A cooling device for a server

Abstract

The utility model discloses a cooling device for server, including cooling machine case, the inside division of cooling machine case is filled with cooling liquid area and heat dissipation area, the front recess of cooling machine case forms a plurality of installation sites, and the installation site is soaked in the cooling liquid filled area, and the server is installed in the installation site, and the server includes the cold plate, is equipped with the liquid inlet plug and the liquid outlet plug on the cold plate, is equipped with the liquid inlet and the liquid outlet in the installation site, and the liquid inlet is connected with the liquid distribution pipe, and is equipped with the cooling pump on the liquid distribution pipe, and the cooling pump is connected with the cooling liquid filled area, and the liquid outlet is connected with the liquid collecting pipe, and is equipped with the heat dissipation coil pipe in the heat dissipation area, and the heat dissipation coil pipe one end is connected with the liquid collecting pipe another end and is connected with the cooling liquid filled area, the utility model discloses the cooling pump pumps the cooling medium into the cold plate and exchanges heat, and carries away most of the heat of server, and the residual heat is directly conducted to the cooling liquid filled area through the installation site wall surface and exchanges heat medium, realizes the immersion environment to combine the cold plate cooling, and ensures the server effective, prolongs the hardware life.

Description

Technical Field

[0001] This utility model relates to the field of server technology, specifically to a cooling device for servers. Background Technology

[0002] In the digital age, online consultation management systems are increasingly reliant on server clusters. These systems often face periodic traffic peaks, such as peak periods for educational consultations at the start of the school year and surges in traffic related to college application after the national college entrance examination. To cope with traffic fluctuations, it is necessary to flexibly increase or decrease the number of servers to achieve dynamic matching of cluster computing power, which places extremely high demands on the adaptability of the server cooling system.

[0003] Traditional server cooling solutions primarily rely on air cooling, which depends on the server's built-in cooling fans and the data center's air conditioning system. Forced airflow removes the heat generated by electronic components (such as CPU, memory, and hard drive). However, cooling fans have relatively low heat dissipation efficiency and limited ability to dissipate localized heat, easily creating temperature gradients inside the server. This can lead to localized overheating around components with high heat flux density, accelerating hardware aging and shortening the server's lifespan over the long term. Summary of the Invention

[0004] The main objective of this invention is to overcome the deficiencies of the prior art and provide a cooling device for servers.

[0005] To achieve the above objectives, this utility model proposes a cooling device for a server, including a cooling chassis. The interior of the cooling chassis is divided into a coolant filling area and a heat dissipation area by a partition plate. Several mounting positions are recessed from the front of the cooling chassis inward, and the mounting positions are immersed in the coolant filling area. The server is removably mounted in the mounting positions. The server includes a cold plate and a support frame. The cold plate is disposed on the support frame and is connected to an inlet plug and an outlet plug, respectively. Each mounting position is provided with an inlet port and an outlet port corresponding to the inlet plug and the outlet plug. The inlet port is connected to a distribution pipe, and a cooling pump is connected to the distribution pipe. The inlet end of the cooling pump is connected to the coolant filling area, and the outlet port is connected to a collection pipe. A heat dissipation coil is provided in the heat dissipation area. The inlet of the heat dissipation coil is connected to the collection pipe, and the outlet of the heat dissipation coil is connected to the coolant filling area.

[0006] To further optimize the technical solution, the bottom end of the support frame is provided with a sliding groove, and the bottom surface of the mounting position is provided with a guide rail corresponding to the sliding groove.

[0007] To further optimize the technical solution, the slide groove is equipped with several rollers.

[0008] To further optimize the technical solution, the liquid distribution pipe is connected to the liquid inlet via a liquid inlet branch pipe, and a valve is provided on the liquid inlet branch pipe.

[0009] To further optimize the technical solution, the heat dissipation coil is fitted with several heat dissipation fins.

[0010] To further optimize the technical solution, a cooling fan is provided above the heat dissipation fins.

[0011] To further optimize the technical solution, ventilation openings are provided on the side walls of the cooling box corresponding to the heat dissipation area.

[0012] To further optimize the technical solution, the cooling box is provided with a coolant inlet and a coolant outlet that are connected to the coolant filling area.

[0013] To further optimize the technical solution, the support frame is provided with a front panel, and the front panel is provided with a handle.

[0014] To further optimize the technical solution, a service interface is provided on the front panel.

[0015] The beneficial effects of this utility model include: by drawing the cooling medium from the coolant filling area into the cold plate through a cooling pump for circulating heat exchange, most of the heat generated by the electronic components is removed. The residual heat generated by the server and the heat absorbed by the cold plate are directly conducted to the heat exchange medium in the coolant filling area through the wall of the mounting position. This achieves immersion environment combined with directional cooling by the cold plate, ensuring a uniform temperature field inside the server, avoiding local overheating, and thus extending the life of the hardware. Attached Figure Description

[0016] Figure 1 This is an overall schematic diagram of the cooling device in an embodiment of this utility model.

[0017] Figure 2 This is a schematic diagram of the interior of the cooling box in an embodiment of this utility model.

[0018] Figure 3 This is a schematic diagram from the perspective of the server in an embodiment of this utility model.

[0019] Figure 4 This is a schematic diagram of the server from another perspective in an embodiment of this utility model.

[0020] Reference numerals: 1 Cooling chassis; 2 Partition plate; 3 Coolant filling area; 4 Heat dissipation area; 5 Mounting position; 6 Server; 7 Cold plate; 8 Support frame; 9 Inlet plug; 10 Outlet plug; 11 Inlet port; 12 Outlet port; 13 Distributor pipe; 14 Cooling pump; 15 Collector pipe; 16 Radiator coil; 17 Slide rail; 18 Guide rail; 19 Roller; 20 Inlet branch pipe; 21 Valve; 22 Heat dissipation fins; 23 Cooling fan; 24 Vent; 25 Coolant filler port; 26 Coolant drain port; 27 Front panel; 28 Handle; 29 Service interface; 30 Electronic components. Detailed Implementation

[0021] To make the technical problems, technical solutions, and beneficial effects of the embodiments of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0022] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as "connected to" another component, it can be directly connected to or indirectly connected to that other component. Furthermore, a connection can be for both fixing and circuit connection purposes.

[0023] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0025] Please see Figures 1 to 4This embodiment discloses a cooling device for a server, including a cooling chassis 1. Inside the cooling chassis 1, a horizontally arranged partition 2 divides the space into a coolant filling area 3 and a heat dissipation area 4. A plurality of mounting positions 5 are recessed from the front of the cooling chassis 1 inwards, and these mounting positions 5 are immersed in the coolant filling area 3. A server 6 is removably mounted in one of the mounting positions 5. The server 6 includes a cold plate 7 and a support frame 8. The cold plate 7 is vertically mounted on the support frame 8. An inlet plug 9 and an outlet plug 10 are respectively connected to the tail end of the cold plate 7. An inlet port 11 and an outlet port 12 corresponding to the inlet plug 9 and outlet plug 10 are provided in the mounting positions 5. When the server 6 is inserted and installed... After installation in position 5, the liquid outlet plug 10 is inserted into the liquid inlet 11 for connection. The liquid outlet plug 10 is also inserted into the liquid outlet 12 for connection. The liquid inlet 11 passes through the back of installation position 5 and connects to the distribution pipe 13 via the liquid inlet branch pipe 20. Each liquid inlet branch pipe 20 is equipped with a valve 21, which is a shut-off valve. A cooling pump 14 is connected to the distribution pipe 13. The inlet of the cooling pump 14 is connected to the coolant filling area 3. The liquid outlet 12 passes through the back of installation position 5 and connects to the collecting pipe 15. A cooling coil 16 is installed in the heat dissipation area 4. The inlet of the cooling coil 16 is connected to the collecting pipe 15, and the outlet of the cooling coil 16 is connected to the coolant filling area 3. Specifically, the interior of the cold plate 7 features a microchannel design, allowing heat conduction through the circulation of cooling medium. Various electronic components 30 of the server 6, such as the CPU, power supply, memory, hard drive, and motherboard, are mounted on the sidewall of the cold plate 7. The coolant filling area 3 is located below the heat dissipation area 4, with an open top. The coolant filling area 3 is filled with liquid cooling medium. The cooling pump 14 is submerged within the coolant filling area 3, and its outlet is connected to the distribution pipe 13. Driven by the cooling pump 14, the cooling medium in the coolant filling area 3 flows along the distribution pipe 13, the inlet port 11, and the inlet plug 9 into the cold plate 7 of the server 6 to exchange heat with the various electronic components 30. After heat exchange, the cooling medium exits through the outlet plug 10 and the outlet port 11. 2. The liquid collection pipe 15 enters the heat dissipation coil 16 to exchange heat with the outside atmosphere, dissipating the heat to the outside of the cooling device. The cooled medium returns to the coolant filling area 3 to continue circulating. The liquid inlet plug 9 and liquid inlet port 11 are a set of UQD quick-release connectors, and the liquid outlet plug 10 and liquid outlet port 12 are also a set of UQD quick-release connectors. They can automatically connect after plugging and automatically close after unplugging. There are 8 sets of mounting positions 5. The mounting position 5 is a rectangular cavity structure with an open front. It is made of a metal material with high thermal conductivity, such as aluminum alloy, and welded to the side wall of the cooling chassis 1. Except for the front, the other 5 sides of the rectangular cavity are immersed in the coolant filling area 3. When the server 6 is installed in the mounting position 5, the heat generated by its operation is dissipated by heat exchange between the inner wall of the mounting position 5 and the coolant in the coolant filling area 3.

[0026] In this embodiment, when the online consultation management system needs to add or remove servers 6 to cope with periodic traffic peaks during the school season and college application period, the servers 6 are modularly installed on the mounting position 5 of the cooling chassis 1. The servers 6 do not need to carry independent cooling fans or other heat dissipation components, nor do they need to drain the coolant from the entire cooling chassis 1, which effectively improves operation and maintenance efficiency and saves energy. The cooling medium in the coolant filling area 3 is drawn into the cold plate 7 by the cooling pump 14 for circulation and heat exchange, which removes most of the heat generated by the CPU, memory and other heat-generating electronic components 30. The residual heat generated by the servers 6 and the heat absorbed by the cold plate 7 are directly conducted to the heat exchange medium in the coolant filling area 3 through the wall of the mounting position 5. The immersion environment combined with the directional cooling of the cold plate 7 ensures a uniform internal temperature field of the servers 6, avoids local overheating, and thus extends the hardware life.

[0027] In a preferred embodiment, a groove 17 is provided at the bottom of the support frame 8, and a guide rail 18 corresponding to the groove 17 is provided on the bottom surface of the mounting position 5. Specifically, there are two sets of grooves 17 and guide rails 18. When the server 6 is inserted into the mounting position 5, the guide rail 18 engages with the groove 17 to provide precise physical guidance, ensuring that the liquid inlet plug 9 and liquid inlet port 11, as well as the liquid outlet plug 10 and liquid outlet port 12, can be precisely aligned.

[0028] In a preferred embodiment, a plurality of rollers 19 are provided in the slide groove 17. When the server 6 is inserted into the mounting position 5, the wheel surface of the rollers 19 rotates on the rail surface of the guide rail 18, which transforms the sliding friction between the slide groove 17 and the guide rail 18 into rolling friction, making it easier and smoother for the server 6 to be inserted into or removed from the mounting position 5.

[0029] In a preferred embodiment, a plurality of heat dissipation fins 22 are fitted on the heat dissipation coil 16. The heat dissipation fins 22 are made of aluminum. The heat dissipation fins 22 can increase the heat dissipation area and improve the heat dissipation efficiency of the entire heat dissipation coil 16, effectively dissipating the heat generated by the server 6 to the outside of the cooling device.

[0030] In a preferred embodiment, a cooling fan 23 is provided above the heat dissipation fins 22, and a vent 24 is provided on the side wall corresponding to the cooling box 1 and the heat dissipation area 4. The cooling fan 23 generates a forced airflow, and the external air is quickly drawn over the surface of the heat dissipation fins 22 through the vent 24, which increases the airflow speed, breaks up the stagnant hot air layer, and further improves the heat dissipation efficiency.

[0031] In a specific example, the cooling housing 1 is provided with a coolant inlet 25 and a coolant outlet 26, both connected to the coolant filling area 3. The coolant inlet 25 is located at the top of the cooling housing 1, and the coolant outlet 26 is located at the bottom of the cooling housing 1. Coolant is added to the coolant filling area 3 from the top through the coolant inlet 25. When the coolant needs to be replaced or maintained, the coolant outlet 26 is opened, and the liquid coolant is discharged under gravity.

[0032] In a preferred embodiment, a front panel 27 is provided on the front of the support frame 8. The front panel 27 has a handle 28 and a service interface 29. The service interface 29 is electrically connected to electronic components 30 mounted on the side wall of the cold plate 7. The service interface 29 includes electrical interfaces such as VGA, USB, and network management ports. During expansion and maintenance operations, operators can easily install or remove the server 6 from the mounting position 5 by holding the handle 28, improving operational efficiency. The centralized arrangement of the service interfaces 29 on the front panel 27 facilitates network configuration, system debugging, or emergency operations for maintenance personnel.

[0033] The above description, in conjunction with specific / preferred embodiments, provides a further detailed explanation of the present invention and should not be construed as limiting the specific implementation of the present invention to these descriptions. For those skilled in the art, various substitutions or modifications can be made to these described embodiments without departing from the concept of the present invention, and all such substitutions or modifications should be considered within the protection scope of the present invention. In the description of this specification, the reference to terms such as "an embodiment," "some embodiments," "preferred embodiment," "example," "specific example," or "some examples," etc., indicates that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials, or characteristics can be combined in a suitable manner in any one or more embodiments or examples. Without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification and the features of different embodiments or examples. Although embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations may be made herein without departing from the scope of protection of the patent application.

Claims

1. A cooling device for a server, characterized in that: The system includes a cooling enclosure, the interior of which is divided into a coolant filling area and a heat dissipation area by a partition plate. Several mounting positions are recessed from the front of the cooling enclosure and are immersed in the coolant filling area. The server is removably mounted in each mounting position. The server includes a cold plate and a support frame. The cold plate is mounted on the support frame and has an inlet and an outlet connector connected to it. Each mounting position has an inlet and an outlet corresponding to the inlet and outlet connectors. The inlet connector is connected to a distribution pipe, which is connected to a cooling pump. The inlet of the cooling pump is connected to the coolant filling area, and the outlet connector is connected to a collection pipe. The heat dissipation area has a heat dissipation coil, the inlet of which is connected to the collection pipe, and the outlet of which is connected to the coolant filling area.

2. The cooling device as described in claim 1, characterized in that: The bottom end of the support frame is provided with a sliding groove, and the bottom surface of the mounting position is provided with a guide rail corresponding to the sliding groove.

3. The cooling device as described in claim 2, characterized in that: The chute is equipped with several rollers.

4. The cooling device as described in claim 3, characterized in that: The liquid distribution pipe is connected to the liquid inlet via a liquid inlet branch pipe, and a valve is provided on the liquid inlet branch pipe.

5. The cooling device as described in claim 4, characterized in that: The heat dissipation coil is fitted with several heat dissipation fins.

6. The cooling device as described in claim 5, characterized in that: A cooling fan is provided above the heat dissipation fins.

7. The cooling device as described in claim 6, characterized in that: The cooling box has ventilation openings on the side wall corresponding to the heat dissipation area.

8. The cooling device as described in claim 7, characterized in that: The cooling unit is provided with a coolant inlet and a coolant outlet that are connected to the coolant filling area.

9. The cooling device as described in claim 8, characterized in that: The support frame has a front panel on its front side, and a handle is provided on the front panel.

10. The cooling device as claimed in claim 9, characterized in that: The front panel is equipped with a service interface.

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