Anti-pressing single-chip microcomputer chip

Abstract

The utility model relates to singlechip chip technical field discloses a kind of anti-pressure singlechip chip, including chip substrate, the top of chip substrate is fixedly connected with singlechip chip, the top of chip substrate is movably installed with anti-pressure cover, the inner wall of anti-pressure cover is fixedly connected with inclined rod, the top of anti-pressure cover is equipped with sliding hole, the inner wall of sliding hole is slidably connected with buffer rod.The utility model has following advantages and effects: rubber layer and the top surface of anti-pressure cover abut, rubber layer is extruded to further buffer, while sliding resistance protrusion increases resistance, the inner wall of sliding hole and the outer surface of resistance protrusion are adapted, shock-absorbing sleeve is damped when sliding, to improve stability, when receiving pressure, the impact force generated is weakened, inclined rod supports the inside of anti-pressure cover, increases overall strength, so that anti-pressure cover is not prone to deformation, can withstand stronger pressure, so that its protective property can be fully guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of microcontroller chip technology, and in particular to a pressure-resistant microcontroller chip. Background Technology

[0002] A microcontroller is an integrated circuit chip that uses very large-scale integrated circuit technology to integrate a central processing unit (CPU) with data processing capabilities, random access memory (RAM), read-only memory (ROM), various I / O ports, interrupt systems, timers / counters, and other functions onto a single silicon chip to form a small but complete microcomputer system. It is widely used in the field of industrial control. Since the 1980s, it has evolved from the 4-bit and 8-bit microcontrollers to the high-speed microcontrollers of today with a speed of 300MHz.

[0003] In the prior art, Chinese Patent Publication No. CN213276524U discloses a pressure-resistant microcontroller chip, including a chip body. Each of the four corners of the chip body has a fixing post. Each of the four fixing posts has a limiting groove on its bottom side facing the chip body. A pressure rod is fixedly connected to the bottom side of each fixing post near the chip body, located at the top of the limiting groove. Sleeve rods are fixedly connected to each pair of opposite sides of the four fixing posts. A tension spring is sleeved on the outer side of each sleeve rod. A connecting rod is fixedly connected between two adjacent sleeve rods. A first protective sleeve located outside the tension spring is fixedly connected between the connecting rod and the fixing post. This pressure-resistant microcontroller chip, through the sleeve rods, tension springs, limiting holes, top plate, and movable plate, can accommodate most chip sizes, improving the versatility of the device. The positioning posts, compression springs, movable plates, shock absorbers, and positioning holes effectively improve the shock absorption effect of the device and protect the chip body from damage, making it convenient to use.

[0004] However, in actual use, when the movable plate and the top plate are subjected to pressure, the bottom space of the movable plate and the top plate is relatively large, and the support effect may not be sufficient. As a result, when the pressure is large, the movable plate and the top plate may deform or break, thus affecting the protective effect. Therefore, improvements are needed. Utility Model Content

[0005] The purpose of this invention is to provide a pressure-resistant microcontroller chip that can withstand strong pressure, thus ensuring its protective performance.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a pressure-resistant microcontroller chip, comprising a chip substrate, a microcontroller chip fixedly connected to the top of the chip substrate, a pressure-resistant cover movably mounted on the top of the chip substrate, a slanted rod fixedly connected to the inner wall of the pressure-resistant cover, a sliding hole opened on the top of the pressure-resistant cover, a buffer rod slidably connected to the inner wall of the sliding hole, a force-bearing plate fixedly connected to the top of the buffer rod, a rubber layer fixedly connected to the bottom of the force-bearing plate, a resistance protrusion fixedly connected to the outer surface of the buffer rod, and a shock-absorbing sleeve fixedly connected to the outer surface of the resistance protrusion.

[0007] By adopting the above technical solution, the pressure shield is installed on the chip substrate during use, thereby surrounding and protecting the microcontroller chip. When pressure is received, the pressure compresses the force plate, which buffers the pressure, causing the buffer rod to slide downwards along the inner wall of the sliding hole. Then, the rubber layer comes into contact with the top surface of the pressure shield, and the rubber layer is squeezed for further buffering. During sliding, the resistance protrusion increases the resistance. The inner wall of the sliding hole matches the outer surface of the resistance protrusion, and the shock-absorbing sleeve dampens the vibration during sliding, thereby improving stability. The impact force generated when pressure is received is reduced, and the diagonal bar supports the inside of the pressure shield, increasing the overall strength. Therefore, the pressure shield is not easy to deform and can withstand strong pressure, thus ensuring its protective performance.

[0008] A further feature of this invention is that the number of resistance protrusions is several, and the several resistance protrusions are arranged in a ring array.

[0009] By adopting the above technical solution, the resistance protrusions are evenly distributed, improving the stability of descent.

[0010] A further feature of this invention is that a return spring is fixedly connected to the bottom of the buffer rod, and the bottom of the return spring is fixedly connected to the sliding hole.

[0011] By adopting the above technical solution, the reset spring is squeezed and contracted under pressure, and randomly rebounds and resets after the pressure is removed.

[0012] A further feature of this invention is that a telescopic rod is fixedly connected inside the reset spring, and the number of reset springs is several.

[0013] By adopting the above technical solution, the telescopic rod can extend and retract to its original position, which is beneficial for the repositioning of the load-bearing plate.

[0014] A further feature of this invention is that a positioning groove is provided on the top of the chip substrate, and an anti-slip frame is fixedly connected to the bottom of the anti-pressure cover.

[0015] By adopting the above technical solution, the anti-slip frame and the positioning groove are aligned vertically during installation.

[0016] A further feature of this invention is that a positioning plate is fixedly connected to the bottom of the anti-slip frame, and the outer surface of the positioning plate has perforations.

[0017] By adopting the above technical solution, the positioning plate is inserted into the positioning slot to achieve its positioning and installation.

[0018] A further feature of this invention is that the chip substrate is internally threaded with a bolt, which penetrates the interior of a through hole.

[0019] By adopting the above technical solution, the bolts play a fixing role, and the fixation is strong.

[0020] A further feature of this invention is that an elastic strip is fixedly connected to the top of the force-bearing plate, and anti-slip particles are provided on the top of the force-bearing plate.

[0021] By adopting the above technical solution, the elastic strip and anti-slip particles increase the cushioning and anti-slip properties of the top, and the elastic strip is squeezed when pressure is applied.

[0022] A further feature of this invention is that the number of elastic strips is several, and the distance between each pair of elastic strips is the same.

[0023] By adopting the above technical solution, the elastic strips are arranged neatly, with appropriate gaps between each one.

[0024] A further feature of this invention is that an anti-compression layer is fixedly connected to the outer surface of the diagonal bar, and a reinforcing rib is fixedly connected to the inside of the diagonal bar.

[0025] By adopting the above technical solutions, the compressive layer and reinforcing ribs increase the support strength of the diagonal brace, making the whole structure more robust.

[0026] The beneficial effects of this utility model are:

[0027] 1. This utility model, through the coordinated arrangement of a chip substrate, a microcontroller chip, a pressure shield, a diagonal rod, a sliding hole, a buffer rod, a force-bearing plate, a rubber layer, a resistance protrusion, and a shock-absorbing sleeve, enables the device to be used by the operator. When the pressure shield is installed on the chip substrate, it surrounds and protects the microcontroller chip. When pressure is applied, the pressure compresses the force-bearing plate, which buffers the pressure. This causes the buffer rod to slide downwards along the inner wall of the sliding hole. The rubber layer then comes into contact with the top surface of the pressure shield, further compressing and buffering the pressure. Simultaneously, the resistance protrusion increases resistance, and the inner wall of the sliding hole matches the outer surface of the resistance protrusion. The shock-absorbing sleeve dampens vibrations during sliding, thus improving stability. The impact force generated when pressure is applied is reduced. The diagonal rod supports the interior of the pressure shield, increasing overall strength, making the pressure shield less prone to deformation and able to withstand strong pressure, thus ensuring its protective performance.

[0028] 2. This utility model, through the coordinated arrangement of a return spring, telescopic rod, positioning groove, anti-slip frame, positioning plate, perforations, bolts, elastic strips, anti-slip particles, pressure-resistant layer, and reinforcing ribs, ensures that the resistance protrusions are evenly distributed during use, improving the stability of descent. Under pressure, the return spring is compressed and contracts, and after the pressure is removed, it randomly rebounds and resets. The telescopic rod can extend and retract to reset, facilitating the reset of the force plate. During installation, the anti-slip frame and positioning groove are aligned vertically, and the positioning plate is inserted into the positioning groove for positioning. Bolts provide a fixing function, resulting in strong stability after fixing. The elastic strips and anti-slip particles increase the cushioning and anti-slip properties of the top. When pressure is applied, the elastic strips are compressed. The elastic strips are neatly arranged with appropriate gaps between each one. The pressure-resistant layer and reinforcing ribs increase the support strength of the diagonal rod, making the overall structure more robust. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the structure of this utility model;

[0031] Figure 2 This is a schematic diagram of the anti-pressure cover structure of this utility model;

[0032] Figure 3 This utility model Figure 2 Enlarged structural diagram at point A;

[0033] Figure 4 This is a schematic diagram of the buffer rod structure of this utility model.

[0034] In the diagram, 1. Chip substrate; 2. Microcontroller chip; 3. Pressure shield; 4. Diagonal rod; 5. Sliding hole; 6. Buffer rod; 7. Force plate; 8. Rubber layer; 9. Resistance protrusion; 10. Shock-absorbing sleeve; 11. Return spring; 12. Telescopic rod; 13. Positioning groove; 14. Anti-slip frame; 15. Positioning plate; 16. Perforation; 17. Bolt; 18. Elastic strip; 19. Anti-slip particles; 20. Pressure-resistant layer; 21. Reinforcing rib. Detailed Implementation

[0035] The technical solution of this utility model will now be clearly and completely described with reference to specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0036] Reference Figure 1-4A pressure-resistant microcontroller chip includes a chip substrate 1, a microcontroller chip 2 fixedly connected to the top of the chip substrate 1, a pressure-resistant cover 3 movably mounted on the top of the chip substrate 1, a diagonal rod 4 fixedly connected to the inner wall of the pressure-resistant cover 3, a sliding hole 5 on the top of the pressure-resistant cover 3, a buffer rod 6 slidably connected to the inner wall of the sliding hole 5, a force-bearing plate 7 fixedly connected to the top of the buffer rod 6, a rubber layer 8 fixedly connected to the bottom of the force-bearing plate 7, a resistance protrusion 9 fixedly connected to the outer surface of the buffer rod 6, and a shock-absorbing sleeve 10 fixedly connected to the outer surface of the resistance protrusion 9. When in use, the pressure-resistant cover 3 is installed on the chip substrate 1 to surround and protect the microcontroller chip 2. When pressure is applied, the pressure compresses the force-bearing plate 7, and the force-bearing plate 7 exerts pressure on the pressure plate 2. The force is buffered, causing the buffer rod 6 to slide downwards along the inner wall of the sliding hole 5. Then, the rubber layer 8 abuts against the top surface of the pressure shield 3, and the rubber layer 8 is compressed for further buffering. Simultaneously, the resistance protrusions 9 increase resistance. The inner wall of the sliding hole 5 matches the outer surface of the resistance protrusions 9. The shock-absorbing sleeve 10 dampens vibrations during sliding, thereby improving stability. When pressure is applied, the impact force is reduced. The diagonal rod 4 supports the interior of the pressure shield 3, increasing overall strength, making the pressure shield 3 less prone to deformation and able to withstand strong pressure, thus ensuring its protective function. There are several resistance protrusions 9 arranged in a circular array, with even distribution, improving the stability of descent. The buffer rod 6... A return spring 11 is fixedly connected to the bottom of the chip substrate 1. The bottom of the return spring 11 is fixedly connected to the sliding hole 5. Under pressure, the return spring 11 is compressed and contracted. After the pressure is removed, it randomly rebounds and resets. A telescopic rod 12 is fixedly connected inside the return spring 11. There are several return springs 11. The telescopic rod 12 can extend and retract to reset, which is beneficial for the reset of the force plate 7. A positioning groove 13 is opened on the top of the chip substrate 1. An anti-slip frame 14 is fixedly connected to the bottom of the anti-pressure cover 3. During installation, the anti-slip frame 14 and the positioning groove 13 are aligned vertically. A positioning plate 15 is fixedly connected to the bottom of the anti-slip frame 14. A through hole 16 is opened on the outer surface of the positioning plate 15. The positioning plate 15 is inserted into the positioning groove 13 to position and install it. The plate 1 is internally threaded with bolts 17, which penetrate the hole 16 and serve as a fixing element, providing strong stability. The top of the load-bearing plate 7 is fixedly connected with elastic strips 18 and anti-slip particles 19. The elastic strips 18 and anti-slip particles 19 increase the cushioning and anti-slip properties of the top. When pressure is applied, the elastic strips 18 are compressed. There are several elastic strips 18, with equal spacing between each pair. The elastic strips 18 are arranged neatly with appropriate gaps between each one. The outer surface of the diagonal bar 4 is fixedly connected with a pressure-resistant layer 20, and the inside of the diagonal bar 4 is fixedly connected with reinforcing ribs 21. The pressure-resistant layer 20 and reinforcing ribs 21 increase the support strength of the diagonal bar 4, making the whole structure more robust.

[0037] In this invention, the coordinated arrangement of the chip substrate 1, microcontroller chip 2, pressure shield 3, inclined rod 4, sliding hole 5, buffer rod 6, force plate 7, rubber layer 8, resistance protrusion 9, and shock-absorbing sleeve 10 allows the device to be used effectively. When the operator installs the pressure shield 3 on the chip substrate 1, it surrounds and protects the microcontroller chip 2. When pressure is applied, the pressure compresses the force plate 7, which buffers the pressure. This causes the buffer rod 6 to slide downwards along the inner wall of the sliding hole 5. The rubber layer 8 then comes into contact with the top surface of the pressure shield 3, further compressing and buffering the pressure. Simultaneously, the resistance protrusion 9 increases resistance, and the inner wall of the sliding hole 5 matches the outer surface of the resistance protrusion 9. The shock-absorbing sleeve 10 dampens the vibrations during sliding, thus improving stability and reducing the impact force when pressure is applied. The inclined rod 4 supports the interior of the pressure shield 3, increasing its overall strength, making the pressure shield 3 less prone to deformation and able to withstand strong pressure, thus enhancing its protective function. The device is designed to ensure stability during use. Through the coordinated arrangement of the return spring 11, telescopic rod 12, positioning groove 13, anti-slip frame 14, positioning plate 15, perforation 16, bolt 17, elastic strip 18, anti-slip particles 19, pressure-resistant layer 20, and reinforcing rib 21, the resistance protrusions 9 are evenly distributed, improving descent stability. Under pressure, the return spring 11 contracts and rebounds randomly after pressure is removed. The telescopic rod 12 can extend and retract to reset, facilitating the reset of the force plate 7. During installation, the anti-slip frame 14 and positioning groove 13 are aligned vertically, and the positioning plate 15 is inserted into the positioning groove 13 for positioning. The bolt 17 provides a fixing function, resulting in strong stability. The elastic strip 18 and anti-slip particles 19 increase the cushioning and anti-slip properties of the top. When pressure is applied, the elastic strip 18 is compressed. The elastic strips 18 are neatly arranged with appropriate gaps between each. The pressure-resistant layer 20 and reinforcing rib 21 increase the support strength of the diagonal rod 4, making the overall structure more robust.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A pressure-resistant microcontroller chip, comprising a chip substrate (1), characterized in that: A microcontroller chip (2) is fixedly connected to the top of the chip substrate (1). A pressure shield (3) is movably installed on the top of the chip substrate (1). A slanted rod (4) is fixedly connected to the inner wall of the pressure shield (3). A sliding hole (5) is opened on the top of the pressure shield (3). A buffer rod (6) is slidably connected to the inner wall of the sliding hole (5). A force plate (7) is fixedly connected to the top of the buffer rod (6). A rubber layer (8) is fixedly connected to the bottom of the force plate (7). A resistance protrusion (9) is fixedly connected to the outer surface of the buffer rod (6). A shock-absorbing sleeve (10) is fixedly connected to the outer surface of the resistance protrusion (9).

2. The pressure-resistant microcontroller chip according to claim 1, characterized in that: The number of the resistance protrusions (9) is several, and the several resistance protrusions (9) are arranged in a ring array.

3. The pressure-resistant microcontroller chip according to claim 1, characterized in that: A reset spring (11) is fixedly connected to the bottom of the buffer rod (6), and the bottom of the reset spring (11) is fixedly connected to the sliding hole (5).

4. The pressure-resistant microcontroller chip according to claim 3, characterized in that: The return spring (11) is internally fixedly connected to a telescopic rod (12), and there are several return springs (11).

5. A pressure-resistant microcontroller chip according to claim 1, characterized in that: The top of the chip substrate (1) is provided with a positioning groove (13), and the bottom of the anti-pressure cover (3) is fixedly connected with an anti-slip frame (14).

6. A pressure-resistant microcontroller chip according to claim 5, characterized in that: The bottom of the anti-slip frame (14) is fixedly connected to a positioning plate (15), and the outer surface of the positioning plate (15) is provided with a perforation (16).

7. A pressure-resistant microcontroller chip according to claim 6, characterized in that: The chip substrate (1) is internally threaded with a bolt (17), which passes through the interior of the through hole (16).

8. A pressure-resistant microcontroller chip according to claim 1, characterized in that: An elastic strip (18) is fixedly connected to the top of the force plate (7), and anti-slip particles (19) are provided on the top of the force plate (7).

9. A pressure-resistant microcontroller chip according to claim 8, characterized in that: The number of elastic strips (18) is several, and the distance between each pair of elastic strips (18) is the same.

10. A pressure-resistant microcontroller chip according to claim 1, characterized in that: The outer surface of the diagonal bar (4) is fixedly connected with a compression-resistant layer (20), and the inside of the diagonal bar (4) is fixedly connected with a reinforcing rib (21).

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