An inner terminal structure of a capacitor lead-out copper head

CN224907791UActive Publication Date: 2026-10-27KESHENG FILM-CAP
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Patent Information

Application Number
CN202522440935.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-17
Publication Date
2026-10-27
Estimated Expiration
2035-11-17

AI Technical Summary

Technical Problem

[0002]参见图5所示,为现有技术电容器引出铜头的内端接线结构,其包括顶盖3、引出铜头1和铜片电极2,引出铜头嵌设在顶盖的顶部,引出铜头的两端分别露出顶盖的内底面和外顶面,铜片电极的上端与所述引出铜头的内端通过焊锡6连接固定,焊锡一般通过采用电烙铁手工熔锡后连接固定,其效率低,而且,熔锡没有进入到铜片电极与引出铜头的相对面内,容易导致虚焊,存在剥离风险

Benefits of technology

本实用新型的电容引出与电极采用焊接的方式结合,适合批量加工,且连接更可靠;再通过电镀表面层,对整体外观及导电性能均得到提升。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a capacitor lead -out copper head's inner terminal wiring structure, including top cap, lead -out copper head and copper sheet electrode, lead -out copper head is embedded in the top of top cap, and the both ends of lead -out copper head expose the inner bottom surface and the outer top surface of top cap respectively, the upper end of copper sheet electrode is opposite with the inner end of lead -out copper head and is welded fixedly, the outer surface of copper sheet electrode and lead -out copper head after welding still is equipped with the electroplating layer. The utility model discloses capacitor lead -out and electrode adopt the mode of welding and combine, and it is suitable for batch processing, and the connection is more reliable, and then through the electroplating surface layer, the overall appearance and the conductivity all are promoted.
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Description

Technical Field

[0001] This utility model relates to a capacitor accessory, and more particularly to an internal wiring structure for a capacitor lead-out copper head. Background Technology

[0002] See Figure 5 As shown, this is the internal wiring structure of a capacitor lead-out copper tip in the prior art. It includes a top cover 3, a lead-out copper tip 1, and a copper electrode 2. The lead-out copper tip is embedded in the top of the top cover, with its two ends protruding from the inner bottom surface and outer top surface of the top cover, respectively. The upper end of the copper electrode is connected and fixed to the inner end of the lead-out copper tip by solder 6. Soldering is generally done by manually melting solder with a soldering iron, which is inefficient. Moreover, the molten solder does not enter the opposing surfaces of the copper electrode and the lead-out copper tip, which can easily lead to poor soldering and poses a risk of peeling.

[0003] Furthermore, if the soldering operation is not performed skillfully, the copper tip may become oxidized due to prolonged contact with the soldering iron, affecting its appearance and conductivity. Utility Model Content

[0004] The purpose of this utility model is to provide an internal wiring structure for the copper lead of a capacitor that is simple and reasonable in structure, reliable in connection, suitable for batch processing, and has a high degree of consistency in surface appearance.

[0005] The purpose of this utility model is achieved as follows: An inner terminal wiring structure for a capacitor lead-out copper tip includes a top cover, a lead-out copper tip, and a copper electrode. The lead-out copper tip is embedded in the top of the top cover, with its two ends protruding from the inner bottom surface and outer top surface of the top cover, respectively. The upper end of the copper electrode is welded and fixed to the inner end of the lead-out copper tip. The outer surfaces of the welded copper electrode and the lead-out copper tip are also provided with an electroplating layer.

[0006] The objective of this utility model can also be achieved by the following technical measures: As a more specific embodiment, the upper end of the copper electrode and the inner end of the lead-out copper head are soldered together, and the electroplating layer covers the exposed surface of the solder.

[0007] As a further option, the electroplated layer is a silver plating layer, or a tin plating layer, or a nickel plating layer, or a chromium plating layer.

[0008] As a further embodiment, the outer end of the copper lead-out head is provided with a connecting stud, and the outer periphery of the inner end is provided with an annular boss; the top of the top cover is provided with an assembly hole corresponding to the copper lead-out head, the inner end of the assembly hole is provided with a limiting step, and the annular boss is supported on the limiting step.

[0009] As a further embodiment, the copper lead-out head is provided in two or more forms, and the top surface of the top cover is provided with a protruding stop between two adjacent copper lead-out heads.

[0010] As a further embodiment, an annular sleeve is provided on the outer periphery of the outer end of the assembly hole, and the annular sleeve wraps around the outer periphery of the lead-out copper head.

[0011] As a further embodiment, the top surface of the top cover is also provided with an injection hole.

[0012] As a further embodiment, the top surface of the top cover is provided with a recessed platform, and the mounting hole is located on the recessed platform.

[0013] As a further embodiment, the upper end of the copper electrode is configured as a horizontally bent section, and the horizontally bent section is welded to the inner end of the lead-out copper head through its top surface.

[0014] The beneficial effects of this utility model are as follows: The capacitor leads and electrodes of this invention are joined by welding, which is suitable for mass production and provides a more reliable connection. Furthermore, the electroplated surface layer improves both the overall appearance and conductivity. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present utility model.

[0016] Figure 2 This is a top view of the structure of this utility model.

[0017] Figure 3 for Figure 2 A schematic diagram of the AA cross-sectional structure.

[0018] Figure 4 for Figure 3 Enlarged structural diagram at point B.

[0019] Figure 5 This is a schematic diagram of the existing technology structure. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments: See Figures 1-4 As shown, an inner terminal wiring structure for a capacitor lead-out copper head includes a top cover 3, a lead-out copper head 1, and a copper electrode 2. The lead-out copper head 1 is embedded in the top of the top cover 3, with its two ends protruding from the inner bottom surface and outer top surface of the top cover 3, respectively. The upper end of the copper electrode 2 is welded and fixed to the inner end of the lead-out copper head 1. The outer surfaces of the welded copper electrode 2 and the lead-out copper head 1 are also provided with an electroplated layer 5.

[0021] The upper end of the copper electrode 2 is welded to the inner end of the lead-out copper head 1 by solder 4, and the electroplating layer 5 covers the exposed surface of the solder 4.

[0022] The electroplated layer 5 is a silver plating layer, or a tin plating layer, or a nickel plating layer, or a chromium plating layer.

[0023] The outer end of the lead-out copper head 1 is provided with a connecting stud, and the outer periphery of the inner end is provided with an annular boss 11; the top of the top cover 3 is provided with an assembly hole corresponding to the lead-out copper head 1, and the inner end of the assembly hole is provided with a limiting step 35, and the annular boss 11 is supported on the limiting step 35.

[0024] The copper lead-out head 1 is provided in two or more, and the top surface of the top cover 3 is provided with a protruding stop block 34 between two adjacent copper lead-out heads 1.

[0025] The outer periphery of the outer end of the assembly hole is also provided with an annular sleeve 33, which wraps around the outer periphery of the lead-out copper head 1.

[0026] The top surface of the top cover 3 is also provided with an injection hole 32.

[0027] The top surface of the top cover 3 is provided with a recessed platform 31, and the assembly hole is located on the recessed platform 31.

[0028] The upper end of the copper sheet electrode 2 is configured as a horizontally bent section, and the horizontally bent section is welded to the inner end of the lead-out copper head 1 through its top surface.

[0029] The processing steps are as follows: the copper lead-out head 1 and the copper sheet electrode 2 are placed on the corresponding tooling, solder is applied to the surface of the copper lead-out head 1 or the copper sheet electrode 2, and then the copper lead-out head 1 and the copper sheet electrode 2 are closed (closed at the positions that need to make conductive contact), and the welding is achieved by wave soldering.

[0030] The welded copper lead-out head 1 and copper sheet electrode 2 are subjected to batch cleaning treatment, such as removing oil and oxides.

[0031] Finally, electroplating is performed to improve conductivity, corrosion resistance, and aesthetics.

[0032] The above describes the preferred embodiments of this utility model, illustrating and describing its basic principles, main features, and advantages. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made without departing from the spirit and scope of this utility model, and all such changes and modifications fall within the scope of protection of this utility model as defined by the appended claims and their equivalents.

Claims

1. An inner terminal wiring structure for a capacitor lead-out copper tip, comprising a top cover (3), a lead-out copper tip (1), and copper electrode (2), wherein the lead-out copper tip (1) is embedded in the top of the top cover (3), and the two ends of the lead-out copper tip (1) are exposed on the inner bottom surface and the outer top surface of the top cover (3), respectively, characterized in that: The upper end of the copper sheet electrode (2) is welded and fixed to the inner end of the lead-out copper head (1); the outer surface of the welded copper sheet electrode (2) and the lead-out copper head (1) is also provided with an electroplating layer (5).

2. The inner terminal wiring structure of the capacitor lead-out copper head according to claim 1, characterized in that: The upper end of the copper sheet electrode (2) is welded to the inner end of the lead-out copper head (1) by solder (4), and the electroplating layer (5) covers the exposed surface of the solder (4).

3. The inner terminal wiring structure of the capacitor lead-out copper head according to claim 1, characterized in that: The electroplated layer (5) is a silver plating layer, or a tin plating layer, or a nickel plating layer, or a chromium plating layer.

4. The inner terminal wiring structure of the capacitor lead-out copper head according to claim 1, characterized in that: The outer end of the lead-out copper head (1) is provided with a connecting stud, and the outer periphery of the inner end is provided with an annular boss (11); the top of the top cover (3) is provided with an assembly hole corresponding to the lead-out copper head (1), and the inner end of the assembly hole is provided with a limiting step (35), and the annular boss (11) is supported on the limiting step (35).

5. The inner terminal wiring structure of the capacitor lead-out copper head according to claim 4, characterized in that: The copper lead-out head (1) is provided in two or more, and the top surface of the top cover (3) is provided with a protruding stop (34) between two adjacent copper lead-out heads (1).

6. The inner terminal wiring structure of the capacitor lead-out copper head according to claim 4, characterized in that: The outer periphery of the outer end of the assembly hole is also provided with an annular sleeve (33), which wraps around the outer periphery of the lead-out copper head (1).

7. The inner terminal wiring structure of the capacitor lead-out copper head according to claim 1, characterized in that: The top surface of the top cover (3) is also provided with an injection hole (32).

8. The inner terminal wiring structure of the capacitor lead-out copper head according to claim 4, characterized in that: The top surface of the top cover (3) is provided with a recessed platform (31), and the mounting hole is located on the recessed platform (31).

9. The inner terminal wiring structure of the capacitor lead-out copper head according to claim 1, characterized in that: The upper end of the copper sheet electrode (2) is configured as a horizontally bent section, and the horizontally bent section is welded to the inner end of the lead-out copper head (1) through its top surface.