Pressure feedback touchpad and electronic device

Abstract

The utility model discloses a kind of pressure feedback touchpad and electronic equipment, belong to touchpad technical field.The pressure feedback touchpad includes fixed support, pressure acquisition sensor, electromagnetic drive module and mainboard;Pressure acquisition sensor is located on fixed support, pressure acquisition sensor is electrically connected with mainboard, and is provided with elastic member in the first direction;Electromagnetic drive module includes moving iron, armature and coil, moving iron is located on the first board surface of mainboard or fixed support, armature is made of multiple mutually insulated silicon steel sheet and is stacked, armature is located on fixed support or mainboard, coil is wound on multiple silicon steel sheet, coil is electrically connected with mainboard, to drive mainboard vibration along second direction.The utility model embodiment provides a kind of pressure feedback touchpad and electronic equipment, not only can realize the feedback of transverse vibration, enough magnetic force can also be generated, vibration amount is big, to simulate real mechanical pressing feeling, improve user experience.

Description

Technical Field

[0001] This utility model belongs to the field of touch panel technology, specifically relating to a pressure feedback touch panel and electronic device. Background Technology

[0002] With the widespread adoption of mobile work and portable electronic devices, users' demands for human-computer interaction experiences are constantly increasing. Traditional mechanical button-type touchpads, due to their inherent drawbacks such as complex structure, easy wear and tear, and slow response, can no longer meet modern users' needs for thinner, lighter, and more efficient interaction. Pressure feedback touchpads, as a new type of interaction solution, detect the user's pressure and provide tactile feedback to achieve a more sensitive and intuitive operating experience, and have become an important development direction for high-end laptops and peripherals.

[0003] However, the electromagnetic drive module in existing pressure feedback touchpads is limited by space, and its magnetic flux density is often low and hysteresis loss is large, which makes it impossible to generate sufficient magnetic force and vibration, making it difficult to simulate the real mechanical pressing feeling and weakening the user experience. Utility Model Content

[0004] In view of the above-mentioned defects or improvement needs of the existing technology, this utility model provides a pressure feedback touch panel and electronic device, the purpose of which is to not only realize the feedback of lateral vibration, but also generate sufficient magnetic force and large vibration, thereby simulating the real mechanical pressing feeling and improving the user experience.

[0005] To achieve the above objectives, in a first aspect, the present invention provides a pressure feedback touch panel, which includes a fixed bracket, a pressure acquisition sensor, an electromagnetic drive module, and a motherboard. The pressure acquisition sensor is located on the fixed bracket, the pressure acquisition sensor is electrically connected to the motherboard, and an elastic element is clamped in the first direction; The electromagnetic drive module includes a moving iron, an armature, and a coil. The moving iron is located on the first surface of the main board or the fixed bracket. The armature is made of multiple mutually insulated silicon steel sheets stacked together. The armature is located on the first surface of the fixed bracket or the main board and is opposite to the moving iron. The coil is wound on the multiple silicon steel sheets and is electrically connected to the main board so that after the coil is energized, it magnetizes the moving iron in a second direction and drives the main board to vibrate in the second direction.

[0006] Optionally, the pressure feedback touch panel includes a cantilever bracket, which is located between the motherboard and the fixed bracket and is fixed to the fixed bracket. The pressure acquisition sensor is located on the cantilever bracket, and the moving iron or the armature is located on the cantilever bracket.

[0007] Optionally, the moving iron or the armature can be movably mounted on the cantilever bracket to adjust the distance between the moving iron and the armature.

[0008] Optionally, the cantilever bracket is provided with a threaded hole, the moving iron or the armature is provided with a through hole, a connecting bolt is inserted into the cantilever bracket, the connecting bolt is arranged with a gap between it and the through hole, and the connecting bolt is locked in the threaded hole after passing through the through hole.

[0009] Optionally, the pressure sensor is attached to the fixed bracket by a hot-pressing process.

[0010] Optionally, the moving iron is located on the fixed bracket, and the armature is located on the first plate surface of the main board.

[0011] Optionally, the thickness of each of the silicon steel sheets in the first direction is 0.2-0.3 mm.

[0012] Optionally, the pressure feedback touchpad further includes a cover plate, which is adhered to the second surface of the motherboard.

[0013] Optionally, the cover plate is made of glass, PET, or a composite material.

[0014] Secondly, the present invention provides an electronic device, the electronic device comprising a housing and a pressure feedback touch panel as described in the first aspect, wherein the fixing bracket is fixed on the housing.

[0015] The aforementioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0016] In summary, the beneficial effects of the above-described technical solutions conceived by this utility model compared with the prior art include: In the pressure feedback touchpad provided in this embodiment of the invention, the fixed bracket is a supporting component of the entire structure, providing support for the pressure sensor, electromagnetic drive module, and motherboard. During use, pressing the motherboard with a finger transmits the pressure to the pressure sensor via an elastic element. The pressure sensor then transmits the collected pressure signal back to the motherboard, which generates a corresponding current signal and transmits it to the coil. The coil then generates an alternating magnetic field, which is constrained by the armature, magnetizing the moving iron laterally. This causes the armature or moving iron to move laterally relative to the fixed bracket, thereby moving the motherboard laterally and ultimately creating vibration feedback perceived by the human body.

[0017] Furthermore, since the armature is made of multiple mutually insulated silicon steel sheets stacked together, the resistivity of the iron core can be increased, and the silicon steel sheets are easily magnetized. In addition, the silicon steel sheets are insulated from each other (for example, by coating the surface with insulating varnish), which confines the eddy currents between the narrow silicon steel sheets. The circuit resistance is very high, the eddy currents are greatly reduced, and the iron loss is low, thereby reducing the energy consumption caused by heat generation. This increases the magnetic flux density while reducing hysteresis loss, which can generate sufficient magnetic force and large vibration. Ultimately, it can simulate the real mechanical pressing sensation and improve the user experience.

[0018] In other words, the pressure feedback touchpad provided in this embodiment of the utility model can not only realize lateral vibration feedback, but also generate sufficient magnetic force and a large amount of vibration, thereby simulating the real mechanical pressing sensation and improving the user experience. Attached Figure Description

[0019] Figure 1 This is an exploded view of a pressure feedback touch panel provided in an embodiment of this utility model; Figure 2 This is an exploded view of another pressure feedback touch panel provided in this embodiment of the utility model.

[0020] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically: 1. Fixed bracket; 2. Pressure acquisition sensor; 3. Electromagnetic drive module; 31. Moving iron; 32. Armature; 33. Coil; 34. Connector; 4. Main board; 5. Elastic component; 6. Cantilever bracket; 7. Cover plate. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model. Furthermore, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0022] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0024] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0026] Example: Figure 1 This is an exploded view of a pressure feedback touchpad provided in an embodiment of this utility model, as shown below. Figure 1 As shown, the pressure feedback touch panel includes a fixed bracket 1, a pressure acquisition sensor 2, an electromagnetic drive module 3, and a main board 4 (i.e., a circuit board).

[0027] The pressure sensor 2 is located on the fixed bracket 1. The pressure sensor 2 is electrically connected to the motherboard 4 (i.e., signal transmission is performed through a cable or connector), and an elastic element 5 is clamped in the first direction (Z-axis direction).

[0028] The electromagnetic drive module 3 includes a moving iron 31, an armature 32, and a coil 33. The moving iron 31 is located on the first plate surface (i.e., the bottom surface) of the main board 4 or on the fixed bracket 1. The armature 32 is made of multiple mutually insulated silicon steel sheets stacked together. The armature 32 is located on the fixed bracket 1 or the first plate surface of the main board 4 and is opposite to the moving iron 31. The coil 33 is wound on multiple silicon steel sheets and is electrically connected to the main board 4 so that after the coil 33 is energized, it magnetizes the moving iron 31 in the second direction (X-axis direction or Y-axis direction) and drives the main board 4 to vibrate in the second direction.

[0029] The main board 4 is located above the fixed bracket 1. When the moving iron 31 is located on the first surface of the main board 4, the armature 32 is located on the fixed bracket 1. At this time, the coil 33 and the main board 4 can be electrically connected through the connector 34 (see...). Figure 1 When the moving iron 31 is located on the fixed bracket 1, the armature 32 is located on the first plate surface of the main board 4 (see...). Figure 2 ).

[0030] In the pressure feedback touchpad provided in this embodiment of the invention, the fixed bracket 1 is the supporting component of the entire structure, providing support for the pressure acquisition sensor 2, the electromagnetic drive module 3, and the main board 4. During use, pressing the main board 4 with a finger transmits the pressure to the pressure acquisition sensor 2 via the elastic element 5. The pressure acquisition sensor 2 then transmits the acquired pressure signal back to the main board 4, which generates a corresponding current signal and transmits it to the coil 33. The coil 33 generates an alternating magnetic field, which is constrained by the armature 32, magnetizing the moving iron 31 laterally. This causes the armature 32 or the moving iron 31 to move laterally relative to the fixed bracket 1, thereby driving the main board 4 to move laterally, ultimately creating vibration feedback perceived by the human body.

[0031] Furthermore, since the armature 32 is made of multiple mutually insulated silicon steel sheets stacked together, the resistivity of the iron core can be increased, and the silicon steel sheets are easy to magnetize. In addition, the silicon steel sheets are mutually insulated (for example, by coating the surface with insulating varnish), which confines the eddy currents between the narrow silicon steel sheets. The circuit resistance is very high, the eddy currents are greatly reduced, and the iron loss is low, thereby reducing the energy consumption caused by heat generation. This increases the magnetic flux density while reducing hysteresis loss, which can generate sufficient magnetic force and large vibration. Ultimately, it can simulate the real mechanical pressing sensation and improve the user experience.

[0032] In other words, the pressure feedback touchpad provided in this embodiment of the utility model can not only realize lateral vibration feedback, but also generate sufficient magnetic force and a large amount of vibration, thereby simulating the real mechanical pressing sensation and improving the user experience.

[0033] For example, the moving iron 31 can be made of 430 stainless steel. There can be multiple elastic elements 5, which are arranged at intervals. The elastic elements 5 can be rubber pads or silicone pads.

[0034] For example, there can be multiple pressure acquisition sensors 2, arranged at intervals.

[0035] It is easy to understand that the electromagnetic drive module 3 provided by this utility model uses materials such as armature 32 and moving iron 31, rather than permanent magnets. Therefore, this utility model only generates a magnetic field when it is working, which can effectively avoid the problem of constantly generating a magnetic field and interfering with other devices.

[0036] For example, the thickness of each silicon steel sheet in the first direction is 0.2-0.3 mm, thereby avoiding excessive thickness of the silicon steel sheet and thus increasing hysteresis loss.

[0037] In one implementation of this utility model, the pressure feedback touch panel includes a cantilever bracket 6, which is located between the main board 4 and the fixed bracket 1. The cantilever bracket 6 is fixed on the fixed bracket 1, the pressure acquisition sensor 2 is located on the cantilever bracket 6, and the moving iron 31 or armature 32 is located on the cantilever bracket 6.

[0038] In the above embodiments, the cantilever bracket 6 can conveniently support the pressure acquisition sensor 2 and the moving iron 31 (or armature 32) respectively, and physically separate the two to avoid mutual interference.

[0039] For example, the cantilever bracket 6 has multiple spaced-apart clearance holes and clearance notches, which not only reduces weight but also effectively lowers costs. Furthermore, the pressure sensor 2 can be attached to the cantilever bracket 6 using a hot-pressing process, minimizing space requirements.

[0040] Furthermore, the moving iron 31 or the armature 32 can be movably mounted on the cantilever bracket 6 to adjust the distance between the moving iron 31 and the armature 32.

[0041] It is easy to understand that by movably mounting the moving iron 31 or the armature 32 on the cantilever bracket 6, the distance between the moving iron 31 and the armature 32 can be adjusted. This not only allows for flexible installation of the moving iron 31 or the armature 32, increasing the convenience of installation, but also allows for flexible adjustment of the distance between the moving iron 31 and the armature 32 according to the weight of the motherboard 4 or feedback requirements, thereby adjusting the magnetic field parameters, adapting to motherboards 4 of different specifications, and thus achieving differentiated design.

[0042] For example, the gap between the moving iron 31 and the armature 32 can be 0.2-0.6mm to accommodate different motherboards 4.

[0043] Specifically, the cantilever bracket 6 is provided with a threaded hole, the moving iron 31 or the armature 32 is provided with a through hole, and a connecting bolt (not shown in the figure) is inserted into the cantilever bracket 6. The connecting bolt is arranged with a gap between it and the through hole, and the connecting bolt is locked in the threaded hole after passing through the through hole. Thus, after the adjustment is completed, the moving iron 31 or the armature 32 can be locked by the connecting bolt. When further adjustment is needed, the connecting bolt can be loosened.

[0044] It should be noted that in other embodiments of this utility model, the movable iron 31 or armature 32 can also be installed on the cantilever bracket 6 by means of a clamp or other structure, and this utility model does not limit this.

[0045] In another implementation of this utility model, the pressure acquisition sensor 2 is directly attached to the fixed bracket 1 via a hot-pressing process (i.e., no cantilever bracket is required, see...). Figure 2 This avoids the need for cantilever brackets, thereby reducing the number of parts, reducing stacking thickness, and further reducing the overall size. In this case, the moving iron 31 or armature 32 is also directly mounted on the fixed bracket 1.

[0046] Preferably, the moving iron 31 is located on the fixed bracket 1, and the armature 32 is located on the first plate surface of the main plate 4 (see...). Figure 2 ).

[0047] It is easy to understand that the armature 32 is directly fixed to the motherboard 4, and the coil 33 on the armature 32 does not need to be electrically connected to the motherboard 4 using a connector, thereby reducing costs. At this time, the coil 33 can be directly soldered to the motherboard 4. The armature 32 can be fixed to the motherboard 4 by bolts, adhesive, or soldering, while the moving iron 31 can also be fixed to the fixed bracket 1 by connecting bolts, so as to achieve flexible adjustment of the moving iron 31 on the fixed bracket 1.

[0048] In this embodiment, the pressure feedback touch panel also includes a cover plate 7, which is adhered to the second surface (i.e., the top surface) of the main board 4. The cover plate 7 can cover and protect the main board 4.

[0049] For example, the cover plate 7 is made of glass, PET (polyethylene terephthalate), or a composite material.

[0050] This utility model embodiment also provides an electronic device, which includes a housing and the aforementioned pressure feedback touch panel, with a fixing bracket 1 fixed on the housing.

[0051] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A pressure feedback touchpad, characterized in that, The pressure feedback touch panel includes a fixed bracket, a pressure acquisition sensor, an electromagnetic drive module, and a motherboard; The pressure acquisition sensor is located on the fixed bracket, the pressure acquisition sensor is electrically connected to the motherboard, and an elastic element is clamped in the first direction; The electromagnetic drive module includes a moving iron, an armature, and a coil. The moving iron is located on the first surface of the main board or the fixed bracket. The armature is made of multiple mutually insulated silicon steel sheets stacked together. The armature is located on the first surface of the fixed bracket or the main board and is opposite to the moving iron. The coil is wound on the multiple silicon steel sheets and is electrically connected to the main board so that after the coil is energized, it magnetizes the moving iron in a second direction and drives the main board to vibrate in the second direction.

2. The pressure feedback touch panel according to claim 1, characterized in that, The pressure feedback touch panel includes a cantilever bracket, which is located between the motherboard and the fixed bracket and is fixed to the fixed bracket. The pressure acquisition sensor is located on the cantilever bracket, and the moving iron or the armature is located on the cantilever bracket.

3. A pressure feedback touchpad according to claim 2, characterized in that, The moving iron or the armature is movably mounted on the cantilever bracket to adjust the distance between the moving iron and the armature.

4. A pressure feedback touchpad according to claim 3, characterized in that, The cantilever bracket is provided with a threaded hole, the moving iron or the armature is provided with a through hole, and a connecting bolt is inserted into the cantilever bracket. The connecting bolt is arranged with a gap between it and the through hole, and the connecting bolt is locked in the threaded hole after passing through the through hole.

5. A pressure feedback touch panel according to claim 1, characterized in that, The pressure sensor is attached to the fixed bracket by a hot-pressing process.

6. A pressure feedback touch panel according to claim 1, characterized in that, The moving iron is located on the fixed bracket, and the armature is located on the first plate surface of the main board.

7. A pressure feedback touchpad according to any one of claims 1-6, characterized in that, The thickness of each silicon steel sheet in the first direction is 0.2-0.3 mm.

8. A pressure feedback touchpad according to any one of claims 1-6, characterized in that, The pressure feedback touchpad also includes a cover plate, which is adhered to the second surface of the motherboard.

9. A pressure feedback touch panel according to claim 8, characterized in that, The cover plate is made of glass, PET, or a composite material.

10. An electronic device, characterized in that, The electronic device includes a housing and a pressure feedback touch panel as described in any one of claims 1-9, wherein the mounting bracket is fixed to the housing.

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