A high-temperature-resistant double-sided readable and writable RFID tag

Abstract

The application belongs to the technical field of RFID tag structure, and particularly relates to a high-temperature-resistant double-sided readable and writable RFID tag, which comprises an injection molding shell formed with a cavity, a tag body arranged in the cavity, and a heat insulation material layer arranged on two sides of the tag body, the tag body is configured as an LC resonant radio frequency circuit formed by a single-sided antenna and a chip, the tag body comprises a base material, and the single-sided antenna and the chip are arranged on the same side of the base material, the single-sided antenna is arranged as a multilayer coil structure around the center of the tag body, and a coil located in the innermost layer and a coil located in the outermost layer are electrically connected through a connecting sheet. In actual application, the RFID tag can be applied to work in a high-temperature environment, meanwhile, the structure of the single-sided antenna can avoid delamination of the single-sided antenna and the base material of the tag body due to long-time high temperature on the premise of guaranteeing the realization of the double-sided reading and writing function, and can prolong the service life of the tag.

Description

Technical Field

[0001] This application belongs to the technical field of RFID tag structure, specifically relating to a high-temperature resistant double-sided readable and writable RFID tag. Background Technology

[0002] RFID tags serve as "digital ID cards" for assets in the Internet of Things (IoT) era. Their diverse technical characteristics and adaptability to various scenarios make them a core tool in fields such as smart manufacturing and smart healthcare. In the future, with technological integration and increasing environmental demands, RFID tags will evolve towards greater intelligence and greener practices, further promoting the realization of the Internet of Everything. In industrial production, logistics, and medical sterilization, where high-temperature environments are often required for the identification, tracking, and management of goods, RFID technology, with its non-contact, efficient, and convenient identification advantages, has become one of the core technological means in these scenarios.

[0003] Currently available conventional RFID tags have significant technical shortcomings in high-temperature environments, failing to meet practical application requirements. Existing RFID tags are prone to material softening, deformation, melting, and even combustion in high-temperature scenarios, leading to structural damage, inability to read data, and complete loss of identification function. Furthermore, conventional RFID tags often employ a double-sided antenna structure; high temperatures can cause the substrate to split into multiple layers, leading to antenna breakage and ultimately causing a circuit break in the tag, rendering it completely inoperable. Due to these deficiencies in material temperature resistance and structural stability, conventional RFID tags have a short lifespan in high-temperature environments. This necessitates frequent tag replacements, increasing material costs and reducing production and management efficiency by requiring pauses in identification operations during replacement. Long-term, stable item tracking and management are difficult to achieve. Therefore, a solution to these problems is urgently needed. Utility Model Content

[0004] The purpose of this application is to provide a high-temperature resistant double-sided readable and writable RFID tag to address the shortcomings of existing technologies. In practical applications, it can be used in high-temperature environments, and the single-sided antenna design can prevent the single-sided antenna from delaminating with the substrate of the tag body due to prolonged high temperatures, thereby further extending the tag's service life.

[0005] To achieve the above objectives, this application adopts the following technical solution: A high-temperature resistant, double-sided readable and writable RFID tag includes an injection-molded shell forming a cavity, a tag body disposed within the cavity, and heat-insulating material layers disposed on both sides of the tag body. The tag body is configured as an LC resonant radio frequency circuit formed by a single-sided antenna and a chip. The tag body includes a substrate, and the single-sided antenna and the chip are both disposed on the same surface of the substrate. The single-sided antenna is configured as a multi-layer coil structure surrounding the center of the tag body, wherein the innermost coil and the outermost coil are electrically connected through a connecting piece.

[0006] In practical applications, the substrate in this application uses Teflon material, which can prevent material aging caused by high temperature; at the same time, PPS and fiber are mixed in a certain proportion as the material of the accommodation shell, and the RFID tag is encapsulated by injection molding process, which can form better protection for the tag body.

[0007] As an improvement to the high-temperature resistant double-sided readable and writable RFID tag described in this application, the injection-molded shell includes a bottom shell and a top cover covering the bottom shell. The top cover has a fastening body extending downward from its edge, and the inner wall of the bottom shell has a fastening groove that matches the fastening body. This increases the bonding force of the injection-molded shell and enhances the protection of the tag body.

[0008] As an improvement to the high-temperature resistant double-sided readable and writable RFID tag described in this application, the heat insulation material layers are all bonded to the tag body through a first adhesive layer.

[0009] As an improvement to the high-temperature resistant double-sided readable and writable RFID tag described in this application, the heat insulation material layer includes a first material layer near the bottom shell and a second material layer near the top cover. The first material layer is attached to the bottom side of the inner cavity of the bottom shell through a second adhesive layer.

[0010] The beneficial effects of this application are as follows: The RFID tag of this application effectively solves the application defects of existing technologies in high-temperature environments by setting a heat-insulating material layer and adopting a single-sided antenna structure, and has significant beneficial effects. The key components such as the tag's substrate and encapsulation are made of high-temperature resistant materials with a high temperature resistance limit of 230-500℃. It can maintain structural integrity and not soften, deform, or burn in extreme high-temperature environments such as high-temperature metallurgical processing, high-temperature baking of automotive paint, and high-pressure steam sterilization in medical applications. This ensures that the tag always has normal data reading and identification functions and significantly broadens the application range of RFID technology in high-temperature fields. The RFID tag of this application adopts a single-sided antenna structure design, placing the coil on a single surface of the high-temperature resistant substrate and ensuring a tight bond between the antenna and the substrate. The single-sided structure reduces the number of interfaces between the antenna and the substrate and reduces the risk of thermal stress concentration. It can effectively avoid the problem of antenna separation from the substrate and ensure the continuity of the LC resonant radio frequency circuit, fundamentally solving the functional failure problem caused by antenna detachment in existing tags. Thanks to the aging resistance of the high-temperature resistant material and the stability of the single-sided antenna structure, the service life of the tag in this application is extended in high-temperature environments. This not only reduces the frequency of tag replacement and lowers material procurement costs, but also avoids production or management interruptions caused by tag replacement and improves operational efficiency, thereby reducing production costs. Attached Figure Description

[0011] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0012] Figure 1 This is a schematic diagram of the structure of an embodiment of this application.

[0013] Figure 2 This is an exploded view of an embodiment of this application.

[0014] Figure 3 This is a schematic diagram of the structure of the label body in the embodiment of this application.

[0015] Figure 4 This is a schematic diagram of the structure of the injection-molded shell in the embodiment of this application.

[0016] The reference numerals in the attached figures are explained as follows: 1. Injection-molded outer shell; 11. Bottom shell; 111. Fastening groove; 12. Top cover; 121. Fastening body; 2. Tag body; 21. Single-sided antenna; 22. Chip; 23. Substrate; 24. Connecting piece; 3. Thermal insulation layer; 31. First material layer; 32. Second material layer; 4. First adhesive layer; 5. Second adhesive layer. Detailed Implementation

[0017] If certain terms are used in the specification and claims to refer to specific components, those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" throughout the specification and claims is an open-ended term and should be interpreted as "including but not limited to." "Approximately" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and substantially achieve the technical effect within a certain margin of error. Furthermore, terms such as "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0018] In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0019] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0020] The following is in conjunction with the appendix Figures 1-4 The present application will be further described in detail with reference to specific implementation methods, but this is not intended to limit the present application.

[0021] Implementation A high-temperature resistant double-sided readable and writable RFID tag includes an injection-molded shell 1 forming a cavity, a tag body 2 disposed within the cavity, and heat-insulating material layers 3 disposed on both sides of the tag body 2. The tag body 2 is configured as an LC resonant radio frequency circuit formed by a single-sided antenna 21 and a chip 22. The tag body 2 includes a substrate 23, and the single-sided antenna 21 and the chip 22 are both disposed on the same surface of the substrate 23. The single-sided antenna 21 is configured as a multi-layer coil structure surrounding the center of the tag body 2, wherein the innermost coil and the outermost coil are electrically connected through a connecting piece 24.

[0022] To prevent the tag body 2 from delaminating due to prolonged exposure to ultra-high temperatures, in this embodiment, the single-sided antenna 21 is disposed on one side of the substrate 23, and a connecting piece 24 is used to connect the innermost coil and the outermost coil to form a closed-loop coil, thereby realizing signal transmission and reception and electromagnetic energy acquisition. While ensuring the implementation of dual-sided read and write functions, the use of a dual-sided antenna structure is avoided. In this embodiment, the connecting piece 24 is made of steel, but other materials that can electrically connect the coils can also be selected according to the actual situation.

[0023] In practical applications, the RFID tag of this embodiment is configured with a through hole in the middle. The injection-molded shell 1, the tag body 2, and the heat insulation material layer 3 are all provided with hole structures that match the through hole. The single coil in the single-sided antenna 21 is set at a peripheral position that is offset from the hole structure, which can reduce the heat-receiving area without affecting the normal use of double-sided reading and writing.

[0024] To make the RFID tag in this embodiment better suited for high-temperature environments, the heat insulation material layer 3 in this embodiment uses a special super heat insulation cotton, which is a new heat insulation material in the form of cross-linked sheets of polymer aggregate and nanoporous vacuum silica. The pores of nanoporous vacuum silica are 10~40nm, which is smaller than the mean free path of air molecules (68nm), with a porosity of over 97% and a density as low as 0.03g / m³, achieving a vacuum effect. Therefore, there is no collision between molecules inside the pores, thus achieving ultra-high heat insulation performance. At the same time, Teflon is used as the material of the substrate 23, which prevents the substrate 23 from aging due to high temperatures, further improving the high temperature resistance of the tag body 2.

[0025] Based on the above structural configuration, the RFID tag in this embodiment has a high temperature resistance limit of 230-500℃. It can maintain structural integrity and not soften, deform or burn in extreme high temperature environments such as metallurgical high-temperature processing, high-temperature baking of automotive paint, and medical high-pressure steam sterilization. This ensures that the tag always has normal data reading and identification functions and significantly expands the application range of RFID technology in high-temperature fields. With the aging resistance of the high-temperature resistant material and the stability of the single-sided antenna structure, the service life of the tag in this application in high-temperature environments is extended. This not only reduces the frequency of tag replacement and lowers material procurement costs, but also avoids production or management interruptions caused by tag replacement and improves operational efficiency, thereby reducing production costs.

[0026] Specifically, the injection-molded shell 1 includes a bottom shell 11 and a top cover 12 covering the bottom shell 11. The top cover 12 extends downward and is provided with a fastening body 121. The inner wall of the bottom shell 11 is provided with a fastening groove 111 that matches the fastening body 121. In this embodiment, PPS and fiber are mixed in a certain proportion as the material of the injection-molded shell 1. The RFID tag is then encapsulated through the injection molding process, which can better protect the tag body 2. At the same time, the structure of the matching fastening body 121 and the fastening groove 111, combined with the secondary injection molding process, effectively enhances the bonding force of the injection-molded shell 1, further enhancing the protective ability of the injection-molded shell 1 for the tag body 2. In addition, the bottom shell 11 and the top cover 12 are respectively provided with matching fixing posts and fixing holes around the above-mentioned through holes, which can further increase the overall robustness of the injection-molded shell 1.

[0027] Specifically, the heat insulation material layer 3 is bonded to the label body 2 through the first adhesive layer 4. The heat insulation material layer 3 includes a first material layer 31 near the bottom shell 11 and a second material layer 32 near the top cover 12. The first material layer 31 is bonded to the bottom side of the inner cavity of the bottom shell 11 through the second adhesive layer 5, which increases the overall firmness of the label body 2 and the connection strength between the label body 2 and the injection molded shell 1.

[0028] During the test, the RFID tag in this embodiment was able to work for 200 hours at 230℃ without any attenuation of RFID radio frequency performance and normal function.

[0029] Furthermore, all content not described in detail in this specification is prior art known to those skilled in the art. Based on the disclosure and teachings of the above specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, this application is not limited to the specific embodiments described above, and any obvious improvements, substitutions, or modifications made by those skilled in the art based on this application are within the scope of protection of this application. In addition, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on this application.

Claims

1. A high-temperature resistant, double-sided readable and writable RFID tag, characterized in that, The label body (2) includes an injection-molded shell (1) forming a cavity, a label body (2) disposed in the cavity, and heat insulation material layers (3) disposed on both sides of the label body (2). The label body (2) is configured as an LC resonant radio frequency circuit formed by a single-sided antenna (21) and a chip (22). The label body (2) includes a substrate (23) and the single-sided antenna (21) and the chip (22) are both disposed on the same surface of the substrate (23). The single-sided antenna (21) is configured as a multi-layer coil structure surrounding the center of the label body (2), wherein the innermost coil and the outermost coil are electrically connected by a connecting piece (24).

2. The high-temperature resistant double-sided readable and writable RFID tag as described in claim 1, characterized in that, The injection-molded housing (1) includes a bottom shell (11) and a top cover (12) covering the bottom shell (11). The top cover (12) extends downward and is provided with a fastening body (121). The inner wall of the bottom shell (11) is provided with a fastening groove (111) that matches the fastening body (121).

3. The high-temperature resistant double-sided readable and writable RFID tag as described in claim 1, characterized in that, The heat insulation material layer (3) is attached to the label body (2) through the first adhesive layer (4).

4. The high-temperature resistant double-sided readable and writable RFID tag as described in claim 2, characterized in that, The heat insulation material layer (3) includes a first material layer (31) near the bottom shell (11) and a second material layer (32) near the top cover (12). The first material layer (31) is attached to the bottom side of the inner cavity of the bottom shell (11) through a second adhesive layer (5).

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