A memory stick sheath and a memory stick device

Abstract

The utility model discloses a memory stick sheath and memory stick device, including memory stick sheath and PCB board, the memory stick sheath sleeve connection is on the outer upper end of PCB board, the front and rear outer wall top corner of PCB board all is equipped with the positioning mouth, the both sides inner wall top corner of memory stick sheath all is equipped with the storage groove, the inside mounting of storage groove has the positioning assembly, the position of positioning assembly and positioning mouth one to one corresponds, and positioning assembly is inserted in the positioning mouth, the top left and right sides of the front and rear outer wall of PCB board all are equipped with the cooperation sliding slot, through the cooperation of positioning assembly in storage groove and PCB board positioning mouth, realizes the accurate positioning of sheath and PCB board. Miniature spring provides sustained elastic pressure, makes miniature ball steady and is connected in the positioning mouth, avoids the loosening deviation caused by vibration, and can realize smooth dismounting through the telescopic expansion of telescopic rod and the rolling of miniature ball.

Description

Technical Field

[0001] This utility model relates to the field of memory module technology, specifically to a memory module sheath and a memory module device. Background Technology

[0002] As a core storage component in electronic devices such as computers and servers, the stability of memory modules directly affects the operating efficiency of the devices. To protect the memory module PCB board from external factors such as dust and impacts, and to optimize heat dissipation and ease of installation, existing technologies typically use a protective sleeve for the memory module on the outside of the PCB board.

[0003] However, current memory module sleeves and related devices still have many shortcomings: First, the positioning structure between the sleeve and the PCB board mostly adopts a simple snap-fit ​​or interference fit design, which has low positioning accuracy. After installation, it is easy to loosen or shift due to factors such as equipment vibration, resulting in relative displacement between the PCB board and the sleeve, affecting the stability of signal transmission; Second, the sliding mating surface between the sleeve and the PCB board lacks an effective guiding and drag-reducing structure, resulting in greater resistance during insertion and removal, which can easily cause wear on the contact surface and reduce the product's service life. Therefore, new technical solutions need to be designed to address these issues. Utility Model Content

[0004] The purpose of this invention is to provide a memory module sleeve and a memory module device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a memory module sleeve and a memory module device, comprising a memory module sleeve and a PCB board. The memory module sleeve is fitted onto the upper part of the PCB board. Positioning openings are provided at the top corners of the front and rear outer walls of the PCB board. Storage grooves are provided at the top corners of the inner walls on both sides of the memory module sleeve. Positioning components are installed inside the storage grooves. The positions of the positioning components correspond one-to-one with the positioning openings, and the positioning components are inserted into the positioning openings. Matching sliding grooves are provided on the left and right sides of the top of the front and rear outer walls of the PCB board. Matching sliders are installed on the left and right ends of the inner walls on both sides of the front and rear sides of the memory module sleeve. The matching sliders are slidably installed in the matching sliding grooves.

[0006] As a preferred embodiment of the present invention, the positioning component includes a miniature telescopic rod installed in a storage slot, a miniature ball seat installed at the end of the miniature telescopic rod, a miniature ball installed inside the miniature ball seat, and the miniature ball being engaged in the positioning port.

[0007] As a preferred embodiment of the memory module sleeve and memory module device of this utility model, a micro spring is fitted on the outside of the micro telescopic rod between the micro ball seat and the storage slot.

[0008] As a preferred embodiment of the memory module sleeve and memory module device of this utility model, the inner wall of the micro ball seat is provided with rotating cavities evenly spaced along its axis, and ball bearings are installed inside the rotating cavities, with the ball bearings fitting snugly against the micro ball.

[0009] As a preferred embodiment of the memory module sleeve and memory module device of this utility model, LED lights are installed on the upper middle section of the front and rear outer walls of the PCB board, and a light guide strip is provided at the top of the memory module sleeve.

[0010] As a preferred embodiment of the memory module sleeve and memory module device of this utility model, the bottom end of the PCB board is provided with pins, and the bottom end of the pins is provided with a U-shaped anti-fooling notch.

[0011] As a preferred embodiment of the memory module sleeve and memory module device of this utility model, the front and rear side walls of the memory module sleeve are provided with label slots, and the inner wall of the memory module sleeve is provided with heat dissipation pads.

[0012] Compared with the prior art, the beneficial effects of this utility model are: the design of the memory module sleeve and memory module device is reasonable; Precise positioning and secure installation: The positioning components (miniature telescopic rod, miniature ball seat, miniature ball, and miniature spring) within the storage slot cooperate with the positioning opening on the PCB board to achieve precise positioning of the sheath and the PCB board. The miniature spring provides continuous elastic pressure, ensuring the miniature ball is stably engaged within the positioning opening. This prevents loosening or displacement caused by vibration, and the telescopic rod's extension and retraction, along with the miniature ball's rolling motion, allows for smooth assembly and disassembly. This solves the problems of inaccurate positioning and laborious assembly / disassembly associated with traditional snap-fit ​​structures, ensuring stable signal transmission.

[0013] Smooth insertion and removal with minimal wear: The guide design of the slider and the sliding groove reduces the sliding friction resistance between the sheath and the PCB board, ensuring precise and controllable insertion and removal. The rotating cavity and ball bearings on the inner wall of the miniature ball seat further reduce the rotational resistance of the miniature ball, making the engagement and disengagement of the positioning components smoother, effectively reducing wear on the contact surface and extending the product's service life. Attached Figure Description

[0014] Figure 1 This is a front-view three-dimensional structural schematic diagram of the present invention; Figure 2 This is a schematic diagram of the memory module sleeve and PCB board of this utility model; Figure 3 This is a side view of the memory module sleeve of this utility model; Figure 4 This is a schematic diagram of the positioning component of this utility model.

[0015] In the diagram: 1. PCB board; 2. Memory module sleeve; 3. Pins; 4. Light guide strip; 5. U-shaped keying notch; 6. Label slot; 7. LED light; 8. Matching slide; 9. Positioning port; 10. Storage slot; 11. Positioning component; 12. Matching slider; 13. Heat sink; 14. Miniature telescopic rod; 15. Miniature spring; 16. Miniature ball seat; 17. Miniature ball; 18. Rotating cavity; 19. Ball bearing. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-4 This utility model provides a technical solution: In this technical solution, a memory module sleeve and a memory module device are provided, including a memory module sleeve 2 and a PCB board 1. The memory module sleeve 2 is sleeved on the upper part of the outside of the PCB board 1. Positioning holes 9 are provided at the top corners of the front and rear outer walls of the PCB board 1, and storage grooves 10 are provided at the top corners of the inner walls on both sides of the memory module sleeve 2. Positioning components 11 are installed inside the storage grooves 10. The positions of the positioning components 11 correspond one-to-one with the positioning holes 9, and the positioning components 11 are inserted into the positioning holes 9. The top left and right sides of the front and rear outer walls of the PCB board 1 are provided with matching sliding grooves 8, and the left and right ends of the inner walls on the front and rear sides of the memory module sleeve 2 are provided with matching sliders 12, which are slidably installed in the matching sliding grooves 8.

[0018] In the specific implementation process, the memory module sleeve 2 is preferably made of flame-retardant ABS or PC material through one-piece injection molding, with a wall thickness of 0.8-1.2mm, balancing structural strength and lightweight requirements. The fit gap between its inner wall and the outer wall of the PCB board 1 is controlled at 0.1-0.3mm, ensuring both fitting stability and allowing for heat dissipation. The positioning port 9 is designed as a hemispherical groove, with the groove diameter matching the diameter of the micro-ball 17 of the positioning component 11 to ensure a good fit. The positioning port 9 is located at the top corner of the PCB board 1, avoiding electronic components on the board and preventing structural interference. The matching groove 8 adopts a T-shaped or dovetail-shaped cross-section design, with a length consistent with the distance from the top of the PCB board 1 to the positioning port 9. The matching slider 12 is made of wear-resistant POM material, and the slider surface is polished. Through the guide and limiting of the groove and the slider, the memory module sleeve 2 can only be inserted and removed in the vertical direction of the PCB board 1, preventing structural wear or poor contact caused by lateral displacement.

[0019] In some technical solutions, the positioning component 11 includes a miniature telescopic rod 14 installed in the storage slot 10, a miniature ball seat 16 installed at the end of the miniature telescopic rod 14, a miniature ball 17 installed inside the miniature ball seat 16, and the miniature ball 17 is snapped into the positioning port 9.

[0020] In practical implementation, the miniature telescopic rod 14 is a multi-section nested metal telescopic rod with a telescopic stroke designed to be 0.5-1mm. One end is fixed to the mounting hole at the bottom of the storage slot 10 via an interference fit, while the other end is connected to the miniature ball seat 16 by thread or welding to ensure a firm connection. The miniature ball seat 16 has a hemispherical cavity structure with an opening diameter slightly smaller than that of the miniature ball 17, which both restricts the miniature ball 17 from leaving the cavity and provides sufficient rotation space. The miniature ball 17 is made of stainless steel or ceramic with a hardness ≥ HRC55 and a surface finish of G10, reducing frictional resistance during engagement and disengagement. The positioning components 11 correspond one-to-one with the positioning ports 9 (4 sets in total, located at the four corners of the PCB board 1), achieving a coaxiality deviation of ≤0.2mm between the memory module sleeve 2 and the PCB board 1 through four-point positioning, ensuring installation accuracy.

[0021] In some technical solutions, a miniature spring 15 is fitted on the outside of the miniature telescopic rod 14 between the miniature ball seat 16 and the storage groove 10.

[0022] In the specific implementation process, the miniature spring 15 is made of stainless steel piano wire with a wire diameter of 0.1-0.2mm, a free length of 3-5mm, and a compression stiffness of 0.5-1N / mm. When it is fitted outside the miniature telescopic rod 14, it is in a pre-compressed state and continuously applies axial elastic force to the miniature ball seat 16. In the natural state, the elastic force of the miniature spring pushes the miniature ball 17 out of the storage groove 10 and into the positioning port 9, thereby locking the sheath to the PCB board. When inserting or removing the sheath, the miniature ball 17 is squeezed by the edge of the positioning port 9, which pushes the miniature ball seat 16 to compress the spring and the telescopic rod to retract, and the miniature ball retracts into the storage groove 10, thus unlocking the device. This ensures the reliability of the locking and reduces the difficulty of disassembly and assembly.

[0023] In some technical solutions, the inner wall of the miniature ball seat 16 is provided with rotating cavities 18 evenly spaced along its axis, and the rotating cavities 18 are equipped with balls 19, which are fitted together with the miniature balls 17.

[0024] In the specific implementation process, the rotating cavity 18 is a cylindrical groove, with 4 grooves evenly distributed along the inner wall axis of the micro-ball seat 16. The groove depth is 1 / 2 to 2 / 3 of the diameter of the ball 19, and the groove opening is chamfered to prevent scratching the micro-ball 17. The ball 19 is a high-precision ball made of the same material as the micro-ball 17, and its surface is in close contact with the outer wall of the micro-ball 17, converting the sliding friction between the micro-ball 17 and the inner wall of the ball seat into the rolling friction of the ball 19. The coefficient of friction is reduced to below 0.05, making the locking and unlocking action of the positioning component smoother, while reducing component wear.

[0025] In some technical solutions, LED lights 7 are installed on the upper middle section of the front and rear outer walls of the PCB board 1, and a light guide strip 4 is set at the top of the memory module sleeve 2.

[0026] In the specific implementation process, LED 7 adopts surface-mount SMD LED, which is soldered to the reserved pads on the front and back sides of PCB board 1 and connected in series with the memory module power supply circuit, requiring no additional power supply; the light color of the LED can be set according to the function, and the power consumption is ≤0.1W to avoid increasing the memory power consumption. The light guide strip 4 is made of high light transmittance PMMA material and is fixed to the top of the memory module sleeve 2 through an embedded slot. Its length is consistent with the sleeve, and the vertical distance between its bottom and LED 7 is controlled at 1-2mm to ensure efficient light transmission; the surface of the light guide strip is treated with a matte finish to make the light diffuse evenly, and the working status of the memory module can be directly observed from the outside of the device without disassembling the machine or relying on the host system for detection.

[0027] In some technical solutions, the bottom of the PCB board 1 is provided with pins 3, and the bottom of pins 3 is provided with a U-shaped anti-fooling notch 5.

[0028] In practical implementation, pin 3 conforms to mainstream memory interface standards such as DDR4 / DDR5, and its number is adapted according to the memory specification (e.g., DDR5 uses 288 pins). The pin material is gold-plated copper core, which improves conductivity and oxidation resistance. Its opening direction matches the anti-fooling protrusion of the memory slot, and the opening width is 0.2-0.3mm larger than the protrusion width to ensure assembly guidance. Anti-fooling mechanism: When the insertion direction is incorrect, the U-shaped anti-fooling notch 4 mechanically interferes with the slot protrusion, preventing further insertion. This directly avoids bending, breakage, or short circuits caused by incorrect insertion of pin 3. It is suitable for professional assembly and non-professional users' self-replacement scenarios, improving installation safety.

[0029] In some technical solutions, label slots 6 are provided on both the front and rear side walls of the memory module sleeve 2, and heat dissipation pads 13 are provided on the inner wall of the memory module sleeve 2.

[0030] In the specific implementation process, the label slot 6 is a rectangular groove, opened in the middle of the front and rear side walls of the memory module sleeve 2. The groove is 1-2mm deep, 30-50mm long, and 15-20mm wide, with rounded corners to accommodate standard product labels. After the label is embedded in the groove, its surface is flush with the outer wall of the sleeve to prevent the label from falling off or wrinkling due to collision or friction. It also facilitates batch labeling and subsequent replacement. The label can indicate information such as product model, serial number, and production date, which helps with production traceability and maintenance management. The heat dissipation pad 13 is a silicone thermal conductive pad with a thickness of 0.5-1mm. It is attached to the inner wall of the memory module sleeve 2 with adhesive backing and corresponds to the heat-generating components such as memory chips and capacitors on the PCB board 1. The heat dissipation pad has good compression and rebound performance, which can tightly adhere to the heat-generating surface and quickly conduct heat to the sleeve. Then, the heat is carried away by natural heat dissipation on the surface of the sleeve or by airflow inside the equipment, which reduces the operating temperature of the memory by 3-5℃ and avoids performance throttling or failure caused by high temperature.

[0031] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0032] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A memory module sleeve and a memory module assembly, comprising a memory module sleeve (2) and a PCB board (1), characterized in that, The memory module sleeve (2) is fitted onto the upper part of the PCB board (1). The top corners of the front and rear outer walls of the PCB board (1) are provided with positioning holes (9). The top corners of the inner walls on both sides of the memory module sleeve (2) are provided with storage slots (10). The storage slots (10) are equipped with positioning components (11). The positioning components (11) correspond one-to-one with the positioning holes (9). The positioning components (11) are inserted into the positioning holes (9). The top left and right sides of the front and rear outer walls of the PCB board (1) are provided with matching sliding grooves (8). The left and right ends of the inner walls on both sides of the front and rear sides of the memory module sleeve (2) are provided with matching sliders (12). The matching sliders (12) are slidably installed in the matching sliding grooves (8).

2. The memory module sleeve and memory module device according to claim 1, characterized in that, The positioning component (11) includes a miniature telescopic rod (14) installed in the storage slot (10), a miniature ball seat (16) is installed at the end of the miniature telescopic rod (14), a miniature ball (17) is installed inside the miniature ball seat (16), and the miniature ball (17) is snapped into the positioning port (9).

3. A memory module sleeve and memory module device according to claim 2, characterized in that, A miniature spring (15) is fitted on the outside of the miniature telescopic rod (14) between the miniature ball seat (16) and the storage groove (10).

4. A memory module sleeve and memory module device according to claim 3, characterized in that, The inner wall of the micro ball seat (16) is provided with rotating cavities (18) evenly spaced along its axis. The rotating cavities (18) are equipped with ball bearings (19), which are fitted together with the micro ball (17).

5. A memory module sleeve and memory module device according to claim 1, characterized in that, LED lights (7) are installed on the upper middle section of the front and rear outer walls of the PCB board (1), and a light guide strip (4) is provided on the top of the memory module sleeve (2).

6. A memory module sleeve and memory module device according to claim 1, characterized in that, The bottom end of the PCB board (1) is provided with pins (3), and the bottom end of the pins (3) is provided with a U-shaped anti-fooling opening (5).

7. A memory module sleeve and memory module device according to claim 1, characterized in that, The front and rear side walls of the memory module sleeve (2) are provided with label slots (6), and the inner wall of the memory module sleeve (2) is provided with heat dissipation stickers (13).

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