An electronic paper screen assembly

Abstract

An electronic paper screen assembly comprises a thin film transistor (TFT) substrate, an FPL layer, and a PS protective layer. The FPL layer comprises an ITO transparent conductive layer and an electronic ink layer. At least one silver glue hole is provided, which penetrates the electronic ink layer and is filled with conductive silver glue. The conductive silver glue is electrically connected to the circuit of the TFT substrate and the ITO transparent conductive layer. The silver glue hole is a non-circular hole. The non-circular hole can be a semicircular hole, an elliptical hole, a rectangular hole or other special-shaped hole, which can reduce the size of the silver glue hole in the short direction, improve the utilization rate of the electronic paper layout under the premise of ensuring the conductivity, and is more economical.

Description

Technical Field

[0001] This application belongs to the field of electronic paper manufacturing, and specifically relates to an electronic paper screen assembly. Background Technology

[0002] Electronic paper (ePaper): A reflective display technology that simulates the visual characteristics of real paper. It relies on ambient light rather than backlight to display content, and features ultra-low power consumption and high readability in sunlight. It consumes no power when maintaining a static image, making it suitable for devices that require long-term display (such as e-books and electronic tags).

[0003] Electronic paper screen components generally consist of three layers: a TFT glass substrate, an FPL film, and a PS protective layer. The TFT glass substrate is the driving substrate, containing circuit components; the FPL film is the middle display layer, encapsulating electronic ink; and the PS protective layer is a sealing and protective layer covering the edges of the FPL.

[0004] TFT: Thin Film Transistor. Its technological essence is a semiconductor driving technology that precisely controls the on / off state of each pixel through a thin-film transistor array. Its role in electronic paper is as the underlying substrate, carrying the driving circuitry.

[0005] FPL: Front Plane Layer. Functional positioning: The core display medium layer of the electronic paper display module, which directly contains electronic ink microcapsules (electrophoretic particles) and determines the final imaging effect.

[0006] The internal structure of an FPL is layered, generally including a surface protective layer, namely the PS protective layer, which is located on the outermost layer of the FPL. It is made of plastic or flexible protective film material and is used for physical protection (scratch resistance, impact resistance) and environmental sealing.

[0007] Conductive substrate: Typically a polyester film (such as PET) or a glass substrate, with an ITO transparent conductive layer covering the surface, forming the electrode circuit that drives the electronic ink. The flexibility of the substrate determines the bendability of the electronic paper.

[0008] Electronic ink layer: Microcapsule electrophoresis units embedded inside the substrate contain color-developing particles with positive / negative charges. These particles change position in response to changes in the electric field, forming black and white or color pixels.

[0009] Silver paste holes in electronic paper are used to inject silver paste into electronic paper display modules to electrically connect internal circuits; their number usually depends on specific design requirements.

[0010] The dimensions of the silver paste holes in electronic paper need to be designed according to the specific application scenario and process requirements. The following are the key specifications: core requirements for hole diameter design, general hole diameter range, the standard hole diameter of PCB plug-in holes is usually 0.60mm~1.0mm (24mil~40mil), and the silver paste holes can be designed with reference to this range. Summary of the Invention

[0011] The technical problem this application aims to solve is to avoid the issue of excessive space occupied by circular holes in the prior art, resulting in a large amount of waste material after electronic paper cutting. It provides a non-circular silver paste hole that reduces the size of the silver paste hole in the short side direction, improving the utilization rate of electronic paper layout while ensuring conductivity, thus being more economical.

[0012] The technical solution of this application to solve the above-mentioned technical problems is an electronic paper screen assembly, including a thin film transistor (TFT) substrate, an FPL layer, and a PS protective layer; the FPL layer includes an ITO transparent conductive layer and an electronic ink layer; it includes at least one silver paste hole, the silver paste hole penetrates the electronic ink layer, the silver paste hole is filled with conductive silver paste, and the conductive silver paste electrically connects the circuit of the TFT substrate and the ITO transparent conductive layer; the silver paste hole is a non-circular hole.

[0013] Yes, the holes in the silver paste mentioned above are semi-circular.

[0014] It is permissible that the radius of the aforementioned silver paste hole is greater than 0.5 mm and less than 1 mm.

[0015] Yes, the radius of the above-mentioned silver paste hole is equal to 0.85 mm.

[0016] Alternatively, the aforementioned silver paste hole can be elliptical, with the major axis of the ellipse parallel to the cutting edge.

[0017] It is possible that the minor axis of the ellipse is greater than 0.05 mm.

[0018] Alternatively, the aforementioned silver paste hole can be rectangular, with the long side of the rectangle parallel to the cutting edge.

[0019] It is permissible if the shorter side of the rectangle is greater than 0.05 millimeters.

[0020] It is permissible that the area of ​​the aforementioned silver paste hole is greater than 0.39 square millimeters and less than 1.57 square millimeters.

[0021] One of the beneficial effects of the technical solution in this application is that the silver paste hole is a non-circular hole, which occupies less space than a complete circle. In electronic paper typesetting and cutting, it can save electronic paper and improve the utilization efficiency of electronic paper.

[0022] One of the beneficial effects of the technical solution in this application is that the silver paste hole is semi-circular, which facilitates manufacturing and saves electronic paper.

[0023] One of the beneficial effects of the technical solution in this application is that the radius of the silver paste hole is greater than 0.5 mm and less than 1 mm, which ensures conductivity while increasing the utilization rate of electronic paper typesetting.

[0024] One of the beneficial effects of the technical solution in this application is that the radius of the silver paste hole is equal to 0.85 mm, which is a better size choice, ensuring conductivity, while also increasing the utilization rate of electronic paper typesetting.

[0025] One of the beneficial effects of the technical solution in this application is that the silver paste hole is elliptical, and the major axis of the ellipse is parallel to the cutting edge, which facilitates manufacturing and saves electronic paper.

[0026] One of the beneficial effects of the technical solution in this application is that the minor axis of the ellipse is greater than 0.05 mm, which ensures conductivity while minimizing the space occupied in the minor axis direction, thus making the utilization rate of electronic paper typesetting higher.

[0027] One of the beneficial effects of the technical solution in this application is that the silver paste hole is rectangular, and the long side of the rectangle is parallel to the cutting edge, which facilitates design and manufacturing and saves electronic paper.

[0028] One of the beneficial effects of the technical solution in this application is that the shorter side of the rectangle is greater than 0.05 mm, which ensures conductivity while minimizing the space occupied in the shorter side direction, thus making the electronic paper layout more efficient.

[0029] One of the beneficial effects of the technical solution in this application is that the area of ​​the silver paste hole is greater than 0.39 square millimeters and less than 1.57 square millimeters, which ensures conductivity while minimizing the space occupied, thus making the utilization rate of electronic paper typesetting higher. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of one embodiment of an electronic paper screen assembly; Figure 2 yes Figure 1 A magnified schematic diagram of part A in the middle; Figure 3 This is a side view of the electronic paper screen assembly; Figure 4 This is a schematic diagram of one embodiment of an electronic paper screen assembly; Figure 5 This is a schematic diagram of one embodiment of an electronic paper screen assembly; Figure 6 This is a schematic diagram of an electronic paper screen component in the prior art. Detailed Implementation

[0031] The embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0032] It should be noted that the following description of preferred embodiments of this application does not constitute any limitation on this application. The description of preferred embodiments is merely an illustration of the general principles of this application. The embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the equipment or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and technical features numbered with Arabic numerals 1, 2, 3, etc., and designations such as "A" and "B," are used for descriptive purposes only, for ease of explanation, and do not represent a temporal or spatial order; they should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first," "second," and numbered with Arabic numerals 1, 2, 3, etc., may explicitly or implicitly include one or more of that feature. In the description of this application, "several" means two or more, unless otherwise expressly and specifically defined.

[0034] like Figure 1 An electronic paper screen assembly includes a thin-film transistor (TFT) substrate, an FPL layer, and a PS protective layer; the FPL layer includes an ITO transparent conductive layer and an electronic ink layer; it includes at least one silver paste hole 0110, the silver paste hole penetrating the electronic ink layer, the interior of the silver paste hole being filled with conductive silver paste, the conductive silver paste electrically connecting the circuit of the TFT substrate and the ITO transparent conductive layer; the silver paste hole is a non-circular hole. The silver paste hole is a via.

[0035] like Figure 1 The holes in the silver paste mentioned above are semi-circular.

[0036] like Figure 2 The radius of the aforementioned silver paste hole is greater than 0.5 mm and less than 1 mm. The radius of the aforementioned silver paste hole is equal to 0.85 mm.

[0037] like Figure 3 There can be multiple silver paste holes, distributed in different positions, with silver paste hole A 0310 and silver paste hole B 0320 arranged symmetrically. Figure 3 The TFT layer in the image is a TFT substrate.

[0038] like Figure 4 The aforementioned silver paste hole 0410 is elliptical, and the major axis of the ellipse is parallel to the cutting edge.

[0039] The minor axis of the ellipse described above is greater than 0.05 mm. The lower limit of the minor axis dimension of the ellipse can be determined by the laser cutting precision.

[0040] like Figure 5 The aforementioned silver paste hole 0510 is rectangular, with its long side parallel to the cutting edge. The short side of the rectangle is greater than 0.05 mm. The lower limit of the short side dimension can be determined by the laser cutting precision.

[0041] In some embodiments, the area of ​​the silver paste holes is greater than 0.39 square millimeters and less than 1.57 square millimeters.

[0042] In some embodiments, the holes can also be of other shapes, i.e., irregularly shaped holes, as long as their shorter side is smaller than their longer side. This improves the utilization rate of the electronic paper layout, at least in the shorter side direction. Although the size difference of a single hole may not be significant, the accumulated amount of waste material can be substantial during mass production. Furthermore, the FPL layer in the electronic paper assembly is the most critical cost item, so the cost savings from such layout are considerable.

[0043] This application can be applied to display products of electronic paper modules. With the increasing number of electronic paper module manufacturers and fierce price competition, manufacturers are focusing on cost control. Among the materials for electronic paper modules, electronic paper material is the most expensive. Therefore, the cutting utilization rate of electronic paper determines the cost of electronic paper, and the size of electronic paper determines the layout utilization rate.

[0044] Figure 6 This is a schematic diagram of an electronic paper screen assembly in the prior art. For example... Figure 6 The Ag glue dots are silver glue holes, which are perfectly circular and occupy a relatively large space.

[0045] In this application, in order to save electronic paper and improve its utilization rate, the electronic paper design has been changed from the previous full-circle design of silver paste holes to a semi-circle, ellipse, or rectangular design, thereby reducing the size of the electronic paper and improving its layout utilization rate.

[0046] By reducing the area of ​​the electronic paper through its shape design, and considering the large distance between the silver paste hole and the bottom of the electronic paper ear, the silver paste hole can be made into a semi-circle, ellipse, or rectangle without affecting the application of silver paste or product functionality. This reduces the area of ​​the electronic paper below the ear hole, thereby improving the layout utilization rate of the electronic paper.

[0047] An electronic paper screen assembly includes a thin-film transistor (TFT) substrate, an FPL layer, and a PS protective layer. The FPL layer includes an ITO transparent conductive layer and an electronic ink layer. It includes at least one silver paste hole penetrating the electronic ink layer, with conductive silver paste filling the hole. The conductive silver paste electrically connects the circuitry of the TFT substrate and the ITO transparent conductive layer. The silver paste hole is non-circular. The non-circular hole can be semi-circular, elliptical, rectangular, or other irregularly shaped, which reduces the size of the silver paste hole in the short side direction, improving the utilization rate of electronic paper layout while ensuring conductivity, thus being more economical.

[0048] As shown in the accompanying drawings, these are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural transformations made using the content of the application specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. An electronic paper screen assembly, comprising a thin-film transistor (TFT) substrate, an FPL layer, and a PS protective layer; wherein the FPL layer comprises an ITO transparent conductive layer and an electronic ink layer; characterized in that, It includes at least one silver paste hole that penetrates the electronic ink layer, the silver paste hole is filled with conductive silver paste, and the conductive silver paste electrically connects the circuit of the TFT substrate and the ITO transparent conductive layer; The silver paste holes are non-circular.

2. The electronic paper screen assembly as described in claim 1, characterized in that, The silver paste hole is semi-circular.

3. The electronic paper screen assembly as described in claim 2, characterized in that, The radius of the silver paste hole is greater than 0.5 mm and less than 1 mm.

4. The electronic paper screen assembly as described in claim 2, characterized in that, The radius of the silver paste hole is 0.85 mm.

5. The electronic paper screen assembly as claimed in claim 1, characterized in that, The silver paste hole is elliptical, and the major axis of the ellipse is parallel to the cutting edge.

6. The electronic paper screen assembly as claimed in claim 5, characterized in that, The minor axis of the ellipse is greater than 0.05 mm.

7. The electronic paper screen assembly as claimed in claim 1, characterized in that, The silver paste hole is rectangular, and the long side of the rectangle is parallel to the cutting edge.

8. The electronic paper screen assembly as claimed in claim 7, characterized in that, The shorter side of the rectangle is greater than 0.05 mm.

9. The electronic paper screen assembly as claimed in claim 5 or 6, characterized in that, The area of ​​the silver paste hole is greater than 0.39 square millimeters and less than 1.57 square millimeters.

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