A flat computer graphene vapor chamber heat dissipation structure

Abstract

The utility model belongs to the field of the heat plate technology especially relates to a tablet computer graphene heat plate heat dissipation structure, include: the heat plate main part, the both sides of heat plate main part are equipped with the heat dissipation mouth, the inner chamber fixedly connected with a plurality of groups of heat dissipation's heat conduction plate of heat dissipation mouth, a plurality of groups The heat conduction plate between fixedly set up have the fin, the inner chamber top fixedly connected with two groups of heat dissipation plate of heat plate main part, two groups The heat dissipation plate between fixedly set up have the graphene ring for heat dissipation, the lateral wall of graphene ring is provided with the copper pipe, the copper pipe is fixedly connected with the fin, one end of heat conduction plate is provided with the inclined portion, The included angle of heat conduction plate and inclined portion is between 45 degrees to 60 degrees, compared with prior art, the utility model avoids the heat to form local accumulation in the heat plate inside, expands the heat exchange contact surface, promotes the air circulation in the heat plate inside, promotes the heat transfer and the efficiency that dissipates.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation plate technology, and particularly relates to a graphene heat dissipation plate structure for tablet computers. Background Technology

[0002] A vapor chamber for tablet computers is a heat dissipation device based on a liquid-to-vapor phase change heat transfer mechanism. It is usually made of copper, a material with high thermal conductivity, and contains a small amount of working liquid. Its core function is to achieve rapid diffusion and uniform distribution of heat through its internal structure, avoiding local overheating and thus improving the device's heat dissipation efficiency. The graphene inside the vapor chamber is mainly to enhance heat dissipation performance. Graphene has a high thermal conductivity, which accelerates the conduction of heat from the heat source to the edge of the vapor chamber, reduces thermal resistance, and improves heat dissipation efficiency.

[0003] Chinese patent publication number 202222088395.8 discloses a heat dissipation structure for a heat dissipation plate, belonging to the field of heat dissipation structure technology. It includes a heat dissipation plate body with an internal cavity. Multiple sets of support columns are evenly arranged inside the cavity, with both ends of the support columns connected to the upper and lower ends of the inner wall of the heat dissipation plate body. A heat dissipation water pipe is installed inside the cavity, and a water storage tank is installed on the side wall of the heat dissipation plate body. Both ends of the heat dissipation water pipe extend into the water storage tank, allowing liquid inside the water storage tank to enter the heat dissipation water pipe. This allows the liquid inside the heat dissipation water pipe to absorb heat from the cavity, preventing a large amount of heat from remaining inside the cavity after prolonged use and affecting the performance of the heat dissipation plate body, thus improving its performance.

[0004] However, existing technologies have the following problems when used: Existing heat dissipation structures with vapor chambers have poor heat dissipation performance within the limited internal space of equipment. Heat from the core heat-generating area is difficult to dissipate in multiple directions, and local heat accumulation is likely to form inside the vapor chamber. As a result, when electronic products generate high heat, the vapor chamber cannot dissipate heat quickly, which has a certain impact on the performance of the vapor chamber. Utility Model Content

[0005] The purpose of this utility model is to address the aforementioned technical problems by providing a graphene heat dissipation structure for a tablet computer, comprising: The heat spreader body has heat dissipation vents on both sides. Multiple sets of heat-conducting plates for heat dissipation are fixedly connected to the inner cavity of the heat dissipation vents. Heat sinks are fixedly arranged between the multiple sets of heat-conducting plates. Two sets of heat dissipation plates are fixedly connected to the top of the inner cavity of the heat spreader body. A graphene ring for heat dissipation is fixedly arranged between the two sets of heat dissipation plates. Copper tubes are arranged on the sidewalls of the graphene rings and are fixedly connected to the heat sinks.

[0006] Furthermore, one end of the heat-conducting plate is provided with an inclined portion, the angle between the heat-conducting plate and the inclined portion is between 45 degrees and 60 degrees, and the other end of the heat-conducting plate is provided with a connecting portion, the top of the connecting portion being fixedly disposed with the top of the inner cavity of the heat-spreading plate body.

[0007] Furthermore, the heat-conducting plate and the inclined portion are integrally made of copper, and a diffusion port is provided on one side of the inclined portion, which extends to the inner side of the heat-conducting plate.

[0008] Furthermore, multiple sets of the heat-conducting plates are arranged in a pattern inside the heat dissipation port (with the middle of the inner cavity of the heat dissipation port as the boundary, and the heat-conducting plates (130) on both sides of the boundary face opposite directions.

[0009] Furthermore, mounting bases are fixedly connected to both sides of the heat spreader body, and mounting holes are provided on the top of the mounting bases.

[0010] Furthermore, a heat-conducting sheet is fixedly connected to the side wall of the heat sink, and one end of the heat-conducting sheet is fixedly disposed with one end of the heat-conducting plate.

[0011] Furthermore, a connecting pipe is fixedly provided on the top of the graphene ring, and one end of the connecting pipe is fixedly provided to the top of the inner cavity of the heat spreader body.

[0012] Furthermore, the copper tube is positioned between the two sets of heat-conducting fins.

[0013] Furthermore, the heat-conducting sheet has heat dissipation holes on its sidewall.

[0014] Compared with existing technologies, the graphene vapor chamber heat dissipation structure for tablet computers described in this invention has the following advantages: By designing a combination of graphene rings, copper pipes, and heat-conducting plates, heat from the core heating area can be directed in multiple directions, preventing localized heat accumulation inside the heat spreader. By setting inclined sections and diffusers on the heat-conducting plates, the heat exchange contact area is expanded without occupying too much space. Heat dissipation holes are set on the heat-conducting plates to promote air circulation inside the heat spreader and improve heat transfer and dissipation efficiency. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a bottom view of the structure of this utility model; Figure 3 This is a structural diagram of the heat sink of this utility model; Figure 4 This is a structural diagram of the heat-conducting plate of this utility model.

[0016] The markings in the diagram are as follows: 100. Heat spreader body; 110. Mounting base; 111. Mounting hole; 120. Heat dissipation port; 130. Heat conduction plate; 131. Inclined part; 132. Diffuser; 133. Connecting part; 140. Heat sink; 150. Heat dissipation plate; 151. Heat conduction plate; 152. Heat dissipation hole; 160. Graphene ring; 161. Copper pipe; 162. Connecting pipe. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0018] It should be noted that all directional and positional terms used in this utility model, such as "up," "down," "left," "right," "front," "back," "vertical," "horizontal," "inner," "outer," "top," "lower," "lateral," "longitudinal," and "center," are only used to explain the relative positional relationships and connection arrangements between components in a specific state (as shown in the accompanying drawings). They are merely for the convenience of describing this utility model and do not require that this utility model be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this utility model. Furthermore, descriptions involving "first," "second," etc., in this utility model are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated.

[0019] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0021] like Figures 1-4 As shown, a graphene vapor chamber heat dissipation structure for a tablet computer includes: The heat spreader body 100 has heat dissipation vents 120 on both sides. Multiple sets of heat-conducting plates 130 for heat dissipation are fixedly connected to the inner cavity of the heat dissipation vents 120. Heat sinks 140 are fixedly arranged between the multiple sets of heat-conducting plates 130. Two sets of heat dissipation plates 150 are fixedly connected to the top of the inner cavity of the heat spreader body 100. Graphene rings 160 for heat dissipation are fixedly arranged between the two sets of heat dissipation plates 150. Copper pipes 161 are arranged on the side wall of the graphene rings 160 and are fixedly connected to the heat sinks 140.

[0022] As a preferred example of this utility model, the heat dissipation vents 120 on both sides of the heat dissipation plate body 100 are used to dissipate heat outwards. Multiple sets of heat-conducting plates 130 and heat sinks 140 fixed in the inner cavity of the heat dissipation vents 120 are used for heat conduction and dissipation. Two sets of heat sinks 150 at the top of the inner cavity of the heat dissipation plate body 100 can absorb the surrounding heat, and the graphene ring 160 between the two sets of heat sinks 150 can gather the heat of the heat dissipation plate body 100 and the heat sinks 150. Then, through the copper pipe 161 connected to the side wall of the graphene ring 160, the heat is conducted to the heat sink 140. Finally, the heat is dissipated to the outside through the heat dissipation vents 120 via the heat sink 140 and the heat-conducting plates 130.

[0023] In the example of this application, one end of the heat-conducting plate 130 is provided with an inclined portion 131, and the angle between the heat-conducting plate 130 and the inclined portion 131 is between 45 degrees and 60 degrees. The other end of the heat-conducting plate 130 is provided with a connecting portion 133, and the top of the connecting portion 133 is fixedly disposed with the top of the inner cavity of the heat-spreading plate body 100.

[0024] As a preferred example of this utility model, the inclined portion 131 provided at one end of the heat-conducting plate 130 has an included angle of 45 to 60 degrees to expand the contact range with air, while the connecting portion 133 at the other end of the heat-conducting plate 130 is fixedly connected to the top of the inner cavity of the heat-spreading plate body 100, so that the heat-spreading plate body 100 and the heat-conducting plate 130 can conduct heat.

[0025] In the example of this application, the heat-conducting plate 130 and the inclined portion 131 are integrally made of copper. A diffuser 132 is provided on one side of the inclined portion 131, and the diffuser 132 extends to the inner side of the heat-conducting plate 130.

[0026] As a preferred example of this utility model, the heat-conducting plate 130 and the inclined portion 131 are made of copper as a single piece, which can reduce heat loss during the conduction process and accelerate the heat transfer speed. The inclined portion 131 has a diffuser 132 that extends to the inside of the heat-conducting plate 130, which can increase the contact area between the heat-conducting plate 130 and the outside air.

[0027] In the example of this application, multiple sets of heat-conducting plates 130 are arranged in an array inside the heat dissipation port 120, with the middle of the inner cavity of the heat dissipation port 120 as the boundary, and the heat-conducting plates 130 on both sides of the boundary have opposite orientations.

[0028] As a preferred example of this utility model, multiple sets of heat-conducting plates 130 are arranged in a pattern inside the heat dissipation port 120, with the middle of the inner cavity of the heat dissipation port 120 as the boundary. The heat-conducting plates 130 on both sides face opposite directions, which can form convection inside the heat dissipation port 120. When the outside air enters the heat dissipation port 120, it will flow under the guidance of the heat-conducting plates 130 with different directions, so as to promote the heat inside the heat dissipation port 120 to fully contact and exchange with the outside air.

[0029] In the example of this application, mounting bases 110 are fixedly connected to both sides of the heat spreader body 100, and mounting holes 111 are provided on the top of the mounting bases 110.

[0030] As a preferred example of this utility model, the mounting seats 110 fixedly connected to both sides of the heat spreader body 100, and the mounting holes 111 opened on the top of the mounting seats 110, provide a way to fix the heat spreader body 100. Specifically, the heat spreader body 100 can be fixed by the cooperation of bolts with the mounting seats 110 and the mounting holes 111.

[0031] In the example of this application, a heat-conducting sheet 151 is fixedly connected to the side wall of the heat sink 150, and one end of the heat-conducting sheet 151 is fixedly disposed with one end of the heat-conducting plate 130.

[0032] As a preferred example of this utility model, the heat-conducting sheet 151 is fixedly connected to the side wall of the heat sink 150, and one end of it is fixedly connected to the heat-conducting plate 130. This allows the heat sink 150 to absorb the heat from the heat spreader body 100 and then transfer it to the heat-conducting plate 130 through the heat-conducting sheet 151. The heat-conducting plate 130 then conducts the heat to the heat dissipation port 120 and dissipates it to the outside.

[0033] In the example of this application, a connecting tube 162 is fixedly disposed on the top of the graphene ring 160, and one end of the connecting tube 162 is fixedly disposed on the top of the inner cavity of the heat spreader body 100.

[0034] As a preferred example of this utility model, a connecting pipe 162 is fixedly disposed on the top of the graphene ring 160, one end of which is fixedly connected to the top of the inner cavity of the heat spreader body 100, so that the graphene ring 160 can be fixed inside the heat spreader body 100, and part of the heat on the graphene ring 160 is conducted to the heat spreader body 100 through the connecting pipe 162.

[0035] In the example of this application, the copper tube 161 is disposed between two sets of heat-conducting plates 151.

[0036] As a preferred example of this utility model, the copper pipe 161 is placed between the two sets of heat-conducting plates 151, so that the copper pipe 161 can exchange heat with the heat-conducting plates 151 on both sides at the same time. When the heat on the graphene ring 160 is transferred to the copper pipe 161, the copper pipe 161 can transfer the heat to the heat-conducting plates 151 on both sides, and then the heat-conducting plates 151 conduct the heat to the corresponding heat-conducting plate 130, thereby expanding the heat dissipation range.

[0037] In the example of this application, heat dissipation holes 152 are provided on the sidewall of the heat-conducting sheet 151.

[0038] As a preferred example of this utility model, heat dissipation holes 152 are opened on the side wall of the heat-conducting plate 151, which increases the surface area of ​​the heat-conducting plate 151 and increases the contact area between the heat-conducting plate 151 and the air inside the heat-spreading plate body 100. The heat dissipation holes 152 can promote the circulation of air inside the heat-spreading plate body 100 and allow air to flow around the heat-conducting plate 151.

[0039] In practical use, the heat spreader body 100 is fixedly assembled with the tablet computer via mounting bases 110 fixedly connected to its two sides and mounting holes 111 opened on the top of the mounting bases 110. After the heat enters the interior of the heat spreader body 100, a portion of it is first absorbed by two sets of heat dissipation plates 150 fixedly connected to the top of the inner cavity of the heat spreader body 100. The heat-conducting fins 151 fixedly connected to the side walls of the heat dissipation plates 150 transfer the absorbed heat to the heat-conducting plate 130 fixedly connected to one end. The heat-conducting plate 130 is connected to the inner cavity of the heat spreader body 100 via the connecting part 133 at the other end. The top is fixed, and the heat is discharged through the inclined part 131 in the heat conduction plate 130 and through the diffuser 132. Some of the heat is absorbed by the graphene ring 160 fixed between the two heat dissipation plates 150. The graphene ring 160 is fixed to the top of the inner cavity of the heat spreader body 100 through the connecting pipe 162 fixed at the top. The copper pipe 161 on its side wall transfers the heat to the heat dissipation vent 120 and the heat dissipation fins 140 fixed between the multiple heat conduction plates 130. Finally, the heat is discharged to the outside through the heat conduction plate 130 and the heat dissipation fins 140 in the heat dissipation vent 120.

[0040] The embodiments of this application have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A graphene vapor chamber heat dissipation structure for a tablet computer, characterized in that, include: A heat spreader body (100) has heat dissipation vents (120) on both sides. Multiple sets of heat-conducting plates (130) for heat dissipation are fixedly connected to the inner cavity of the heat dissipation vents (120). Heat sinks (140) are fixedly arranged between the multiple sets of heat-conducting plates (130). Two sets of heat dissipation plates (150) are fixedly connected to the top of the inner cavity of the heat spreader body (100). Graphene rings (160) for heat dissipation are fixedly arranged between the two sets of heat dissipation plates (150). Copper tubes (161) are arranged on the sidewalls of the graphene rings (160). The copper tubes (161) are fixedly connected to the heat sinks (140).

2. The graphene heat dissipation structure for a tablet computer according to claim 1, characterized in that, One end of the heat-conducting plate (130) is provided with an inclined portion (131), and the angle between the heat-conducting plate (130) and the inclined portion (131) is between 45 degrees and 60 degrees. The other end of the heat-conducting plate (130) is provided with a connecting portion (133), and the top of the connecting portion (133) is fixedly disposed with the top of the inner cavity of the heat-spreading plate body (100).

3. The graphene vapor chamber heat dissipation structure for a tablet computer according to claim 2, characterized in that, The heat-conducting plate (130) and the inclined part (131) are made of copper metal. A diffuser (132) is provided on one side of the inclined part (131), and the diffuser (132) extends to the inside of the heat-conducting plate (130).

4. The graphene heat dissipation structure for a tablet computer according to claim 3, characterized in that, Multiple sets of heat-conducting plates (130) are arranged in an array inside the heat dissipation port (120), with the middle of the inner cavity of the heat dissipation port (120) as the boundary, and the heat-conducting plates (130) on both sides of the boundary have opposite orientations.

5. The graphene heat dissipation structure for a tablet computer according to claim 1, characterized in that, Both sides of the heat spreader body (100) are fixedly connected to mounting bases (110), and the top of the mounting base (110) is provided with mounting holes (111).

6. The graphene heat dissipation structure for a tablet computer according to claim 1, characterized in that, A heat-conducting sheet (151) is fixedly connected to the side wall of the heat sink (150), and one end of the heat-conducting sheet (151) is fixedly disposed with one end of the heat-conducting plate (130).

7. The graphene heat dissipation structure for a tablet computer according to claim 1, characterized in that, A connecting tube (162) is fixedly installed on the top of the graphene ring (160), and one end of the connecting tube (162) is fixedly installed on the top of the inner cavity of the heat spreader body (100).

8. The graphene vapor chamber heat dissipation structure for a tablet computer according to claim 6, characterized in that, The copper tube (161) is disposed between the two sets of heat-conducting plates (151).

9. The graphene vapor chamber heat dissipation structure for a tablet computer according to claim 6, characterized in that, The heat-conducting sheet (151) has heat dissipation holes (152) on its side wall.

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