An air-cooled heat sink

Abstract

The utility model discloses a kind of air-cooled radiators, including bottom plate, heat pipe, first fin and second fin. Bottom plate is equipped with first pipe groove, and fixedly connected with the heat conduction plate with second pipe groove, both cooperation clamping fixed heat pipe, improve heat conduction efficiency. First fin is installed with first fan by first fixed frame, and second fan is installed between first fin and second fin by second fixed frame. When working, CPU heat is conducted to two groups of fins through heat conduction plate and heat pipe, first fan inhales cold wind and blows to first fin, and second fan guides airflow to blow through second fin, forms forced convection, significantly enhances heat dissipation effect. Bottom plate is connected with mounting bracket by quick-release bolt, easy to disassemble and assemble;Fin outside is equipped with protection frame, improves structural safety. The utility model realizes efficient heat dissipation and stable installation by double-fan series air duct and optimized heat conduction structure.

Description

Technical Field

[0001] This utility model belongs to the field of radiator technology, specifically relating to an air-cooled radiator. Background Technology

[0002] With technological advancements, computers have become deeply integrated into daily life and work. Under high load, the Central Processing Unit (CPU) generates a significant amount of heat. If this heat cannot be dissipated effectively and promptly, it can cause system lag and crashes, or even permanent damage to the CPU due to overheating. Therefore, thermal paste is applied to the CPU surface, and a heatsink is installed to improve heat transfer efficiency and ensure the CPU temperature remains within a safe range. It can be said that the heatsink plays a crucial role in maintaining stable CPU operation. However, current mainstream air-cooling solutions often struggle to achieve rapid and sufficient heat dissipation when faced with the high heat density generated by high-performance CPUs. This causes the CPU to throttle due to overheating, directly impacting its performance. Utility Model Content

[0003] The purpose of this invention is to provide an air-cooled radiator to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: an air-cooled heat sink, comprising a base plate, heat pipes, a first fin, and a second fin. The base plate is provided with a first pipe groove. The base plate is fixedly connected to the first fin and the second fin via the heat pipes. A first fan is fixedly mounted on the first fin via a first fixing bracket. A second fan is fixedly mounted between the first fin and the second fin via a second fixing bracket. A mounting bracket is fixedly connected to the base plate via quick-release bolts. A heat-conducting plate is fixedly mounted on the base plate. The heat-conducting plate is provided with a second pipe groove. The first fin and the second fin are both fixedly mounted with protective brackets via fastening bolts.

[0005] Preferably, the protective frame is fixedly mounted with a top shell, the top shell is fixedly mounted with a magnet, and the fastening bolts are made of stainless steel.

[0006] Preferably, the second mounting bracket is fixedly mounted with an LCD display module, and the top shell is fixedly mounted with a light-transmitting plate.

[0007] Preferably, the heat-conducting plate is made of copper.

[0008] Preferably, the first fan is fixedly mounted with a first cover.

[0009] Preferably, a second cover is fixedly installed on the outer side of the second fin.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] The base plate of this invention has a first groove, and the heat-conducting plate has a second groove. The heat-conducting plate is in direct contact with the CPU. The first and second grooves cooperate to tightly fix the heat-conducting pipes, thereby improving heat exchange efficiency. The heat-conducting pipes are fixedly connected to the first and second fins respectively. A first fan is installed on the first fin, and a second fan is installed between the first and second fins. During operation, the heat generated by the CPU is conducted to the heat-conducting pipes through the heat-conducting plate, and then conducted to the first and second fins by the heat-conducting pipes. The first fan draws in cool air from the outside and blows it onto the first fin. Subsequently, the airflow continues to blow across the second fin under the relay action of the second fan, thereby accelerating the flow of cool air between the fins, effectively improving heat dissipation efficiency, and ensuring the stability of the CPU's operating temperature. Attached Figure Description

[0012] Figure 1 This is the first perspective structural view of this utility model.

[0013] Figure 2 This is the second perspective structural view of this utility model.

[0014] Figure 3 This is an exploded structural view of the present invention.

[0015] Figure 4 This is an exploded structural view of the base plate of this utility model.

[0016] Figure 5 This is a structural view of the top shell of this utility model.

[0017] The diagram is labeled as follows: base plate 1, heat pipe 2, first fin 3, second fin 4, first tube groove 5, first mounting bracket 6, first fan 7, second mounting bracket 8, second fan 9, quick-release bolt 10, mounting bracket 11, heat-conducting plate 12, second tube groove 13, fastening bolt 14, protective bracket 15, top shell 16, magnet 17, LCD display module 18, light-transmitting plate 19, first cover 20, second cover 21. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Example 1:

[0020] This utility model provides an air-cooled heat sink, including a base plate 1, heat pipes 2, first fins 3, and second fins 4. The base plate 1 has a first pipe groove 5. The base plate 1 is fixedly connected to the first fins 3 and second fins 4 through the heat pipes 2. A first fan 7 is fixedly mounted on the first fin 3 through a first fixing bracket 6. A second fan 9 is fixedly mounted between the first fin 3 and the second fin 4 through a second fixing bracket 8. A mounting bracket 11 is fixedly connected to the base plate 1 through quick-release bolts 10. A heat-conducting plate 12 is fixedly mounted on the base plate 1. The heat-conducting plate 12 has a second pipe groove 13. The first fins 3 and the second fin 4 are both fixedly mounted with protective brackets 15 through fastening bolts 14. A top shell 16 is fixedly mounted on the protective bracket 15. A magnet 17 is fixedly mounted on the top shell 16. The fastening bolts 14 are made of stainless steel. An LCD display module 18 is fixedly mounted on the second fixing bracket 8. A light-transmitting plate 19 is fixedly mounted on the top shell 16. The heat-conducting plate 12 is made of copper. The first fan 7 is fixedly mounted with a first cover 20. The second fin 4 is fixedly mounted with a second cover 21 on its outer side.

[0021] Through the above technical solution, the base plate 1 of this utility model is provided with a first tube groove 5, and the heat-conducting plate 12 is provided with a second tube groove 13. The heat-conducting plate 12 is in direct contact with the CPU. The first tube groove 5 and the second tube groove 13 cooperate to tightly fix the heat-conducting pipe 2, thereby improving the heat exchange efficiency. The heat-conducting pipe 2 is fixedly connected to the first fin 3 and the second fin 4 respectively. A first fan 7 is installed on the first fin 3, and a second fan 9 is installed between the first fin 3 and the second fin 4. During operation, the heat generated by the CPU is conducted to the heat-conducting pipe 2 through the heat-conducting plate 12, and then conducted to the first fin 3 and the second fin 4 by the heat-conducting pipe 2. The first fan 7 draws in outside cold air and blows it towards the first fin 3. Then, under the relay action of the second fan 9, the airflow continues to blow across the second fin 4, thereby accelerating the flow of cold air between the fins, effectively improving the heat dissipation efficiency, and ensuring the stability of the CPU operating temperature.

[0022] Example 2:

[0023] In this embodiment, the base plate 1 is made of flat metal, and its surface has a first groove 5 for accommodating the heat pipe 2. A heat-conducting plate 12 is fixedly installed below the base plate 1, directly contacting the central processing unit. The heat-conducting plate 12 has a second groove 13 aligned with the first groove 5, together tightly clamping and fixing the heat pipe 2. The heat pipe 2 passes through the grooves of the base plate 1 and the heat-conducting plate 12, and is firmly connected to the first fin 3 and the second fin 4 respectively, forming an efficient heat conduction path. A first fan 7 is mounted on the first fin 3 via a first fixing bracket 6. The first fixing bracket 6 is made of metal or high-strength plastic, and the first fan 7 is fixed to the outside of the first fin 3 by screws or clips to ensure stable fan operation. A second fan 9 is mounted between the first fin 3 and the second fin 4 via a second fixing bracket 8. The second fixing bracket 8 is designed as an adjustable structure to adapt to different fin spacing layouts. The second fan 9 is located in the gap between the two fin groups, facilitating airflow relay.

[0024] The base plate 1 is connected to the mounting bracket 11 via quick-release bolts 10. These bolts feature a quick-tight design, allowing users to easily remove or install the heatsink without tools. The mounting bracket 11 is fixed to the motherboard, providing a stable support base. The heatsink plate 12 is fixed to the base plate 1 by welding or bonding, ensuring a gapless heat conduction interface and improving overall heat dissipation performance. Both the first fin 3 and the second fin 4 are fitted with protective brackets 15 via fastening bolts 14. These brackets 15 cover the outer side of the fins, preventing impact from external objects or dust accumulation, while not obstructing airflow. The fastening bolts 14 feature a standard thread design, facilitating disassembly and cleaning during regular maintenance.

[0025] During operation, the heat generated by the central processing unit (CPU) is first conducted to the heat dissipation plate 12, and then rapidly transferred to the first fin 3 and the second fin 4 via the heat pipe 2. After the first fan 7 starts, it draws in cool external air and blows it onto the surface of the first fin 3, accelerating heat dissipation. Subsequently, the airflow continues under the relay action of the second fan 9, blowing across the second fin 4 to further enhance the heat dissipation effect. This dual-fan collaborative operation ensures continuous and efficient airflow between the fins, effectively reducing the CPU temperature and preventing performance degradation or damage due to overheating. The entire system has a compact structure, is easy to install, and is suitable for various high-performance computing environments, providing reliable heat dissipation.

[0026] Example 3:

[0027] In this embodiment, the base plate 1 is provided with a first tube groove 5. The base plate 1 is fixedly connected to the first fin 3 and the second fin 4 through a heat-conducting pipe 2. The first fin 3 is fixedly mounted with a first fan 7 through a first fixing bracket 6, and a second fan 9 is fixedly mounted between the first fin 3 and the second fin 4 through a second fixing bracket 8. The base plate 1 is fixedly connected with a mounting bracket 11 through quick-release bolts 10, and a heat-conducting plate 12 is fixedly mounted on the base plate 1. The heat-conducting plate 12 is provided with a second tube groove 13. Both the first fin 3 and the second fin 4 are fixedly mounted with protective brackets 15 through fastening bolts 14. The protective bracket 15 is fixedly mounted with a top shell 16, and the top shell 16 is fixedly mounted with a magnet 17. The fastening bolts 14 are made of stainless steel. The magnet 17 attracts the fastening bolts 14, fixing the top shell 16, which is easy to disassemble and clean.

[0028] During heatsink operation, the large amount of heat generated by the CPU is conducted to the heat pipe 2 through the heat conduction plate 12. The heat conduction plate 12 is in direct contact with the CPU, and the first pipe slot 5 and the second pipe slot 13 work together to firmly fix the heat pipe 2, thereby improving heat exchange efficiency. Heat is conducted to the first fin 3 and the second fin 4 by the heat pipe 2. The first fan 7 draws in cool air from the outside and blows it onto the first fin 3. Then, the airflow continues to blow across the second fin 4 under the relay action of the second fan 9, thereby accelerating the flow of cool air between the fins, effectively improving heat dissipation efficiency, and ensuring the stability of the CPU's operating temperature. The top shell 16 is fixed to the protective frame 15 by the attraction of the magnet 17 and the fastening bolt 14. This fixing method is not only firm and reliable, but also facilitates users to quickly disassemble the top shell 16 for internal dust cleaning, preventing dust accumulation from affecting heat dissipation performance.

[0029] A strong magnetic attraction is formed between the magnet 17 of the top cover 16 and the stainless steel fastening bolt 14, ensuring that the top cover 16 will not loosen or fall off due to vibration or airflow impact during radiator operation. When cleaning dust is required, the user can simply pull the top cover 16 to overcome the magnetic force and remove it without the need for tools or disassembly of other parts, making the operation simple and quick. After cleaning, align the top cover 16 with the fastening bolt 14 on the protective frame 15, and the magnet 17 will automatically attract and fix it, restoring it to its original state. This design significantly improves the ease of maintenance of the radiator and extends its service life.

[0030] Furthermore, the protective frame 15 not only supports the top shell 16 but also enhances the overall structural stability. The coordinated operation of the first fan 7 and the second fan 9, through multi-stage airflow acceleration, ensures rapid heat dissipation from the fin surface, preventing the CPU from throttling due to overheating. The base plate 1 is connected to the mounting bracket 11 via quick-release bolts 10, facilitating the overall installation and removal of the heatsink and further improving usability. The fixed installation of the heat-conducting plate 12 to the base plate 1 ensures the continuity of the heat conduction path, improving heat dissipation efficiency.

[0031] In summary, the air-cooled heat sink in this embodiment achieves a perfect combination of efficient heat dissipation and convenient maintenance by optimizing the heat conduction path and airflow organization, combined with the magnetic top shell 16 design, effectively ensuring the stability and performance of the central processing unit under high load.

[0032] Example 4:

[0033] This embodiment significantly enhances the user interaction experience by adding an LCD display module 18 and a light-transmitting plate 19. Specifically, the LCD display module 18 is fixedly installed on the second mounting bracket 8, and the light-transmitting plate 19 is fixedly installed on the top shell 16. Users can directly view various information displayed by the LCD display module 18 through the light-transmitting plate 19, including time, temperature, user-defined patterns or video content, so that the heat sink can achieve efficient heat dissipation while also serving as an information display and personalized decoration function.

[0034] The overall structure of this air-cooled heatsink includes a base plate 1, heat pipes 2, first fins 3, and second fins 4. The base plate 1 has a first pipe groove 5, and the heat-conducting plate 12 has a second pipe groove 13. The heat-conducting plate 12 is in direct contact with the central processing unit. The heat pipes 2 are firmly fixed by the tight fit between the first pipe groove 5 and the second pipe groove 13, thereby optimizing the heat conduction path. The heat pipes 2 are fixedly connected to the first fins 3 and the second fins 4 respectively, forming a complete heat transfer channel. The first fins 3 are mounted with a first fan 7 via a first mounting bracket 6, and a second fan 9 is mounted between the first fins 3 and the second fins 4 via a second mounting bracket 8. The second mounting bracket 8 also serves as the mounting base for the LCD display module 18. The top shell 16 is fixed to the first fins 3 and the second fins 4 via a protective frame 15. The light-transmitting plate 19 embedded on its surface faces the LCD display module 18, ensuring that the displayed content is clearly visible. The base plate 1 is connected to the mounting bracket 11 by quick-release bolts 10, which facilitates the quick assembly and disassembly of the entire heat sink. The heat conduction plate 12 is fixed to the base plate 1 by fastening bolts 14, and the protective bracket 15 is fixed to the fins by fastening bolts 14. The top shell 16 is fixed by magnets 17 and stainless steel fastening bolts 14, which enables the top shell 16 to be easily disassembled and assembled, which is conducive to daily cleaning and maintenance.

[0035] During operation, the large amount of heat generated by the central processing unit (CPU) is first absorbed by the heat-conducting plate 12, and then rapidly conducted to the first fin 3 and the second fin 4 through the heat pipe 2. At this time, the first fan 7 starts, drawing in cool outside air and blowing it onto the surface of the first fin 3. The airflow carries away heat as it flows over the fins. Immediately afterwards, the second fan 9 takes over, further guiding the pre-heated airflow to the second fin 4, forming a continuous and efficient air-cooling cycle. This dual-fan collaborative cooling mechanism significantly enhances the flow speed and coverage of cool air between the fins, thereby greatly improving heat dissipation efficiency and ensuring that the CPU always operates stably within a safe temperature range. At the same time, the LCD display module 18 displays the system time and current temperature data in real time, or displays personalized patterns and videos according to user settings. Users can intuitively view this information through the light-transmitting plate 19 of the top shell 16. This design not only meets basic heat dissipation requirements, but also enriches the user experience through visual interaction functions, making the heat sink a computer component that combines practicality and aesthetics.

[0036] In summary, this embodiment, by integrating the LCD display module 18 and the light-transmitting plate 19, expands the functional boundaries of the air-cooled heat sink while ensuring efficient heat dissipation performance. This enables it to meet the growing demand from users for personalized and intelligent computer accessories, effectively enhancing the product's overall competitiveness and user satisfaction.

[0037] Example 5:

[0038] In this embodiment, the heatsink 12 is made of copper to significantly improve overall heat dissipation efficiency. The heatsink includes a base plate 1, heat pipes 2, first fins 3, and second fins 4. The base plate 1 has a first pipe groove 5, and the heatsink 12 has a second pipe groove 13. The heatsink 12 is in direct contact with the central processing unit (CPU). The first pipe groove 5 and the second pipe groove 13 cooperate to tightly fix the heat pipe 2, thereby optimizing the heat exchange process. The heat pipes 2 are fixedly connected to the first fins 3 and the second fins 4, forming an efficient heat conduction path. A first fan 7 is mounted on the first fin 3 via a first mounting bracket 6, while a second fan 9 is mounted between the first fin 3 and the second fin 4 via a second mounting bracket 8. This dual-fan design enhances airflow circulation. The base plate 1 is fixedly connected to the mounting bracket 11 via quick-release bolts 10 for easy installation and removal. Simultaneously, the base plate 1 is fixedly mounted with the heatsink 12 to ensure efficient heat transfer from the CPU. Both the first fin 3 and the second fin 4 are fitted with protective frames 15 by fastening bolts 14 to provide structural support and protection.

[0039] In practical applications, when the central processing unit (CPU) operates under high load, it generates a large amount of heat. This heat is first conducted through the heatsink 12. Because the heatsink 12 is made of copper, its high thermal conductivity allows it to quickly absorb and transfer heat, reducing thermal resistance. The heat is then evenly distributed to the first fin 3 and the second fin 4 through the heat pipe 2. The first fan 7 starts, drawing in cool external air and blowing it onto the first fin 3. The airflow carries away the heat from the fin surface, achieving initial cooling. Next, the second fan 9 takes over, further guiding the airflow to the second fin 4, ensuring continuous flow of cool air between the fins and preventing heat accumulation. This dual-fan collaborative working mode, combined with the rapid thermal response of the copper heatsink 12, significantly improves heat dissipation efficiency, preventing the CPU from throttling or being damaged due to overheating.

[0040] The core principle of this embodiment lies in utilizing the high thermal conductivity of copper to accelerate the heat transfer process from the central processing unit (CPU) to the heat sink fins. Direct contact between the heatsink 12 and the CPU ensures efficient heat capture, while the coordinated design of the first heat pipe slot 5 and the second heat pipe slot 13 securely fixes the heat pipe 2, reducing heat loss. The dual-fan system enhances convective cooling through continuous airflow; the first fan 7 handles initial cooling, while the second fan 9 extends the airflow path, improving overall heat dissipation coverage. The quick-release bolts 10 and the protective bracket 15 not only simplify maintenance but also enhance the stability and durability of the heat sink. Overall, this design, through material selection and structural optimization, effectively addresses the high heat density of high-performance CPUs, ensuring stable system operation under prolonged high loads and preventing performance degradation or hardware failure due to overheating.

[0041] Example 6:

[0042] In this embodiment, the base plate 1 is provided with a first tube groove 5. The base plate 1 is fixedly connected to the first fin 3 and the second fin 4 through heat conduction pipes 2. The first fin 3 is fixedly mounted with a first fan 7 through a first fixing bracket 6, and the first fin 3 and the second fin 4 are fixedly mounted with a second fan 9 through a second fixing bracket 8. The base plate 1 is fixedly connected with a mounting bracket 11 through quick-release bolts 10. The base plate 1 is fixedly mounted with a heat conduction plate 12, which is provided with a second tube groove 13. The first fin 3 and the second fin 4 are both fixedly mounted with protective brackets 15 through fastening bolts 14. In this embodiment, the first fan 7 is fixedly mounted with a first cover 20, and the second fin 4 is fixedly mounted with a second cover 21 on the outside. The design of the first cover 20 and the second cover 21 is mainly used to improve the appearance of the heat sink, and at the same time, allow users to choose different textures and patterns according to personal preferences or equipment style, thereby enhancing the overall visual effect. The first cover 20 is directly fixed to the outside of the first fan 7, which not only covers the fan structure, but also guides airflow and protects the fan, preventing external foreign objects from interfering with the fan operation. The second cover 21 is installed on the outside of the second fin 4, covering part of the fin assembly, further optimizing the appearance of the heatsink and making it more in line with the aesthetic requirements of modern electronic devices. Through this cover design, the heatsink can better integrate into computer cases or other application environments while maintaining efficient heat dissipation performance, improving the user experience.

[0043] During heat dissipation, the heat generated by the CPU is first conducted to the heat pipe 2 through the heat conduction plate 12. The heat pipe 2 utilizes the phase change principle of its internal working fluid to quickly transfer the heat to the first fin 3 and the second fin 4. After the first fan 7 starts, it draws in external cool air and blows it onto the first fin 3, accelerating the dissipation of heat from the fin surface into the air. Subsequently, the airflow continues under the relay action of the second fan 9, blowing over the second fin 4 to further enhance the heat dissipation effect. The installation of the first cover 20 and the second cover 21 does not interfere with the normal airflow; on the contrary, it may optimize the airflow through reasonable shape design, thereby improving heat dissipation efficiency. In addition, the way the cover is fixed ensures that it remains stable when the fan is running at high speed, avoiding vibration or noise. Overall, this air-cooled heatsink achieves the dual goals of efficient heat dissipation and aesthetic optimization through the coordinated work of multiple fans and the aesthetic design of the cover. It is suitable for high-performance computing scenarios and ensures that the CPU maintains a stable temperature under long-term high-load operation.

[0044] In practical applications, the first housing 20 and the second housing 21 of this embodiment can be manufactured using various materials and processes, such as injection molding or metal stamping, to achieve different textures and patterns. Users can choose customized housing designs, such as geometric patterns, brand logos, or abstract art styles, based on the theme of the computer case or their personal preferences, thereby enhancing the overall aesthetics and personalization of the device. Simultaneously, the housing installation process is simple, secured with clips or screws, facilitating user replacement or maintenance. Regarding heat dissipation performance, the presence of the housing does not significantly increase the weight or volume of the heatsink, ensuring compatibility with various standard chassis sizes. Through this design, the heatsink not only meets basic heat dissipation needs but also considers the emphasis on aesthetics and user experience in modern electronic devices, making it more attractive in the market.

[0045] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0046] The above description is only used to illustrate the technical solution of this utility model and is not intended to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model, as long as they do not depart from the spirit and scope of the technical solution of this utility model, should be covered within the scope of the claims of this utility model.

Claims

1. A wind-cooled heat sink, comprising a base plate, heat pipes, a first fin, and a second fin, wherein the base plate is provided with a first pipe groove, and the base plate is fixedly connected to the first fin and the second fin via the heat pipes, characterized in that, The first fin is fixedly mounted with a first fan via a first fixing bracket. The first fin and the second fin are fixedly mounted with a second fan via a second fixing bracket. The base plate is fixedly connected with a mounting bracket via quick-release bolts. The base plate is fixedly mounted with a heat-conducting plate. The heat-conducting plate is provided with a second tube groove. The first fin and the second fin are both fixedly mounted with protective brackets via fastening bolts.

2. The air-cooled radiator according to claim 1, characterized in that, The protective frame is fixedly mounted with a top shell, and the top shell is fixedly mounted with a magnet. The fastening bolts are made of stainless steel.

3. The air-cooled radiator according to claim 2, characterized in that, The second mounting bracket is fixedly installed with an LCD display module, and the top shell is fixedly installed with a light-transmitting plate.

4. The air-cooled radiator according to claim 1, characterized in that, The heat-conducting plate is made of copper.

5. A wind-cooled radiator according to claim 1, characterized in that, The first fan is fixedly mounted with a first cover.

6. The air-cooled radiator according to claim 1, characterized in that, A second cover is fixedly installed on the outer side of the second fin.

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