Busbar structure applied to circuit board welding and circuit board

Abstract

The utility model relates to the technical field of circuit board processing, more particularly to busbar structure and circuit board for circuit board welding, include: conductive strip, the conductive strip includes first conductive arm and second conductive arm, be equipped with arc connecting portion between the first conductive arm and the second conductive arm, insulating coating, cover the outer wall of first conductive arm and second conductive arm, insulating sleeve, cover the outer wall of arc connecting portion, the utility model discloses a traditional flexible jumper is reformed into the busbar structure with rigid conductive arm and standardization PIN needle, makes it can be steady, accurate by automated equipment snatch and positioning, this makes the busbar to be like standard electronic components and pass through mounting equipment to realize automatic insertion, compatible reflow soldering, wave soldering and other automatic welding process, to improve the production efficiency and consistency of PCB assembly.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and more specifically to a busbar structure used for circuit board soldering and a circuit board. Background Technology

[0002] In the design, manufacturing, and debugging of printed circuit boards (PCBs), jumpers are a common and important electrical connection method. They are primarily used to establish a direct conductive path between two electrical nodes on a PCB. Their applications are wide-ranging, including but not limited to: correcting initial design flaws, enabling flexible configuration of circuit functions, providing temporary connections during prototyping, and providing additional current-carrying paths for high-current circuits.

[0003] Currently, the most common jumper solution in the industry is to use single or multiple strands of copper wire to fix them to the pads or through holes of the PCB by hand soldering. Although this traditional method is simple and flexible, it is essentially dependent on manual operation. Therefore, its inherent limitations are becoming increasingly apparent in the modern electronics manufacturing industry's pursuit of automation, high efficiency and high quality consistency.

[0004] Because jumper wires are usually non-standard flexible wires with variable shapes and sizes, and lack rigid structures that allow automated equipment to precisely grasp and position them, the entire soldering process must be done manually. This severely restricts the production pace of PCB assembly lines and is incompatible with modern automated soldering processes such as reflow soldering and wave soldering, becoming a bottleneck for improving overall manufacturing efficiency.

[0005] Meanwhile, the quality of manual soldering directly depends on the operator's skill level and concentration. It is very easy to introduce defects such as cold solder joints, false solder joints, too much or too little solder. These process defects will lead to increased resistance at the connection point and insufficient mechanical strength. They may fail under vibration or temperature change environments, directly affecting the long-term reliability and yield of the final product. Utility Model Content

[0006] The purpose of this utility model is to address the shortcomings of existing technologies by providing a technical solution: a busbar structure for circuit board soldering, comprising:

[0007] A conductive strip, comprising a first conductive arm and a second conductive arm, wherein an arc-shaped connecting portion is provided between the first conductive arm and the second conductive arm;

[0008] An insulating coating is applied to the outer walls of the first conductive arm and the second conductive arm.

[0009] An insulating sleeve is fitted onto the outer wall of the arc-shaped connection portion;

[0010] The first conductive arm, the second conductive arm, and the arc-shaped connecting part are all made of copper. The strength of the first conductive arm and the second conductive arm is higher than that of the arc-shaped connecting part. The first conductive arm and the second conductive arm are copper strip structures. The first conductive arm and the second conductive arm are provided with PIN pins for soldering to the circuit board nodes.

[0011] The first conductive arm and the second conductive arm are set to a pre-formed shape and can be grasped by a robotic arm to move the PIN pin to the target position on the circuit board. The arc-shaped connecting part undergoes adaptive deformation according to the relative position of the first conductive arm and the second conductive arm.

[0012] Preferably, the first conductive arm and the second conductive arm are provided with one or more PIN pin connection portions.

[0013] Preferably, the first conductive arm and the second conductive arm are provided with a first PIN pin connection part and a second PIN pin connection part, and both the first PIN pin connection part and the second PIN pin connection part are connected with PIN pins.

[0014] Preferably, the first PIN connector and the second PIN connector are bent to form a predetermined angle so that the distribution of the multiple PINs corresponds to the nodes on the circuit board.

[0015] Preferably, the plurality of PIN pins connected to each of the PIN pin connectors are linearly distributed.

[0016] Preferably, the insulating coating comprises an epoxy resin insulating layer.

[0017] Preferably, the insulating sleeve includes a heat shrink tubing.

[0018] Preferably, the surface of the PIN pin is provided with a tin-plated layer or a nickel-plated layer.

[0019] Preferably, the conductive strip is a strip structure formed by repeatedly stacking multiple layers of copper foil with a thickness of 0.05 to 0.5 mm, wherein the copper foil is welded into a single structure at the first conductive arm and the second conductive arm.

[0020] Another aspect of this utility model proposes a technical solution: a circuit board, comprising:

[0021] The first node and the second node;

[0022] The aforementioned busbar structure for circuit board soldering is connected between the first node and the second node.

[0023] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0024] This invention transforms traditional flexible jumpers into busbar structures with rigid conductive arms and standardized pins, enabling them to be stably and accurately grasped and positioned by automated equipment. This allows the busbars to be automatically inserted into the PCB through placement equipment, just like standard electronic components, and is compatible with automated soldering processes such as reflow soldering and wave soldering, thereby improving the production efficiency and consistency of PCB assembly. The flexible arc-shaped connection design effectively absorbs stress generated by thermal expansion and contraction or mechanical vibration during soldering and subsequent use, preventing stress concentration at the solder joints that could lead to cracking or failure, thus ensuring long-term connection reliability and service life of the product in harsh environments. Attached Figure Description

[0025] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component shown in the various figures may be denoted by the same reference numeral. For clarity, not every component is labeled in each figure. Embodiments of various aspects of the present invention will now be described by way of example and with reference to the accompanying drawings, wherein:

[0026] Figure 1 This is a schematic diagram of the busbar structure applied to circuit board soldering as shown in this utility model;

[0027] Figure 2 This is an exploded view of the busbar structure used for circuit board soldering as shown in this utility model;

[0028] Figure 3 This is a first schematic diagram of the busbar structure shown in this utility model being installed on a circuit board;

[0029] Figure 4 This is a second schematic diagram of the busbar structure shown in this utility model being installed on a circuit board. Detailed Implementation

[0030] To better understand the technical content of this utility model, specific embodiments are provided below in conjunction with the accompanying drawings.

[0031] {Example 1}

[0032] Combination Figure 1 and Figure 2 As shown, the first aspect of this utility model provides a technical solution: a busbar structure for circuit board soldering, comprising a conductive strip 10, an insulating coating 20, and an insulating sleeve 30.

[0033] It should be understood that the purpose of a busbar structure is to directly and simply connect two nodes on a PCB so that current can flow through. It is typically used for PCB board correction / remediation, testing and debugging, or compatibility with different configurations, as well as as a high-current channel.

[0034] Specifically, in combination Figure 1 As shown, the conductive strip 10 includes a first conductive arm 11 and a second conductive arm 12, and an arc-shaped connecting part 13 is provided between the first conductive arm 11 and the second conductive arm 12.

[0035] The first conductive arm 11, the second conductive arm 12, and the arc-shaped connecting part 13 are all made of copper. The strength of the first conductive arm 11 and the second conductive arm 12 is higher than that of the arc-shaped connecting part 13. The first conductive arm 11 and the second conductive arm 12 are copper strip structures. The first conductive arm 11 and the second conductive arm 12 are each provided with PIN pins 14 for soldering to the circuit board nodes.

[0036] Furthermore, the first conductive arm 11 and the second conductive arm 12 are set to a pre-formed shape and can be grasped by a robotic arm to move the PIN pin 14 to the target position on the circuit board. The arc-shaped connecting part 13 undergoes adaptive deformation according to the relative position of the first conductive arm 11 and the second conductive arm 12.

[0037] As described above, the conductive strip 10 is configured with three parts: two high-strength rigid conductive arms (first conductive arm 11 and second conductive arm 12) and a low-strength flexible arc-shaped connecting part (arc-shaped connecting part 13).

[0038] The two rigid conductive arms provide a stable and reliable gripping point for the robotic arm. Their pre-formed shape and sufficient strength ensure that they will not deform during automatic insertion, thus enabling precise insertion of the PIN pins 14 into the predetermined holes on the circuit board. The flexible arc-shaped connecting part 13 in the middle acts as a stress buffer area, which can compensate for the thermal stress generated during soldering (such as reflow soldering) due to the difference in thermal expansion coefficients between the PCB board and the busbar. It absorbs this stress through its own elastic deformation, thereby effectively preventing the solder joint from cracking or forming a cold solder joint due to stress concentration, and improving the reliability of long-term connection.

[0039] Meanwhile, the flexible connection allows the two conductive arms to move relative to each other within a certain range, which provides tolerance for the manufacturing tolerance of the PCB board and the installation alignment, enabling the busbar to adapt to two nodes that are not perfectly aligned, thereby improving the applicability of the product and the assembly yield.

[0040] In an optional embodiment, the conductive strip 10 is a strip structure formed by repeatedly stacking multiple layers of copper foil with a thickness of 0.05 to 0.5 mm. In the first conductive arm 11 and the second conductive arm 12, the copper foil is welded into a single structure. However, it is not welded at the arc-shaped connection portion 13. Therefore, the strength at the arc-shaped connection portion 13 is low and it is easy to bend.

[0041] In this way, multiple layers of copper foil are welded together at the conductive arm to form a thick conductive path, which can carry large currents. At the arc-shaped connection 13, the unwelded independent thin copper foil layers can slide against each other, making this part very flexible and easy to bend, thus meeting the requirements of maintaining rigidity at connection points requiring high strength and high current, and maintaining flexibility in the connection path.

[0042] In addition, this processing method, which first forms a semi-finished composite board through welding and then shapes it through precision processes such as stamping / laser cutting and CNC bending, can efficiently and accurately manufacture various complex three-dimensional shapes to meet the spatial requirements of different circuit board layouts.

[0043] In an optional embodiment, the first conductive arm 11 and the second conductive arm 12 are provided with one or more PIN pin connections.

[0044] Combination Figure 1 and Figure 2 As shown, the first conductive arm 11 and the second conductive arm 12 are provided with a first PIN pin connection part 141 and a second PIN pin connection part 142, and both the first PIN pin connection part 141 and the second PIN pin connection part 142 are connected to PIN pins 14.

[0045] The first PIN connector 141 and the second PIN connector 142 are bent to form a predetermined angle so that the distribution of the plurality of PINs 14 corresponds to the nodes on the circuit board.

[0046] Thus, a first PIN pin connection portion 141 and a second PIN pin connection portion 142 that can be bent independently are provided on the conductive arm. Each connection portion can carry one or more PIN pins 14. These connection portions can be pre-made with specific angles and orientations so that a group of PIN pins 14 can be precisely aligned with a group of nodes on the circuit board that may be irregularly distributed (such as non-linear arrangement).

[0047] Preferably, the multiple PIN pins 14 connected to each PIN pin connector are linearly distributed.

[0048] In this way, the linear arrangement is highly consistent with the movement trajectory of the automatic insertion equipment and the layout pattern of the through holes on the PCB, enabling the robotic arm to smoothly and accurately insert a whole row of pins into the corresponding node holes on the PCB at the same time.

[0049] Furthermore, the surface of the PIN 14 is provided with a tin-plated layer or a nickel-plated layer. This improves the solderability of the PIN 14, allowing the solder to quickly and evenly wet and spread during reflow soldering or wave soldering with the PCB, forming a strong and reliable solder joint and effectively preventing cold solder joints.

[0050] Combination Figure 2As shown, the insulating coating 20 covers the outer walls of the first conductive arm 11 and the second conductive arm 12 (the PIN pin 14 is not coated with the insulating coating 20), and the insulating sleeve 30 is fitted onto the outer wall of the arc-shaped connecting part 13.

[0051] In an optional embodiment, the insulating coating 20 comprises an epoxy resin insulating layer. The insulating sleeve 30 comprises a heat-shrink tubing.

[0052] Specifically, the insulating coating 20 adopts an electrostatic spraying process, which allows charged epoxy powder to be uniformly adsorbed on the surface of the conductive arm. Then, it is cured by heating to form a dense and strong insulating film. This can form an insulating layer with controllable thickness and extremely thin thickness, which does not affect the spatial layout of the busbar in dense components, and is conducive to realizing mass production and standardized automated production.

[0053] Specifically, the heat shrink tubing can be selected in a suitable size and fitted over the flexible arc-shaped connection part 13. It is then heated (e.g., by hot air) to shrink and tightly wrap the part. Since the heat shrink tubing itself has a certain degree of flexibility, it can provide insulation protection without significantly affecting the bending and stretching deformation capabilities required by the arc-shaped connection part 13.

[0054] {Example 2}

[0055] Combination Figure 3 As shown, another aspect of this utility model proposes a technical solution: a circuit board 100, including a first node 110 and a second node 120; wherein, the aforementioned busbar structure for circuit board soldering is connected between the first node 110 and the second node 120.

[0056] Combination Figure 4 As shown, when the spacing between the first node 110 and another node on the circuit board 100 does not match the length of the busbar structure, for example, the longitudinal offset node 121 can be connected to the first node 110 and the longitudinal offset node 121 through the busbar structure by shortening or lengthening the arc-shaped connecting part 13; for example, the lateral offset node 122 can be connected to the first node 110 and the lateral offset node 122 through the busbar structure by shifting the arc-shaped connecting part 13.

[0057] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this invention shall be determined by the claims.

Claims

1. A busbar structure for use in circuit board soldering, characterized in that, include: A conductive strip (10) includes a first conductive arm (11) and a second conductive arm (12), and an arc-shaped connecting part (13) is provided between the first conductive arm (11) and the second conductive arm (12); An insulating coating (20) is applied to the outer walls of the first conductive arm (11) and the second conductive arm (12); An insulating sleeve (30) is fitted onto the outer wall of the arc-shaped connecting part (13); Among them, the first conductive arm (11), the second conductive arm (12) and the arc-shaped connecting part (13) are all made of copper, and the strength of the first conductive arm (11) and the second conductive arm (12) is higher than that of the arc-shaped connecting part (13). The first conductive arm (11) and the second conductive arm (12) are copper strip structures, and the first conductive arm (11) and the second conductive arm (12) are provided with PIN pins (14) for soldering to the circuit board nodes. The first conductive arm (11) and the second conductive arm (12) are set to a pre-formed shape and can be grasped by a robotic arm to move the PIN pin (14) to the target position on the circuit board. The arc-shaped connecting part (13) undergoes adaptive deformation according to the relative position of the first conductive arm (11) and the second conductive arm (12).

2. The busbar structure for circuit board soldering according to claim 1, characterized in that, The first conductive arm (11) and the second conductive arm (12) are provided with one or more PIN pin connection portions.

3. The busbar structure for circuit board soldering according to claim 2, characterized in that, The first conductive arm (11) and the second conductive arm (12) are provided with a first PIN pin connection part (141) and a second PIN pin connection part (142), and both the first PIN pin connection part (141) and the second PIN pin connection part (142) are connected with PIN pins (14).

4. The busbar structure for circuit board soldering according to claim 3, characterized in that, The first PIN connector (141) and the second PIN connector (142) are bent to form a predetermined angle so that the distribution of the plurality of PINs (14) corresponds to the nodes on the circuit board.

5. The busbar structure for circuit board soldering according to any one of claims 2 to 4, characterized in that, The multiple PIN pins (14) connected to each of the PIN pin connectors are linearly distributed.

6. The busbar structure for circuit board soldering according to claim 1, characterized in that, The insulating coating (20) includes an epoxy resin insulating layer.

7. The busbar structure for circuit board soldering according to claim 1, characterized in that, The insulating sleeve (30) includes a heat shrink tubing.

8. The busbar structure for circuit board soldering according to claim 1, characterized in that, The surface of the PIN pin (14) is provided with a tin-plated layer or a nickel-plated layer.

9. The busbar structure for circuit board soldering according to claim 1, characterized in that, The conductive strip (10) is a strip structure formed by repeatedly stacking multiple layers of copper foil with a thickness of 0.05 to 0.5 mm. The copper foil is welded into a single structure at the first conductive arm (11) and the second conductive arm (12).

10. A circuit board, characterized in that, include: First node (110) and second node (120); The busbar structure for circuit board soldering described in any one of claims 1-9 is connected between the first node (110) and the second node (120).

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