Connector assembly

Abstract

The utility model discloses a connector assembly installed on a circuit board, and the connector assembly comprises an electric connector arranged on the circuit board, a mating element electrically connected with the electric connector downward and a radiator, the electric connector comprises a metal body and a terminal module, the terminal module comprises an insulating block and a conductive terminal arranged on the insulating block, the insulating block is installed on the metal body, the conductive terminal comprises a contact portion, an intermediate portion and a lead portion connected in sequence, the contact portion protrudes out of the insulating block upward to be in elastic contact with the mating element, the lead portion is exposed on the bottom of the insulating block downward to be in lead connection with the circuit board, and the intermediate portion is arranged on the insulating block, the mating element is clamped between the radiator and the electric connector along the up-down direction, the radiator covers at least a part of the electric connector and the mating element respectively downward, the radiator is in contact with the metal body and in contact with the mating element. Two heat dissipation paths are created, the heat dissipation area is increased, and the heat dissipation efficiency is provided.

Description

[Technical Field]

[0001] This utility model relates to a connector assembly, and more particularly to a connector assembly with good heat dissipation. [Background Technology]

[0002] With the rapid development of electronic technology, the operating frequency and power density of integrated circuits and electronic components are constantly increasing, leading to a sharp increase in heat generation. Efficient heat dissipation has become crucial for ensuring the stable and reliable operation of electronic equipment. In various electronic systems, connectors, as key interfaces for signal and power transmission, generate significant heat due to their contact resistance and the large currents flowing through them. Simultaneously, components that interface with connectors (such as central processing units, graphics processors, memory modules, and CPO (co-packaged optoelectronic) chip components) are major heat sources within the system. Therefore, effective thermal management of connectors and their interfaced components is of paramount importance.

[0003] There are various existing designs for connector heat dissipation. For example, a common approach for cable connectors involves a heat dissipation module with a receiving slot in which the metal body of the cable connector is at least partially housed. Heat generated by the connector is dissipated through contact between the heat dissipation module and the metal body. However, this approach is primarily suitable for cable connections where the connector itself is connected downwards to the circuit board or directly to the cable. It is unsuitable for onboard electrical connectors that require electrical connection to a separate mating component (such as a chip module).

[0004] Furthermore, existing technologies for onboard electrical connectors also employ designs that dissipate heat by using a metal housing that contacts an external heatsink. However, such designs typically have a significant limitation: an incomplete heat dissipation path. Specifically, existing heat dissipation structures primarily focus on the heat dissipation of the electrical connector itself, with the heatsink only contacting the connector's metal housing. In reality, the heat generated by the system's primary heat source—the component that mates with the electrical connector (such as the CPU / GPU module)—can only dissipate through its own limited heat dissipation pathways or indirectly through the connector's conductive terminals, resulting in low efficiency. This leads to heat accumulation at the contact interface between the mating component and the electrical connector, becoming a heat dissipation bottleneck and affecting the overall system's heat dissipation performance and long-term reliability.

[0005] Therefore, it is necessary to design a new connector assembly to overcome the above problems. [Utility Model Content]

[0006] To address the problems of the prior art, the purpose of this utility model is to provide a new connector assembly with good heat dissipation function.

[0007] To achieve the above objectives, this utility model provides a connector assembly mounted on a circuit board, comprising: at least one electrical connector disposed on the circuit board and used for upward electrical connection with a corresponding mating element; the electrical connector includes a metal body and at least one terminal module; each terminal module includes an insulating block and at least one conductive terminal disposed on the insulating block; the insulating block is mounted on the metal body; the conductive terminal includes a contact portion, a conductive portion, and an intermediate portion located between the contact portion and the conductive portion; the intermediate portion is disposed on the insulating block; the contact portion protrudes upward from the insulating block for elastic contact with the mating element; the conductive portion is exposed downward at the bottom of the insulating block for conductive connection with the circuit board; and a heat sink along the vertical direction; the mating element is sandwiched between the heat sink and the electrical connector; the heat sink downward covers at least a portion of both the electrical connector and the mating element; and the heat sink contacts the metal body and the mating element.

[0008] Furthermore, the heat sink includes at least one receiving groove that extends downward through the heat sink but does not extend upward through the heat sink. The docking element includes a docking portion that is received in the receiving groove and abuts upward against the heat sink. The docking portion covers the terminal module downward and contacts the contact portion. The metal body has an upper surface facing the docking portion. The upper surface protrudes outward relative to the docking portion in a horizontal direction, and a portion of the upper surface abuts upward against the heat sink.

[0009] Furthermore, the thermal conductivity of the heat sink is higher than that of the metal body, and the lower surface of the heat sink is at least partially attached downwards to the circuit board.

[0010] Furthermore, the circuit board includes an electronic module disposed thereon, the connector assembly is closer to the edge of the circuit board than the electronic module, and multiple electrical connectors are provided, each of which is electrically connected to a corresponding mating element. The multiple electrical connectors are disposed on the outer periphery of the electronic module and are spaced apart. The heat sink includes multiple receiving slots, each of which penetrates downward through the heat sink but does not penetrate upward through the heat sink. Each mating element includes a mating portion, each of which is received in one of the receiving slots and abuts upward against the heat sink. Each mating portion downward covers the corresponding terminal module and contacts the corresponding contact portion.

[0011] Furthermore, the heat sink includes a base and a plurality of protrusions connected to each other, the receiving groove is disposed on the base, each of the protrusions is disposed downward opposite to one of the mating portions, the protrusions are formed by protruding upward from the upper surface of the base, and include a plurality of heat dissipation fins arranged at intervals in a horizontal direction, the plurality of heat dissipation fins being located directly above one of the receiving grooves.

[0012] Furthermore, the outer boundary of the projection of the electronic module onto the circuit board is rectangular, and four heat sinks are provided, which are distributed on the four sides of the electronic module.

[0013] Furthermore, the insulating block protrudes downward from the metal body and is supported on the circuit board, with the metal body and the circuit board spaced apart.

[0014] Furthermore, the insulating block protrudes upward from the metal body to abut against the docking element, and the docking element is spaced apart from the metal body.

[0015] Furthermore, along the vertical direction, the thickness of the metal body is less than the thickness of the circuit board.

[0016] Furthermore, the metal body has a relief groove that is recessed upward from the lower surface of the metal body. The mating element has a crimping member fixed on its side facing the electrical connector. The crimping member extends downward and is at least partially received in the relief groove and abuts upward against the metal body to lock the mating element and the metal body together.

[0017] Furthermore, the metal body is formed by stacking and welding multiple metal plates one on top of the other, and one of the metal plates closest to the circuit board is defined as the first metal sheet, and the clearance groove is provided on the first metal sheet and extends through the first metal sheet from top to bottom.

[0018] Furthermore, the terminal module includes at least one first terminal module and a plurality of second terminal modules. The first terminal module includes an insulating block and a plurality of conductive terminals disposed on the insulating block. The plurality of conductive terminals include single-ended signal terminals. Each second terminal module includes an insulating block and two conductive terminals disposed on the insulating block. The conductive terminals are differential signal terminals.

[0019] Furthermore, the connector assembly includes multiple locking fasteners, the heat sink includes at least one receiving groove that extends downward through the heat sink but does not extend upward through the heat sink, the mating element and the electrical connector are each at least partially received in the receiving groove, the electrical connector is sandwiched between the mating element and the circuit board, the heat sink presses downward against the mating element and is locked to the circuit board by the multiple locking fasteners to stably connect the mating element and the electrical connector.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] Along the vertical direction, the mating element is sandwiched between the heat sink and the electrical connector. By downwardly covering at least a portion of both the electrical connector and the mating element, the heat sink contacts the metal body and the mating element, increasing the heat dissipation area and creating two heat dissipation paths. First, the heat generated by the electrical connector can be dissipated through the metal body or transferred through the contact between the heat sink and the metal body. Second, the heat generated by the mating element (such as a light engine or chip), a major heat generator, can be directly transferred to the heat sink above it through contact with the heat sink. [Attached Image Description]

[0022] Figure 1 A perspective view of a connector assembly surrounding an electronic module and mounted on a circuit board, according to a specific embodiment of the present invention.

[0023] Figure 2 for Figure 1 A magnified view of part A in the image;

[0024] Figure 3 for Figure 1 3D exploded view of the connector assembly structure;

[0025] Figure 4 for Figure 1 The connector assembly is not assembled onto the circuit board and is shown in a partial exploded 3D view;

[0026] Figure 5 for Figure 3 The 3D view of only one electrical connector in the connector assembly is shown.

[0027] Figure 6 for Figure 1 Top view;

[0028] Figure 7 for Figure 6 A sectional view cut along the BB direction;

[0029] Figure 8 for Figure 7 A magnified view of part D;

[0030] Figure 9 This is a sectional view cut along the CC direction (6).

[0031] Figure 10 for Figure 9 A magnified view of part E in the image.

[0032] Explanation of icon numbers:

[0033] Metal sheet 1a First metal sheet 1a' upper surface 11 Lower surface 12 Leaving slot 13 Positioning hole 14 Terminal Module 2 First terminal module 2A Second terminal module 2B Insulating block 21 Conductive terminal 22 Differential signal terminal 22a Single-ended signal terminal 22b Contact Department 221 Conductor 222 Middle section 223 Positioning component 3 Radiator 200 Base 4 Projection 5 Heatsink fins 51 Storage Slot 6 First containment tank 61 Second containment tank 62 Contact surface 63 300 docking components Docking section 7 crimping part 8 Locking firmware 400 Circuit Board 2000 Electronic Module 3000

Detailed Implementation Methods

[0034] To facilitate a better understanding of the purpose, structure, and features of this utility model, it is defined that there are three directions: vertical (Z-axis), horizontal (X-axis), and front-back (Y-axis). These three directions are perpendicular to each other. The utility model will now be further described in conjunction with the accompanying drawings and specific embodiments.

[0035] like Figures 1 to 9 The diagram illustrates a specific embodiment of the connector assembly 1000 of this utility model. The connector assembly 1000 is mounted on a circuit board 2000, which includes an electronic module 3000 located at its center. The connector assembly 1000 is positioned closer to the edge of the circuit board 2000 relative to the electronic module 3000. The connector assembly 1000 includes a plurality of electrical connectors 100, a plurality of mating elements 300 corresponding to each of the electrical connectors 100, and a plurality of heat sinks 200 surrounding the electronic module 3000. Each electrical connector 100 is electrically connected upwards to a corresponding mating element 300 and downwards to the circuit board 2000. In this embodiment, the electronic module 3000 is a chip, and the mating part between the docking element 300 and the electrical connector 100 is a substrate structure. The substrate is electrically connected to a light engine (not shown). In other embodiments, the connector assembly 1000 may have only one electrical connector 100, one docking element 300, and one heat sink 200, or it may have multiple electrical connectors 100, multiple docking elements 300, and one heat sink 200.

[0036] like Figure 1 and Figure 3As shown, the outer boundary of the projection of the electronic module 3000 onto the circuit board 2000 is rectangular. In this embodiment, four heat sinks 200 are provided, distributed on the four sides of the electronic module 3000, that is, the four heat sinks 200 surround the electronic module 3000 in the front-back and left-right directions. The four heat sinks 200 together cover the multiple electrical connectors 100 and multiple mating elements 300 of the connector assembly 1000. Each heat sink 200 is provided corresponding to four electrical connectors 100 and four mating elements 300. In the vertical direction, the mating elements 300 are sandwiched between the heat sink 200 and the electrical connectors 100.

[0037] like Figure 2 and Figure 4 As shown, the plurality of electrical connectors 100 corresponding to each of the two heat sinks 200 are arranged in a left-right direction, and the plurality of electrical connectors 100 corresponding to each of the other two heat sinks 200 are arranged in a front-back direction. Each heat sink 200 downwardly covers at least a portion of each of the four electrical connectors 100 and the four mating elements 300. In other embodiments, the four heat sinks 200 can be connected as one unit to form a heat sink 200. The heat sink 200 can also be configured to correspond to only one electrical connector 100 and one mating element 300, that is, one heat sink 200 downwardly covers at least a portion of each of the electrical connector 100 and the mating element 300.

[0038] like Figure 3 and Figure 5 As shown, the electrical connector 100 includes a metal body 1 and a plurality of terminal modules 2 disposed on the metal body 1. Each terminal module 2 includes an insulating block 21 and at least one conductive terminal 22 disposed on the insulating block 21. The insulating block 21 is mounted on the metal body 1. The metal body 1 includes an upper surface 11 and a lower surface 12 disposed opposite each other, a clearance groove 13, two positioning holes 14, and two positioning elements 3. Along the vertical direction, the thickness of the metal body 1 is less than the thickness of the circuit board 2000 (see reference). Figure 7 and Figure 8 In other embodiments, the electrical connector 100 may have only one terminal module 2, which has multiple conductive terminals 22.

[0039] like Figure 4 and Figure 5As shown, the upper surface 11 and the lower surface 12 are vertically aligned and parallel, with the upper surface 11 facing the mating element 300 and the lower surface 12 facing the circuit board 2000. The clearance groove 13 is recessed upward from the lower surface 12 and does not penetrate the upper surface 11. The positioning holes 14 penetrate the upper surface 11 and the lower surface 12 in a vertical direction, and the two positioning holes 14 are located diagonally opposite each other on the metal body 1. The two positioning elements 3 are received one-to-one in the two positioning holes 14 and protrude downward from the lower surface 12 to be fixed to the circuit board 2000.

[0040] like Figure 3 and Figure 5 As shown, the metal body 1 is formed by stacking and welding multiple metal plates 1a. In this embodiment, the metal body 1 has three metal plates 1a. The metal plate 1a closest to the circuit board 2000 is defined as the first metal sheet 1a'. The clearance groove 13 is provided on the first metal sheet 1a' and passes through the first metal sheet 1a' vertically. In other embodiments, the clearance groove 13 can pass through the first metal sheet 1a' downwards but not upwards. The number of metal plates 1a can be two or more than three. The metal body 1 can also be integrally formed from metal material, that is, the metal body 1 can be made from only one metal plate 1a.

[0041] like Figure 5 , Figure 7 and Figure 8 As shown, the insulating block 21 protrudes upward from the metal body 1 to abut against the docking element 300, thereby supporting the docking element 300 upward. The docking element 300 is spaced apart from the metal body 1, that is, there is a gap between the upper surface 11 and the docking element 300. The insulating block 21 protrudes downward from the metal body 1 and is supported on the circuit board 2000. The metal body 1 is spaced apart from the circuit board 2000, that is, there is a gap between the lower surface 12 and the circuit board 2000.

[0042] like Figure 3 and Figure 5As shown, the plurality of terminal modules 2 include two first terminal modules 2A and a plurality of second terminal modules 2B. The insulating block 21 of the first terminal module 2A is provided with a plurality of conductive terminals 22 for transmitting single-ended signals. The conductive terminals 22 for transmitting single-ended signals are defined as single-ended signal terminals 22b. The plurality of conductive terminals 22 are arranged in a row along the longitudinal extension direction of the heat sink 200. The second terminal module 2B includes one insulating block 21 and two conductive terminals 22 disposed on the insulating block 21. The conductive terminals 22 are differential signal terminals 22a.

[0043] like Figure 5 and Figure 10 As shown, each conductive terminal 22 includes a contact portion 221, a conductive portion 222, and an intermediate portion 223 located between the contact portion 221 and the conductive portion 222. The intermediate portion 223 is disposed on the insulating block 21. The contact portion 221 protrudes upward from the insulating block 21 to elastically contact the mating element 300. The conductive portion 222 is exposed downward at the bottom of the insulating block 21 to conduct with the circuit board 2000. In this embodiment, both the conductive portion 222 and the contact portion 221 are spring arm structures. The conductive portion 222 is used to elastically abut against the circuit board 2000. In other embodiments, the conductive portion 222 can be conducted with the circuit board 2000 by welding.

[0044] like Figure 2 and Figure 3 As shown, the thermal conductivity of the heat sink 200 is higher than that of the metal body 1. Each heat sink 200 includes a base 4, four receiving slots 6, and four protrusions 5. The base 4 extends longitudinally and connects to the four protrusions 5. The four receiving slots 6 are all disposed on the base 4 and are spaced apart and arranged in a row along the longitudinal extension direction of the base 4. Specifically, the four receiving slots 6 of each heat sink 200 are spaced apart on the corresponding base 4 in its longitudinal extension direction. The four protrusions 5 of each heat sink 200 correspond one-to-one with the four receiving slots 6, and each protrusion 5 is located directly above the corresponding receiving slot 6. Specifically, the protrusion 5 extends upward from the upper surface of the base 4, and each protrusion 5 includes a plurality of heat dissipation fins 51 spaced apart along the longitudinal extension direction of the base 4 (the plurality of heat dissipation fins 51 of the heat sink 200 located on the front and rear sides of the electronic module 3000 are spaced apart in the left and right direction, and the plurality of heat dissipation fins 51 of the heat sink 200 located on the left and right sides of the electronic module 3000 are spaced apart in the front and rear direction), wherein a plurality of heat dissipation fins 51 are provided directly above each receiving slot 6.

[0045] like Figure 3 and Figure 4 As shown, each of the receiving slots 6 extends downward through the base 4 but does not extend upward through the base 4. Each receiving slot 6 includes a first receiving slot 61 and a second receiving slot 62 located above the first receiving slot 61, which are interconnected, and two abutting surfaces 63 adjacent to the first receiving slot 61. The first receiving slot 61 is used to receive the metal body 1, and the second receiving slot 62 is used to receive the docking element 300.

[0046] like Figure 7 and Figure 8 As shown, the first receiving groove 61 protrudes outward from the left and right sides of the second receiving groove 62, such that the width of the first receiving groove 61 in the left and right direction is greater than the width of the second receiving groove 62 in the left and right direction, and the two abutting surfaces 63 are located on the left and right sides of the second receiving groove 62, that is, the abutting surfaces 63 are formed on the top of the first receiving groove 61 in the up and down direction, and the abutting surfaces 63 are arranged downward to abut against the upper surface 11.

[0047] like Figure 3 and Figure 4 As shown, each of the mating elements 300 includes a mating portion 7 and a crimping member 8. The mating portion 7 is received in the second receiving groove 62. Along the vertical direction, the side of the mating portion 7 facing the electrical connector 100 has a plurality of metal pads (unlabeled). The plurality of metal pads are used to abut against the plurality of contact portions 221. The side of the mating portion 7 away from the electrical connector 100 contacts the top wall above the second receiving groove 62.

[0048] like Figure 3 , Figure 7 and Figure 8 As shown, when the connector assembly 1000 and the circuit board 2000 are assembled, the mating part 7 covers the terminal module 2 downward and contacts the contact part 221. The upper surface 11 protrudes outward relative to the mating part 7 in the horizontal direction (i.e., the left-right direction or the front-back direction). The part of the upper surface 11 that protrudes outward relative to the mating part 7 in the horizontal direction (i.e., the left-right direction or the front-back direction) abuts upward against the abutting surface 63.

[0049] like Figure 9 and Figure 10 As shown, the mating element 300 has the crimping member 8 fixed on its side facing the electrical connector 100. The crimping member 8 extends downward and is at least partially received in the relief groove 13 and abuts upward against the metal body 1 to lock the mating element 300 and the metal body 1 together.

[0050] like Figure 3 and Figure 7 As shown, the connector assembly 1000 further includes multiple locking fasteners 400. In this embodiment, the locking fasteners 400 are screws. The electrical connector 100 is sandwiched between the mating element 300 and the circuit board 2000. The heat sink 200 presses downward against the mating element 300 and is locked to the circuit board 2000 by the multiple locking fasteners 400 to stably connect the mating element 300 and the electrical connector 100. The lower surface 12 of the heat sink 200 is at least partially attached downward to the circuit board 2000. In other embodiments, a back plate may also be provided below the circuit board 2000. The multiple locking fasteners 400 pass through the back plate, the circuit board 2000, and the heat sink 200 to lock together, thereby strengthening the structural strength of the circuit board 2000.

[0051] like Figure 1 , Figure 3 and Figure 4 As shown, the connector assembly 1000 is assembled as follows: first, multiple electrical connectors 100 are positioned on the circuit board 2000, and multiple mating elements 300 are pre-installed in multiple second receiving slots 62 of the heat sink 200. Then, the heat sink 200 and multiple mating elements 300 are pressed onto the multiple electrical connectors 100, and the heat sink 200 is locked to the circuit board 2000 by multiple locking fasteners 400. In this way, the mating elements 300 and the electrical connectors 100 are pressed together by the heat sink 200.

[0052] The connector assembly of this utility model also has the following beneficial effects:

[0053] 1. The mating element 300 is sandwiched between the heat sink 200 and the electrical connector 100 along the vertical direction. The heat sink 200 covers at least a portion of both the electrical connector 100 and the mating element 300 downwards. The heat sink 200 is in contact with the metal body 1 and the mating element 300, increasing the heat dissipation area and creating two heat dissipation paths. First, the heat generated by the electrical connector 100 can be dissipated through the metal body 1 or transferred through the contact between the heat sink 200 and the metal body 1. Second, the heat generated by the mating element 300 (such as a light engine or chip), which generates a large amount of heat, can be directly transferred to the heat sink 200 above it through contact with the heat sink 200.

[0054] 2. The design of the receiving groove 6 allows the docking part 7 of the docking element 300 to be precisely positioned and accommodated, ensuring that it "abuts upward against the heat sink 200", achieving a large-area, stable and reliable physical contact, which is the basis for efficient heat conduction; the docking part 7 "covers the terminal module 2 downward", and the upper surface 11 of the metal body 1 also abuts against the heat sink 200, making the docking element 300 and the electrical connector 100 highly integrated in the vertical direction. The receiving groove 6 of the heat sink 200 is perfectly adapted to this structure, achieving the maximum heat dissipation effect in a limited space without adding extra lateral dimensions.

[0055] 3. The thermal conductivity of the heat sink 200 is higher than that of the metal body 1, which is more conducive to heat dissipation. The lower surface 12 of the heat sink 200 is attached to the circuit board 2000, which means that heat can be further conducted from the heat sink 200 to the entire circuit board 2000. The copper layer of the circuit board 2000 and other possible heat dissipation structures (such as grounding layer, heat dissipation holes) are used to assist in heat dissipation. This allows the heat sink 200 to not only dissipate heat upward (e.g., through multiple heat dissipation fins 51 to the air) but also conduct heat downward, forming a more three-dimensional "heat dissipation network" and significantly improving the heat load capacity of the entire system.

[0056] 4. One heat sink 200 simultaneously dissipates heat for multiple docking elements 300 and multiple electrical connectors 100, avoiding the cumbersome and space-wasting design of heat sinks for each electrical connector 100, improving heat dissipation efficiency and simplifying assembly.

[0057] 5. By placing multiple heat dissipation fins 51 directly above one of the receiving slots 6, it means that each docking element 300 (high heat source) has a dedicated, enhanced heat dissipation structure above it, achieving efficient "point-to-point" heat dissipation and avoiding heat concentration.

[0058] 6. By providing a heat sink 200 on each of the four sides of the rectangular electronic module 3000, it can be ensured that the heat sources in all directions of the electronic module 3000 can be dissipated evenly and effectively, preventing local overheating.

[0059] 7. The insulating block 21 protrudes upward and downward from the metal body 1 to prevent the metal body 1 from short-circuiting due to simultaneous contact with the circuit board 2000 (which may be charged) and the docking element 300.

[0060] 8. The thickness of the metal body 1 is less than the thickness of the circuit board 2000. The thinner metal body 1 is beneficial to reducing manufacturing costs and the overall weight of the component. It is also beneficial to the compact design of the connector assembly 1000 and to save space occupied in the vertical direction.

[0061] 9. By setting the crimping member 8 to engage with the relief groove 13, the connection between the mating element 300 and the electrical connector 100 is made more stable and has stronger resistance to vibration and impact.

[0062] 10. The metal body 1 is made of multiple stacked metal plates 1a, and the relief groove 13 can be stamped on a single plate, which simplifies the processing technology of complex structures and reduces production costs.

[0063] The above detailed description is only a description of the preferred embodiment of this utility model and is not intended to limit the patent scope of this utility model. Therefore, all equivalent technical changes made using the content of this invention's specification and illustrations are included within the patent scope of this invention.

Claims

1. A connector assembly mounted on a circuit board, characterized in that, include: At least one electrical connector is disposed on the circuit board and is used to electrically connect upward to a corresponding mating element. The electrical connector includes a metal body and at least one terminal module. Each terminal module includes an insulating block and at least one conductive terminal disposed on the insulating block. The insulating block is mounted on the metal body. The conductive terminal includes a contact portion, a conductive portion, and an intermediate portion located between the contact portion and the conductive portion. The intermediate portion is disposed on the insulating block. The contact portion protrudes upward from the insulating block for elastic contact with the mating element. The conductive portion is exposed downward at the bottom of the insulating block for conduction with the circuit board. A heat sink is provided, with the mating element sandwiched between the heat sink and the electrical connector in the vertical direction. The heat sink covers at least a portion of both the electrical connector and the mating element downwards, and the heat sink is in contact with the metal body and the mating element.

2. The connector assembly according to claim 1, characterized in that: The heat sink includes at least one receiving groove that extends downward through the heat sink but does not extend upward through the heat sink. The docking element includes a docking portion that is received in the receiving groove and abuts upward against the heat sink. The docking portion covers the terminal module downward and contacts the contact portion. The metal body has an upper surface facing the docking portion. The upper surface protrudes outward relative to the docking portion in a horizontal direction. A portion of the upper surface abuts upward against the heat sink.

3. The connector assembly according to claim 1, characterized in that: The thermal conductivity of the heat sink is higher than that of the metal body, and the lower surface of the heat sink is at least partially attached downwards to the circuit board.

4. The connector assembly according to claim 1, characterized in that: The circuit board includes an electronic module disposed thereon. The connector assembly is closer to the edge of the circuit board than the electronic module. Multiple electrical connectors are provided, each of which is electrically connected to a corresponding mating element. The multiple electrical connectors are disposed on the outer periphery of the electronic module and are spaced apart. The heat sink includes multiple receiving slots, each of which penetrates downward through the heat sink but not upward. Each mating element includes a mating portion, each of which is received in one of the receiving slots and abuts upward against the heat sink. Each mating portion downward covers the corresponding terminal module and contacts the corresponding contact portion.

5. The connector assembly according to claim 4, characterized in that: The heat sink includes a base and a plurality of protrusions connected to each other. The receiving groove is disposed on the base. Each of the protrusions is disposed downward and directly opposite one of the mating portions. The protrusions extend upward from the upper surface of the base and include a plurality of heat dissipation fins arranged at intervals in a horizontal direction. The plurality of heat dissipation fins are located directly above one of the receiving grooves.

6. The connector assembly according to claim 4, characterized in that: The outer boundary of the projection of the electronic module on the circuit board is rectangular, and four heat sinks are provided, which are distributed on the four sides of the electronic module.

7. The connector assembly according to claim 1, characterized in that: The insulating block protrudes downward from the metal body and is supported on the circuit board, with the metal body and the circuit board spaced apart.

8. The connector assembly according to claim 1, characterized in that: The insulating block protrudes upward from the metal body to abut against the docking element, and the docking element is spaced apart from the metal body.

9. The connector assembly according to claim 1, characterized in that: Along the vertical direction, the thickness of the metal body is less than the thickness of the circuit board.

10. The connector assembly according to claim 1, characterized in that: The metal body has a relief groove formed by an upward recess from the lower surface of the metal body. The mating element has a crimping member fixed on its side facing the electrical connector. The crimping member extends downward and is at least partially received in the relief groove and abuts against the metal body upward to lock the mating element and the metal body together.

11. The connector assembly according to claim 10, characterized in that: The metal body is formed by stacking and welding multiple metal plates. The metal plate closest to the circuit board is defined as the first metal sheet. The clearance groove is provided on the first metal sheet and extends through the first metal sheet vertically.

12. The connector assembly according to claim 1, characterized in that: The terminal module includes at least one first terminal module and a plurality of second terminal modules. The first terminal module includes an insulating block and a plurality of conductive terminals disposed on the insulating block. The plurality of conductive terminals include single-ended signal terminals. Each second terminal module includes an insulating block and two conductive terminals disposed on the insulating block. The conductive terminals are differential signal terminals.

13. The connector assembly according to claim 1, characterized in that: The connector assembly includes multiple locking fasteners, the heat sink includes at least one receiving groove that extends downward through the heat sink but does not extend upward through the heat sink, the mating element and the electrical connector are each at least partially received in the receiving groove, the electrical connector is sandwiched between the mating element and the circuit board, the heat sink presses downward against the mating element and is locked to the circuit board by the multiple locking fasteners to stably connect the mating element and the electrical connector.

Images