Modular computer cooling device

Abstract

The utility model provides a modularization computer heat abstractor, include: heat dissipation subassembly, heat dissipation subassembly includes a number of groups of heat dissipation fin for heat dissipation and a heat exchange plate, and heat dissipation fin installs in the bottom rear side of heat conduction base plate, and heat dissipation subassembly installs in the inside of heat dissipation box, and the inside front side of heat dissipation box is provided with a heat dissipation cavity one for installing heat exchange plate, compared with prior art, the utility model has the beneficial effects as follows: through set up dust cover, heat exchange plate and elastic component, when using, take down dust cover and expose the installation mouth, and the two groups of sliding installation groove of heat exchange plate top are inserted along two groups of sliding installation strip to the back, after heat exchange plate installation is finished, under the upward push of four groups of elastic component, make heat exchange plate and heat conduction base plate between installation more stable, and the final effect is through the modularization setting of heat exchange plate, can according to the heating condition in the case and selectivity install, and convenient maintenance improves the heat dissipation efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation device technology, and specifically relates to a modular computer heat dissipation device. Background Technology

[0002] Computer cooling systems are devices or systems used to lower the temperature of internal computer components. Their main purpose is to prevent performance degradation, hardware damage, and even system crashes caused by overheating. Current computer cases typically use air cooling, the most common method. This involves installing heatsinks on heat-generating components such as the CPU and GPU, along with fans, to dissipate heat into the air. The advantages of this method are low cost and ease of maintenance due to its simple structure. However, its drawback is that the fixed structure of air cooling makes it impossible to select different cooling modules based on hardware power consumption, potentially leading to poor cooling performance. Therefore, a new structure is proposed to address these issues. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a modular computer heat dissipation device to solve the problems mentioned in the background technology.

[0004] This utility model is achieved through the following technical solution: a modular computer heat dissipation device, comprising: a heat dissipation component, the heat dissipation component including several sets of heat dissipation fins for heat dissipation and a heat exchange plate, the heat dissipation fins being installed on the bottom rear side of the heat-conducting substrate; The heat dissipation assembly is installed inside the heat dissipation box. A heat dissipation cavity one for installing a heat exchange plate is opened on the front side of the heat dissipation box, and a heat dissipation cavity two for placing several sets of heat dissipation fins is opened on the rear side of the heat dissipation cavity one.

[0005] In a preferred embodiment, the top of the thermally conductive substrate is fixed to the bottom of the semiconductor cooling chip above it by bolt one, the bottom of the thermally conductive substrate is fixed to the inside of the heat sink box by bolt two, and the heat sink box is fixed to the mounting bracket pre-installed inside the chassis. The bottom front side of the thermally conductive substrate is provided with two sets of sliding mounting strips from front to back, and the longitudinal section of the sliding mounting strips is a convex shape.

[0006] In a preferred embodiment, the top of the heat exchange plate is provided with two sets of sliding mounting grooves from front to back, and the longitudinal cross-sectional shape of the sliding mounting groove matches the longitudinal cross-sectional shape of the sliding mounting strip.

[0007] In a preferred embodiment, the length, width, and depth of the sliding mounting groove are matched with the length, width, and thickness of the sliding mounting strip, and the length, width, and thickness of the heat exchange plate are matched with the length, width, and depth of the heat dissipation cavity. The convex structure of the sliding mounting strip can achieve a fitting connection with the inner side of the sliding mounting groove, so the heat exchange plate will not fall off longitudinally when installed below the heat-conducting substrate.

[0008] In a preferred embodiment, a negative pressure fan is installed at the bottom of the heat dissipation cavity to exhaust the air inside the heat dissipation cavity, and several sets of air inlets are provided on the right side wall of the heat dissipation cavity.

[0009] In a preferred embodiment, four sets of elastic components are equidistantly arranged at the four corners of the lower inner surface of the heat dissipation cavity. Each elastic component includes a spring and a top block. The top of the top block has a semi-cylindrical structure. When the heat exchange plate is installed, its bottom will press against the side of the top block. Since the top of the top block has an arc-shaped structure, a downward component force will be generated, which will compress the spring and cause the spring to contract. Thus, after the heat exchange plate is installed, the four sets of elastic components will stably abut the heat exchange plate against the bottom of the heat-conducting substrate.

[0010] In a preferred embodiment, the heat dissipation cavity has an installation port on its left side, and four sets of fitting grooves are provided at the four corners of the right side inside the installation port. A dust cover is installed inside the installation port, and four sets of fitting rods that fit and connect with the fitting grooves are provided at the four corners of the right side of the dust cover. A quick-release handle is provided on the left side of the dust cover. The dust cover serves to prevent dust and can be opened and closed quickly, facilitating quick disassembly and assembly of the heat exchange plate.

[0011] In a preferred embodiment, two sets of negative pressure fans are installed at the bottom of the heat dissipation cavity two. The negative pressure fans two are the same as the negative pressure fans one. Several sets of air inlets two are opened on the inner wall of the right side of the heat dissipation cavity two.

[0012] In a preferred embodiment, the length, width, and depth of the second heat dissipation cavity match the length, width, and height of the square area composed of several sets of heat dissipation fins, and several sets of ventilation holes are horizontally opened on the surface of the heat dissipation fins.

[0013] After adopting the above technical solution, the beneficial effects of this utility model are as follows: 1. By setting a dust cover, a heat exchange plate, and an elastic component, the dust cover is fixed to the installation port opened on the left side of the heat dissipation cavity through four sets of interlocking rods. A pair of sliding installation grooves are opened at the front and rear positions of the top of the heat exchange plate. A pair of sliding installation strips are provided on the front side of the bottom of the heat conduction substrate and are slidably connected to the sliding installation strips. The elastic component includes a spring and a semi-cylindrical top block. When in use, the dust cover is removed to expose the installation port. The two sets of sliding installation grooves on the top of the heat exchange plate are inserted backward along the two sets of sliding installation strips. During the insertion process, the bottom of the heat exchange plate contacts the side of the top block. Since the top of the top block has an arc structure, it will squeeze the top block to squeeze the spring downward. After the heat exchange plate is installed, the installation between the heat exchange plate and the heat conduction substrate is more stable under the upward pushing action of the four sets of elastic components. The final effect is that through the modular setting of the heat exchange plate, selective installation can be carried out according to the heat dissipation of the inside of the chassis, and maintenance is also convenient.

[0014] 2. By setting up heat dissipation fins, several sets of heat dissipation fins are located inside the second heat dissipation cavity. The heat-conducting substrate transfers heat downwards to the heat exchange plate and several sets of heat dissipation fins. The heat exchange plate transfers heat to the first heat dissipation cavity. The negative pressure fan exhausts the heat-absorbing air from the first heat dissipation cavity. The several sets of heat dissipation fins transfer the heat transferred by the heat-conducting substrate to the second heat dissipation cavity. Two sets of negative pressure fans introduce air into the second heat dissipation cavity. The air flows inside the second heat dissipation cavity and passes through several sets of ventilation holes opened on the surface of several sets of heat dissipation fins. Therefore, the area of ​​air blowing on the surface of the heat dissipation fins is increased, which speeds up the exhaust of heat from the second heat dissipation cavity. The final effect is to significantly improve the heat dissipation efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a modular computer heat dissipation device according to the present invention.

[0017] Figure 2 This is a schematic diagram of the internal structure of the heat sink box in a modular computer heat dissipation device according to this utility model.

[0018] Figure 3 This is a schematic diagram of the elastic component in a modular computer heat dissipation device according to the present invention.

[0019] Figure 4 This utility model Figure 2A schematic diagram of the structure at point A in the middle.

[0020] Figure 5 This is a schematic diagram of the heat dissipation component in a modular computer heat dissipation device according to the present invention.

[0021] Figure 6 This utility model Figure 5 A schematic diagram of the structure at point B.

[0022] In the diagram, 100-heat dissipation component, 110-thermal conductive substrate, 120-sliding mounting strip, 130-heat dissipation fins, 131-ventilation hole, 140-heat exchange plate, 141-sliding mounting groove; 200-heat sink; 300-Heat dissipation cavity one, 310-Elastic component, 311-Spring, 312-Top block, 320-Mounting port, 321-Matching groove, 330-Dust cover, 331-Matching rod; 400-Heat dissipation cavity two. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only one aspect of the present utility model, and not all aspects. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0024] Please see Figures 1 to 6 A modular computer heat dissipation device includes: a heat dissipation assembly 100, the heat dissipation assembly 100 including several sets of heat dissipation fins 130 for heat dissipation and a heat exchange plate 140, the heat dissipation fins 130 being mounted on the rear side of the bottom of the heat-conducting substrate 110; The heat dissipation assembly 100 is installed inside the heat dissipation box 200. A heat dissipation cavity 300 for installing the heat exchange plate 140 is opened on the front side of the heat dissipation box 200, and a heat dissipation cavity 400 for placing several sets of heat dissipation fins 130 is opened on the rear side of the heat dissipation cavity 300.

[0025] The top of the thermal conductive substrate 110 is fixed to the bottom of the semiconductor cooling chip above it by bolt one, and the bottom of the thermal conductive substrate 110 is fixed to the inside of the heat sink 200 by bolt two. The heat sink 200 is fixed to the mounting bracket pre-installed inside the chassis. Two sets of sliding mounting strips 120 are horizontally arranged from front to back on the bottom front side of the thermally conductive substrate 110. The longitudinal section of the sliding mounting strip 120 is a convex-shaped structure.

[0026] The top of the heat exchange plate 140 has two sets of sliding mounting grooves arranged from front to back, and the longitudinal cross-sectional shape of the sliding mounting groove matches the longitudinal cross-sectional shape of the sliding mounting strip 120.

[0027] The length, width, and depth of the sliding mounting groove 141 match the length, width, and thickness of the sliding mounting strip 120. The length, width, and thickness of the heat exchange plate 140 match the length, width, and depth of the heat dissipation cavity 300. The convex structure of the sliding mounting strip 120 can achieve a fitting connection with the inner side of the sliding mounting groove 141. Therefore, the heat exchange plate 140 will not fall off longitudinally when installed below the heat-conducting substrate 110.

[0028] A negative pressure fan is installed at the bottom of the heat dissipation cavity 300 to exhaust the air inside the heat dissipation cavity 300, and several sets of air inlets are opened on the right side wall of the heat dissipation cavity 300.

[0029] Four sets of elastic components 310 are equidistantly arranged at the four corners of the lower inner surface of the heat dissipation cavity 300. Each elastic component 310 includes a spring 311 and a top block 312. The top of the top block 312 has a semi-cylindrical structure. When the heat exchange plate 140 is installed, its bottom will be pressed against the side of the top block 312. Since the top of the top block 312 has an arc-shaped structure, a downward component force will be generated, which will compress the spring 311 and cause the spring 311 to contract. Thus, after the heat exchange plate 140 is installed, the four sets of elastic components 310 will stably abut the heat exchange plate 140 against the bottom of the heat-conducting substrate 110.

[0030] The heat dissipation cavity 300 has an installation port 320 on its left side. Inside the installation port 320, there are four sets of fitting grooves 321 at the four corners of the right side. A dust cover 330 is installed inside the installation port 320. The dust cover 330 has four sets of fitting rods 331 at the four corners of the right side that fit into the fitting grooves 321. The dust cover 330 has a quick-release handle on its left side. The dust cover 330 serves to prevent dust and can be opened and closed quickly, facilitating quick installation and removal of the heat exchange plate 140.

[0031] Two sets of negative pressure fans are installed at the bottom of the heat dissipation cavity 2 400. The negative pressure fans 2 are the same as the negative pressure fans 1. Several sets of air inlets 2 are opened on the inner wall of the right side of the heat dissipation cavity 2 400.

[0032] The length, width, and depth of the heat dissipation cavity 400 are matched with the length, width, and height of the square area composed of several sets of heat dissipation fins 130. Several sets of ventilation holes 131 are horizontally opened on the surface of the heat dissipation fins 130.

[0033] Example 1: Please refer to Figures 2 to 5In actual use, a heat-conducting substrate 110 is installed on the upper part of the heat sink 200. A thermoelectric cooler is installed on the top of the heat-conducting substrate 110, with the hot side of the thermoelectric cooler in contact with the top of the heat-conducting substrate 110 and its cold side facing the heat-generating components inside the chassis. Two sets of sliding mounting strips 120 are provided on the front bottom side of the heat-conducting substrate 110. The longitudinal section of the sliding mounting strips 120 is a convex structure. A heat exchange plate 140 is provided on the front bottom side of the heat-conducting substrate 110. Two sets of sliding mounting grooves 141 are provided on the top of the heat exchange plate 140, and the longitudinal section shape of the sliding mounting grooves 141 matches the longitudinal section shape of the sliding mounting strips 120. After the heat exchange plate 140 is installed with the heat-conducting substrate 110, the heat exchange plate 140 is located inside the heat dissipation cavity 300 opened on the front side of the heat sink 200. Four sets of elastic components 310 are provided at the four corners of the lower inner surface of the heat dissipation cavity 300. The elastic components 310 include springs 311 and semi-cylindrical top blocks 312. The arc surface of the top blocks 312 is set upward. Several sets of air inlets are opened on the inner right side of the heat dissipation cavity 300 to introduce air into the heat dissipation cavity 300 when the negative pressure fan is working. A negative pressure fan is installed at the bottom of the heat dissipation cavity 300 to exhaust the air that has absorbed heat inside the heat dissipation cavity 300. An installation port 320 is opened on the left side of the heat dissipation cavity 300. Four sets of fitting grooves 321 are opened on the right side inside the installation port 320. A dust cover 330 is installed inside the installation port 320. Four sets of fitting rods 331 are provided on the right side of the dust cover 330 to fit and connect with the four sets of fitting grooves 321. When installing the heat exchange plate 140, pick it up with the side having the sliding mounting groove 141 facing upwards, then remove the dust cover 330 to expose the mounting opening 320. Pass the heat exchange plate 140 through the mounting opening 320 and insert the two sets of sliding mounting grooves 141 on its top along the two sets of sliding mounting strips 120 backwards. During the sliding installation process, the bottom of the heat exchange plate 140 contacts the sides of the four sets of top blocks 312. Since the top of the top block 312 has an arc-shaped structure, the bottom of the heat exchange plate 140 will press against the top blocks 312. Block 312 compresses the spring 311 downwards, causing the four sets of springs 311 to contract and store force. After the heat exchange plate 140 is installed, the four sets of spring components 310 push the heat exchange plate 140 upwards to tightly abut against the heat-conducting substrate 110, thus completing the installation of the heat exchange plate 140. The final effect is that, through the modular design of the heat exchange plate 140, selective installation can be carried out according to the heat generation inside the chassis, improving the heat dissipation efficiency of the heat dissipation component 100, while facilitating quick disassembly and assembly of the heat exchange plate 140, thus improving the efficiency of disassembly, assembly, and maintenance.

[0034] Example 2: Please refer to Figure 1 , Figure 2 , Figure 5 and Figure 6When the heat dissipation component 100 is dissipating heat, the heat exchange plate 140 is in the installed state by default. At this time, the heat-conducting substrate 110 transfers the heat generated by the hot surface of the thermoelectric cooler to the heat exchange plate 140 and several sets of heat dissipation fins 130 respectively. The heat exchange plate 140 transfers the heat to the interior of the first heat dissipation cavity 300. At this time, the first negative pressure fan starts and introduces the outside air into the interior of the first heat dissipation cavity 300. After the air absorbs heat, it is discharged through the first negative pressure fan and through the heat dissipation holes on the side of the chassis. At the same time, several sets of heat dissipation fins 130 transfer the heat to the interior of the second heat dissipation cavity 400. At this time, the second negative pressure fans start (the first negative pressure fan, the second negative pressure fan and the thermoelectric cooler are all existing technologies, and their internal structure and working principle will not be described in detail here). External air is introduced into the heat dissipation cavity 400, where it flows through the heat dissipation cavity 300 and passes through the ventilation holes 131 on the surface of the heat dissipation fins 130. This increases the area on which the air blows across the surface of the heat dissipation fins 130, thereby significantly improving the efficiency of heat removal from the surface of the heat dissipation fins 130. As a result, the heat exchange plate 140 and the arrangement of several sets of heat dissipation fins 130 can significantly improve the heat generated on the hot surface of the thermoelectric cooler, thereby helping to improve the cooling efficiency of the thermoelectric cooler and, consequently, the heat dissipation efficiency of the heat-generating components inside the chassis.

[0035] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A modular computer heat dissipation device, comprising: A heat dissipation assembly (100) is characterized in that: the heat dissipation assembly (100) includes several sets of heat dissipation fins (130) for heat dissipation and a heat exchange plate (140), the heat dissipation fins (130) are installed on the rear side of the bottom of the heat-conducting substrate (110); the heat dissipation assembly (100) is installed inside a heat dissipation box (200), a heat dissipation cavity (300) for installing the heat exchange plate (140) is opened on the front side of the heat dissipation box (200), and a heat dissipation cavity (300) for placing several sets of heat dissipation fins (130) is opened on the rear side of the heat dissipation cavity (300). The heat dissipation cavity 2 (400) of the heat-conducting substrate (130) is fixed to the bottom of the semiconductor cooling chip above it by bolt 1, and the bottom of the heat-conducting substrate (110) is fixed to the inside of the heat dissipation box (200) by bolt 2. The heat dissipation box (200) is fixed to the mounting bracket pre-installed inside the chassis. Two sets of sliding mounting strips (120) are horizontally arranged from front to back on the front side of the bottom of the heat-conducting substrate (110). The longitudinal section of the sliding mounting strip (120) is a convex structure. The top of the heat exchange plate (140) is opened sequentially from front to back. Two sets of sliding mounting grooves (141) are provided, the longitudinal cross-sectional shape of which matches the longitudinal cross-sectional shape of the sliding mounting strip (120); the length, width, and depth of the sliding mounting groove (141) match the length, width, and thickness of the sliding mounting strip (120); the length, width, and thickness of the heat exchange plate (140) match the length, width, and depth of the heat dissipation cavity one (300); four sets of elastic components (310) are equidistantly provided at the four corners of the lower inner surface of the heat dissipation cavity one (300); the elastic components (310) are provided at the four corners of the lower inner surface of the heat dissipation cavity one (300). 10) Includes a spring (311) and a top block (312), the top of which is a semi-cylindrical structure; the heat dissipation cavity (300) has an installation port (320) on its left side, and four sets of fitting grooves (321) are provided at the four corners of the right side inside the installation port (320). A dust cover (330) is installed inside the installation port (320), and four sets of fitting rods (331) that fit and connect with the fitting grooves (321) are provided at the four corners of the right side of the dust cover (330). A quick-release handle is provided on the left side of the dust cover (330).

2. The modular computer heat dissipation device as described in claim 1, characterized in that: A negative pressure fan is installed at the bottom of the heat dissipation cavity (300) to exhaust the air inside the heat dissipation cavity (300), and several sets of air inlets are opened on the right side wall of the heat dissipation cavity (300).

3. A modular computer heat dissipation device as described in claim 1, characterized in that: Two sets of negative pressure fans are installed at the bottom of the heat dissipation cavity 2 (400). The negative pressure fans 2 are the same as the negative pressure fans 1. Several sets of air inlets 2 are opened on the inner wall of the right side of the heat dissipation cavity 2 (400).

4. A modular computer heat dissipation device as described in claim 3, characterized in that: The length, width and depth of the second heat dissipation cavity (400) are matched with the length, width and height of the square area composed of several sets of heat dissipation fins (130), and several sets of ventilation holes (131) are horizontally opened on the surface of the heat dissipation fins (130).

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