Integrated GPU liquid cooling heat dissipation device

Abstract

The utility model discloses an integral type GPU liquid cooling heat dissipation device relates to GPU heat dissipation device technical field, including heat dissipation cold plate, one side of heat dissipation cold plate is plane structure, and the other side of heat dissipation cold plate is provided with three -dimensional microchannel structure, and one side of heat dissipation cold plate is provided with two connecting pipes, and the inside of three -dimensional microchannel structure is provided with baffle, the utility model discloses a heat dissipation cold plate, three -dimensional microchannel structure, baffle, liquid channel, water pump, pipeline and heat exchanger are set up, make its composition one independent circulation's path, empty the gas of circulating channel under the class vacuum environment, inject liquid cooling medium simultaneously, and liquid cooling fast conduction key component's heat, and the heat dissipation of air cooling is carried out to other gas elements in computer, and the overall heat dissipation effect is improved significantly.

Description

Technical Field

[0001] This utility model relates to the technical field of GPU heat dissipation devices, specifically an integrated GPU liquid cooling device. Background Technology

[0002] Computer components, such as the CPU, GPU, and graphics card, generate a significant amount of heat during operation. This is especially true for high-performance AI GPUs used in data centers, which consume a lot of power and run hot. To prevent these internal electrical components from operating in a high-heat environment for extended periods, heatsinks are installed inside the computer case. These heatsinks, by contacting these components, quickly dissipate the heat generated, ensuring the computer's temperature remains within a normal range.

[0003] Traditional cooling methods involve installing a cooling fan at the rear of the computer and using air cooling. However, the low thermal conductivity of air results in poor overall cooling performance for the computer. Utility Model Content

[0004] The technical problem this invention aims to solve is to overcome existing defects and provide an integrated GPU liquid cooling device. Through the arrangement of a heat dissipation plate, a three-dimensional microchannel structure, baffles, liquid channels, a water pump, pipes, and a heat exchanger, it forms an independent circulation path. In a near-vacuum environment, the gas in the circulation channel is vented while liquid cooling medium is injected. Liquid cooling rapidly conducts heat from key components, while air cooling dissipates heat from other gaseous components within the computer, significantly improving the overall heat dissipation effect and effectively solving the problems in the background technology.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an integrated GPU liquid cooling device, including a heat dissipation plate, one side of which is a planar structure, and the other side of which is provided with a three-dimensional microchannel structure. Two connecting pipes are provided on one side of the heat dissipation plate, a baffle is provided inside the three-dimensional microchannel structure, and a liquid channel is provided inside the heat dissipation plate. The interior of the three-dimensional microchannel structure is connected to the liquid channel.

[0006] Furthermore, a pipe is connected to the connecting pipe, and a water pump is connected to the pipe.

[0007] Furthermore, a heat exchanger is connected to the end of the pipe away from the heat dissipation plate, and a cooling fan is installed on the heat exchanger.

[0008] Furthermore, the location of the three-dimensional microchannel structure on the heat dissipation plate coincides with the high-heat location on the GPU module.

[0009] Furthermore, the pipe is connected to the heat dissipation plate via the connecting pipe, the pipe is inserted into the connecting pipe, and the pipe is inserted into the water pump.

[0010] Furthermore, the pipe is inserted into the heat exchanger, and the baffle is fixedly connected to the inner side of the liquid channel.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. This utility model, through the setting of a heat dissipation plate, a three-dimensional microchannel structure, a baffle, a liquid channel, a water pump, pipes and a heat exchanger, forms an independent circulation path. In a near-vacuum environment, the gas in the circulation channel is emptied, while liquid cooling medium is injected. Liquid cooling quickly conducts heat from key components, and air cooling dissipates heat from other gas components in the computer, significantly improving the overall heat dissipation effect. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0014] Figure 2 This is a bottom view of the structure of this utility model;

[0015] Figure 3 This is a three-dimensional structural diagram of the present invention;

[0016] Figure 4 This is a three-dimensional structural diagram of the heat dissipation plate in this utility model;

[0017] Figure 5 This is a top view of the heat dissipation plate in this utility model.

[0018] Figure 6 This is a partial main cross-sectional view of the connection position between the three-dimensional microchannel structure and the heat dissipation plate in this utility model.

[0019] In the diagram: 1. Water pump; 2. Cooling plate; 3. Heat exchanger; 4. Pipeline; 5. Three-dimensional microchannel structure; 6. Connecting pipe; 7. Baffle; 8. Liquid channel. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-6This embodiment provides a technical solution: an integrated GPU liquid cooling device, including a heat dissipation plate 2. One side of the heat dissipation plate 2 is a planar structure, and the other side of the heat dissipation plate 2 is provided with a three-dimensional microchannel structure 5. Two connecting pipes 6 are provided on one side of the heat dissipation plate 2. A baffle 7 is provided inside the three-dimensional microchannel structure 5. A liquid channel 8 is provided inside the heat dissipation plate 2. The interior of the three-dimensional microchannel structure 5 is connected to the liquid channel 8.

[0022] like Figure 1-6 As shown, the side of the heat sink 2 with the three-dimensional microchannel structure 5 is fixedly installed facing the GPU, so that the heat sink 2 and the three-dimensional microchannel structure 5 are in full contact with the GPU. The water pump 1 can pump the liquid inside the heat exchanger 3 through the pipe 4 to the liquid channel 8 inside the heat sink 2. The heat generated by the GPU is transferred to the liquid through the heat sink 2 and pumped by the water pump 1 to the heat exchanger 3 for heat exchange treatment. After the liquid temperature is reduced, it is sent back into the heat sink 2 for heat absorption and cooling treatment. When the liquid flows in the liquid channel 8, it turns after encountering the baffle 7 and flows to the inside of the three-dimensional microchannel structure 5, so that the three-dimensional microchannel structure 5 and the GPU contact position can fully exchange heat, improve the heat exchange effect, and thus ensure the cooling effect of the GPU.

[0023] Pipe 4 is connected to connecting pipe 6, and water pump 1 is connected to pipe 4.

[0024] The end of the pipe 4 away from the heat dissipation plate 2 is connected to a heat exchanger 3. A cooling fan is installed on the heat exchanger 3, which can accelerate the heat exchange between the heat exchanger 3 and the outside air.

[0025] The three-dimensional microchannel structure 5 on the heat dissipation plate 2 is positioned to coincide with the high heat-generating location on the GPU module.

[0026] Pipe 4 is connected to heat dissipation plate 2 via connecting pipe 6. Pipe 4 is inserted into connecting pipe 6 and pipe 4 is inserted into water pump 1.

[0027] Pipe 4 is inserted into heat exchanger 3, and baffle 7 is fixedly connected to the inner side of liquid channel 8.

[0028] The working principle of the integrated GPU liquid cooling device provided by this utility model is as follows: Figures 1-6As shown, the side of the heat sink 2 with the three-dimensional microchannel structure 5 is fixedly installed facing the GPU, so that the heat sink 2 and the three-dimensional microchannel structure 5 are in full contact with the GPU. The water pump 1 can pump the liquid inside the heat exchanger 3 through the pipe 4 to the liquid channel 8 inside the heat sink 2. The heat generated by the GPU is transferred to the liquid through the heat sink 2 and pumped by the water pump 1 to the heat exchanger 3 for heat exchange treatment. After the liquid temperature is reduced, it is sent back into the heat sink 2 for heat absorption and cooling treatment. When the liquid flows in the liquid channel 8, it turns after encountering the baffle 7 and flows to the inside of the three-dimensional microchannel structure 5, so that the three-dimensional microchannel structure 5 and the GPU contact position can fully exchange heat, improve the heat exchange effect, and thus ensure the cooling effect of the GPU.

[0029] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. An integrated GPU liquid cooling device, comprising a heat dissipation plate (2), characterized in that: One side of the heat dissipation plate (2) is a planar structure, and the other side of the heat dissipation plate (2) is provided with a three-dimensional microchannel structure (5). Two connecting pipes (6) are provided on one side of the heat dissipation plate (2). A baffle (7) is provided inside the three-dimensional microchannel structure (5). A liquid channel (8) is provided inside the heat dissipation plate (2). The interior of the three-dimensional microchannel structure (5) is connected to the liquid channel (8). When the liquid flows in the liquid channel (8), it turns and flows into the interior of the three-dimensional microchannel structure (5) after encountering the baffle (7). This allows the three-dimensional microchannel structure (5) to have sufficient heat exchange with the GPU, improves the heat exchange effect, and ensures the cooling effect of the GPU.

2. The integrated GPU liquid cooling device according to claim 1, characterized in that: The connecting pipe (6) is connected to a pipe (4), and the pipe (4) is connected to a water pump (1).

3. The integrated GPU liquid cooling device according to claim 2, characterized in that: The end of the pipe (4) away from the heat dissipation plate (2) is connected to a heat exchanger (3), and a cooling fan is installed on the heat exchanger (3).

4. The integrated GPU liquid cooling device according to claim 1, characterized in that: The three-dimensional microchannel structure (5) on the heat dissipation plate (2) is positioned to coincide with the high heat generation location on the GPU module.

5. The integrated GPU liquid cooling device according to claim 2, characterized in that: The pipe (4) is connected to the heat dissipation plate (2) through the connecting pipe (6), the pipe (4) is inserted into the connecting pipe (6), and the pipe (4) is inserted into the water pump (1).

6. The integrated GPU liquid cooling device according to claim 3, characterized in that: The pipe (4) is inserted into the heat exchanger (3), and the baffle (7) is fixedly connected to the inner side of the liquid channel (8).

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