Combination silver colloid hole electronic paper screen assembly and electronic device

Abstract

The combination silver glue hole electronic paper screen assembly comprises a thin film transistor TFT substrate, an FPL layer and a protective layer. The FPL layer comprises an ITO transparent conductive layer and an electronic ink layer. At least two silver glue holes in group A are included, the silver glue holes penetrate the electronic ink layer, the silver glue holes are filled with conductive silver glue, the conductive silver glue is in electrical communication with the circuit of the TFT substrate and the ITO transparent conductive layer, the silver glue holes in group A are used for communicating A electrical signals, and the A electrical signals penetrate the electronic ink layer. The application changes one silver glue point into two or more silver glue points, increases the driving capacity, enhances the structural strength, enhances the conductivity, display effect and stability, and the silver glue contact area is large, the filling is uniform, and the silver glue and the electronic paper ITO are not separated during the high-temperature curing process, so that the silver glue does not cause display abnormalities in the high-temperature and high-humidity operation of the electronic paper, and the product reliability is ensured.

Description

Technical Field

[0001] This application belongs to the field of electronic paper manufacturing, and specifically relates to a combined silver-painted hole electronic paper screen assembly and electronic device. Background Technology

[0002] Electronic paper (ePaper): A reflective display technology that simulates the visual characteristics of real paper. It relies on ambient light rather than backlight to display content and features ultra-low power consumption and high readability in sunlight.

[0003] Electronic paper screen components generally consist of three layers: a TFT glass substrate, an FPL film, and a PS protective layer.

[0004] Currently, when cleaning the earpiece of the e-paper used in e-readers, the small area of ​​the earpiece makes it easy to scratch the ITO. After applying silver paste, display problems will occur during testing. As a result, stress will be generated during high-temperature curing. Over time and due to environmental factors, the silver paste and ITO at the earpiece end of the e-paper will separate, leading to abnormal product display.

[0005] TFT glass substrate: driving substrate, containing circuit elements; FPL film: Middle display layer, encapsulating electronic ink; PS protective layer: A sealed protective layer that covers the edges of the FPL.

[0006] TFT: Thin Film Transistor. Its technological essence is a semiconductor driving technology that precisely controls the on / off state of each pixel through a thin-film transistor array. Its role in electronic paper is as the underlying substrate, carrying the driving circuitry.

[0007] FPL: Front Plane Layer. Functional positioning: The core display medium layer of the electronic paper display module, which directly contains electronic ink microcapsules (electrophoretic particles) and determines the final imaging effect.

[0008] The internal structure of an FPL is layered, and generally includes: The surface protective layer, also known as the PS protective layer, is located on the outermost layer of the FPL. It is made of plastic or flexible protective film material and is used for physical protection (scratch resistance, impact resistance) and environmental sealing.

[0009] Conductive substrate: Typically a polyester film (such as PET) or a glass substrate, with an ITO transparent conductive layer covering the surface, forming the electrode circuit that drives the electronic ink. The flexibility of the substrate determines the bendability of the electronic paper.

[0010] Electronic ink layer: Microcapsule electrophoresis units embedded inside the substrate contain color-developing particles with positive / negative charges. These particles change position in response to changes in the electric field, forming black and white or color pixels. Summary of the Invention

[0011] To address the issue of silver paste separating from ITO at the earpiece end of electronic paper, which leads to abnormal product display, this application proposes replacing one silver paste dot with two or more silver paste dots. This increases driving capability, strengthens the structure, enhances conductivity, improves display effect and stability, and increases the contact area of ​​the silver paste, resulting in more uniform filling. During high-temperature curing, the silver paste will not separate from the ITO of the electronic paper, thus preventing display abnormalities. Consequently, the electronic paper will not exhibit display problems under high temperature and high humidity conditions, ensuring product reliability.

[0012] An electronic paper screen assembly with combined silver paste holes includes a thin-film transistor (TFT) substrate, an FPL layer, and a protective layer; the FPL layer includes an ITO transparent conductive layer and an electronic ink layer; it includes at least A groups of silver paste holes, each group comprising at least two silver paste holes, which penetrate the electronic ink layer; the silver paste holes are filled with conductive silver paste, which electrically connects the circuitry of the TFT substrate and the ITO transparent conductive layer; the A groups of silver paste holes are used to connect an A electrical signal, which penetrates the electronic ink layer.

[0013] Yes, the protective layer mentioned above can be a PS film.

[0014] Alternatively, the protective layer can be a transparent paint film, which is applied by spraying to cover the FPL layer.

[0015] Yes, the holes in the silver paste mentioned above can be circular.

[0016] Yes, the above-mentioned silver paste holes are oval-shaped.

[0017] Yes, the above-mentioned Group A silver paste holes include at least 3 silver paste holes.

[0018] It may also include a group of B silver paste holes, which include at least two silver paste holes. The group of B silver paste holes are used to connect to the B electrical signal, which passes through the electronic ink layer.

[0019] Yes, the radius of the aforementioned silver paste hole is less than 1 millimeter.

[0020] An electronic device comprising any of the above-described combinations of silver-coated perforated electronic paper screen components.

[0021] One of the beneficial effects of the technical solution in this application is that a single via is made into two electrically connected vias, arranged side by side. The side-by-side arrangement of the two vias does not increase the overall height. One of the beneficial effects of the technical solution in this application is that it expands the effective connection area and improves the connection strength within a limited diameter range.

[0022] One of the beneficial effects of the technical solution in this application is that the elliptical silver paste hole is easy to process and can reduce the height in the short axis direction. One of the beneficial effects of the technical solution in this application is that more than three vias can increase the connection strength and reduce the height. One of the beneficial effects of the technical solution in this application is that multiple sets of silver paste holes can improve the structural strength and connection area of ​​each set. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a traditional electronic paper screen component; Figure 2 This is a schematic diagram of the use of dual vias in Example 1; Figure 3 This is a schematic diagram of the use of dual vias in Example 2; Figure 4 This is a schematic diagram of the use of dual vias in Example 3; Figure 5 This is a schematic diagram of the above-mentioned Group A silver paste holes, which includes at least 3 silver paste holes; Figure 6 This is a schematic diagram of an electronic paper screen component used in an electronic device; Figure 7 This is a schematic diagram of the double vias used in Example 5. Detailed Implementation

[0024] The embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0025] It should be noted that the following description of preferred embodiments of this application does not constitute any limitation on this application. The description of preferred embodiments is merely an illustration of the general principles of this application. The embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the equipment or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and technical features numbered with Arabic numerals 1, 2, 3, etc., and designations such as "A" and "B," are used for descriptive purposes only, for ease of explanation, and do not represent a temporal or spatial order; they should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first," "second," and numbered with Arabic numerals 1, 2, 3, etc., may explicitly or implicitly include one or more of that feature. In the description of this application, "several" means two or more, unless otherwise expressly and specifically defined.

[0027] like Figure 1 This is a schematic diagram of a traditional electronic paper screen component.

[0028] like Figure 1 Traditional electronic paper screen components have an ITO transparent conductive layer coated on the TFT layer, forming the electrode circuit for driving electronic ink. The FPL layer contains vias filled with silver paste. Above the FPL layer is a PS film, its perimeter sealed with UV sealant. The TFT layer also includes a driver chip IC. The FPC is connected to the TFT layer.

[0029] Because of the limited number of vias, the components are prone to movement and instability during the bonding process, resulting in a low yield.

[0030] like Figure 2 The schematic diagram of the double vias used in Example 1.

[0031] like Figure 2 One approach is to create two electrically connected vias arranged side-by-side. This side-by-side arrangement of two vias does not increase the overall height, but within a limited diameter range, it expands the effective connection area and enhances the connection strength.

[0032] like Figure 2An electronic paper screen assembly with combined silver paste holes includes a thin-film transistor (TFT) layer (TFT substrate), an FPL layer, and a protective PS film. The FPL layer includes an ITO transparent conductive layer and an electronic ink layer. The assembly includes at least a group A of silver paste holes, each group comprising at least two silver paste holes that penetrate the electronic ink layer. The silver paste holes are filled with conductive silver paste, which electrically connects the circuitry of the TFT substrate and the ITO transparent conductive layer. The group A of silver paste holes is used to connect an A electrical signal, which penetrates the electronic ink layer.

[0033] like Figure 2 The aforementioned protective layer is a PS film.

[0034] Alternatively, you can skip the PS film and directly apply a transparent lacquer film to the FPL layer, then spray the transparent lacquer film over the FPL layer.

[0035] like Figure 3 The schematic diagram of the double vias used in Example 2.

[0036] like Figure 3 The holes in the silver paste are round.

[0037] like Figure 4 The schematic diagram of the double vias used in Example 3.

[0038] like Figure 4 The silver paste holes are oval-shaped. Oval-shaped silver paste holes are easier to machine and also reduce the height along the minor axis.

[0039] like Figure 4 The schematic diagram in Example 4 shows the use of three vias. Three or more vias can increase connection strength and reduce height.

[0040] like Figure 5 The above-mentioned Group A silver paste holes include at least 3 silver paste holes.

[0041] like Figure 4 The component also includes a group of B silver paste holes, which include at least two silver paste holes. The group of B silver paste holes are used to connect to a B electrical signal, which passes through the electronic ink layer.

[0042] Yes, the radius of the aforementioned silver paste hole is less than 1 millimeter.

[0043] like Figure 6 A schematic diagram of an electronic paper screen assembly used in an electronic device; An electronic device comprising any of the above-described combinations of silver-coated perforated electronic paper screen components.

[0044] like Figure 6Above the TFT layer is the FPL layer, and above the FPL layer is the PS protective layer. The gaps between the layers are sealed with edge-sealing adhesive.

[0045] A driver chip IC is bonded to the TFT substrate. An FPC circuit board is soldered to the edge of the TFT substrate, and the interface between the IC and the FPC circuit is sealed with silicone for waterproofing. Two Ag silver paste dots are distributed at the edge of the FPL layer.

[0046] like Figure 7 A schematic diagram of the electronic paper screen assembly used in Example 5; exist Figure 6 Based on this, one Ag silver paste dot is replaced with two parallel circular double vias. This way, the height of the via can be reduced without reducing the effective area of ​​the via, and it can even increase the effective connection area and increase the connection strength.

[0047] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural transformations made using the content of the application specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A combined silver-painted hole electronic paper screen assembly, comprising a thin-film transistor (TFT) substrate, an FPL layer, and a protective layer; wherein the FPL layer comprises an ITO transparent conductive layer and an electronic ink layer; characterized in that, It includes at least a group A of silver paste holes, wherein the group A of silver paste holes includes at least two silver paste holes that penetrate the electronic ink layer; The holes in the silver paste are filled with conductive silver paste, which electrically connects the circuit of the TFT substrate and the ITO transparent conductive layer. The A group of silver paste holes is used to connect to the A electrical signal, which passes through the electronic ink layer.

2. The combined silver-painted hole electronic paper screen assembly as described in claim 1, characterized in that, The protective layer is a PS film.

3. The combined silver-painted hole electronic paper screen assembly as described in claim 1, characterized in that, The protective layer is a transparent paint film, which is applied by spraying to cover the FPL layer.

4. The combined silver-painted hole electronic paper screen assembly as described in claim 1, characterized in that, The holes in the silver paste are circular.

5. The combined silver-painted hole electronic paper screen assembly as described in claim 1, characterized in that, The silver paste holes are oval-shaped.

6. The combined silver-painted hole electronic paper screen assembly as described in claim 1, characterized in that, The group A silver paste holes include at least 3 silver paste holes.

7. The combined silver-painted hole electronic paper screen assembly as described in claim 1, characterized in that, It also includes a group of B silver paste holes, which includes at least two silver paste holes. The group of B silver paste holes are used to connect to the B electrical signal, which passes through the electronic ink layer.

8. The combined silver-painted hole electronic paper screen assembly as described in claim 1, characterized in that, The radius of the silver paste hole is less than 1 mm.

9. An electronic device, characterized in that, Includes the electronic paper screen assembly with silver-coated holes according to any one of claims 1 to 8.

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