transmittance of the liquid crystal display panel 310 is 6.3%, for example, a CC430LV1D liquid crystal display panel from CEC Panda, or a SG746AD06-1 liquid crystal display panel from CSOT.

[0051] In some embodiments, please refer to Figure 3 The display device 300 also includes a protective layer 320, which is disposed on the side of the liquid crystal display panel 310 opposite to the backplate 210. For example, the protective layer 320 is attached to the liquid crystal display panel 310. The protective layer 320 is used to protect the liquid crystal display panel 310 and reduce damage to the liquid crystal display panel 310 from external forces and corrosive substances. Optionally, the protective layer 320 is tempered glass. Optionally, the tempered glass completely covers the side of the liquid crystal display panel 310 opposite to the backlight module 200.

[0052] [Experimental Section] Control group: The material is light-emitting component 100, wherein the length and width of the light-emitting surface 121 of the light-emitting chip 12 are both 40 mils.

[0053] Experimental Group 1: The material is a light-emitting component 100, wherein the length and width of the light-emitting surface 121 of the light-emitting chip 12 are both 48 mils.

[0054] Experimental Group 2: The material is a light-emitting component 100, wherein the length and width of the light-emitting surface 121 of the light-emitting chip 12 are both 52 mils.

[0055] Test method: Apply the same current to each light-emitting component 100 and measure the brightness of each light-emitting unit 1 using a lux meter. When multiple light-emitting units 1 are connected to the circuit board 3 of the light-emitting component 100, the brightness of multiple light-emitting units 1 can be measured and averaged to reduce errors.

[0056] Experimental results: Compared with the control group's light-emitting unit 1, the brightness of light-emitting unit 1 in experimental group 1 increased by 14%, and the brightness of light-emitting unit 1 in experimental group 2 increased by 19%.

[0057] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this application as described above, which are not provided in detail for the sake of brevity; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A light-emitting component, characterized in that, include: The light-emitting unit includes a chip holder and a light-emitting chip. The chip holder has a mounting groove on one side facing a first direction, and the light-emitting chip is disposed in the mounting groove. A fluorescent light emitter is disposed in the mounting groove.

2. The light-emitting component according to claim 1, characterized in that, The side of the light-emitting chip facing the first direction includes a light-emitting surface, which is rectangular and has a length and width greater than 40 mils.

3. The light-emitting component according to claim 2, characterized in that, At least one of the length and width of the light-emitting surface is 48 mils; Alternatively, at least one of the length and width of the light-emitting surface is 52 mils.

4. The light-emitting component according to claim 1, characterized in that, The mounting groove has a circular light outlet on the side facing the first direction, and the inner diameter of the light outlet is greater than 2.1 mm; Alternatively, the top of the mounting slot has a rectangular light-emitting port, the length and width of which are both greater than 2.1 mm; Alternatively, the light outlet is circular, and the inner diameter of the light outlet is 2.4 mm.

5. The light-emitting component according to any one of claims 1 to 4, characterized in that, The light-emitting chip has a reflective layer on the side opposite to the first direction.

6. The light-emitting component according to claim 5, characterized in that, The reflective layer includes a silver reflective layer.

7. A backlight module, characterized in that, include: Back panel; An optical film layer is disposed on the light-emitting side of the back plate; The light-emitting component as described in any one of claims 1 to 6, wherein the light-emitting component is disposed on the back plate and located between the back plate and the optical film layer.

8. The backlight module according to claim 7, characterized in that, The backlight module also includes a reflective sheet, which is disposed on the back plate and located between the back plate and the light-emitting component.

9. A display device, characterized in that, include: The backlight module as described in claim 7 or 8; A liquid crystal display panel is located on the light-emitting side of the backlight module.

10. The display device according to claim 9, characterized in that, The transmittance of the liquid crystal display panel is greater than 5.4%; Alternatively, the transmittance of the liquid crystal display panel is 6.3%.

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