Screen module and electronic device
Patent Information
- Application Number
- CN202522049848.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-23
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2035-09-23
AI Technical Summary
但是围坝胶本身表面能较低,与被粘接表面的润湿性较差,固化后在后期的运输、以及跌落、振动等机械测试中容易脱落
[0018]本公开屏幕模组的封装组件包括封装体、阻隔体和拆除结构,阻隔体可以隔断封装区域和内部区域,避免封装体对位于内部区域的功能主体的干扰。可拆除结构与主体结构可拆卸连接,在阻隔体完成功能后能够利用可拆除结构实现拆除,避免阻隔体在后续组装、测试、运输或使用过程中发生脱落而影响屏幕模组功能。
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Figure CN224907505U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of electronic technology, and in particular to screen modules and electronic devices. Background Technology
[0002] LIPO (Low-Injection Pressure Overmolding) technology uses liquid polymer materials to encapsulate the ribbon cable connections of the screen module. After the polymer material solidifies, it is tightly bonded to the main functional structure of the screen module and the frame of the electronic device. LIPO technology can cleverly "hide" components such as the driver chip and circuitry of the screen module. Compared with traditional COG (Chip on Glass) and COF (Chip on Film) packaging technologies, it can reduce the space occupied by the bezel, thereby achieving a narrower bezel effect.
[0003] In the LIPO process, damming adhesive forms a physical barrier during injection molding, preventing liquid LIPO adhesive from overflowing into areas that don't need filling. This ensures the accuracy and reliability of the encapsulation, avoiding display abnormalities such as stains, color differences, or uneven brightness in the screen module. However, damming adhesive itself has low surface energy and poor wetting properties with the bonded surfaces. After curing, it is prone to detachment during transportation and mechanical tests such as drops and vibrations. Detached damming adhesive can cause problems such as screen flickering or blackouts due to movement within the screen assembly and impacts on the screen. Utility Model Content
[0004] This disclosure provides a screen module and an electronic device to solve related technical problems.
[0005] According to a first aspect of this disclosure, a screen module is provided, the screen module including a main structure and an encapsulation component;
[0006] The main structure includes a functional main body; the encapsulation component includes an encapsulation body, a barrier body, and a removal structure; the main structure has an encapsulation area, an internal area, and an intermediate area connecting the encapsulation area and the internal area, the encapsulation body is located in the encapsulation area, the functional main body is located in the internal area; the barrier body is located in the intermediate area to separate the encapsulation area and the internal area;
[0007] The dismantling structure is detachably connected to the main structure, and at least a portion of the barrier is fixedly connected to the dismantling structure.
[0008] Optionally, the removal structure includes a protective film layer exposed on the main structure; the protective film layer is provided with a partition structure, the partition structure dividing the protective film layer into a protective functional area and a tear-off area, the partition structure including a disconnection area, and the barrier being fixedly connected to the tear-off area.
[0009] Optionally, the tearing area includes a connecting portion and a tearing handle portion extending from the connecting portion, and the barrier is fixedly connected to the connecting portion.
[0010] Optionally, the main structure includes a control component electrically connected to the functional main body, and the package covers the control component.
[0011] Optionally, the main structure includes a heat dissipation structure exposed on the main structure, and at least a portion of the barrier is connected to the heat dissipation structure.
[0012] Optionally, the heat dissipation structure includes at least one groove, and the barrier body engages with the groove.
[0013] Optionally, the removal structure includes a tearing handle portion extending along a first direction, and the groove includes a strip-shaped structure extending along the first direction.
[0014] Optionally, the encapsulation body is made of a cured liquid polymer material, and the encapsulation body is formed by low-pressure injection molding.
[0015] Optionally, the barrier includes a dammed colloid.
[0016] According to a second aspect of this disclosure, an electronic device is provided, the electronic device including any of the screen modules described in the first aspect.
[0017] The technical solution provided in this disclosure can achieve at least the following beneficial effects:
[0018] The encapsulation components of this disclosed screen module include an encapsulation body, a barrier, and a removable structure. The barrier can separate the encapsulation area from the internal area, preventing the encapsulation body from interfering with the functional components located in the internal area. The removable structure is detachably connected to the main structure, and can be removed after the barrier has completed its function, preventing the barrier from detaching during subsequent assembly, testing, transportation, or use and affecting the functionality of the screen module.
[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this specification. Attached Figure Description
[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this specification and, together with the description, serve to explain the principles of this specification.
[0021] Figure 1 This is a partial structural schematic diagram of an electronic device according to an exemplary embodiment of the present disclosure;
[0022] Figure 2 This is a partial structural schematic diagram of an electronic device according to another exemplary embodiment of the present disclosure.
[0023] Figure label:
[0024] Screen module 1;
[0025] Main structure 11; Functional main body 111; Control component 112; Encapsulation area 113; Internal area 114; Middle area 115; Heat dissipation structure 116; Groove 1161;
[0026] Encapsulation component 12; Encapsulation body 121; Barrier body 122; Removal structure 123; Protective functional area 1231; Tear-off area 1232; Separation structure 1233; Connecting part 1232a; Tear handle part 1232b;
[0027] Electronic device 2; middle frame 21. Detailed Implementation
[0028] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this specification. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this specification as detailed in the appended claims.
[0029] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. Unless otherwise defined, the technical or scientific terms used in this specification should be understood in their ordinary sense by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, “a” or “one,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of one. “A plurality” or “several” indicates two or more. Unless otherwise indicated, the terms “front,” “rear,” “lower,” and / or “upper,” and similar terms are for ease of description only and are not limited to a location or spatial orientation. The terms “comprising,” “including,” and similar terms mean that the elements or objects preceding “comprising,” encompass the elements or objects listed following “comprising,” and their equivalents, and do not exclude other elements or objects. The terms “connected,” “linked,” and similar terms are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect.
[0030] The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The singular forms “a,” “the,” and “the” as used in this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.
[0031] LIPO (Low-Injection Pressure Overmolding) technology uses liquid polymer materials to encapsulate the ribbon cable connections of the screen module. After curing, the polymer material is tightly bonded to the main functional structure of the screen module and the frame of the electronic device. LIPO technology can cleverly "hide" components such as the driver chip and circuitry of the screen module, reducing the space occupied by the bezel compared to traditional COG (Chip on Glass) and COF (Chip on Film) packaging technologies, thus achieving a narrower bezel effect. In the LIPO process, the damming adhesive forms a physical barrier during injection molding, preventing the liquid LIPO adhesive from overflowing into areas that do not need to be filled, thereby ensuring the accuracy and reliability of the encapsulation and avoiding display abnormalities such as stains, color differences, or uneven brightness in the screen module. However, the damming adhesive itself has low surface energy and poor wettability with the bonded surface, making it prone to detachment during subsequent transportation and mechanical tests such as drops and vibrations after curing. Detached damming adhesive can cause problems such as screen flickering and blackouts due to movement within the screen compartment and impact with the screen.
[0032] This disclosure provides a screen module, Figure 1 This is a partial structural schematic diagram of an electronic device according to an exemplary embodiment of the present disclosure, such as... Figure 1 As shown, the screen module 1 includes a main structure 11 and an encapsulation component 12. The main structure 11 includes a functional body 111. The encapsulation component 12 includes an encapsulation body 121, a barrier body 122, and a detachable structure 123. The main structure 11 has an encapsulation area 113, an inner area 114, and an intermediate area 115 connecting the encapsulation area 113 and the inner area 114. The encapsulation body 121 is located in the encapsulation area 113, the functional body 111 is located in the inner area 114, and the barrier body 122 is located in the intermediate area 115 to separate the encapsulation area 113 and the inner area 114. The detachable structure 123 is detachably connected to the main structure 11, and at least a portion of the barrier body 122 is fixedly connected to the detachable structure 123.
[0033] The encapsulation component 12 of the aforementioned screen module 1 includes an encapsulation body 121, a barrier body 122, and a detachable structure 123. The barrier body 122 can separate the encapsulation area 113 from the internal area 114, preventing the encapsulation body 121 from interfering with the functional main body 111 located in the internal area 114. The detachable structure 123 is detachably connected to the main structure 11. After the barrier body 122 has completed its function, it can be removed using the detachable structure 123, preventing the barrier body 122 from falling off during subsequent assembly, testing, transportation, or use and affecting the function of the screen module 1.
[0034] It should be noted that the aforementioned functional body 111 can be a component in the screen module 1 used to implement screen functions such as display, touch, and fingerprint recognition. The aforementioned package 121 can be used to encapsulate components such as ribbon cables and chips in the screen module 1, and can also be set at specific locations in the screen module 1 to serve functions such as sealing, connection, and structural reinforcement. For example, the main structure 11 can include a control component 112 electrically connected to the functional body 111, and the package 121 covers the control component 112, thus encapsulating the control component 112. The control component 112 can include ribbon cables and chips located between the functional body 111 and the frame 21 of the electronic device 2. When encapsulating the ribbon cables and chips, the package 121 can also connect the functional body 111 to the frame 21 using the structure of the package 121.
[0035] In the embodiments of this disclosure, the encapsulation body 121 is made of a cured liquid polymer material, and the encapsulation body 121 is formed by low-pressure injection molding. Low-temperature injection molding of the liquid polymer material can encapsulate the control component 112 of the screen module 1, reducing the space occupied by the bezel and thus achieving a narrower bezel effect. The barrier body 122 includes a damming colloid, which can be made of silicone-based adhesive or other materials; this disclosure does not limit this. Alternatively, the encapsulation body 121 and the barrier body 122 can also be made of other materials capable of encapsulation or barrier; this disclosure does not limit this.
[0036] In some embodiments, such as Figure 2 As shown, the removal structure 123 includes a protective film layer exposed outside the main structure 11. The protective film layer has a partition structure 1233, which divides the protective film layer into a protective functional area 1231 and a tear-off area 1232. The partition structure 1233 includes a disconnection area, and the barrier 122 is fixedly connected to the tear-off area 1232. By using the protective film layer on the outside of the main structure 11 as the removal structure 123, the structural complexity and the space occupied by the additional removal structure 123 are reduced. The partition structure 1233 of the protective film layer has a disconnection area, which facilitates the subsequent disconnection and removal of the tear-off area 1232 relative to the protective functional area 1231.
[0037] The separation structure 1233 can be arranged at intervals to form a structure that is easy to tear, or the separation area can be arranged in an array to form a structure that is easy to tear.
[0038] In the above embodiment, the tear-off area 1232 includes a connecting portion 1232a and a tear-handle portion 1232b extending from the connecting portion 1232a, with the barrier 122 fixedly connected to the connecting portion 1232a. Because the barrier 122 is fixedly connected to the connecting portion 1232a, pulling the tear-handle portion 1232b can cause the connecting portion 1232a and the barrier 122 to separate together from the protective functional area 1231. The tear-handle portion 1232b also improves the ease of operation in the tear-off area 1232 removal process.
[0039] In some embodiments, the aforementioned protective film layer can be an insulating film. The insulating film in the screen module 1 can protect the electronic components of the screen module 1 and prevent interference caused by contact with external components. By using the insulating film to set up the removal structure 123, additional structural and functional interference to the screen module 1 is reduced, and the removal operation is also facilitated.
[0040] In some embodiments, the main structure 11 includes a heat dissipation structure 116 exposed on the main structure 11, and at least a portion of the barrier 122 is connected to the heat dissipation structure 116. The heat dissipation structure 116 on the outside of the main structure 11 can be used to dissipate heat from the screen module 1. The connection between the heat dissipation structure 116 and the barrier 122 reduces additional structural and functional interference to the screen module 1 and facilitates the separation of the barrier 122 from the heat dissipation structure 116. The heat dissipation structure 116 can be made of metal, such as copper foil or stainless steel, and can also form electromagnetic shielding for the screen module 1 to prevent electromagnetic interference. Furthermore, when the heat dissipation structure 116 is metal, it can also provide structural support for the screen module 1, improving the structural reliability of the screen module 1.
[0041] In some embodiments, the heat dissipation structure 116 includes at least one groove 1161, and the barrier 122 engages with the groove 1161 to form a glue-holding structure, thereby improving the glue-holding effect.
[0042] The removal structure 123 includes a tearing handle portion 1232b extending along a first direction, and the groove 1161 includes a strip-shaped structure extending along the first direction, so that the barrier adhesive can separate from the groove 1161 along the first direction when the tearing handle is pulled, thereby avoiding adhesive residue.
[0043] This disclosure further provides an electronic device 2, which includes the screen module 1 described above.
[0044] The encapsulation component 12 of the screen module 1 includes an encapsulation body 121, a barrier 122, and a detachable structure 123. The barrier 122 can separate the encapsulation area 113 from the internal area 114, preventing the encapsulation body 121 from interfering with the functional main body 111 located in the internal area 114. The detachable structure 123 is detachably connected to the main structure 11. After the barrier 122 has completed its function, it can be removed using the detachable structure 123, preventing the barrier 122 from falling off during subsequent assembly, testing, transportation, or use and affecting the function of the screen module 1.
[0045] The electronic device 2 includes a mid-frame 21. When the encapsulation body 121 is made of a cured liquid polymer material, and the encapsulation body 121 is formed by low-pressure injection molding, the mid-frame 21 can be fixed to the main structure 11 of the screen module 1 during the curing process. The liquid polymer material, through low-temperature injection molding, can encapsulate the control components 112 of the screen module 1, reducing the space occupied by the bezel and thus achieving a narrower bezel effect.
[0046] The aforementioned electronic device 2 may be a mobile terminal such as a mobile phone, tablet computer, vehicle terminal, medical terminal, or wearable device, or it may be a vehicle, mobile cleaning equipment, robot, etc. This disclosure does not impose any restrictions on it.
[0047] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure in any way. Although this disclosure has been disclosed above with reference to a preferred embodiment, it is not intended to limit this disclosure. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this disclosure. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this disclosure without departing from the content of the technical solution of this disclosure shall still fall within the scope of the technical solution of this disclosure.
Claims
1. A screen module, characterized in that, It includes the main structure (11) and the encapsulation components (12); The main structure (11) includes a functional main body (111); the encapsulation component (12) includes an encapsulation body (121), a barrier body (122), and a dismantling structure (123); The main structure (11) has an encapsulation area (113), an inner area (114), and an intermediate area (115) connecting the encapsulation area (113) and the inner area (114). The encapsulation body (121) is located in the encapsulation area (113), and the functional body (111) is located in the inner area (114). The barrier body (122) is located in the intermediate area (115) to separate the encapsulation area (113) and the inner area (114). The dismantling structure (123) is detachably connected to the main structure (11), and at least a portion of the barrier (122) is fixedly connected to the dismantling structure (123).
2. The screen module according to claim 1, characterized in that, The removal structure (123) includes a protective film layer exposed on the main structure (11); the protective film layer is provided with a partition structure (1233), the partition structure (1233) divides the protective film layer into a protective functional area (1231) and a tear-off area (1232), the partition structure (1233) includes a disconnection area, and the barrier (122) is fixedly connected to the tear-off area (1232).
3. The screen module according to claim 2, characterized in that, The tearing area (1232) includes a connecting portion (1232a) and a tearing hand portion (1232b) extending from the connecting portion (1232a), and the barrier (122) is fixedly connected to the connecting portion (1232a).
4. The screen module according to claim 1, characterized in that, The main structure (11) includes a control component (112) electrically connected to the functional main body (111), and the package (121) covers the control component (112).
5. The screen module according to claim 1, characterized in that, The main structure (11) includes a heat dissipation structure (116) exposed to the main structure (11), and at least a portion of the barrier (122) is connected to the heat dissipation structure (116).
6. The screen module according to claim 5, characterized in that, The heat dissipation structure (116) includes at least one groove (1161), and the barrier (122) engages with the groove (1161).
7. The screen module according to claim 6, characterized in that, The dismantling structure (123) includes a tearing handle portion (1232b) extending in a first direction, and the groove (1161) includes a strip structure extending in the first direction.
8. The screen module according to claim 1, characterized in that, The encapsulation body (121) is made of a cured liquid polymer material and is formed by low-pressure injection molding.
9. The screen module according to claim 1, characterized in that, The barrier (122) includes a dam colloid.
10. An electronic device, characterized in that, Includes the screen module (1) as described in any one of claims 1-9.