A bidirectional flow guide backflow prevention heat sink suitable for a vertical graphic card

Abstract

The utility model relates to computer hardware heat dissipation technical field, and disclose a kind of two-way flow guiding backflow prevention radiator of adaptation vertical installation display card, two-way flow guiding structure is through the flow guide cover and directional fan of symmetry, construct efficient air circulation, adaptation vertical installation space air flow direction, avoid eddy current formation in cabinet, accelerate heat discharge;Backflow prevention component's one-way flow guiding piece and elastic return piece synergistic effect can block hot air backflow when fan stops or low load, maintain the low temperature environment inside radiator, the V-shaped microchannel of heat spreader and phase change coolant strengthen heat conduction, cooperate with the aluminum alloy fin of surface with honeycomb micro-nano texture, substantially improve heat diffusion efficiency, export display card core and peripheral heat quickly, overall structure is compact and convenient to install, U-shaped support and adjusting screw adaptation mainstream vertical installation display card, cushion design avoids display card damage.

Description

Technical Field

[0001] This utility model relates to the field of computer hardware heat dissipation technology, specifically a bidirectional airflow-guided anti-backflow heatsink adapted to vertically mounted graphics cards. Background Technology

[0002] With the increasing demands of esports and graphics processing, vertically mounted graphics cards are becoming increasingly popular in PC builds due to their aesthetic appeal and space utilization. However, the vertical layout alters the traditional airflow environment of horizontally mounted cards, leading to numerous shortcomings in existing cooling solutions.

[0003] Traditional CPU coolers often employ a unidirectional exhaust design, suitable for the horizontal airflow of horizontally mounted graphics cards. However, when used for vertical mounting, they are easily limited by the vertical space of the case, causing airflow to stagnate at the top or bottom of the graphics card, creating vortices and significantly reducing heat exchange efficiency. Furthermore, in vertical mounting scenarios, there is a clear stratification of hot and cold air within the case. When the cooler fan stops or slows down under low load, hot air can easily flow back from the exhaust vents to the cooling fins, causing the graphics card core temperature to rise again and affecting performance during subsequent startups. In addition, some coolers designed for vertical mounting have heat conduction bottlenecks, with simple heat dissipation structures and insufficient fin heat exchange area, making it difficult to quickly dissipate the concentrated heat from high-power graphics cards. Poor product installation compatibility, with fixing mechanisms easily causing pressure damage to the graphics card, and the lack of dust protection design leading to dust accumulation on the fins accelerating performance degradation—all these issues restrict the cooling stability and lifespan of vertically mounted graphics cards.

[0004] Therefore, a bidirectional airflow-guided anti-backflow heatsink adapted for vertically mounted graphics cards is proposed to address the above problems. Utility Model Content

[0005] This utility model provides a bidirectional airflow anti-backflow heatsink adapted to vertically mounted graphics cards, which solves the problems of unidirectional heatsinks being easily limited by space and hot air stagnation. The bidirectional airflow design improves heat dissipation efficiency, while the anti-backflow function prevents the internal temperature of the heatsink from rising during standby, further optimizing the heat dissipation performance of the graphics card during start-up and shutdown. At the same time, the addition of a metal dust filter reduces dust accumulation on the fins, extends the maintenance cycle, and reduces the user's operating costs.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a bidirectional airflow and anti-backflow heatsink adapted to a vertically mounted graphics card, comprising a heatsink body, a bidirectional airflow component, an anti-backflow component, and a mounting and fixing mechanism. The heatsink body is fitted to the heat-generating area of ​​the vertically mounted graphics card. The bidirectional airflow component is symmetrically arranged at the upper and lower ends of the heatsink body. The anti-backflow component is embedded in the airflow channel of the bidirectional airflow component. The mounting and fixing mechanism is connected to the heatsink body and fixes the heatsink to the vertically mounted graphics card.

[0007] Preferably, the heat dissipation body includes a heat spreader, a heat dissipation fin assembly, and a thermal grease layer. One side of the heat spreader is attached to the vertically mounted graphics card through the thermal grease layer, and the other side of the heat spreader is welded and fixed to the heat dissipation fin assembly. The heat dissipation fin assembly is composed of several parallel aluminum alloy fins, and a uniform airflow gap is formed between the fins.

[0008] Preferably, the bidirectional airflow assembly includes an upper airflow guide, a lower airflow guide, and an airflow guide fan. The upper and lower airflow guides are fixed to the upper and lower ends of the heat dissipation fin assembly respectively and have a symmetrical structure. Both the upper and lower airflow guides include an airflow guide cavity and an air outlet. The airflow guide cavity has a tapered structure. The large-diameter end of the airflow guide cavity is connected to the end of the heat dissipation fin assembly. The airflow guide fan is embedded in the middle of the airflow guide cavity. The airflow guide fan in the upper airflow guide faces upward, and the airflow guide fan in the lower airflow guide faces downward, thereby realizing bidirectional airflow output.

[0009] Preferably, the anti-backflow component includes a one-way guide vane and an elastic reset member. The one-way guide vane is hinged to the inner wall of the air outlet of the airflow cavity via a rotating shaft. The elastic reset member is a torsion spring sleeved on the rotating shaft. The two ends of the elastic reset member abut against the one-way guide vane and the inner wall of the airflow cavity, respectively. When the airflow fan starts, the airflow pressure pushes the one-way guide vane to rotate around the rotating shaft, opening the airflow channel. When the fan stops or the airflow returns, the one-way guide vane resets under the action of the elastic reset member, preventing the hot airflow from flowing back to the heat dissipation fin assembly.

[0010] Preferably, the mounting and fixing mechanism includes a fixing bracket, an adjusting screw, and a buffer pad. The fixing bracket has a U-shaped structure, and both ends of the fixing bracket are connected to the two sides of the heat sink body through the adjusting screw. The buffer pad is set on the contact surface between the fixing bracket and the vertically mounted graphics card to avoid damage to the graphics card caused by the installation pressure. At the same time, the adjusting screw can be used to adapt to vertically mounted graphics cards of different thicknesses.

[0011] Preferably, the surface of the heat dissipation fins of the heat dissipation fin assembly is provided with micro-nano heat dissipation texture, wherein the micro-nano heat dissipation texture is a honeycomb-shaped pit structure, which can increase the heat dissipation area and improve the heat exchange efficiency.

[0012] Preferably, dust filters are provided at the air outlets of the upper and lower air ducts. The dust filters are made of metal mesh to prevent dust from entering the air duct cavity and heat dissipation fin assembly, thus avoiding the degradation of heat dissipation performance.

[0013] Preferably, the heat spreader has a V-shaped microchannel inside, which is filled with phase change coolant. The heat transfer efficiency of the heat spreader is improved through phase change heat absorption and circulating heat dissipation, and the heat of the graphics card core is quickly transferred to the heat dissipation fin assembly.

[0014] Preferably, the edge of the one-way guide vane is provided with a sealing strip, which is made of high-temperature resistant silicone material, which can enhance the sealing performance when the one-way guide vane is closed and improve the backflow prevention effect.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] 1. The bidirectional airflow structure uses symmetrical upper and lower airflow guides and directional fans to create efficient airflow circulation, adapt to the airflow direction of vertical installation space, avoid the formation of vortices in the chassis, and accelerate heat dissipation;

[0017] 2. The anti-backflow component's one-way guide plate and elastic reset component work together to block hot air backflow when the fan stops or is under low load, maintaining a low-temperature environment inside the heatsink. The V-shaped microchannels of the heat spreader and the phase change coolant enhance heat conduction. Combined with aluminum alloy fins with honeycomb micro-nano texture on the surface, it greatly improves heat diffusion efficiency and quickly dissipates heat from the graphics card core and surrounding areas. The overall structure is compact and easy to install. The U-shaped bracket and adjustment screw are compatible with mainstream vertical graphics cards, and the buffer pad design prevents damage to the graphics card.

[0018] 3. The product can effectively reduce the core temperature of vertically mounted graphics cards under high load, reduce performance throttling caused by overheating, extend the life of the graphics card, and provide stable heat dissipation for gaming PCs, graphics workstations and other equipment. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 In this utility model Figure 1 Enlarged schematic diagram of the structure at point A in the middle;

[0021] Figure 3 This is a side view of the overall structure of this utility model;

[0022] Figure 4 This utility model Figure 3 Enlarged schematic diagram of the structure at point B;

[0023] Figure 5 This is a schematic diagram of the structure and installation of the dustproof net in this utility model;

[0024] Figure 6 This utility model Figure 5 Enlarged schematic diagram of the structure at point C;

[0025] Figure 7 This is a bottom view of the overall structure of this utility model.

[0026] In the diagram: 1. Heatsink main body; 10. Vertically mounted graphics card; 11. Heat sink; 12. Heatsink fin assembly; 13. Thermal grease layer; 2. Bidirectional airflow guide assembly; 21. Upper airflow guide shroud; 22. Lower airflow guide shroud; 23. Airflow guide fan; 24. Airflow guide cavity; 25. Air outlet; 3. Anti-backflow assembly; 31. Unidirectional airflow guide fin; 32. Elastic reset component; 4. Mounting and fixing mechanism; 41. Fixing bracket; 42. Adjusting screw; 43. Buffer pad; 5. Dustproof mesh; 6. V-shaped microchannel; 7. Sealing strip. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] like Figures 1 to 7 As shown, this utility model provides a bidirectional airflow and anti-backflow heatsink adapted to a vertically mounted graphics card, including a heatsink body 1, a bidirectional airflow component 2, an anti-backflow component 3, and a mounting and fixing mechanism 4. The heatsink body 1 is fitted to the heat-generating area of ​​the vertically mounted graphics card 10. The bidirectional airflow component 2 is symmetrically arranged at the upper and lower ends of the heatsink body 1. The anti-backflow component 3 is embedded in the airflow channel of the bidirectional airflow component 2. The mounting and fixing mechanism 4 is connected to the heatsink body 1 and fixes the heatsink to the vertically mounted graphics card 10.

[0029] like Figures 1 to 7 As shown, the heat dissipation body 1 is attached to the heat-generating area of ​​the vertically mounted graphics card 10. The heat dissipation body 1 includes a heat dissipation plate 11, a heat dissipation fin assembly 12, and a thermal grease layer 13. One side of the heat dissipation plate 11 is attached to the vertically mounted graphics card 10 through the thermal grease layer 13, and the other side of the heat dissipation plate 11 is welded and fixed to the heat dissipation fin assembly 12. The heat dissipation fin assembly 12 is composed of several parallel aluminum alloy fins and is disposed between the contact surfaces of the heat dissipation plate and the vertically mounted graphics card 10. The thermal grease layer 13 is used to fill the microscopic gaps on the surfaces of the two, reduce the contact thermal resistance, and enable the heat generated in the heat-generating area of ​​the graphics card to be efficiently conducted to the heat dissipation plate 11, and then conducted away through the heat dissipation fin assembly 12.

[0030] It should be noted that the heat spreader 11 has a V-shaped microchannel 6 inside, which is filled with phase change coolant. The heat transfer efficiency of the heat spreader 11 is improved through phase change heat absorption and circulation heat dissipation, and the heat of the graphics card core is quickly transferred to the heat dissipation fin group 12.

[0031] It should be noted that the surface of the heat dissipation fin assembly 12 is provided with micro-nano heat dissipation texture, which is a honeycomb-shaped pit structure, which can increase the heat dissipation area and improve the heat exchange efficiency.

[0032] like Figures 1 to 7 As shown, the bidirectional airflow assembly 2 includes an upper airflow guide shroud 21, a lower airflow guide shroud 22, and an airflow guide fan 23. The upper airflow guide shroud 21 and the lower airflow guide shroud 22 are respectively fixed to the upper and lower ends of the heat dissipation fin assembly 12 and have a symmetrical structure. Both the upper airflow guide shroud 21 and the lower airflow guide shroud 22 include an airflow guide cavity 24 and an air outlet 25. The airflow guide cavity 24 has a tapered structure, and the large-diameter end of the airflow guide cavity 24 is connected to the end of the heat dissipation fin assembly 12. The airflow guide fan 23 is embedded in the middle of the airflow guide cavity 24. The airflow direction of the airflow guide fan 23 in the upper airflow guide shroud 21 is upward, and the airflow direction of the airflow guide fan 23 in the lower airflow guide shroud 22 is downward. The airflow cavity 24 adopts a tapered design, with its large-diameter end connecting to the end of the heat dissipation fin assembly 12 and its small-diameter end connecting to the air outlet 25. This structure can create an acceleration effect in the airflow cavity 24, enhance the wind speed flowing through the fin assembly, and improve the heat dissipation effect. The bidirectional air outlet design makes the airflow fan 23 in the upper airflow shroud 21 exhaust upward and the airflow fan 23 in the lower airflow shroud 22 exhaust downward, forming a bidirectional airflow circulation. This design is adapted to the installation space characteristics of the vertically mounted graphics card 10, which can effectively prevent the airflow from forming vortices in the chassis and ensure that heat is quickly discharged.

[0033] It should be noted that dust filters 5 are provided at the air outlets 25 of the upper air guide shroud 21 and the lower air guide shroud 22. The dust filters 5 are made of metal mesh. The metal dust filters 5 can effectively block dust from entering the heat sink and prevent dust accumulation on the fins from causing a decrease in heat dissipation performance.

[0034] like Figures 1 to 7 As shown, the anti-backflow component 3 includes a one-way guide vane 31 and an elastic reset member 32. The one-way guide vane 31 is hinged to the inner wall of the air outlet 25 of the guide cavity 24 via a rotating shaft. The elastic reset member 32 is a torsion spring sleeved on the rotating shaft. The two ends of the elastic reset member 32 abut against the one-way guide vane 31 and the inner wall of the guide cavity 24, respectively. The edge of the one-way guide vane 31 is provided with a sealing strip 7. The sealing strip 7 is made of high-temperature resistant silicone. When the airflow flows in the forward direction, the one-way guide vane 31 is pushed open by the airflow, and the sealing strip 7 separates from the inner wall of the guide cavity 24, allowing the airflow to pass smoothly. When the airflow flows in the reverse direction, the one-way guide vane 31 adheres to the inner wall of the guide cavity 24 under the pressure of the reverse airflow, and the sealing strip 7 fills the gap, achieving a seal and blocking the backflow channel.

[0035] like Figures 1 to 7As shown, the mounting and fixing mechanism 4 includes a fixing bracket 41, an adjusting screw 42, and a buffer pad 43. The fixing bracket 41 has a U-shaped structure. Both ends of the fixing bracket 41 are connected to the two sides of the heat sink 1 through the adjusting screw 42. The buffer pad 43 is set on the contact surface between the fixing bracket 41 and the vertically mounted graphics card 10. The fixing bracket 41 adopts a U-shaped structure design, which can be adapted to vertically mounted graphics cards 10 of different widths. Its two ends are connected to the two sides of the heat sink 1 through the adjusting screw 42, which makes it easy to adjust the fixing position according to the size of the graphics card. The adjusting screw 42 is connected to the fixing bracket 41 and the heat sink 1 through threads. Rotating the screw can adjust the distance between the fixing bracket 41 and the heat sink 1, ensuring that the heat sink 1 is in close contact with the heat-generating area of ​​the graphics card, and at the same time, it is easy to install and remove. The buffer pad 43 is set on the contact surface between the fixing bracket 41 and the vertically mounted graphics card 10. It is made of elastic material, which can effectively buffer the installation pressure, avoid damage to the surface of the graphics card due to excessive force, and enhance the stability of the fixing.

[0036] Working principle and process: The heat generated by the vertically mounted graphics card 10 in its heat-generating area is first transferred to the heat spreader 11 through the thermal grease layer 13. The phase change coolant inside the heat spreader 11 absorbs the heat and evaporates, then rapidly diffuses throughout the entire heat spreader 11 within the V-shaped microchannels 6, achieving uniform heat distribution. The heat on 11 is then transferred to the heat dissipation fin assembly 12 welded to it. The honeycomb-shaped micro-nano heat dissipation texture on the fin surface increases the contact area with air, allowing heat to quickly diffuse to the fin surface. At this time, the bidirectional airflow guide assembly 2 starts to work. The fan in the upper airflow guide shroud 21 exhausts air upwards, and the fan in the lower airflow guide shroud 22 exhausts air upwards. With the fan blowing downwards, the airflow accelerates through the heat dissipation fin assembly 12 under the action of the tapered structure of the airflow guide cavity 24, carrying away the heat from the surface of the fins. The heated airflow is then quickly discharged from the heatsink through the air outlet 25. When the graphics card is under low load and the fan speed decreases or stops, the external hot air may flow in the opposite direction. At this time, the one-way airflow guide 31 of the anti-backflow component 3, under the combined action of the reverse airflow pressure and the elastic reset component 32, tightly adheres to the inner wall of the airflow guide cavity 24. The sealing strip 7 further enhances the sealing effect, preventing hot air from flowing back and ensuring that the heatsink maintains a low temperature environment inside.

[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0038] All technical features in this embodiment can be freely combined according to actual needs.

[0039] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. A bidirectional airflow-guided anti-backflow heatsink adapted for vertically mounted graphics cards, characterized in that: The device includes a heat dissipation body (1), a bidirectional airflow guide assembly (2), an anti-backflow assembly (3), and a mounting and fixing mechanism (4). The heat dissipation body (1) is fitted to the heat-generating area of ​​the vertically mounted graphics card (10). The bidirectional airflow guide assembly (2) is symmetrically arranged at the upper and lower ends of the heat dissipation body (1). The anti-backflow assembly (3) is embedded in the airflow channel of the bidirectional airflow guide assembly (2). The mounting and fixing mechanism (4) is connected to the heat dissipation body (1) and fixes the heat sink to the vertically mounted graphics card (10).

2. The bidirectional airflow-guided anti-backflow heatsink adapted for vertically mounted graphics cards according to claim 1, characterized in that: The heat dissipation body (1) includes a heat dissipation plate (11), a heat dissipation fin assembly (12), and a thermal grease layer (13). One side of the heat dissipation plate (11) is attached to the vertically mounted graphics card (10) through the thermal grease layer (13), and the other side of the heat dissipation plate (11) is welded and fixed to the heat dissipation fin assembly (12). The heat dissipation fin assembly (12) is composed of several parallel aluminum alloy fins.

3. A bidirectional airflow-guided anti-backflow heatsink adapted for vertically mounted graphics cards according to claim 1, characterized in that: The bidirectional airflow assembly (2) includes an upper airflow shield (21), a lower airflow shield (22), and an airflow fan (23). The upper airflow shield (21) and the lower airflow shield (22) are respectively fixed at the upper and lower ends of the heat dissipation fin assembly (12) and have a symmetrical structure. The upper airflow shield (21) and the lower airflow shield (22) each include an airflow cavity (24) and an air outlet (25). The airflow cavity (24) has a tapered structure. The large diameter end of the airflow cavity (24) is connected to the end of the heat dissipation fin assembly (12). The airflow fan (23) is embedded in the middle of the airflow cavity (24). The airflow fan (23) in the upper airflow shield (21) has an upward airflow direction, and the airflow fan (23) in the lower airflow shield (22) has a downward airflow direction.

4. A bidirectional airflow-guided anti-backflow heatsink adapted for vertically mounted graphics cards according to claim 1, characterized in that: The anti-backflow component (3) includes a one-way guide vane (31) and an elastic reset member (32). The one-way guide vane (31) is hinged to the inner wall of the air outlet (25) of the guide cavity (24) via a rotating shaft. The elastic reset member (32) is fitted onto the rotating shaft with a torsion spring. The two ends of the elastic reset member (32) abut against the one-way guide vane (31) and the inner wall of the guide cavity (24) respectively.

5. A bidirectional airflow-guided anti-backflow heatsink adapted for vertically mounted graphics cards according to claim 1, characterized in that: The mounting and fixing mechanism (4) includes a fixing bracket (41), an adjusting screw (42), and a buffer pad (43). The fixing bracket (41) has a U-shaped structure. Both ends of the fixing bracket (41) are connected to the two sides of the heat dissipation body (1) through the adjusting screw (42). The buffer pad (43) is set on the contact surface between the fixing bracket (41) and the vertically mounted graphics card (10).

6. A bidirectional airflow-guided anti-backflow heatsink adapted for vertically mounted graphics cards according to claim 2, characterized in that: The surface of the heat dissipation fin group (12) is provided with micro-nano heat dissipation texture, wherein the micro-nano heat dissipation texture is a honeycomb-shaped pit structure.

7. A bidirectional airflow-guided anti-backflow heatsink adapted for vertically mounted graphics cards according to claim 3, characterized in that: The upper air guide (21) and the lower air guide (22) are provided with dustproof nets (5) at their air outlets (25), and the dustproof nets (5) are made of metal filters.

8. A bidirectional airflow-guided anti-backflow heatsink adapted for vertically mounted graphics cards according to claim 2, characterized in that: The heat spreader (11) has a V-shaped microchannel (6) inside, and the V-shaped microchannel (6) is filled with phase change coolant.

9. A bidirectional airflow-guided anti-backflow heatsink adapted for vertically mounted graphics cards according to claim 4, characterized in that: The edge of the one-way guide vane (31) is provided with a sealing strip (7), which is made of high-temperature resistant silicone material.

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