A wavelength conversion device, light emitting device and projection device thereof

Abstract

The utility model discloses a wavelength conversion device and its light emitting device and projection device, include: bearing base plate, bearing base plate includes first surface and second surface of opposite arrangement, wavelength conversion component, wavelength conversion component includes fluorescent sheet and reflection layer, fluorescent sheet and reflection layer are laminated arrangement, heat conduction adhesive layer, wavelength conversion component with first surface of bearing base plate is connected through heat conduction adhesive layer, make bearing base plate, heat conduction adhesive layer and wavelength conversion component are laminated arrangement, wherein, reflection layer is located between fluorescent sheet and heat conduction adhesive layer. The device adopts heat conduction adhesive layer and connects reflection layer, fluorescent sheet and bearing base plate, so through heat conduction adhesive layer can be good to the heat of wavelength conversion component is delivered to bearing base plate, and the adhesion of heat conduction adhesive will not be worse because temperature rises, solved the problem of falling off between the silver plating or welding layer and bearing base plate directly on bearing base plate in prior art.

Description

Technical Field

[0001] This utility model relates to the field of lighting and projection technology, and in particular to a wavelength conversion device and its light-emitting device and projection device. Background Technology

[0002] With the continuous development of laser technology, laser phosphor light sources are increasingly widely used in display and lighting fields. To achieve multi-color displays, blue lasers are typically used to excite green, yellow, or red phosphors. A wavelength conversion device then converts a portion of the blue laser light into green, yellow, or red light, forming the three primary colors for display. Currently, the main wavelength conversion devices are divided into two types: reflective and transmissive. Reflective wavelength conversion devices typically include a wavelength conversion layer and a reflective substrate, with a silver layer on the reflective substrate to improve reflectivity. Transmissive wavelength conversion devices, on the other hand, direct the excitation light from a transparent substrate, allowing it to pass through the substrate and enter the light-emitting layer to excite fluorescence. A wavelength-selective dielectric film then separates the excitation light from the fluorescence.

[0003] However, existing wavelength conversion devices have some problems. In reflective wavelength conversion devices, the silver layer is prone to moisture and oxidation, leading to a decrease in reflectivity and affecting reliability. Another reflective layer—the diffuse reflective layer—has a low thermal conductivity, hindering heat dissipation from the phosphor layer and affecting light conversion efficiency. Aluminum substrates are generally used as reflective substrates, but their thermal conductivity is not optimal, causing heat focused on the phosphor layer to not dissipate quickly enough, thus reducing the phosphor layer's conversion efficiency. For example, CN215340668U discloses a reflective wavelength conversion device, which includes a support structure, at least two wavelength conversion layers, and a reflective structure. This structure includes a reflective structure to partially reflect the light from the excitation source and the light emitted by the excited light through different wavelength conversion layers, thereby controlling the emitted light spectrum. It also includes a heat dissipation structure to effectively dissipate the heat generated by the excited light. However, this patent still has the problem of needing to improve the heat dissipation structure to conduct the heat generated by the excited light away more quickly, avoiding heat accumulation that could affect the efficiency and lifespan of the conversion device.

[0004] To address these issues, a novel wavelength conversion device needs to be developed. This device should possess excellent heat dissipation and reflection performance, while also effectively controlling the spectrum and improving light utilization. Utility Model Content

[0005] Therefore, it is necessary for this utility model to provide a wavelength conversion device, its light emission device, and its projection device to solve the above-mentioned technical problems.

[0006] One technical solution of this utility model is: A wavelength conversion device, comprising: A carrier substrate, the carrier substrate including a first surface and a second surface disposed opposite to each other; A wavelength conversion component, the wavelength conversion component including a phosphor sheet and a reflective layer, wherein the phosphor sheet and the reflective layer are stacked together; A thermally conductive adhesive layer is provided, and the wavelength conversion component is connected to the first surface of the carrier substrate through the thermally conductive adhesive layer, so that the carrier substrate, the thermally conductive adhesive layer and the wavelength conversion component are stacked in a layered manner. The reflective layer is located between the fluorescent sheet and the thermally conductive adhesive layer.

[0007] In one specific embodiment, the reflective layer is formed from silver material by sintering.

[0008] In one specific embodiment, the carrier substrate is a diamond substrate.

[0009] As one specific embodiment, it also includes a thermally conductive layer, which is disposed on the second surface of the carrier substrate and is positioned corresponding to the wavelength conversion component.

[0010] In one specific embodiment, the thermally conductive layer has several grooves on the side away from the supporting substrate, and the grooves are interconnected.

[0011] In one specific embodiment, the depth of the groove is less than the thickness of the heat-conducting layer; or, the depth of the groove is equal to the thickness of the heat-conducting layer.

[0012] As one specific embodiment, it also includes a light spot adjustment layer, which is located between the reflective layer and the phosphor sheet.

[0013] As one specific embodiment, it also includes a filter layer located on the side of the phosphor sheet away from the carrier substrate.

[0014] A light-emitting device, the light-emitting device comprising any of the wavelength conversion devices described above.

[0015] A projection device, the projection device comprising the light-emitting device described above.

[0016] The wavelength conversion device provided in this application uses a thermally conductive adhesive layer to connect the reflective layer, phosphor sheet, and carrier substrate. In this way, the heat of the wavelength conversion component can be effectively transferred to the carrier substrate through the thermally conductive adhesive layer, and the adhesion of the thermally conductive adhesive will not deteriorate due to the increase in temperature. This solves the problem of direct silver plating or detachment of the solder layer from the carrier substrate in the prior art. In this application, the carrier substrate is a diamond substrate with high thermal conductivity, which has better thermal conductivity and can ensure the conversion efficiency of the wavelength conversion device. Attached Figure Description

[0017] Other features, objectives, and beneficial effects of this application will become more apparent from the following detailed description of the reference embodiments with reference to the accompanying drawings.

[0018] Figure 1 This is a schematic diagram of the structure of a wavelength conversion device according to the present invention; Figures 2a-2f This is a schematic diagram of the fabrication process of a wavelength conversion device according to the present invention; Figure 3 This is another structural schematic diagram of a wavelength conversion device according to the present invention; Figure 4 This is another structural schematic diagram of a wavelength conversion device according to the present invention; Figure 5 This is another structural schematic diagram of a wavelength conversion device according to the present invention.

[0019] Icon description: 10-Substrate; 20-Thermal conductive adhesive layer; 30-Phosphor sheet; 40-Reflective layer; 50-Motor; 60-Thermal conductive layer; 70-Filter layer; 80-Spot adjustment layer. Detailed Implementation

[0020] To facilitate understanding of this utility model, it will be described in detail below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of this utility model, but the implementation of this utility model is not limited thereto. These embodiments are provided to provide a more comprehensive and thorough understanding of the disclosure of this utility model.

[0021] The same reference numerals in the figures represent the same or similar structures, and therefore will not be described again. It should be noted that directional terms such as "upper," "lower," and "between" may be used in this specification. These expressions are only for the convenience of describing the orientation shown in the figures and do not limit the actual direction of this utility model. Furthermore, the terms "first," "second," etc., used in this document are only used to distinguish different features and do not constitute a limitation on the number or importance of features.

[0022] Unless otherwise expressly stated, the technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for description of specific embodiments only and does not constitute a limitation thereof. The term "and / or" should be interpreted as including any and all combinations of one or more of the associated listed items.

[0023] like Figure 1 The diagram shows a schematic representation of a wavelength conversion device, which includes: The carrier substrate 10 includes a first surface and a second surface disposed opposite to each other; wherein, the carrier substrate 10 is preferably formed of a material with good heat dissipation, such as an aluminum substrate, sapphire glass, ceramic, etc. As one specific embodiment of this application, the carrier substrate 10 is a diamond substrate, which has very good heat dissipation effect, thus ensuring the performance of the wavelength conversion device; the carrier substrate 10 is connected to a motor 50, so that the carrier substrate 10 can be driven to rotate by the motor 50. A wavelength conversion component includes a phosphor sheet 30 and a reflective layer 40, wherein the phosphor sheet 30 and the reflective layer 40 are stacked together; the phosphor sheet 30 also has a first surface and a second surface disposed opposite to each other, and the reflective layer 40 is directly disposed on the second surface of the phosphor sheet 30; the phosphor sheet 30 may be a ceramic phosphor sheet. A thermally conductive adhesive layer 20 is provided, through which the wavelength conversion component is connected to the first surface of the carrier substrate 10, such that the carrier substrate 10, the thermally conductive adhesive layer 20, and the wavelength conversion component are stacked. In this way, when the wavelength conversion component is irradiated by excitation light, the heat generated can be quickly transferred to the carrier substrate 10 through the thermally conductive adhesive layer 20 and then quickly dissipated, ensuring that the wavelength conversion component can emit light normally. The reflective layer 40 is located between the phosphor sheet 30 and the thermally conductive adhesive layer 40, so that the thermally conductive adhesive layer 20 is directly connected to the carrier substrate 10. Since the reflective layer 40 is located between the phosphor sheet 30 and the thermally conductive adhesive layer 40, there are no special restrictions on the thermally conductive adhesive layer 20, as long as it can meet the thermal conductivity requirements. It can be transparent or opaque.

[0024] In one specific embodiment, the reflective layer 40 is formed of silver material by sintering. The silver particles of the pure silver reflective layer 40 formed by sintering are more dense, which has better reflection and heat dissipation functions and more stable performance.

[0025] like Figure 3As shown, in one specific embodiment, a thermally conductive layer 60 is also included. The thermally conductive layer 60 is disposed on the second surface of the supporting substrate 10, and its position corresponds to that of the wavelength conversion component. Preferably, the radial width of the thermally conductive layer 60 is greater than the radial width of the wavelength conversion component to better ensure heat dissipation and further dissipate heat from the supporting substrate 10. In one specific embodiment, the thermally conductive layer 60 has several grooves on the side away from the supporting substrate 10, and these grooves are interconnected to provide sufficient space for heat exchange. In one specific embodiment, the depth of the grooves is less than the thickness of the thermally conductive layer 60; or, the depth of the grooves is equal to the thickness of the thermally conductive layer 60; preferably, the depth of the grooves is equal to the thickness of the thermally conductive layer 60, meaning there is no residual material between the grooves and the supporting substrate 10. This results in a larger space in the grooves, which is beneficial for heat exchange and improves the heat dissipation effect.

[0026] like Figure 4 As shown, in one specific embodiment, a filter layer 70 is also included. The filter layer 70 is located on the side of the phosphor sheet 30 away from the carrier substrate 10. The filter layer 70 is of at least one type. When it is necessary to filter light of different colors, different filter layers 70 need to be provided on the surface of the phosphor sheet 30. That is, the surface of the phosphor sheet 30 is provided with several regions, and at least one region is provided with a filter layer 70. Different regions can be provided with the same filter layer 70 or different filter layers 70, so that different light can be filtered.

[0027] like Figure 5 As shown, in one specific embodiment, it also includes a beam adjustment layer 80, which is located between the reflective layer 40 and the phosphor sheet 30; the beam adjustment layer 80 focuses the beam by superimposing different refractive indices, thereby improving the utilization rate of the laser.

[0028] A light-emitting device, the light-emitting device comprising any of the wavelength conversion devices described above.

[0029] A projection device, the projection device including the light-emitting device described above, wherein the light-emitting device is placed in the optical path of the projection device.

[0030] like Figures 2a-2fAs shown, a method for fabricating the wavelength conversion device is provided. A thermally conductive adhesive layer 20 is disposed on the first surface of the carrier substrate 10. The thermally conductive adhesive layer 20 is located at the edge of the carrier substrate 10, and a motor 50 is connected to the middle region of the carrier substrate 10. Of course, directly disposing the thermally conductive adhesive layer 20 on the first surface of the carrier substrate 10 is just one method. A phosphor sheet 30 is prepared, which can be a ceramic phosphor sheet. The phosphor sheet 30 includes a first surface and a second surface. A reflective layer 40 is formed on the second surface of the phosphor sheet 30 by sintering. When the reflective layer 40 is formed on the second surface of the phosphor sheet 30, a wavelength conversion component is formed. Then, the wavelength conversion component is connected to the carrier substrate 10 through the thermally conductive adhesive layer 20. As mentioned above, the thermally conductive adhesive layer can also be on the side of the reflective layer 40 away from the phosphor sheet 30. Then, the thermally conductive adhesive layer 20 and the wavelength conversion component are directly attached to the edge region of the carrier substrate 10. The thermally conductive adhesive layer 20 can be formed on the surface of the carrier substrate 10 or the wavelength conversion component by coating, or by spraying.

[0031] The wavelength conversion device provided in this application uses a thermally conductive adhesive layer to connect the reflective layer, phosphor sheet, and carrier substrate. In this way, the heat of the wavelength conversion component can be effectively transferred to the carrier substrate through the thermally conductive adhesive layer, and the adhesion of the thermally conductive adhesive will not deteriorate due to the increase in temperature. This solves the problem of direct silver plating or detachment of the solder layer from the carrier substrate in the prior art. In this application, the carrier substrate is a diamond substrate with high thermal conductivity, which has better thermal conductivity and can ensure the conversion efficiency of the wavelength conversion device.

[0032] To more clearly illustrate the purpose, features, and advantages of this utility model, the specific embodiments of this utility model have been described in detail above with reference to the accompanying drawings, and numerous specific details have been elaborated for understanding. However, this utility model can be implemented in many other forms different from those described, and those skilled in the art can make various modifications, variations, or improvements without departing from the core concept of this utility model. Furthermore, the technical features in the above embodiments can be combined arbitrarily, and such combinations should be considered within the scope of this specification as long as they do not contradict each other.

[0033] The above embodiments are merely specific illustrations of several implementations of this utility model, and their descriptions should not be construed as limiting the scope of protection of this utility model. The actual scope of protection of this utility model shall be determined by the contents of the appended claims.

Claims

1. A wavelength conversion device, comprising: A carrier substrate, the carrier substrate including a first surface and a second surface disposed opposite to each other; A wavelength conversion component, the wavelength conversion component including a phosphor sheet and a reflective layer, wherein the phosphor sheet and the reflective layer are stacked together; A thermally conductive adhesive layer is provided, and the wavelength conversion component is connected to the first surface of the carrier substrate through the thermally conductive adhesive layer, so that the carrier substrate, the thermally conductive adhesive layer and the wavelength conversion component are stacked in a layered manner. The reflective layer is located between the fluorescent sheet and the thermally conductive adhesive layer.

2. The wavelength conversion device according to claim 1, characterized in that, The reflective layer is formed from silver material by sintering.

3. The wavelength conversion device according to claim 2, characterized in that, The substrate is a diamond substrate.

4. The wavelength conversion device according to claim 1, characterized in that, It also includes a thermally conductive layer disposed on the second surface of the carrier substrate, and the thermally conductive layer is disposed in a position corresponding to that of the wavelength conversion component.

5. A wavelength conversion device according to claim 4, characterized in that, The thermally conductive layer has several grooves on the side away from the supporting substrate, and the grooves are interconnected.

6. A wavelength conversion device according to claim 5, characterized in that, The depth of the groove is less than the thickness of the heat-conducting layer; or, the depth of the groove is equal to the thickness of the heat-conducting layer.

7. The wavelength conversion device according to claim 1, characterized in that, It also includes a light spot adjustment layer, which is located between the reflective layer and the phosphor sheet.

8. The wavelength conversion device according to claim 1, characterized in that, It also includes a filter layer located on the side of the phosphor sheet away from the carrier substrate.

9. A light-emitting device, the light-emitting device comprising the wavelength conversion device according to any one of claims 1 to 8.

10. A projection device comprising the light-emitting device of claim 9.

Images