Storage device and electronic device

Abstract

The application provides a storage device and an electronic equipment, and relates to the technical field of electronic equipment. The storage device comprises a storage bracket, the storage bracket has a containing space for containing a target structure; a heat dissipation structure is arranged in the containing space; a transmission structure is movably connected with the storage bracket, and the transmission structure is connected with the heat dissipation structure; the target structure is located in the containing space, and the transmission structure can drive the heat dissipation structure to contact the target structure, so as to absorb heat of the target structure.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to a storage device and an electronic device. Background Technology

[0002] The hard drive uses liquid cooling, employing a design where water channels are wrapped around the outside of the hard drive tray. The heat from the hard drive is transferred to the water cooling pipes through the tray casing, and then carried away by cold water. This design is complex, requiring multiple water channel connections, increasing the risk of leakage, and also necessitates a specially designed hard drive tray, thus increasing its space requirements. Utility Model Content

[0003] This disclosure provides a storage device and an electronic device, the technical solutions of which are as follows:

[0004] In a first aspect, this application provides a storage device, comprising:

[0005] A storage tray having a receiving space for accommodating the target structure;

[0006] A heat dissipation structure is disposed within the accommodating space;

[0007] A transmission structure is movably connected to the storage tray and is also connected to the heat dissipation structure.

[0008] The target structure is located within the accommodating space, and the transmission structure can drive the heat dissipation structure to contact the target structure in order to absorb the heat of the target structure.

[0009] In this embodiment, the heat dissipation structure is connected to the storage tray via a connecting component, and the heat dissipation structure is movable relative to the storage tray in a first direction via the connecting component.

[0010] In this embodiment, the heat dissipation structure includes:

[0011] A first heat dissipation component is disposed within the accommodating space, and the first heat dissipation component is a plate-shaped structure.

[0012] In this embodiment, the heat dissipation structure includes:

[0013] A second heat dissipation component, wherein a first end of the second heat dissipation component is connected to the first heat dissipation component, and a second end of the second heat dissipation component extends outside the storage tray;

[0014] The third heat dissipation component is connected to the second end of the second heat dissipation component.

[0015] In this embodiment, the heat dissipation structure is connected to the storage tray via a first reset component, which provides a reset force for the heat dissipation structure to move relative to the storage tray in a direction opposite to the first direction.

[0016] In this embodiment, the transmission structure is connected to the storage tray via a second reset assembly, the second reset assembly being used to provide a reset force for the transmission structure to move relative to the storage tray in a direction opposite to the second direction.

[0017] In this embodiment, the transmission structure includes:

[0018] A transmission plate is located between the heat dissipation structure and the storage tray, and the transmission plate has a guide on one side facing the first heat dissipation assembly;

[0019] The first heat dissipation component is provided with a guide groove that is adapted to the guide member;

[0020] The guide member moves relative to the guide groove in a second direction so that the heat dissipation structure can move relative to the storage tray in a first direction, the first direction and the second direction having an angle.

[0021] In this embodiment, the transmission structure is correspondingly arranged with the driving component, and the driving component can drive the transmission structure to generate displacement so that the transmission structure can drive the heat dissipation structure to contact the target structure.

[0022] In this embodiment, a heat-conducting sheet is provided on the side of the heat dissipation structure facing away from the transmission structure; a wear-resistant layer is provided on the side of the heat dissipation structure facing away from the transmission structure.

[0023] Secondly, this application also provides an electronic device, including: a target structure and a storage device; the storage device includes:

[0024] A storage tray having a receiving space to accommodate the target structure;

[0025] A heat dissipation structure is disposed within the accommodating space;

[0026] A transmission structure is movably connected to the storage tray and is also connected to the heat dissipation structure.

[0027] The target structure is located within the accommodating space, and the transmission structure can drive the heat dissipation structure to contact the target structure in order to absorb the heat of the target structure.

[0028] The above description is only an overview of the technical solution of this disclosure. In order to better understand the technical means of this disclosure and to implement it in accordance with the contents of the specification, the preferred embodiments of this disclosure are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of a storage device in which the target structure is not fully inserted into the storage device, as provided in this disclosure.

[0031] Figure 2 This is a schematic diagram of a storage device in which the target structure is fully inserted into the storage device, as provided in this disclosure.

[0032] Figure 3 This is a side view of a storage device provided in this disclosure, showing a target structure not fully inserted into the storage device.

[0033] Figure 4 A side view of a storage device with the target structure fully inserted into the storage device as provided in this disclosure;

[0034] Figure 5 for Figure 4 A magnified view of part A in the image;

[0035] Figure 6 Two target structures in a storage device provided in this disclosure are inserted into side views of the storage device at different degrees;

[0036] Figure 7 An exploded view of a storage device provided in this disclosure.

[0037] Explanation of reference numerals in the attached figures:

[0038] 100. Storage device; 1. Storage bracket; 11. Accommodation space; 2. Heat dissipation structure; 21. First heat dissipation component; 211. Guide groove; 22. Second heat dissipation component; 23. Third heat dissipation component; 3. Transmission structure; 31. Transmission plate; 32. Guide component; 4. Connecting component; 5. First reset component; 6. Second reset component; 61. Pin; 62. Conical spring; 7. Driving component; 8. Heat-conducting plate; 200. Target structure. Detailed Implementation

[0039] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0040] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0041] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0042] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0043] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0044] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0045] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0046] In related technologies, most server hard drives on the market use air cooling, utilizing airflow between the drives for heat dissipation. However, for higher power consumption solid-state drives (SSDs), air cooling solutions are somewhat insufficient. SSDs use liquid cooling, employing a design where water channels are wrapped around the outside of the drive tray. The heat from the drive is transferred to the water cooling pipes through the tray shell, and then carried away by cold water. This design is more complex, requiring a larger, custom-made drive tray, increasing space requirements, and necessitating multiple water channel connections, increasing the risk of leakage. Therefore, this application provides a storage device that integrates a heat dissipation structure within the space housing the SSD. Through a transmission structure connected to the heat dissipation structure, the structure can contact the SSD, absorbing and dissipating its heat. This simplifies the structure, eliminates the need for a custom drive tray, and avoids increased space requirements. Furthermore, the contact between the heat dissipation structure and the fixed drive increases the heat transfer area and reduces the number of connections between pipes, thereby lowering the potential risk of leakage.

[0047] like Figures 1 to 7 As shown, this application provides a storage device 100, including:

[0048] Storage tray 1, the storage tray 1 having a receiving space 11 for receiving the target structure 200;

[0049] Heat dissipation structure 2 is disposed within the accommodating space 11;

[0050] The transmission structure 3 is movably connected to the storage tray 1 and is also connected to the heat dissipation structure 2.

[0051] The target structure 200 is located within the accommodating space 11, and the transmission structure 3 can drive the heat dissipation structure 2 to contact the target structure 200 in order to absorb the heat of the target structure 200.

[0052] In this embodiment, the storage tray 1 is a structure for placing the target structure 200. One end of the storage tray 1 along its length has an opening, and the target structure 200 is inserted into the receiving space 11 of the storage tray 1 through the opening to be placed in the storage tray 1. The storage tray 1 is used to protect the target structure 200 and prevent damage to the target structure 200.

[0053] In this embodiment, the target structure 200 can be a structure for generating heat, a solid-state drive, a memory card, a memory module, or other storage structures.

[0054] In this embodiment, the heat dissipation structure 2 can be a liquid-cooled heat dissipation structure 2, which is used to absorb the heat of the target structure 200 by contacting the target structure 200, thereby reducing the heat of the target structure 200 and achieving the purpose of heat dissipation.

[0055] In this embodiment, the transmission structure 3 has a first state and a second state. In the first state, the transmission structure 3 is not fully inserted into the storage tray 1, and the target structure 200 is not fully installed with the storage tray 1. At this time, the heat dissipation structure 2 is not in contact with the target structure 200. In the second state, the transmission structure 3 is fully inserted into the storage tray 1, and the target structure 200 is installed with the storage tray 1. At this time, the transmission structure 3 drives the heat dissipation structure 2 to move so that the heat dissipation structure 2 is in contact with the target structure 200, so that the heat dissipation structure 2 can absorb the heat of the target structure 200.

[0056] This application provides a storage device 100, including a storage tray 1, a heat dissipation structure 2, and a transmission structure 3. The storage tray 1 has a receiving space 11, and the heat dissipation structure 2 and a target structure 200 are both disposed in the receiving space 11. The transmission structure 3 is movably connected to the storage tray 1, so that the storage tray 1 is in a first state or a second state. When the storage tray 1 is in the first state, the transmission structure 3 is not fully inserted into the storage tray 1, and the heat dissipation structure 2 is not in contact with the target structure 200. When the transmission structure 3 is in the second state, the transmission structure 3 is fully inserted into the storage tray 1, and the target structure 200 is installed with the storage tray 1. At this time, the transmission structure 3 can drive the heat dissipation structure 2 to move, so that the heat dissipation structure 2 is in contact with the target structure 200, thereby the heat dissipation structure 2 can absorb the heat of the target structure 200.

[0057] Therefore, the storage device 100 provided in this application has a heat dissipation structure 2 disposed in the receiving space 11 that accommodates the target structure 200. Through a transmission structure 3 connected to the heat dissipation structure 2, the heat dissipation structure 2 can contact the target structure 200, absorbing and dissipating heat from the target structure 200. This results in a simple structure, eliminating the need for a special storage bracket 1 and avoiding the increased space required due to external water channels. Furthermore, the target structure 200 can be directly inserted into the storage bracket 1, solving the problem in related technologies where the target structure 200 cannot be directly inserted or removed, thus supporting direct insertion and removal of the target structure 200. The contact between the heat dissipation structure 2 and the target structure 200 achieves heat absorption, increasing the heat transfer area and reducing the number of connections between pipes, avoiding the potential risk of leakage caused by multiple connections required for water-cooling pipes.

[0058] like Figures 1 to 4 As shown in the embodiment of this application, the heat dissipation structure 2 is connected to the storage tray 1 through a connecting component 4, and the heat dissipation structure 2 can move relative to the storage tray 1 in a first direction through the connecting component 4.

[0059] In this embodiment, the connecting component 4 is used to connect the heat dissipation component and the storage tray 1, and can be either a pin 61 or a screw. The connecting component 4 is arranged along the thickness direction of the storage tray 1, one end of the pin 61 is fixedly connected to the storage tray 1, and the other end is connected to the heat dissipation structure 2.

[0060] In this embodiment, when the transmission structure 3 is in the first state, the transmission structure 3 is not fully inserted into the receiving space 11, and the heat dissipation structure 2 is connected to the storage tray 1 through the connecting component 4. There is a gap between the heat dissipation structure 2 and the target structure 200. When the transmission structure 3 changes from the first state to the second state, the transmission structure 3 is inserted into the receiving space 11. Under the action of the transmission structure, the connecting component 4 can make the heat dissipation structure 2 move relative to the storage tray 1 in the first direction so that the heat dissipation component comes into contact with the target structure 200 to absorb the heat of the target structure 200.

[0061] like Figure 3 , Figure 4 and Figure 7 As shown in this embodiment, the heat dissipation structure 2 includes:

[0062] The first heat dissipation component 21 is disposed within the accommodating space 11 and has a plate-like structure.

[0063] In this embodiment, the first heat dissipation component 21 can be a heat spreader, a two-dimensional planar heat conduction device that achieves rapid temperature uniformity through the evaporation and condensation circulation of the actuating fluid within a closed cavity, possessing both heat conduction and heat diffusion functions. Its structure consists of a metal shell, capillary structure, and actuating fluid, and is manufactured through processes such as annealing and vacuuming, which can rapidly diffuse point-like high heat flux into a planar low heat flux distribution.

[0064] In this embodiment, the storage tray 1 has a accommodating space 11 including a first accommodating space 11 and a second accommodating space 11. The first accommodating space 11 and the second accommodating space 11 are arranged adjacent to each other along the thickness direction of the storage tray 1. The first accommodating space 11 is used to place the target structure 200, and the second accommodating space 11 is used to place the heat dissipation structure 2. The heat dissipation structure 2 includes a first heat dissipation component 21, which is disposed in the second accommodating space 11. The first heat dissipation component 21 is a plate-shaped structure. When the target structure 200 is in the first accommodating space 11, the target structure 200 is a plate-shaped structure arranged parallel to the first heat dissipation component 21. The first heat dissipation component 21 is connected to the transmission structure 3. When the transmission structure 3 is in a first state, there is a gap between the first heat dissipation component 21 and the target structure 200. When the transmission structure 3 drives the first heat dissipation component 21 from the first state to the second state, it can drive the first heat dissipation component 21 to move closer to the target structure 200, so that the first heat dissipation component 21 can fit against the target structure 200, thereby absorbing heat from the target structure 200.

[0065] like Figure 7 As shown in this embodiment, the heat dissipation structure 2 includes:

[0066] The second heat dissipation component 22 has a first end connected to the first heat dissipation component 21 and a second end extending outside the storage tray 1.

[0067] The third heat dissipation component 23 is connected to the second end of the second heat dissipation component 22.

[0068] In this embodiment, the second heat dissipation component 22 can be a heat pipe, which is an artificial component with excellent heat transfer performance, typically consisting of a closed metal tube, an internal working medium, and a capillary structure. Its working principle is based on the lower boiling point of a liquid under vacuum, the fact that its latent heat of vaporization is higher than its sensible heat, and the suction force of the capillary structure on the liquid. A heat pipe can be divided into an evaporation section, an adiabatic section, and a condensation section, and is widely used in the heat dissipation systems of electronic devices, such as smartphones and laptops. A single 10mm heat pipe or three 6mm heat pipes, flattened, can be welded to the first heat dissipation component 21. The heat pipe and the fluid distributor can be connected by brazing or by pressing together.

[0069] In this embodiment, the heat pipe can be wound and welded around the surface of the vapor chamber, thereby increasing the heat exchange area between the heat pipe and the vapor chamber, so as to better achieve heat exchange with the vapor chamber and transfer the heat of the vapor chamber to the outside of the storage bracket.

[0070] In this embodiment, the third heat dissipation component 23 can be a fluid distributor, which is an industrial device for precisely controlling the distribution of liquids. Its core structure includes a flexible closed container, a cap assembly, and a drive mechanism, which realizes the directional delivery of liquids through mechanical or electronic control.

[0071] In this embodiment, the heat dissipation structure 2 includes a first heat dissipation component 21, a second heat dissipation component 22, and a third heat dissipation component 23. The first heat dissipation component 21 can be a heat spreader, the second heat dissipation component 22 can be a heat pipe, and the third heat dissipation component 23 can be a fluid distributor. The fluid distributor can continuously transfer coolant to the heat pipe. The heat pipe exchanges heat with the heat spreader through the coolant to absorb heat and transfer the heat to the fluid distributor outside the storage tray 1. The fluid distributor cools the high-temperature coolant and then transfers it to the heat pipe again, thereby continuously dissipating heat for the target structure 200.

[0072] In this embodiment, the heat dissipation structure 2 includes a first heat dissipation component 21, a second heat dissipation component 22, and a third heat dissipation component 23. The first heat dissipation component 21 is in contact with the target structure 200, thereby absorbing the heat from the target structure 200. The second heat dissipation component 22 is disposed on the surface of the first heat dissipation component 21 and is in contact with the first heat dissipation component 21, thereby exchanging heat with the first heat dissipation component 21 to absorb the heat from the first heat dissipation component 21 and transfer the heat to the outside of the storage tray. Outside the storage tray, the third heat dissipation component 23 is in contact with the second heat dissipation component 22, thereby cooling the second heat dissipation component 22 through the liquid cooling medium of the third heat dissipation component 23. The third heat dissipation component 23 can have a continuous input of coolant, so that the first heat dissipation component 21, the second heat dissipation component 22, and the third heat dissipation component 23 can continuously dissipate heat for the target structure 200.

[0073] like Figures 3 to 6 As shown in the embodiment of this application, the heat dissipation structure 2 is connected to the storage tray 1 through the first reset component 5. The first reset component 5 is used to provide a reset force for the heat dissipation structure 2 to move relative to the storage tray 1 in a direction opposite to the first direction.

[0074] In this embodiment, the first reset structure is an elastic structure made of a high-resilience alloy, which can improve the working stress to be less than the elastic limit and maintain good resilience even after being subjected to pressure for a long time.

[0075] In this embodiment, the first direction is parallel to the thickness direction of the storage tray 1.

[0076] In this embodiment, the reset component is a combination of a pin 61 and a conical spring 62 sleeved on the pin 61.

[0077] In this embodiment, in the thickness direction of the storage tray 1, the first side plate of the storage tray 1, the heat dissipation structure 2 and the target structure 200 are arranged sequentially. The first reset component 5 passes through the transmission structure 3 to connect the heat dissipation structure 2 and the storage tray 1. Multiple first reset components 5 are respectively arranged at each corner of the heat dissipation structure 2 to connect the storage tray 1 and the heat dissipation structure 2 and prevent the heat dissipation structure 2 from shaking in directions other than the first direction.

[0078] In this embodiment, the first end of the pin 61 is fixedly connected to the storage tray 1, and the second end passes through the heat dissipation structure 2 and is located on the side of the heat dissipation structure 2 away from the first side plate of the storage tray 1. A conical spring 62 is provided between the heat dissipation structure 2 and the second end of the pin 61. The conical spring 62 is sleeved on the outside of the pin 61. When the transmission structure 3 is in the first state, the conical spring 62 is in a state of initial compression, the pin 61 is locked, and the conical spring 62 relies on the pin 61 to apply a force in the opposite direction to the first direction to the heat dissipation structure 2, thereby bringing the heat dissipation structure 2 closer to and fixing it to the first side plate of the storage tray 1. As the transmission structure 3 changes from the first state to the second state, the transmission structure 3 will press down on the heat dissipation structure 2 in the first direction, thereby further compressing the conical spring 62 between the heat dissipation structure 2 and the second end of the pin 61. At this time, the conical spring 62 is in a fully compressed state. At this time, the distance between the heat dissipation structure 2 and the first side plate of the storage tray 1 increases, and the heat dissipation structure 2 is attached and fixed to the surface of the target structure 200. Thus, the heat dissipation structure 2 can absorb the heat of the target structure 200 to cool down the target structure 200.

[0079] In this embodiment, when the target structure 200 is removed from the receiving space 11, the conical spring 62 can provide a restoring force to the heat dissipation structure 2 relative to the storage tray 1 in the opposite direction to the first direction, so that the heat dissipation structure 2 moves closer to the storage tray 1 again, and the conical spring 62 can also change from a fully compressed state to a partially compressed state.

[0080] like Figure 1 , Figure 2 , Figure 6 and Figure 7 As shown in the embodiment of this application, the transmission structure 3 is connected to the storage tray 1 through the second reset component 6. The second reset component 6 is used to provide a reset force for the transmission structure 3 to move relative to the storage tray 1 in a direction opposite to the second direction.

[0081] In this embodiment, the second direction can be the length direction of the storage tray 1, the setting direction of the second reset component 6 is parallel to the second direction, and the transmission structure 3 can move relative to the storage tray 1 in the second direction or in the opposite direction.

[0082] In this embodiment, the second reset component 6 is an elastic structure made of a high-resilience alloy, which can improve the working stress to be less than the elastic limit and maintain good resilience even after being subjected to pressure for a long time.

[0083] In this embodiment, a first hollow area is provided on the first side plate of the storage tray 1, and a second hollow area is provided on the transmission structure 3. When the transmission structure 3 is in the first state, the first hollow area and the second hollow area are correspondingly provided. When the transmission structure 3 is in the second state, the first hollow area and part of the second hollow area are corresponding.

[0084] In this embodiment, the second reset component 6 is disposed within the second hollow area. The first end of the second reset component 6 is fixedly connected to the heat dissipation structure 2 by bolts, and the second end is connected to the edge of the hollow area of ​​the transmission structure 3. When the transmission structure 3 is in the first state, i.e., not fully inserted into the storage tray 1, the second reset component 6 is in an extended state, with its second end connected to the edge of the hollow area of ​​the transmission structure 3. When the transmission structure 3 changes from the first state to the second state, it moves along the second direction, thereby driving the second end of the second reset component 6 to move along the second direction, causing the second reset component 6 to change from an extended state to a compressed state. The second reset component 6 in the compressed state has a reset force in the opposite direction to the second direction, which allows the second reset component 6 to push the transmission component to move along the second direction after the transmission structure 3 is released from its locking position, thus restoring the first state.

[0085] In this embodiment, the second reset component 6 has a Y-shaped structure, including a first spring and two second springs. The two second springs are symmetrically arranged at one end of the first spring. The first spring is sleeved on the fixing structure, and the fixing structure is connected to the heat dissipation structure 2 by bolts. The ends of the two second springs away from the first spring are respectively engaged with the edge of the second hollow area of ​​the transmission structure. The edge of the second hollow area away from the third heat dissipation component along the first direction is provided with a locking interface. The ends of the second springs away from the first spring are provided with locking hooks that are adapted to the locking interface. The locking hooks of the second springs are engaged with the locking interface.

[0086] When the transmission structure 3 is in the first state, the second reset component 6 is in the extended state. When the transmission structure 3 is in the second state, the transmission structure moves along the second direction, while the heat dissipation structure 2 remains stationary. Thus, the position of the first elastic piece remains unchanged, while the ends of the two second elastic pieces away from the first elastic piece move along the second direction, changing from an extended state to a compressed state. At this time, the two second elastic pieces have a reset force moving in the opposite direction to the second direction. When the transmission structure 3 is unlocked, it can be driven back to the position of the first state.

[0087] In this embodiment, when the transmission structure 3 is in the first state, i.e., not fully inserted into the storage tray 1, the conical spring 62 in the first reset structure is in a preliminary compressed state, the pin 61 is locked, and the conical spring 62, relying on the pin 61, applies a force in the opposite direction to the first direction to the heat dissipation structure 2, thereby bringing the heat dissipation structure 2 closer to and fixing it to the first side plate of the storage tray 1; while the second reset assembly 6 is in an extended state, and the second end of the second reset assembly 6 is connected to the edge of the hollow area of ​​the transmission structure 3; and when the transmission structure 3 changes from the first state to the second state, the transmission structure 3 moves along the first... The transmission structure moves in the first direction and in the second direction. Moving in the first direction, the transmission structure presses down on the heat dissipation structure 2, thereby further compressing the conical spring 62 between the heat dissipation structure 2 and the second end of the pin 61. At this time, the conical spring 62 is in a fully compressed state. At this time, the distance between the heat dissipation structure 2 and the first side plate of the storage tray 1 increases, so that the heat dissipation structure 2 is attached and fixed to the surface of the target structure 200. Moving in the second direction, the transmission structure 3 drives the end of the second elastic plate of the second reset assembly 6 away from the first elastic plate to move in the second direction, so that the second reset assembly 6 changes from an extended state to a compressed state.

[0088] like Figure 3 and Figure 4 As shown in the embodiment of this application, the transmission structure 3 includes:

[0089] A transmission plate 31 is located between the heat dissipation structure 2 and the storage tray 1, and a guide 32 is provided on the side of the transmission plate 31 facing the first heat dissipation assembly 21.

[0090] The first heat dissipation component 21 is provided with a guide groove 211 that is adapted to the guide member 32;

[0091] The guide member 32 moves relative to the guide groove 211 in a second direction so that the heat dissipation structure 2 can move relative to the storage tray 1 in a first direction, the first direction and the second direction having an angle.

[0092] In this embodiment, the guide 32 is a wedge-shaped block protruding from the surface of the transmission plate 31. The first heat dissipation assembly 21 has a guide groove 211 adapted to the wedge-shaped block on the side facing the transmission plate 31. When the transmission plate 31 is in the first state, that is, not fully inserted into the receiving space 11, the guide 32 on the transmission plate 31 is inserted into the guide groove 211 of the first heat dissipation assembly 21, and the transmission plate 31 is in contact with the first heat dissipation assembly 21. When the transmission plate 31 moves relative to the first heat dissipation assembly 21 in the second direction, the guide 32 is disengaged from the guide groove 211. At the same time, the guide 32 presses the first heat dissipation assembly 21 to make the first heat dissipation assembly 21 move away from the transmission plate 31. That is, the first heat dissipation assembly 21 moves relative to the storage tray 1 in the opposite direction to the first direction. The first heat dissipation assembly 21 approaches and is in contact with the target structure 200, so that the first heat dissipation assembly 21 absorbs heat from the target structure 200 to achieve heat dissipation of the target structure 200.

[0093] like Figure 1 and Figure 2 As shown in the embodiment of this application, the transmission structure 3 is correspondingly arranged with the driving member 7. The driving member 7 can drive the transmission structure 3 to generate displacement so that the transmission structure 3 can drive the heat dissipation structure 2 to contact the target structure 200.

[0094] In this embodiment, the driving member 7 can be a device for driving the transmission member to move in the second direction, or it can be a bracket handle for inserting the target structure 200 into the receiving space 11. The first end of the bracket handle in the width direction is rotatably connected to the target structure 200, and the second end is detachably connected to both the target structure 200 and the storage bracket 1.

[0095] In this embodiment, the driving component 7 can also be movably disposed on the storage tray 1, and can directly drive the transmission structure 3 to generate displacement.

[0096] In this embodiment, the length direction of the storage tray 1 is parallel to the second direction, and the thickness direction of the storage tray 1 is parallel to the first direction.

[0097] In this embodiment, the storage tray 1 has an opening at one end along its length, through which the target structure 200 enters and exits the receiving space 11, thereby enabling the direct insertion and removal of the target structure 200.

[0098] In this embodiment, after most of the target structure 200 is moved along the second direction to be inserted into the receiving space 11, the second end of the bracket handle is connected to the opening of the storage tray 1. During the connection between the bracket handle and the storage tray 1, the first heat dissipation component 21 is pushed so that the transmission plate 31 moves along the second direction. During the movement of the transmission plate 31 along the second direction, the guide member 32 on the transmission plate 31 will disengage from the guide groove 211 on the first heat dissipation component 21, so that the guide member 32 will press against the first heat dissipation component 21, so that the first heat dissipation component 21 moves relative to the storage tray 1 in the opposite direction to the first direction. During this process, the conical spring 62 will change from initial compression to full compression, so that the first heat dissipation component 21 fits against the target structure 200 and completes the locking. Thus, the first heat dissipation component 21 absorbs the heat of the target structure 200 and prevents the target structure 200 from overheating.

[0099] In this embodiment, the transmission plate 31 has an elongated through hole extending in the second direction corresponding to the range of motion of the pin 61, thereby preventing the movement of the transmission plate 31 from affecting the connection between the storage tray 1 and the first heat dissipation assembly 21.

[0100] like Figure 3 , Figure 4 and Figure 7 As shown in the embodiment of this application, a heat-conducting sheet 8 is provided on the side of the heat dissipation structure 2 that is away from the transmission structure 3; a wear-resistant layer is provided on the side of the heat dissipation structure 2 that is away from the transmission structure 3.

[0101] In this embodiment, the heat-conducting sheet 8 can accelerate the transfer of heat from the target structure 200 to the heat dissipation structure 2.

[0102] In this embodiment, a heat-conducting sheet 8 is provided on the side of the first heat dissipation component 21 away from the transmission plate 31. One side of the heat-conducting sheet 8 is connected to the first heat dissipation component 21 by adhesive backing, and the other side is provided with a wear-resistant layer. Thus, during the process of the target structure 200 being inserted into or pulled out of the receiving space 11, the target structure 200 can come into contact with the wear-resistant layer, preventing the target structure 200 from damaging the heat-conducting sheet 8 during repeated insertion and removal.

[0103] In this embodiment, heat dissipation structures 2 can be provided on both sides of the target structure 200 in the thickness direction to improve the heat dissipation effect. However, when the power of the target structure 200 is less than or equal to 25W, the heat dissipation structure 2 can be provided only on one side of the target structure 200 in the thickness direction.

[0104] On the other hand, this application also provides an electronic device, including:

[0105] Target structure 200 and storage device 100; the storage device 100 includes:

[0106] Storage tray 1, the storage tray 1 having a receiving space 11 for accommodating the target structure 200;

[0107] Heat dissipation structure 2 is disposed within the accommodating space 11;

[0108] The transmission structure 3 is movably connected to the storage tray 1 and is also connected to the heat dissipation structure 2.

[0109] The target structure 200 is located within the accommodating space 11, and the transmission structure 3 can drive the heat dissipation structure 2 to contact the target structure 200 in order to absorb the heat of the target structure 200.

[0110] In this embodiment, the storage tray 1 is a structure for placing the target structure 200. One end of the storage tray 1 along its length has an opening, and the target structure 200 is inserted into the receiving space 11 of the storage tray 1 through the opening to be placed in the storage tray 1. The storage tray 1 is used to protect the target structure 200 and prevent damage to the target structure 200.

[0111] In this embodiment, the target structure 200 can be a structure for generating heat, a solid-state drive, or other structures.

[0112] In this embodiment, the heat dissipation structure 2 can be a liquid-cooled heat dissipation structure 2, which is used to absorb the heat of the target structure 200 by contacting the target structure 200, thereby reducing the heat of the target structure 200 and achieving the purpose of heat dissipation.

[0113] In this embodiment, the transmission structure 3 has a first state and a second state. In the first state, the transmission structure 3 is not fully inserted into the storage tray 1, and the target structure 200 is not fully installed with the storage tray 1. At this time, the heat dissipation structure 2 is not in contact with the target structure 200. In the second state, the transmission structure 3 is fully inserted into the storage tray 1, and the target structure 200 is installed with the storage tray 1. At this time, the transmission structure 3 drives the heat dissipation structure 2 to move so that the heat dissipation structure 2 is in contact with the target structure 200, so that the heat dissipation structure 2 can absorb the heat of the target structure 200.

[0114] This application provides an electronic device including a storage device 100 and a target structure 200. The storage device 100 includes a storage tray 1, a heat dissipation structure 2, and a transmission structure 3. The storage tray 1 has a receiving space 11. The heat dissipation structure 2 and the target structure 200 are both disposed in the receiving space 11. The transmission structure 3 is movably connected to the storage tray 1, so that the storage tray 1 is in a first state or a second state. When the storage tray 1 is in the first state, the transmission structure 3 is not fully inserted into the storage tray 1, and the heat dissipation structure 2 is not in contact with the target structure 200. When the transmission structure 3 is in the second state, the transmission structure 3 is fully inserted into the storage tray 1, and the target structure 200 is installed with the storage tray 1. At this time, the transmission structure 3 can drive the heat dissipation structure 2 to move, so that the heat dissipation structure 2 is in contact with the target structure 200, thereby the heat dissipation structure 2 can absorb the heat of the target structure 200.

[0115] Therefore, the electronic device provided in this application has a heat dissipation structure 2 disposed in the receiving space 11 that accommodates the target structure 200. Through a transmission structure 3 connected to the heat dissipation structure 2, the heat dissipation structure 2 can contact the target structure 200, absorbing and dissipating heat from the target structure 200. This results in a simple structure, eliminating the need for a special storage tray 1 and avoiding the increased space required by externally wrapped water channels. Furthermore, the target structure 200 can be directly inserted into the storage tray 1, solving the problem in related technologies where the target structure 200 cannot be directly inserted or removed, thus supporting direct insertion and removal of the target structure 200. The heat absorption achieved through the contact between the heat dissipation structure 2 and the target structure 200 increases the heat transfer area and reduces the number of connections between pipes, avoiding the potential risk of leakage caused by multiple connections required for water-cooling pipes.

[0116] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0117] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.

Claims

1. A storage device, characterized in that, include: A storage tray having a receiving space for accommodating the target structure; A heat dissipation structure is disposed within the accommodating space; A transmission structure is movably connected to the storage tray and is also connected to the heat dissipation structure. The target structure is located within the accommodating space, and the transmission structure can drive the heat dissipation structure to contact the target structure in order to absorb the heat of the target structure.

2. The storage device according to claim 1, characterized in that, The heat dissipation structure is connected to the storage tray via a connecting component, and the heat dissipation structure can move relative to the storage tray in a first direction via the connecting component.

3. The storage device according to claim 1 or 2, characterized in that, The heat dissipation structure includes: A first heat dissipation component is disposed within the accommodating space, and the first heat dissipation component is a plate-shaped structure.

4. The storage device according to claim 3, characterized in that, The heat dissipation structure includes: A second heat dissipation component, wherein a first end of the second heat dissipation component is connected to the first heat dissipation component, and a second end of the second heat dissipation component extends outside the storage tray; The third heat dissipation component is connected to the second end of the second heat dissipation component.

5. The storage device according to claim 1 or 2, characterized in that, The heat dissipation structure is connected to the storage tray via a first reset component, which provides a reset force for the heat dissipation structure to move relative to the storage tray in a direction opposite to the first direction.

6. The storage device according to claim 1, characterized in that, The transmission structure is connected to the storage tray via a second reset assembly, which provides a reset force for the transmission structure to move relative to the storage tray in a direction opposite to the second direction.

7. The storage device according to claim 3, characterized in that, The transmission structure includes: A transmission plate is located between the heat dissipation structure and the storage tray, and the transmission plate has a guide on one side facing the first heat dissipation assembly; The first heat dissipation component is provided with a guide groove that is adapted to the guide member; The guide member moves relative to the guide groove in a second direction so that the heat dissipation structure can move relative to the storage tray in a first direction, the first direction and the second direction having an angle.

8. The storage device according to claim 1, characterized in that, The transmission structure is correspondingly arranged with the driving component, and the driving component can drive the transmission structure to generate displacement so that the transmission structure can drive the heat dissipation structure to contact the target structure.

9. The storage device according to claim 1, characterized in that, A heat-conducting plate is provided on the side of the heat dissipation structure opposite to the transmission structure; a wear-resistant layer is provided on the side of the heat dissipation structure opposite to the transmission structure.

10. An electronic device, characterized in that, Including the target structure and storage device; The storage device includes: A storage tray having a receiving space to accommodate the target structure; A heat dissipation structure is disposed within the accommodating space; A transmission structure is movably connected to the storage tray and is also connected to the heat dissipation structure. The target structure is located within the accommodating space, and the transmission structure can drive the heat dissipation structure to contact the target structure in order to absorb the heat of the target structure.

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