Test apparatus and test system for memory chips

Abstract

The application discloses a kind of test equipment and test system of storage chip, the test equipment includes inverted disc jig, fixed frame, bearing disc, lifting control assembly and test seat, the inverted disc jig is equipped with multiple fixed positions, the fixed position is used to place storage chip, and the ball mounting surface of the storage chip is opposite the bottom of the fixed position;The inside of the fixed frame is hollow, the bearing disc is arranged in the inside of the fixed frame, for carrying the inverted disc jig;The lifting control assembly is connected with the bearing disc, for controlling the up-and-down movement of the bearing disc;The test seat is arranged at the top of the fixed frame, for detecting the storage chip on the inverted disc jig after the inverted disc jig rises. By the above design, batch testing of storage chip can be realized.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and in particular to a testing device and testing system for memory chips. Background Technology

[0002] The testing equipment for memory chips is used to test the performance and packaging of memory chips after they have been manufactured. Its main purpose is to test memory chips and screen out those that do not meet the quality standards, making it easier to select out unqualified memory chips.

[0003] Currently, commonly used memory chip testing equipment can only test one memory chip at a time. Therefore, when different memory chips need to be tested, repeated picking and unpicking operations are required, which cannot achieve batch testing of memory chips and results in low testing efficiency. Utility Model Content

[0004] The purpose of this application is to provide a testing device and system for memory chips to enable batch testing of memory chips.

[0005] This application discloses a testing device for memory chips. The testing device includes a flipping fixture, a fixing frame, a carrier plate, a lifting control component, and a test seat. The flipping fixture has multiple fixing positions for placing memory chips, with the spherical surface of the memory chips facing away from the bottom of the fixing positions. The fixing frame is hollow inside, and the carrier plate is disposed inside the fixing frame to support the flipping fixture. The lifting control component is connected to the carrier plate and is used to control the up and down movement of the carrier plate. The test seat is disposed on the top of the fixing frame and is used to test the memory chips on the flipping fixture after the flipping fixture is raised.

[0006] Optionally, the test fixture includes a test base plate and multiple test main plates. The test base plate is disposed on top of the fixing frame and is disposed opposite to the tray-turning fixture. The test base plate is provided with multiple pin groups, each pin group including at least one pin, and each pin group corresponds to one of the memory chips for connection testing of one of the memory chips. The test main plates are disposed on the side of the test base plate away from the carrier tray, and one end of the test main plates is connected to at least two pin groups.

[0007] Optionally, the plurality of fixed positions are arranged in a multi-row and multi-column array on the turntable fixture, and the plurality of pin groups are arranged in a multi-row and multi-column array on the test base plate, with each test main board connected to at least one pin group in the same column.

[0008] Optionally, the test base plate is also provided with a plurality of first fixing parts, and the turntable fixture is provided with a plurality of second fixing parts, wherein the first fixing parts and the second fixing parts are inserted into each other in a one-to-one correspondence.

[0009] Optionally, the first fixing part includes a pin, and the plurality of first fixing parts are located on at least two straight lines; the second fixing part includes a socket, and the socket and the pin are inserted into each other in a one-to-one correspondence.

[0010] Optionally, the test equipment further includes a fan assembly located on top of the mounting bracket and positioned opposite the test motherboard for heat dissipation.

[0011] Optionally, the lifting control assembly includes a cylinder, two up control keys, and one down control key. The cylinder is connected to the support plate and is used to control the lifting and lowering of the support plate. The cylinder is electrically connected to both the up control key and the down control key. When both up control keys are activated simultaneously, the cylinder controls the support plate to rise. When the down control key is activated, the cylinder controls the support plate to fall.

[0012] Optionally, the top of the carrier plate is provided with a first limiting part, a second limiting part and a third limiting part, the first limiting part abutting against the front end of the reversing fixture, and the second limiting part and the third limiting part abutting against the two sides of the reversing fixture respectively.

[0013] Optionally, the rear end of the tilting fixture is provided with a handle.

[0014] This application also discloses a testing system for memory chips. The testing system includes a host, a display terminal, and a testing device for memory chips as described above. The host is connected to both the display terminal and a test socket in the testing device. The host is used to control the test socket to display the test results of the memory chips on the flipping fixture on the display terminal.

[0015] The beneficial effects of this application embodiment are as follows: Using the testing equipment provided in this application embodiment, the flipping fixture can simultaneously place multiple memory chips in batches, ensuring the spherical surface of the memory chips faces upwards. After placing the flipping fixture with the placed memory chips onto the carrier tray, the lifting control component controls the carrier tray and flipping fixture to move upwards, causing the test socket to contact the test points on the spherical surface of the memory chips. The test socket simultaneously tests all memory chips to detect any defective chips in this batch. After testing all memory chips, the lifting control component controls the carrier tray and flipping fixture to move downwards, then the flipping fixture is removed, the memory chips are taken out, and the next batch of memory chips is placed in. Therefore, the testing equipment provided in this application embodiment can simultaneously perform batch testing of memory chips, improving testing efficiency. Attached Figure Description

[0016] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings: Figure 1 This is a front view of a testing device provided in the first embodiment of this application in its first state; Figure 2 This is a front view of a testing device provided in the first embodiment of this application in the second state; Figure 3 This is a three-dimensional schematic diagram of a testing device provided in the first embodiment of this application; Figure 4 This is a schematic diagram of a test socket provided in the first embodiment of this application; Figure 5 This is a top view schematic diagram of a testing device provided in the first embodiment of this application; Figure 6 This is a schematic diagram of a turntable fixture provided in the first embodiment of this application; Figure 7 This is a schematic diagram of a tray-turning fixture and a carrier tray stacked according to the first embodiment of this application; Figure 8 This is a schematic diagram of a testing system provided in the second embodiment of this application.

[0017] Among them, 10 is the test system; 20 is the host; 30 is the display terminal; 40 is the test equipment; 100 is the reversing fixture; 100a is the front end; 100b is the rear end; 110 is the fixing position; 120 is the handle; 130 is the second fixing part; 200 is the fixing frame; 210 is the top plate; 220 is the bottom plate; 230 is the support plate; 240 is the slot; 300 is the carrier plate; 310 is the first limiting part; 320 is the second limiting part; 330 is the third limiting part; 400 is the lifting control assembly; 410 is the cylinder; 420 is the rising control key; 430 is the falling control key; 500 is the test seat; 510 is the test base plate; 511 is the pin assembly; 512 is the first fixing part; 520 is the test motherboard; 600 is the fan assembly; 610 is the fan; 620 is the fan knob; 700 is the control console; and 710 is the emergency stop button. Detailed Implementation

[0018] It should be understood that the terminology, specific structural and functional details used herein are merely for describing particular embodiments and are representative. However, this application may be implemented in many alternative forms and should not be construed as being limited to the embodiments set forth herein.

[0019] Furthermore, unless otherwise explicitly specified and limited, "connected" or "linked" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0020] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments.

[0021] like Figure 1 , Figure 2 and Figure 3 As shown, a test device 40 for a memory chip is provided as a first embodiment of this application. The test device 40 is used to perform tests on the memory chip, including but not limited to packaging tests, card opening tests, or performance tests.

[0022] The testing equipment 40 includes a flipping fixture 100, a fixing frame 200, a carrier plate 300, a lifting control component 400, and a testing base 500. The flipping fixture 100 has multiple fixing positions 110 for placing memory chips, with the ball-mounted surface of the memory chip facing away from the bottom of the fixing position 110. It should be noted that the ball-mounted surface of the memory chip refers to the side where the bottom of the memory chip is located, which has multiple pads and solder balls connected to the pads. In this embodiment, the memory chip is placed upside down into the fixing position 110 of the flipping fixture 100, so that the memory chip in the fixing position 110 is bottom-facing upwards and top-facing downwards.

[0023] Typically, before testing memory chips, they are placed in material trays. Each material tray contains multiple memory chips arranged in an array, with the chips positioned bottom-down and top-up. Using the flip-over fixture 100 in this embodiment, the fixture can be placed upside down on the material tray containing the memory chips, aligning the fixing positions 110 of the fixture with the chips on the tray. Then, the fixture and tray are rotated 180 degrees together, causing the chips to fall into the fixing positions 110 of the fixture, with their bottoms facing up and tops facing down, meeting the placement requirements. Afterward, the material tray is removed, the memory chips to be tested are reloaded onto it, and the flip-over fixture 100 containing the chips is placed on the carrier tray 300 to begin batch testing of the memory chips.

[0024] It should be noted that the reversing fixture 100 can be adapted to the different specifications of material trays from different manufacturers. For example, the distribution of the fixed positions 110 on the reversing fixture 100 and the spacing between the fixed positions 110 can be designed synchronously with the specifications of the fixed positions on the material tray, so as to facilitate the transfer of all the memory chips on the material tray into the fixed positions 110 of the reversing fixture 100. Of course, in some scenarios, the specifications of the reversing fixture 100 can also be different from those of the material tray. For example, the number of fixed positions 110 can be different, the distribution can be different, and even the memory chips can be manually placed into the fixed positions 110 of the reversing fixture 100.

[0025] In this embodiment, the fixed frame 200 is hollow, and the support plate 300 is disposed inside the fixed frame 200 for supporting the tilting fixture 100. The lifting control component 400 is connected to the support plate 300 and is used to control the vertical movement of the support plate 300; the test seat 500 is disposed on the top of the fixed frame 200 and is used to detect the memory chip on the tilting fixture 100 after the tilting fixture 100 is raised.

[0026] Figure 1 The carrier plate 300 is in its initial position, such as Figure 1 As shown, when the carrier disk 300 is in the initial position, the flipping fixture 100 containing the memory chip to be tested can be placed on the carrier disk 300, or the flipping fixture 100 can be removed from the carrier disk 300 after the test is completed.

[0027] Figure 2 The carrier plate 300 is in the test position, such as Figure 2 As shown, after the carrier plate 300 rises, the test points of the memory chip in the reversing fixture 100 contact the pins in the test socket 500, and the memory chip in the reversing fixture 100 is tested.

[0028] Using the testing equipment 40 provided in this embodiment, the flipping fixture 100 can simultaneously place multiple memory chips in batches, ensuring the chip's spherical surface faces upwards. After placing the flipping fixture 100 with the placed memory chips onto the carrier tray 300, the lifting control component 400 controls the carrier tray 300 and the flipping fixture 100 to move upwards, causing the test holder 500 to contact the test points on the spherical surface of the memory chips. The test holder 500 simultaneously tests all memory chips to detect any defective chips in this batch. After testing all memory chips, the lifting control component 400 controls the carrier tray 300 and the flipping fixture 100 to move downwards, then the flipping fixture 100 is removed, the memory chips are taken out, and the next batch of memory chips is placed in. Therefore, the testing equipment 40 provided in this embodiment can simultaneously perform batch testing of memory chips, improving testing efficiency.

[0029] like Figure 3 As shown, in one specific embodiment, the fixing frame 200 has a top plate 210, a bottom plate 220, and a support plate 230 connecting the top plate 210 and the bottom plate 220. The support plate 230 can be located on both sides and the front end of the fixing frame 200, separating the top plate 210 and the bottom plate 220, making the interior of the fixing frame 200 hollow. The bearing plate 300 is then positioned between the top plate 210 and the bottom plate 220. The lifting control assembly 400 includes a cylinder 410, the body of which is located below the bottom plate 220. The piston rod of the cylinder 410 passes through a through hole in the bottom plate 220 and connects to the bearing plate 300, controlling the up-and-down movement of the bearing plate 300. The test seat 500 is fixed to the top plate 210.

[0030] In other embodiments, the top plate 210 and bottom plate 220 of the fixing frame 200 can be connected by support columns at the four corners, or by a combination of support plate 230 and support columns. There is no limitation here, as long as the structural stability can be guaranteed and the up and down movement of the bearing plate 300 and the tilting jig 100 is not affected.

[0031] In other embodiments, the top plate 210 can be replaced with a hollow frame structure, and the bottom plate 220 can also be replaced with a hollow frame structure, as long as the stability of the structure is not affected.

[0032] like Figure 4 As shown, in some embodiments, the test base 500 includes a test base plate 510 and a plurality of test main plates 520. The test base plate 510 is disposed on the top of the fixing frame 200, specifically at the bottom of the top plate 210 of the fixing frame 200, and is disposed opposite to the tilting fixture 100 on the carrier plate 300.

[0033] The test base plate 510 is provided with multiple pin groups 511, each pin group 511 including at least one pin, and each pin group 511 corresponds to one of the memory chips for connection testing of one of the memory chips. During testing of the memory chip, the pins in each pin group 511 make contact with the corresponding test points on the memory chip to achieve electrical connection.

[0034] It should be noted that the number of pins required for testing varies depending on the model of the memory chip. In this embodiment, each pin group 511 tests one memory chip, and the pins in each pin group 511 are selected according to the actual situation.

[0035] The test socket 500 is compatible with both BGA154 and BGA146 product specifications for testing.

[0036] like Figure 3 and Figure 5As shown, the test motherboard 520 is disposed on the side of the test base plate 510 away from the carrier plate 300, and one end of the test motherboard 520 is connected to at least two pin groups 511. Specifically, the top of the mounting bracket 200 is provided with multiple slots 240, with the openings of the slots 240 facing upwards. The test motherboards 520 are vertically inserted into the corresponding slots 240 and connected to the corresponding pin groups 511. Through the above design, each test motherboard 520 can test at least two memory chips, thereby improving testing efficiency; moreover, these test motherboards 520 are arranged side by side and vertically, thereby improving the space utilization of the test motherboards 520, allowing the same number of test motherboards 520 to test a larger number of memory chips.

[0037] In some embodiments, the plurality of fixing positions 110 are arranged in a multi-row and multi-column array on the flipping fixture 100, and the plurality of pin groups 511 are arranged in a multi-row and multi-column array on the test base plate 510. Each test motherboard 520 is connected to at least one pin group 511 in the same column. Correspondingly, the slots 240 on the top of the fixing bracket 200 are arranged side by side, and the test motherboards 520 are also arranged side by side. Through the above design, the number of memory chips that can be tested simultaneously by each test motherboard 520 is further increased, and the number of memory chips that the test equipment 40 can test at one time is further increased.

[0038] It should be noted that, in this embodiment of the application, when selling the test equipment 40 according to actual needs, it is not necessary to insert the test motherboard 520 into the slot 240 at the top of the mounting bracket 200. When using the test equipment 40, customers can insert a qualified test motherboard 520 into the slot 240 to test the memory chip.

[0039] like Figure 4 and Figure 6 As shown, in some embodiments, the test base plate 510 is further provided with a plurality of first fixing parts 512, and the rewinding fixture 100 is provided with a plurality of second fixing parts 130, with the first fixing parts 512 and the second fixing parts 130 being inserted into each other in a one-to-one correspondence. In this embodiment, by providing first fixing parts 512 on the test base plate 510 and second fixing parts 130 on the rewinding fixture 100, the first fixing parts 512 on the test base plate 510 and the second fixing parts 130 on the rewinding fixture 100 are inserted and fixed during testing of the memory chip on the rewinding fixture 100. This limits the rewinding fixture 100 and prevents the pins on the test base plate 510 from not corresponding with the test points on the memory chip due to movement of the rewinding fixture 100, thus affecting the testing results.

[0040] The plurality of first fixing parts 512 are located on at least two straight lines, and the plurality of second fixing parts 130 are also located on at least two straight lines, so that after the turntable jig 100 is limited by the first fixing parts 512, it is subjected to limiting forces in at least two directions, thereby further improving the stability of the memory chip during testing.

[0041] In one specific implementation, the first fixing part 512 adopts a socket design, and the second fixing part 130 adopts a pin design. During the process of controlling the reversing jig 100 to rise, the pin on the reversing jig 100 is inserted into the socket on the test base plate 510 to achieve positioning of the reversing jig 100.

[0042] In another specific implementation, the first fixing part 512 adopts a pin design, and the second fixing part 130 adopts a socket design. During the process of controlling the reversing fixture 100 to rise, the pin on the test base plate 510 is inserted into the socket on the reversing fixture 100 to achieve positioning of the reversing fixture 100.

[0043] Of course, in other embodiments, the first fixing part 512 may also be a hybrid structure of a pin and a socket, and the second fixing part 130 may also be a hybrid structure of a pin and a socket.

[0044] like Figure 1 and Figure 3 As shown, in some embodiments, the test device 40 further includes a fan assembly 600, which is located on top of the mounting bracket 200 and is disposed opposite to the test motherboard 520. The fan assembly 600 is used to dissipate heat from the test motherboard 520 and avoid the test motherboard 520 from overheating due to prolonged testing, which would affect the service life of the test motherboard 520.

[0045] The fan assembly 600 includes multiple fans 610, specifically four fans 610 arranged side by side, which simultaneously blow air to cool all the test motherboards 520. Of course, in some other embodiments, the fan assembly 600 may not be installed on the test device 40, or the fans 610 may be detached from the mounting bracket 200, and the user may install the fans 610 as needed.

[0046] like Figure 1 As shown, in some embodiments, the test device 40 also includes a console 700 located below the fixture 200, where the main part of the lifting control assembly 400 and the control part of the fan assembly 600 are located.

[0047] Specifically, the fan assembly 600 is controlled by a fan knob 620, which controls the start and stop of the fan 610, as well as the speed of the fan 610.

[0048] In some embodiments, the lifting control assembly 400 includes a cylinder 410, two up control keys 420, and one down control key 430. The cylinder 410 is connected to the support plate 300 and is used to control the lifting and lowering of the support plate 300. The cylinder 410 is electrically connected to both the up control key 420 and the down control key 430. When both up control keys 420 are activated simultaneously, the cylinder 410 controls the support plate 300 to rise. When the down control key 430 is activated, the cylinder 410 controls the support plate 300 to fall.

[0049] Specifically, the main body of the cylinder 410 is disposed within the control console 700, and the piston rod of the cylinder 410 is connected to the support plate 300. The up control key 420 and the down control key 430 are both disposed on the control console 700, and are located on the front of the control console 700 together with the fan knob 620, with the two up control keys 420 respectively located on both sides of the front of the control console 700.

[0050] By employing the aforementioned lifting control component 400, two hands are required to simultaneously press the two lifting control buttons 420 to control the lifting of the carrier plate 300. This prevents accidental lifting of the carrier plate 300, which could lead to incorrect testing and cause the test fixture 500 to start operating before contacting the memory chip, thus posing a safety risk. Furthermore, it prevents accidental lifting of the carrier plate 300 if other structures are placed on it, or if the memory chip on the flipping fixture 100 is not properly positioned, which could cause the other structures or improperly positioned memory chip to press against the pins on the test base plate 510, resulting in pin damage. After testing, the carrier plate 300 is lowered back to its initial position by pressing the lowering control button 430 with one hand.

[0051] In some embodiments, the front of the console 700 is also provided with an emergency stop button 710. In case of an emergency, the emergency stop button 710 can be pressed to stop the entire test equipment 40 from operating. Moreover, on the front of the console 700, two up control buttons 420 are located in the upper area of ​​the console 700 and are located on both sides; the fan knob 620 is located below one of the up control buttons 420, the emergency stop button 710 is located below the fan knob 620, and the down control button 430 is located below the other up control button 420 and is at the same height as the emergency stop button 710.

[0052] like Figure 7As shown, in some embodiments, the top of the carrier 300 is provided with a first limiting part 310, a second limiting part 320, and a third limiting part 330. The first limiting part 310 abuts against the front end 100a of the reversing fixture 100, and the second limiting part 320 and the third limiting part 330 abut against the two sides of the reversing fixture 100, respectively. During the process of placing the reversing fixture 100 onto the carrier 300, due to the limited space within the fixing frame 200, the front end 100a of the reversing fixture 100 needs to be placed on the rear end 100b of the carrier 300 first, with the reversing fixture 100 positioned between the second limiting part 320 and the third limiting part 330. Then, the reversing fixture 100 is pushed towards the interior of the fixing frame 200, so that the front end 100a of the reversing fixture 100 contacts the first limiting part 310 of the carrier 300. At this point, the front end 100a and both sides of the reversing jig 100 abut against the first limiting part 310, the second limiting part 320 and the third limiting part 330 of the carrier plate 300, respectively. The reversing jig 100 is limited by the first limiting part 310, the second limiting part 320 and the third limiting part 330, which facilitates moving the reversing jig 100 to the target position and maintaining the stability of the reversing jig 100 during the rising process, which facilitates the subsequent alignment between the first fixing part 512 and the second fixing part 130.

[0053] In some embodiments, the rear end 100b of the reversing fixture 100 is provided with a handle 120, which allows the operator to hold the handle 120 to remove the reversing fixture 100 from the fixing frame 200, or to hold the handle 120 to push the reversing fixture 100 into the fixing frame 200. Therefore, the handle 120 at the rear end 100b of the reversing fixture 100 facilitates the handling of the reversing fixture 100.

[0054] like Figure 8 As shown, a memory chip testing system 10 provided as a second embodiment of this application includes a host 20, a display terminal 30, and a memory chip testing device 40 as described above. The host 20 is connected to both the display terminal 30 and the test socket 500 in the test device 40. The host 20 is used to control the test socket 500 to display the test results of the memory chip on the flipping fixture 100 on the display terminal 30.

[0055] The solution adopted in this application embodiment can increase the testing efficiency of memory chips from 480Pcs / h to 3000Pcs / h, which is 6.2 times the original efficiency, greatly improving the detection efficiency.

[0056] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A testing device for memory chips, characterized in that, include: A memory chip placement fixture is provided with multiple fixing positions for placing memory chips, and the spherical surface of the memory chips faces away from the bottom of the fixing positions. The fixing frame is hollow inside; A support plate, disposed inside the fixed frame, is used to support the tilting fixture; A lifting control component, connected to the support plate, is used to control the up and down movement of the support plate; as well as A test stand, located on top of the fixed frame, is used to detect the memory chip on the reversing fixture after the reversing fixture is raised.

2. The testing equipment for memory chips as described in claim 1, characterized in that, The test socket includes a test base plate and multiple test main plates. The test base plate is disposed on the top of the fixing frame and is disposed opposite to the reversing fixture. The test base plate is provided with multiple pin groups, each pin group including at least one pin, and each pin group corresponds to one of the memory chips for connection testing of one of the memory chips. The test motherboard is located on the side of the test base plate away from the carrier plate, and one end of the test motherboard is connected to at least two of the pin groups.

3. The testing equipment for memory chips as described in claim 2, characterized in that, The plurality of fixed positions are arranged in a multi-row and multi-column array on the reversing fixture, and the plurality of pin groups are arranged in a multi-row and multi-column array on the test base plate, with each test main board connected to at least one pin group in the same column.

4. The testing equipment for memory chips as described in claim 2, characterized in that, The test base plate is also provided with a plurality of first fixing parts, and the reversing fixture is provided with a plurality of second fixing parts, with the first fixing parts and the second fixing parts being inserted into each other in a one-to-one correspondence.

5. The testing equipment for memory chips as described in claim 4, characterized in that, The first fixing part includes a pin, and the plurality of first fixing parts are located on at least two straight lines; The second fixing part includes a socket, and the socket and the pin are inserted into each other in a one-to-one correspondence.

6. The testing equipment for memory chips as described in claim 2, characterized in that, The testing equipment also includes a fan assembly located on top of the mounting bracket and positioned opposite the test motherboard for heat dissipation.

7. The testing equipment for memory chips as described in claim 1, characterized in that, The lifting control assembly includes a cylinder, two up control keys and one down control key. The cylinder is connected to the support plate and is used to control the lifting and lowering of the support plate. The cylinder is electrically connected to both the up control key and the down control key. When both up control keys are activated simultaneously, the cylinder controls the support plate to rise; when the down control key is activated, the cylinder controls the support plate to fall.

8. The testing equipment for memory chips as described in claim 1, characterized in that, The top of the carrier plate is provided with a first limiting part, a second limiting part and a third limiting part. The first limiting part abuts against the front end of the reversing fixture, and the second limiting part and the third limiting part abut against the two sides of the reversing fixture respectively.

9. The testing equipment for memory chips as described in claim 1, characterized in that, The reversing fixture has a handle at its rear end.

10. A testing system for a memory chip, characterized in that, The device includes a host, a display, and a testing device for a memory chip as described in any one of claims 1-9. The host is connected to both the display and a test socket in the testing device. The host is used to control the test socket to display the test results of the memory chip on the flipping fixture on the display.

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