A CPU heat sink structure that is easy to quickly assemble
Patent Information
- Application Number
- CN202522097344.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-29
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2035-09-29
AI Technical Summary
[0003]然而,传统的CPU散热片在设计和安装方面存在诸多不足之处
[0020](1)本装置通过弹板、支撑座上的压钮、弹力杆及环绕的弹簧之间的巧妙联动,实现了徒手快速安装,安装人员仅需按压压钮,弹板便会产生形变,带动弹力杆调整散热片位置,轻松适应不同 CPU 的安装需求,同时,安装架底部的连接板与卡杆能快速精准地与主板卡槽配合,完成固定,此外,滑轨与机箱滑槽的配合,进一步简化了安装流程,使散热片能顺畅滑入安装位置,这种安装方式不仅节省了安装时间,还降低了安装难度,即使非专业人员也能轻松完成,大大提高了安装效率。
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Figure CN224907328U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of computer technology, and more specifically, to a CPU heatsink structure that is easy to assemble quickly. Background Technology
[0002] In a computer system, the CPU (Central Processing Unit) is the core component, undertaking a large number of data processing and computation tasks. During operation, the CPU generates a significant amount of heat. If this heat cannot be dissipated in time, the CPU temperature will rise sharply. Excessive heat not only degrades CPU performance, causing slower processing speeds and system lag, but prolonged exposure to high temperatures can also cause permanent damage to the CPU, severely impacting the computer's lifespan and stability. To address this issue, CPU heatsinks were developed. A CPU heatsink is a device specifically designed to dissipate heat from the CPU. It increases the heat dissipation area and utilizes principles of heat conduction and convection to quickly transfer the heat generated by the CPU to the surrounding air, ensuring the CPU can operate stably within a suitable temperature range. With the continuous development of computer technology, CPU performance has improved, and its power consumption and heat generation have also increased accordingly. This makes efficient CPU heatsinks increasingly important for maintaining the normal operation of the computer system.
[0003] However, traditional CPU heatsinks have many shortcomings in design and installation. During installation, traditional heatsinks often require various complex tools, such as screwdrivers and wrenches, making the process cumbersome and time-consuming. This not only demands high technical skills from installers but also presents difficulties in the confined space of a computer case, easily leading to improper installation, affecting the contact between the heatsink and the CPU, and thus reducing heat dissipation efficiency. In terms of heat dissipation performance, traditional heatsinks have relatively simple heat dissipation structures, and the limitations of heat dissipation materials and design make their heat dissipation efficiency insufficient to meet the cooling requirements of modern high-performance CPUs. After prolonged use, some traditional heatsinks are prone to loosening due to thermal expansion and contraction and vibrations generated during computer operation, resulting in decreased contact between the heatsink and the CPU, reduced heat transfer efficiency, and ultimately, increased CPU temperature, affecting overall computer performance and causing problems such as slow program operation and system crashes. Furthermore, traditional heatsinks are also incompatible with different CPU models, often requiring customized installation for specific CPU models, lacking universality, increasing user costs and selection difficulty. Therefore, this application proposes a CPU heatsink structure that is easy to assemble quickly to solve the above-mentioned problems. Utility Model Content
[0004] To address the aforementioned issues, this application provides a CPU heatsink structure that is easy to assemble quickly.
[0005] The CPU heatsink structure provided in this application, which is easy to assemble quickly, adopts the following technical solution:
[0006] A CPU heatsink structure that is easy to assemble quickly includes:
[0007] The mounting frame has two sets of spring plates on the top two sides and two sets of spring rods on the bottom two sides of the spring plates. The mounting frame has a cooling fan inside and a cooling fin at the bottom of the cooling fan.
[0008] The heat dissipation fins are internally connected to two sets of heat-conducting copper pipes, and a heat spreader is installed at one end of each heat-conducting copper pipe.
[0009] Furthermore, the bottom of the spring plate is provided with a support base, and the top of the support base is provided with a button extending to the top of the spring plate.
[0010] Through the above technical solution, the support base at the bottom of the spring plate and the button extending to the top of the spring plate constitute a convenient and efficient operating structure. When the CPU heatsink needs to be installed, the operator presses the button, which transmits force to the support base. Due to the pressure, the support base causes the spring plate to undergo elastic deformation. The deformation of the spring plate drives the connected spring rod, which further transmits this change to the entire mounting bracket. In this process, the elastic deformation of the spring plate allows the heatsink to adapt to different installation spaces and CPU fixing requirements. For example, in some cases where the internal space of a computer case is compact and the CPU installation position is special, pressing the button to adjust the spring plate can make the heatsink securely installed on the CPU. This design not only facilitates the installation operation and avoids the tedious process of using complex tools, but also ensures that the heatsink and the CPU maintain good contact during installation, laying the foundation for subsequent heat dissipation work and effectively improving the flexibility and adaptability of heatsink installation.
[0011] Furthermore, one end of the elastic rod extends to the bottom of the mounting bracket, and a spring is provided around the outside of the elastic rod.
[0012] Through the above technical solution, the design of the spring rod extending to the bottom of the mounting bracket and surrounding the spring on the outside forms a close linkage with the spring plate and the entire mounting bracket. When the spring plate is deformed by external force, it drives the spring rod to move, and the spring will be compressed or extended accordingly. During the installation process, the elasticity of the spring plays a buffering role, avoiding damage to the CPU or computer motherboard due to excessive installation force. When the heat sink is installed on the CPU, the spring rod descends as the spring plate is pressed down, and the spring is compressed, providing a reverse buffering force to ensure that the heat sink fits the CPU smoothly. At the same time, the presence of the spring allows the heat sink to automatically adapt to the vibration generated by computer operation and the dimensional changes caused by thermal expansion and contraction during long-term use.
[0013] Furthermore, the mounting bracket has two sets of connecting plates on both sides of its bottom, and one end of each connecting plate has a locking rod.
[0014] Through the above technical solution, the connecting plates on both sides of the bottom of the mounting bracket and the locking rod at one end form an effective installation and positioning linkage with the entire heatsink structure. When installing the heatsink, the position of the heatsink is initially adjusted by the synergistic action of the spring plate, spring rod, and spring. Then, the locking rod on the connecting plate is used for precise positioning and fixation. The locking rod can cooperate with the corresponding slot or fixing structure on the computer motherboard to firmly fix the heatsink to the motherboard. This design not only improves the accuracy of installation but also enhances the stability of the heatsink after installation. During computer operation, various vibrations may occur. The locking rod and the motherboard slot can tightly cooperate to resist these vibrations and prevent the heatsink from shifting. Moreover, the two sets of connecting plates and locking rods on both sides ensure that the heatsink is evenly stressed during installation, avoiding poor contact between the heatsink and the CPU due to uneven local stress, further ensuring the heat dissipation effect. At the same time, this structural design also makes the heatsink relatively easy to remove. Simply detach the locking rod from the slot to easily remove the heatsink, facilitating the maintenance and replacement of the CPU or heatsink.
[0015] Furthermore, the bottom of the mounting bracket is provided with a slide rail away from the inner side of the connecting plate, and one end of the slide rail is provided with an opening.
[0016] Through the above technical solution, the slide rail located at the bottom of the mounting bracket away from the inner side of the connecting plate forms a unique linkage with other components, bringing many conveniences to the installation and maintenance of the heat sink. When installing the heat sink, the slide rail can cooperate with the corresponding sliding groove structure inside the computer case, allowing operators to accurately and smoothly slide the heat sink into the installation position along the slide rail. This process works in conjunction with components such as the spring plate and spring rod to further improve installation efficiency. When it is necessary to install the heat sink in a specific position inside the case, the angle and position of the heat sink can be adjusted first using the spring plate, and then it can be slid in along the slide rail, which can quickly complete the installation and reduce the difficulty of operation in the confined space of the case. The slide rail also plays an important role when maintaining or replacing the heat sink. It facilitates the removal of the heat sink. Simply slide it in the opposite direction along the slide rail to easily remove the heat sink from the case without complicated disassembly steps. In addition, the slide rail can also guide the airflow inside the case to a certain extent, working in conjunction with the cooling fan and cooling fins to optimize the airflow path and improve the overall cooling efficiency. For example, air can be guided along the slide rail to pass more effectively through the cooling fins, carrying away heat and enhancing the cooling effect.
[0017] Furthermore, the mounting bracket has a limiting plate inside, and the inner side of the limiting plate is connected to the outer side of the cooling fan.
[0018] Through the above technical solution, the mounting bracket has a limiting plate inside, and its inner side is connected to the outer side of the cooling fan. This structure plays a crucial linkage role in the operation of the heatsink. The limiting plate provides precise positioning and stabilization for the cooling fan, ensuring that the cooling fan remains stable during operation and will not shift due to vibration or other external forces. When the cooling fan is working, it generates a certain amount of vibration and airflow impact force. The limiting plate can effectively resist these forces, ensuring the continuous and stable operation of the cooling fan, thereby ensuring the stability of the heat dissipation effect. When the computer is running, the vibration generated by the high-speed rotation of the cooling fan is transmitted to the mounting bracket through the limiting plate, and then some of the vibration energy is absorbed by the spring on the outer side of the elastic rod, reducing the vibration amplitude of the entire heatsink structure and reducing noise generation. In addition, the limiting plate can also help guide the cooling airflow, making the air blown out by the cooling fan flow more concentratedly to the heat dissipation fins, enhancing the heat dissipation efficiency of the heat dissipation fins, improving the heat dissipation effect on the CPU, ensuring that the CPU works within a stable temperature range, and improving the overall performance of the computer.
[0019] In summary, this application includes at least one of the following beneficial technical effects:
[0020] (1) This device achieves quick manual installation through the ingenious linkage between the spring plate, the button on the support base, the spring rod and the surrounding spring. The installer only needs to press the button, and the spring plate will deform, which will drive the spring rod to adjust the position of the heat sink, easily adapting to the installation requirements of different CPUs. At the same time, the connecting plate and the locking rod at the bottom of the mounting bracket can quickly and accurately cooperate with the motherboard slot to complete the fixation. In addition, the cooperation between the slide rail and the chassis slide further simplifies the installation process, allowing the heat sink to slide smoothly into the installation position. This installation method not only saves installation time, but also reduces the installation difficulty. Even non-professionals can easily complete the installation, greatly improving the installation efficiency.
[0021] This device, through the close cooperation of a heat spreader, heat-conducting copper pipes, and heat sink fins, can quickly conduct and dissipate the heat generated by the CPU. The cooling fan, stabilized by the limiting plate, operates stably, and its airflow is precisely directed towards the heat sink fins, accelerating airflow and significantly improving heat dissipation efficiency. Simultaneously, the structure composed of a spring plate, spring rod, and spring not only allows for flexible adjustment during installation but also effectively buffers vibrations during computer operation, ensuring the heat sink remains in close contact with the CPU and maintains excellent heat dissipation. This highly efficient and stable heat dissipation performance better guarantees the stable operation of the CPU and extends the lifespan of computer hardware. Attached Figure Description
[0022] Figure 1 This is a three-dimensional structural diagram of the present application;
[0023] Figure 2 This is a schematic diagram of the three-dimensional cross-sectional structure of this application;
[0024] Figure 3 This is a schematic diagram of the three-dimensional structure of the spring plate in this application;
[0025] Figure 4 This is a three-dimensional schematic diagram of the heat dissipation structure of this application.
[0026] The following are the labels in the diagram: 1. Mounting bracket; 2. Spring plate; 3. Spring rod; 4. Support base; 5. Connecting plate; 6. Locking rod; 7. Slide rail; 8. Cooling fan; 9. Cooling fins; 10. Heat-conducting copper pipe; 11. Heat spreader; 12. Limiting plate. Detailed Implementation
[0027] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0028] In the description of this application, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0030] Example:
[0031] The following is in conjunction with the appendix Figure 1 -2 provides further detailed description of this application.
[0032] This application discloses a CPU heatsink structure that is easy to assemble quickly, including:
[0033] Mounting bracket 1, with two sets of spring plates 2 on the top two sides and two sets of spring rods 3 on the bottom two sides. The mounting bracket 1 is equipped with a cooling fan 8 inside and a cooling fin 9 at the bottom of the cooling fan 8.
[0034] Two sets of heat-conducting copper pipes 10 are installed inside the heat dissipation fins 9, and a heat spreader 11 is installed at one end of the heat-conducting copper pipes 10.
[0035] See Figure 3 The bottom of the spring plate 2 is provided with a support base 4, and the top of the support base 4 is provided with a button that extends to the top of the spring plate 2.
[0036] See Figure 1 , 3 One end of the elastic rod 3 extends to the bottom of the mounting bracket 1, and a spring is provided around the outside of the elastic rod 3.
[0037] See Figure 1 The bottom sides of the mounting bracket 1 are provided with two sets of connecting plates 5, and one end of the connecting plate 5 is provided with a locking rod 6.
[0038] See Figure 1 The bottom of the mounting bracket 1 is provided with a slide rail 7 on the inner side away from the connecting plate 5.
[0039] See Figure 2 The mounting bracket 1 has a limiting plate 12 inside, and the inner side of the limiting plate 12 is connected to the outer side of the cooling fan 8.
[0040] The implementation principle of the CPU heatsink structure that is easy to assemble quickly in this application embodiment is as follows:
[0041] First, by pressing the button on the top of the support base 4 at the bottom of the spring plate 2, the spring plate 2 undergoes elastic deformation. This deformation drives the spring rods 3 on both sides of the bottom. Since one end of the spring rod 3 extends to the bottom of the mounting bracket 1 and is surrounded by a spring, the spring is compressed or extended accordingly. This linkage allows the heatsink to flexibly adjust its position and angle to adapt to different computer case interior spaces and CPU installation requirements, achieving a convenient installation and positioning effect, allowing operators to easily place the heatsink in a suitable position above the CPU.
[0042] Next, the connecting plates 5 on both sides of the bottom of the mounting bracket 1 and the locking lever 6 at one end come into play. After the heatsink is roughly positioned by the spring plate 2 and the spring rod 3, the locking lever 6 engages with the corresponding slot or fixing structure on the computer motherboard. The process of the locking lever 6 inserting into the slot, in conjunction with the previous adjustment actions of the spring plate 2 and the spring rod 3, further precisely positions and firmly fixes the heatsink, achieving the effect of improving installation accuracy and stability, ensuring that the heatsink will not shift due to vibration or other factors during computer operation, and ensuring that the heatsink and CPU are always in close contact.
[0043] Meanwhile, the slide rail 7 at the bottom of the mounting bracket 1, away from the inner side of the connecting plate 5, also participates in the installation process. When the heatsink is placed into the chassis, the slide rail 7 is linked with the corresponding sliding groove structure inside the chassis. The operator can smoothly slide the heatsink into the designated installation position along the slide rail 7. This, in conjunction with the operation of the spring plate 2, spring rod 3, connecting plate 5, and locking lever 6, greatly improves installation efficiency, achieving a fast and accurate installation effect and reducing the difficulty and time of installation in a confined chassis space.
[0044] During the heat dissipation phase, the heat generated by the CPU is first transferred to the heat spreader 11. The heat spreader 11 quickly and evenly distributes the heat, which is then conducted to the heat sink fins 9 through the connected heat pipes 10. Due to their large surface area, the heat sink fins 9 efficiently dissipate heat into the surrounding air. Simultaneously, the cooling fan 8 inside the mounting bracket 1 begins operation. The cooling fan 8 is positioned and secured by a limiting plate 12 located inside the mounting bracket 1. The limiting plate 12 ensures the stability of the cooling fan 8 during operation, and its linkage with the cooling fan 8 allows vibrations generated by the cooling fan 8 to be transmitted to the mounting bracket 1 through the limiting plate 12. These vibrations are then buffered and damped by the springs on the outside of the spring rod 3, reducing overall vibration and noise. The airflow generated by the rotating cooling fan 8 blows towards the heat sink fins 9, accelerating the airflow around the fins and thus speeding up heat dissipation. This series of interconnected components—the heat spreader 11, the heat pipe 10, the heat sink fins 9, the cooling fan 8, and the limiting plate 12—work together to achieve efficient heat dissipation, ensuring that the CPU operates stably within its normal operating temperature range, thereby guaranteeing the stable performance of the computer's overall performance.
[0045] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A CPU heatsink structure that is easy to assemble quickly, characterized in that, include: Mounting bracket (1), the mounting bracket (1) has two sets of spring plates (2) on the top two sides, the spring plates (2) have two sets of spring rods (3) on the bottom two sides, the mounting bracket (1) has a cooling fan (8) inside, and the cooling fan (8) has cooling fins (9) at the bottom. Two sets of heat-conducting copper pipes (10) are installed inside the heat dissipation fins (9), and a heat spreader (11) is installed at one end of each heat-conducting copper pipe (10).
2. The CPU heatsink structure that is easy to assemble quickly according to claim 1, characterized in that: The bottom of the spring plate (2) is provided with a support base (4), and the top of the support base (4) is provided with a button that extends to the top of the spring plate (2).
3. The CPU heatsink structure that is easy to assemble quickly according to claim 1, characterized in that: One end of the elastic rod (3) extends to the bottom of the mounting bracket (1), and a spring is provided around the outside of the elastic rod (3).
4. The CPU heatsink structure that is easy to assemble quickly according to claim 1, characterized in that: The mounting bracket (1) has two sets of connecting plates (5) on both sides of its bottom, and one end of the connecting plate (5) is provided with a locking rod (6).
5. The CPU heatsink structure that is easy to assemble quickly according to claim 1, characterized in that: The bottom of the mounting bracket (1) is provided with a slide rail (7) away from the inner side of the connecting plate (5), and one end of the slide rail (7) is provided with an opening.
6. The CPU heatsink structure that is easy to assemble quickly according to claim 1, characterized in that: The mounting bracket (1) has a limiting plate (12) inside, and the inner side of the limiting plate (12) is connected to the outer side of the cooling fan (8).