A module power skeleton transformer based on reflow soldering

Abstract

The utility model belongs to transformer manufacturing technical field especially is a kind of module power skeleton transformer based on reflow soldering, including magnetic ring and enameled wire, still including microskeleton, microskeleton includes magnetic ring positioning part, magnetic ring limiting part, enameled wire constraint part and PCB adaptation part;Magnetic ring positioning part is "U" type component, inside is equipped with the positioning groove for placing magnetic ring;Two groups of enameled wire constraint part are fixed in the top surface both ends of magnetic ring positioning part, for the outgoing end of constraint enameled wire;PCB adaptation part includes surface mount pin and binding post;Through the surface mount connection assembly adaptation SMT reflow soldering process of integration microskeleton, need not artificial spot welding, can be integrated into high-speed production line;Magnetic ring positioning part and magnetic ring limiting part fixed magnetic ring, enameled wire constraint part limits enameled wire displacement, prevents the problem that magnetic ring pulls enameled wire and leads to soldering point drop, fracture;Without additional fixing piece, overall volume is equivalent with traditional magnetic ring transformer, adapts module power miniaturization demand.

Description

Technical Field

[0001] This utility model belongs to the field of transformer manufacturing technology, specifically relating to a modular power supply frame transformer based on reflow soldering, which is suitable for modular power supplies in PLC / DCS systems, industrial automation control, instrumentation, power and rail transportation, medical and security fields. Background Technology

[0002] Modular power supplies are the core power supply components of electronic devices, and transformers, as key components of modular power supplies, have their manufacturing processes directly affecting the production efficiency and product quality of modular power supplies.

[0003] Currently, the transformer design for modular power supplies mainly adopts the magnetic ring transformer solution. The specific process is as follows: enameled wire is wound on a magnetic ring to form a magnetic ring transformer, and then the enameled wire leads of the magnetic ring transformer are soldered to the PCB board of the modular power supply through spot welding.

[0004] However, the existing spot welding process for magnetic ring transformers has significant drawbacks:

[0005] 1. The magnetic ring transformer has a large number of enameled wire leads. During spot welding, it is necessary to manually distinguish the PCB welding position corresponding to each lead. This is not compatible with modern high-speed SMT (Surface Mount Technology) production lines, resulting in slow production cycle and high labor costs.

[0006] 2. To meet the miniaturization requirements of modular power supplies, the enameled wire used in magnetic ring transformers is usually small in diameter (e.g., less than 0.1mm), while the magnetic ring core is relatively large in volume and heavy in weight. After spot welding, the magnetic ring is prone to displacement during subsequent transportation or assembly. The large weight of the magnetic ring will pull the thin enameled wire, causing the solder joint to fall off or the enameled wire to break, resulting in a high product defect rate.

[0007] To address the aforementioned issues, this application proposes a reflow soldering-based modular power supply frame transformer. Utility Model Content

[0008] To address the aforementioned problems in the existing technology, this utility model provides a reflow soldering-based modular power supply frame transformer, enabling automated production of modular power supply transformers (compatible with SMT production lines), while simultaneously improving product quality stability and reducing production costs.

[0009] The core of this solution is to transform the traditional "unconstrained spot welding of magnetic ring transformers" into a "skeleton-positioned surface mount" mode by designing an integrated micro-skeleton. While retaining the original electromagnetic properties of the magnetic ring transformer (such as inductance and anti-interference), the mechanical structure of the skeleton achieves three main functions: 1. Fixing the magnetic ring to prevent displacement during production, transportation, and use; 2. Constraining the enameled wire leads to eliminate the risk of wire breakage due to thin wires; 3. Adapting to SMT reflow soldering processes to achieve automated production, thus solving the efficiency and quality pain points of traditional spot welding processes from a mechanical structure perspective.

[0010] To achieve the above objectives, this utility model provides the following technical solution: a modular power supply frame transformer based on reflow soldering, including a magnetic ring and enameled wire wound on the magnetic ring, and also including a microframework. The microframework is injection molded from high temperature resistant reinforced engineering plastic, and the microframework includes a magnetic ring positioning part, a magnetic ring limiting part, an enameled wire constraint part, and a PCB adapter part.

[0011] The magnetic ring positioning part is a "U" shaped component with a positioning groove inside for placing the magnetic ring. The magnetic ring limiting part is fixed in the positioning groove to fix the magnetic ring.

[0012] The two sets of enameled wire constraint portions are symmetrically fixed at both ends of the top surface of the magnetic ring positioning portion to constrain the lead-out ends of the enameled wires;

[0013] Two sets of PCB adapters are symmetrically fixed at both ends of the magnetic ring positioning part. Each set includes surface mount pins and wire bonding posts electrically connected to the surface mount pins. The surface mount pins are connected to the PCB pads by reflow soldering, and the lead-out end of the enameled wire is connected to the wire bonding post.

[0014] Preferably, the magnetic ring positioning part, the magnetic ring limiting part, and the enameled wire constraint part are injection-molded integrated components, and the PCB adapter part is embedded in the magnetic ring positioning part.

[0015] Preferably, the high-temperature resistant reinforced engineering plastic is glass fiber reinforced PA66 or PPS.

[0016] Preferably, multiple sets of magnetic ring limiting parts are fixed at equal intervals along the circumferential direction in the positioning groove, each including an elastic sheet and a locking block;

[0017] The elastic sheet and the magnetic ring positioning part are integrally injection molded;

[0018] The card block is integrally formed on the top of the elastic sheet, and the top surface of the card block is provided with an inclined guide surface.

[0019] Preferably, the bottom surface of the card block is provided with a clearance groove for avoiding the enameled wire.

[0020] Preferably, the enameled wire constraint part includes a support base, an arc-shaped lead plate, and an arc-shaped guide block;

[0021] The support base and the magnetic ring positioning part are integrally injection molded;

[0022] The arc-shaped lead plate is integrally formed on the top of the support base, and the top of the arc-shaped lead plate is provided with an opening for the enameled wire to pass through.

[0023] The two arc-shaped guide blocks are symmetrically distributed and integrally formed on both sides of the opening.

[0024] Preferably, the bottom surface of the magnetic ring positioning part is provided with an auxiliary heat dissipation part.

[0025] Preferably, the auxiliary heat dissipation part includes a heat dissipation groove;

[0026] Multiple heat dissipation slots are equally spaced on the bottom surface of the magnetic ring positioning part.

[0027] Compared with the prior art, the beneficial effects of this utility model are:

[0028] 1. The surface mount connection components of the integrated micro-skeleton are adapted to the SMT reflow soldering process, eliminating the need for manual spot soldering. They can be integrated into high-speed production lines, improving production cycle time and reducing labor costs.

[0029] 2. The magnetic ring positioning part and the magnetic ring limiting part fix the magnetic ring, and the enameled wire constraint part restricts the displacement of the enameled wire, thereby preventing the problem of solder joint detachment and breakage caused by the magnetic ring pulling the enameled wire and reducing the product defect rate.

[0030] 3. No additional fasteners are required, and the overall size is comparable to that of a traditional magnetic ring transformer, making it suitable for miniaturized modular power supplies.

[0031] Other additional advantages and benefits of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0032] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0033] Figure 1 A schematic diagram of a magnetic ring transformer using the existing spot welding process.

[0034] Figure 2 This is a schematic diagram of the surface-mount transformer in this utility model;

[0035] Figure 3This is a schematic diagram of the microskeleton isometric structure of this utility model;

[0036] Figure 4 This is an isometric structural diagram of the magnetic ring positioning part in this utility model;

[0037] Figure 5 This is an isometric structural diagram of the enameled wire constraint part in this utility model.

[0038] In the diagram: 1. Magnetic ring; 2. Enamelled wire; 3. Microframework; 31. Magnetic ring positioning part; 311. Positioning groove; 32. Auxiliary heat dissipation part; 321. Heat dissipation groove; 33. Magnetic ring limiting part; 331. Elastic sheet; 332. Locking block; 3321. Angled guide surface; 3322. Clearance groove; 34. Enamelled wire constraint part; 341. Support base; 342. Arc-shaped lead plate; 3421. Opening; 343. Arc-shaped guide block; 35. PCB adapter part; 351. Surface mount pin; 352. Wire binding post. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0040] Please see Figures 2-5 The present invention provides the following technical solution: a modular power supply frame transformer based on reflow soldering, including a magnetic ring 1 and an enameled wire 2 wound on the magnetic ring 1, and also including a microframe 3. The microframe 3 is injection molded from high temperature resistant reinforced engineering plastic, and the microframe 3 includes a magnetic ring positioning part 31, a magnetic ring limiting part 33, an enameled wire constraint part 34 and a PCB adapter part 35.

[0041] Furthermore, by Figure 2 and Figure 3 As shown, in this embodiment, the magnetic ring positioning part 31 is a "U"-shaped component, with a positioning groove 311 inside for placing the magnetic ring 1. The magnetic ring limiting part 33 is fixed in the positioning groove 311 to fix the magnetic ring 1. Two sets of enameled wire constraint parts 34 are symmetrically fixed at both ends of the top surface of the magnetic ring positioning part 31 to constrain the lead-out ends of the enameled wire 2. Two sets of PCB adapter parts 35 are symmetrically fixed at both ends of the magnetic ring positioning part 31. Each set includes surface mount pins 351 and wire binding posts 352 electrically connected to the surface mount pins 351. The surface mount pins 351 are connected to the PCB pads by reflow soldering, and the lead-out ends of the enameled wire 2 are connected to the wire binding posts 352.

[0042] Taking the T1100L magnetic ring transformer as an example, the skeleton transformer of this utility model can have the following options:

[0043] Magnetic ring 1: Uses T1100L magnetic ring, with an outer diameter of 11mm, an inner diameter of 5mm, and a height of 4mm;

[0044] Enameled wire 2: Polyurethane enameled copper wire, 0.1mm in diameter, temperature resistance rating 155℃;

[0045] Microskeleton 3: Made of high-temperature resistant reinforced engineering plastics, such as glass fiber reinforced PA66 or PPS, with a temperature resistance of 260℃ and an overall size of 15mm×8mm×5mm;

[0046] Surface mount pin 351 (and wire tie post 352): Both are made of H62 brass with tin plating. Surface mount pin 351 is 2mm long, 1mm wide and 0.3mm thick. Wire tie post 352 is 2mm long and 1mm in diameter.

[0047] After adopting the above scheme, when using it, firstly, the enameled wire 2 is wound around the outer circumference of the magnetic ring 1 according to the designed number of turns, leaving a lead-out end for connection with the binding post 352; then, the magnetic ring 1 is embedded in the positioning groove 311 of the magnetic ring positioning part 31 of the micro skeleton 3. The magnetic ring limiting part 33 realizes the bidirectional limiting of the magnetic ring 1 through structural constraints: on the one hand, it restricts the movement of the magnetic ring 1 along the axial direction of the positioning groove 311, and on the other hand, it prevents its circumferential rotation, ensuring that the magnetic ring 1 is always in the preset working position during subsequent processing and use.

[0048] The two leads of the enameled wire 2 are respectively pulled to the enameled wire constraint parts 34 at both ends of the top surface of the magnetic ring positioning part 31. The enameled wire constraint parts 34 fix the direction of the leads and buffer the tension, so as to prevent the leads from becoming messy and tangled due to their own elastic rebound.

[0049] After removing the insulation layer from the lead end of the enameled wire 2 (e.g., by heat stripping or chemical stripping), the bare wire portion is electrically fixed to the binding post 352 of the PCB adapter 35 (e.g., by low-temperature pre-soldering or crimping). Since the binding post 352 and the surface mount pin 351 are an integrated conductive structure (which can be achieved by embedding a metal insert during injection molding), the enameled wire 2 and the surface mount pin 351 form an indirect electrical connection, laying the foundation for subsequent connection with the PCB.

[0050] The assembled transformer is placed on the preset pad position on the PCB board of the module power supply, ensuring that the surface mount pins 351 of the two sets of PCB adapters 35 are precisely aligned with the PCB pads; then the PCB board is sent into the reflow oven, and the oven temperature is raised to 210-260℃ (typical high temperature range for reflow soldering) according to the preset curve.

[0051] Because the microskeleton 3 is made of high-temperature resistant reinforced engineering plastic (such as glass fiber reinforced PA66 or PPS), it does not melt, deform or decay in mechanical properties under high temperature environment, effectively maintaining the relative position stability of the magnetic ring 1, the enameled wire 2 and the surface mount pin 351.

[0052] The solder paste on the pads melts when heated, wraps around the surface mount pins 351 and fills the gap between the pins and the pads. After the temperature cools down, the solder solidifies to form a strong mechanical connection and a low-resistance electrical path. Compared with traditional manual soldering, this connection method has no risk of poor soldering, high contact resistance consistency, and avoids the risk of burns to the enameled wire 2 caused by manual soldering.

[0053] When the module power supply is powered on, the current is transmitted through the PCB pads to the surface mount pin 351, and then conducted to the enameled wire 2 through the wire bond post 352. The enameled wire 2 wound on the magnetic ring 1 forms an electromagnetic winding, and the high permeability of the magnetic ring 1 is used to realize the magnetic coupling conversion of the current (such as boost, buck or isolation) to meet the voltage requirements of the module power supply. In this process:

[0054] The magnetic ring limiting part 33 continuously constrains the magnetic ring 1 to prevent it from being displaced due to electromagnetic force or equipment vibration, and avoids the decrease in energy conversion efficiency caused by the deflection of winding inductance.

[0055] The enameled wire constraint part 34 clamps and fixes the lead end to counteract the thermal expansion and contraction tension of the enameled wire 2 caused by temperature changes, and prevents the connection between the lead end and the binding post 352 from failing.

[0056] Ultimately, this achieves stable and reliable operation of the transformer in the modular power supply, while leveraging the automated connection characteristics of reflow soldering to improve the mass production efficiency and product consistency of the modular power supply.

[0057] Optionally, by Figure 2 and Figure 3 As shown in this embodiment, the magnetic ring positioning part 31, the magnetic ring limiting part 33, and the enameled wire constraint part 34 are injection-molded integrated components. The PCB adapter part 35 is embedded in the magnetic ring positioning part 31. With the above solution, when in use, the magnetic ring positioning part 31, the magnetic ring limiting part 33, and the enameled wire constraint part 34 are integrally injection molded, without the need for additional assembly processes. This avoids the loosening and displacement problems caused by vibration, high temperature, or long-term use of the separate structure, ensuring that the relative position of the magnetic ring 1 and the enameled wire 2 is always accurate, effectively maintaining the stability of core parameters such as transformer inductance and coupling efficiency, and reducing the risk of power failure due to structural failure.

[0058] The integrated structure reduces the number of parts, simplifies the initial assembly process, eliminates the need to assemble positioning, limiting and constraining components one by one, and shortens the production cycle.

[0059] The integrated injection-molded component precisely controls dimensional tolerances through the mold, ensuring uniform constraint force of the enameled wire constraint part 34 on the enameled wire 2, and avoiding insulation layer damage caused by uneven force on the lead-out end; the PCB adapter part 35 has high positioning accuracy after being embedded, which can ensure the alignment accuracy between the surface mount pin 351 and the PCB pad. Combined with the reflow soldering process, it can realize automated and efficient soldering, reduce manual operation errors, improve the soldering qualification rate and connection stability. At the same time, the integrated structure is more uniformly stressed in the high temperature environment of reflow soldering, further reducing the risk of deformation.

[0060] Preferably, by Figure 2 and Figure 3 As shown in this embodiment, the high-temperature resistant reinforced engineering plastic is glass fiber reinforced PA66 or PPS. After adopting the above scheme, both glass fiber reinforced PA66 and PPS have excellent high-temperature resistance when used. The heat distortion temperature of glass fiber reinforced PA66 can reach above 250°C, and the long-term use temperature of PPS is stable above 200°C, which can completely withstand the high temperature range of 210-260°C in the reflow oven.

[0061] The two materials do not melt, warp, or degrade their mechanical properties at high temperatures, thus maintaining the structural morphology of each functional part of the microframework 3. This ensures the precise relative positions of the magnetic ring 1, the enameled wire 2, and the PCB adapter 35, preventing assembly accuracy failure caused by high temperatures and guaranteeing the smooth implementation of the reflow soldering process.

[0062] After glass fiber reinforced PA66 and PPS are modified by glass fiber filling, their tensile strength, flexural strength and impact resistance are significantly better than ordinary engineering plastics. They can effectively resist the clamping force during transformer assembly, the vibration and impact during transportation, and the slight deformation caused by electromagnetic force during use. At the same time, the materials have good dimensional stability and low coefficient of thermal expansion, which can reduce the impact of ambient temperature changes on the size of the micro-skeleton 3, avoid problems such as loosening of the magnetic ring 1 and wear of the enameled wire 2 due to structural deformation, and extend the service life of the transformer.

[0063] Optionally, by Figures 2-4As shown, in this embodiment, multiple sets of magnetic ring limiting parts 33 are fixed at equal intervals in the positioning groove 311 along the circumferential direction. Each set includes an elastic sheet 331 and a locking block 332. The elastic sheet 331 and the magnetic ring positioning part 31 are integrally injection molded. The locking block 332 is integrally formed on the top of the elastic sheet 331, and the top surface of the locking block 332 is provided with an inclined guide surface 3321. With the above solution, during use, when the magnetic ring 1 is inserted into the positioning groove 311 of the magnetic ring positioning part 31, the outer periphery of the magnetic ring 1 first contacts the inclined guide surface 3321 on the top surface of the locking block 332 of the multiple sets of magnetic ring limiting parts 33. Since the inclined guide surface 3321 has a preset tilt angle ( (e.g., 15°-30°) The force of pushing the magnetic ring 1 along the axial direction of the positioning groove 311 will be decomposed into a radial component through the inclined plane. This component drives the elastic piece 331, which is integrated with the locking block 332, to undergo elastic deformation towards the inside of the positioning groove 311 (because the elastic piece 331 and the magnetic ring positioning part 31 are integrally injection molded, they have a preset elastic margin), thereby providing sufficient embedding space for the magnetic ring 1 and avoiding rigid collision between the magnetic ring 1 and the locking block 332, which would cause assembly jamming. At the same time, multiple sets of magnetic ring limiting parts 33 are evenly distributed along the circumference to ensure that the magnetic ring 1 is subjected to uniform force in all directions during the pushing process and always moves along the axial direction of the positioning groove 311, ensuring assembly coaxiality.

[0064] After the magnetic ring 1 is fully embedded in the positioning groove 311 to the preset depth, the radial extrusion force of the magnetic ring 1 on the inclined guide surface 3321 disappears. The elastic sheet 331 rebounds under its own elastic restoring force, driving the locking block 332 to return to the inner circumference of the magnetic ring 1. At this time, multiple sets of locking blocks 332 form a ring-shaped limiting array along the circumference of the magnetic ring 1: on the one hand, the non-guide surface (vertical or obtuse angle surface, i.e., bottom surface) of the locking block 332 forms a rigid abutment with the top end face of the magnetic ring 1, restricting the magnetic ring 1 from moving along the axial direction of the positioning groove 311; on the other hand, the equally spaced locking blocks 332 simultaneously apply radial constraints to the magnetic ring 1, preventing the magnetic ring 1 from moving radially in the positioning groove 311, realizing the bidirectional positioning and fixing of the magnetic ring 1 in the positioning groove 311, and the elastic deformation characteristics of the elastic sheet 331 can adapt to the small size deviations (such as ±0.1mm) of different batches of magnetic rings 1, improving the versatility of the limiting structure.

[0065] It should be noted that, since multiple sets of magnetic ring limiting parts 33 are distributed at equal intervals along the circumference, and adjacent magnetic ring limiting parts 33 have clearance gaps, they can avoid the wound enameled wire 2 and prevent the enameled wire 2 from being excessively squeezed.

[0066] In addition, after the magnetic ring 1 is fully embedded in the positioning groove 311 at the preset depth, when the enameled wire 2 is not wound, a certain small gap (such as 0.1mm) is reserved between the top of the magnetic ring 1 and the card block 332, and between the inner ring surface of the magnetic ring 1 and the elastic sheet 331, to match the wire diameter of the enameled wire 2 and avoid the enameled wire 2 being subjected to excessive compression.

[0067] Preferably, by Figures 2-4As shown in this embodiment, the bottom surface of the card block 332 is provided with a clearance groove 3322 for avoiding the enameled wire 2. After adopting the above solution, during use, the clearance groove 3322 on the bottom surface of the card block 332 can provide a space for the enameled wire 2 near the area of ​​the card block 332 on the outer periphery of the magnetic ring 1 after the enameled wire 2 is wound, avoiding hard contact or friction between the enameled wire 2 and the bottom surface of the card block 332. On the one hand, it prevents the risk of short circuit of the wire body caused by the insulation layer of the enameled wire 2 being damaged by squeezing or scratching, and ensures the electrical insulation performance of the transformer. On the other hand, it avoids the local stress concentration caused by interference of the enameled wire 2, reduces the probability of wire breakage, and further improves the structural integrity of the enameled wire 2, especially under the conditions of high temperature thermal expansion and contraction or long-term vibration during subsequent reflow soldering.

[0068] The reserved space of the clearance groove 3322 can ensure that the enameled wire 2 is evenly distributed along the outer circumference of the magnetic ring 1, improving the fit and reducing winding deviation; at the same time, multiple sets of clips 332 are evenly distributed along the circumference, and their clearance grooves 3322 can form a ring-shaped wire clearance path, ensuring that the enameled wire 2 wound around the magnetic ring 1 in the whole circumference can be accurately fitted, effectively reducing the performance difference between different batches of transformers and improving product consistency.

[0069] The clearance slot 3322 can be preset with a reasonable width and depth according to design requirements (such as to adapt to the common enameled wire diameter of 0.1-0.5mm). When the transformer needs to be replaced with enameled wire 2 of different diameters to adjust the power and impedance parameters, there is no need to redesign or replace the structure of the card block 332. The winding requirements of different wire diameters can be accommodated simply by the space margin of the clearance slot 3322.

[0070] Optionally, by Figures 2-5 As shown, in this embodiment, the enameled wire constraint part 34 includes a support base 341, an arc-shaped lead plate 342, and an arc-shaped guide block 343. The support base 341 and the magnetic ring positioning part 31 are integrally injection molded. The arc-shaped lead plate 342 is integrally formed on the top of the support base 341, and the top of the arc-shaped lead plate 342 is provided with an opening 3421 for the enameled wire 2 to pass through. The two arc-shaped guide blocks 343 are symmetrically distributed and integrally formed on both sides of the opening 3421. With the above solution, when the lead end of the enameled wire 2 is led out from the outer periphery of the magnetic ring 1 to the wire binding post 352 of the PCB adapter part 35, it first contacts the two arc-shaped guide blocks 343 of the enameled wire constraint part 34.

[0071] Since the arc-shaped guide blocks 343 are symmetrically distributed on both sides of the opening 3421 and have an arc-shaped structure, their arc-shaped surfaces can be adapted to the outer peripheral curved surfaces of the enameled wire 2, forming a "progressive guidance" for the enameled wire 2: on the one hand, it avoids the enameled wire 2 from directly impacting the rigid structure and causing damage to the insulation layer, and disperses the lead-out tension of the enameled wire 2 through the arc-shaped surfaces; on the other hand, the symmetrical arc-shaped guide blocks 343 can correct the lead-out direction of the enameled wire 2, ensuring that the enameled wire 2 accurately enters the opening 3421 of the arc-shaped lead plate 342 along the preset path (pointing to the binding post 352), and prevents the enameled wire 2 from interfering with other components of the microframework 3 due to deviation in direction.

[0072] After the enameled wire 2 passes through the opening 3421, the arc-shaped structure of the arc-shaped lead plate 342 begins to function: the curvature of the arc-shaped lead plate 342 matches the natural bending trajectory of the enameled wire 2 from the magnetic ring 1 to the binding post 352, which can reduce the bending stress of the enameled wire 2 and prevent the wire from fatigue fracture due to long-term bending; at the same time, the width of the opening 3421 is designed to be a gap that matches the diameter of the enameled wire 2 (such as 0.05-0.1mm larger than the diameter), which allows the enameled wire 2 to undergo slight thermal expansion and contraction due to temperature changes, and also restricts the radial movement of the enameled wire 2, preventing the wire from deviating from the preset path during subsequent assembly or transportation.

[0073] In addition, the arc-shaped lead plate 342 is integrally formed with the support base 341. The support base 341 provides rigid support through the integrated injection molding structure with the magnetic ring positioning part 31, ensuring that the arc-shaped lead plate 342 does not deform when subjected to the tension of the enameled wire 2, and maintaining a stable constraint effect.

[0074] During the reflow soldering process, when connecting the binding post 352, workers or automated equipment need to pull the enameled wire 2 to adjust the tension. The arc-shaped guide block 343 can guide the enameled wire 2 again to prevent the wire from rubbing against the edge of the opening 3421 during the pulling process. The opening 3421 continuously constrains the enameled wire 2 to prevent it from deviating excessively due to pulling, ensuring that the connection position between the enameled wire 2 and the binding post 352 is accurate and reducing the risk of poor soldering.

[0075] In the high-temperature environment of reflow soldering, the support base 341, the arc-shaped lead plate 342 and the arc-shaped guide block 343 maintain structural stability along with the magnetic ring positioning part 31 (glass fiber reinforced PA66 or PPS material), without melting or deformation, and continuously constrain the enameled wire 2; at the same time, the arc-shaped structure can reduce the contact area between the enameled wire 2 and the constraint part at high temperature, reducing the risk of local heat accumulation leading to aging of the insulation layer of the enameled wire 2.

[0076] Preferably, by Figure 2 and Figure 3As shown in this embodiment, the bottom surface of the magnetic ring positioning part 31 is provided with an auxiliary heat dissipation part 32. After adopting the above solution, during use, the auxiliary heat dissipation part 32 on the bottom surface of the magnetic ring positioning part 31 can significantly increase the contact area between the microframework 3 and the air. At the same time, relying on the direct contact relationship between the magnetic ring positioning part 31 and the magnetic ring 1, the heat generated by the magnetic ring 1 during operation due to hysteresis loss and eddy current loss, as well as the Joule heat when the enameled wire 2 is energized, can be quickly conducted to the heat dissipation part 32. Through the effect of air convection and thermal radiation, the heat is efficiently dissipated to the internal space of the module power supply, avoiding the accumulation of heat in the contact area of ​​the magnetic ring 1, the enameled wire 2 and the microframework 3. On the one hand, it ensures the stability of the magnetic permeability characteristics of the magnetic ring 1 and avoids the decrease in energy conversion efficiency caused by the inductance deviation. On the other hand, it slows down the thermal aging rate of the insulation layer (such as polyurethane or polyesterimide material) of the enameled wire 2, reduces the risk of insulation layer breakdown and short circuit, and significantly improves the operating reliability of the transformer under long-term full load conditions.

[0077] Optionally, by Figure 2 and Figure 3 As shown in this embodiment, the auxiliary heat dissipation part 32 includes heat dissipation grooves 321; multiple heat dissipation grooves 321 are equally spaced on the bottom surface of the magnetic ring positioning part 31. After adopting the above solution, during use, the multiple equally spaced heat dissipation grooves 321 can significantly expand the heat dissipation area of ​​the bottom surface of the magnetic ring positioning part 31. Compared with the flat bottom surface, the groove wall (inner side wall, outer side wall) and groove bottom of the heat dissipation groove 321 form a multi-dimensional heat dissipation surface, which significantly improves the heat dissipation area compared with the planar structure. During operation, the heat generated by the magnetic ring 1 due to hysteresis loss and eddy current loss, as well as the Joule heat of the enameled wire 2, can be quickly conducted to each surface of the heat dissipation groove 321 through the magnetic ring positioning part 31, and then dissipated outward through the dual effects of air convection (airflow in the heat dissipation groove 321) and thermal radiation, effectively reducing the working temperature of the magnetic ring 1 and the enameled wire 2, avoiding problems such as the decrease in magnetic permeability of the magnetic ring 1 and the accelerated thermal aging of the insulation layer of the enameled wire 2 caused by local high temperature, and ensuring the stability of the transformer energy conversion efficiency.

[0078] The heat sink 321 adopts a "recessed bottom" design, occupying space only in the thickness direction of the magnetic ring positioning part 31, without protruding outwards. It does not require additional horizontal installation space inside the module power supply, making it suitable for miniaturized power supply designs with densely arranged components. At the same time, the equally spaced channels can form "airflow channels". When the module power supply has a built-in fan or natural convection, the airflow can flow directionally along the channels of the heat sink 321, carrying away more heat. Especially when the transformer is installed close to heat-generating components such as capacitors and chips, it can reduce the superposition of heat, improve the heat dissipation coordination of the entire power supply system, and avoid heat dissipation bottlenecks caused by space limitations.

[0079] The heat sink 321 can be integrally injection molded with the magnetic ring positioning part 31 using the same mold, eliminating the need for additional heat dissipation structure processing steps (such as milling grooves and drilling holes), as well as the need to install auxiliary heat dissipation components such as metal heat sinks and thermal conductive adhesives, significantly reducing the complexity of the production process and material costs.

[0080] Components not described in detail in this article are existing technologies.

[0081] The working principle and usage process of this utility model: The modular power supply frame transformer based on reflow soldering of this utility model has the following assembly steps:

[0082] Step 1: Winding of enameled wire 2. Wind enameled wire 2 onto magnetic ring 1 as specified (e.g., wind 50 turns on magnetic ring 1 with a tension of 70g), leaving a suitable length (e.g., 15mm) for the lead-out end, stripping the insulation layer and tinning (tin layer thickness 8mm).

[0083] Step 2: Assemble the magnetic ring 1. Insert the magnetic ring 1 with the enameled wire 2 wound around it into the positioning groove 311 through the inclined guide surface 3321 of the locking block 332, and fix it with the elastic sheet 331 and the locking block 332.

[0084] Step 3: Constraining and fixing the enameled wire 2. The lead-out end of the enameled wire 2 is embedded into the arc-shaped lead plate 342 through the arc-shaped guide block 343. After being guided by the arc-shaped lead plate 342, it is fixed to the binding post 352 (such as low-temperature pre-welding or crimping).

[0085] Step 4: SMT reflow soldering. Place the integrated components made in steps 1 to 3 at the corresponding points on the PCB board (the surface mount pin 351 corresponds to the corresponding solder joint on the PCB board), put them into the SMT tray, and send them into the SMT reflow soldering equipment to complete the automated soldering and fixing.

[0086] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A reflow soldering-based modular power supply frame transformer, comprising a magnetic ring (1) and enameled wire (2) wound on the magnetic ring (1), characterized in that, It also includes a microframe (3), which is injection molded from high temperature resistant reinforced engineering plastic, and the microframe (3) includes a magnetic ring positioning part (31), a magnetic ring limiting part (33), an enameled wire constraint part (34) and a PCB adapter part (35). The magnetic ring positioning part (31) is a "U" shaped component, and a positioning groove (311) for placing the magnetic ring (1) is provided inside. The magnetic ring limiting part (33) is fixed in the positioning groove (311) to fix the magnetic ring (1). The two sets of enameled wire constraint parts (34) are symmetrically fixed at both ends of the top surface of the magnetic ring positioning part (31) to constrain the lead-out end of the enameled wire (2); Two sets of PCB adapters (35) are symmetrically fixed at both ends of the magnetic ring positioning part (31). Each set includes surface mount pins (351) and wire binding posts (352) electrically connected to the surface mount pins (351). The surface mount pins (351) are connected to the PCB pads by reflow soldering. The lead-out end of the enameled wire (2) is connected to the wire binding post (352).

2. The modular power supply frame transformer based on reflow soldering according to claim 1, characterized in that: The magnetic ring positioning part (31), the magnetic ring limiting part (33) and the enameled wire constraint part (34) are injection molded integrated components, and the PCB adapter part (35) is embedded in the magnetic ring positioning part (31).

3. The modular power supply frame transformer based on reflow soldering according to claim 1, characterized in that: The high-temperature resistant reinforced engineering plastic is glass fiber reinforced PA66 or PPS.

4. The modular power supply frame transformer based on reflow soldering according to claim 1, characterized in that: Multiple sets of magnetic ring limiting parts (33) are fixed at equal intervals in the positioning groove (311) along the circumferential direction, and each includes an elastic sheet (331) and a locking block (332). The elastic sheet (331) and the magnetic ring positioning part (31) are integrally injection molded; The card block (332) is integrally formed on the top of the elastic sheet (331), and the top surface of the card block (332) is provided with an inclined guide surface (3321).

5. A modular power supply frame transformer based on reflow soldering according to claim 4, characterized in that: The bottom surface of the card block (332) is provided with a clearance groove (3322) for avoiding the enameled wire (2).

6. A modular power supply frame transformer based on reflow soldering according to claim 1, characterized in that: The enameled wire restraint part (34) includes a support base (341), an arc-shaped lead plate (342), and an arc-shaped guide block (343). The support base (341) and the magnetic ring positioning part (31) are integrally injection molded; The arc-shaped lead plate (342) is integrally formed on the top of the support base (341), and the top of the arc-shaped lead plate (342) is provided with an opening (3421) for the enameled wire (2) to pass through. The two arc-shaped guide blocks (343) are symmetrically distributed and integrally formed on both sides of the opening (3421).

7. A modular power supply frame transformer based on reflow soldering according to claim 1, characterized in that: The bottom surface of the magnetic ring positioning part (31) is provided with an auxiliary heat dissipation part (32).

8. A modular power supply frame transformer based on reflow soldering according to claim 7, characterized in that: The auxiliary heat dissipation part (32) includes a heat dissipation groove (321); Multiple heat dissipation slots (321) are equally spaced on the bottom surface of the magnetic ring positioning part (31).

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