Laser crystal fixing structure, laser and laser processing equipment

Abstract

The utility model belongs to the technical field of laser, disclose a kind of laser crystal fixing structure, laser and laser processing equipment, the laser crystal fixing structure includes crystal and heat sink structure, heat sink structure includes at least two heat sinks, two heat sinks butt joint fixed or multiple heat sinks are fixed in turn butt joint, and all heat sinks are enclosed into socket;At least two heat sinks are fixed and are enclosed into socket using butt joint, using heat-conducting adhesive layer to wrap the outer periphery of crystal and then put into socket, the heat of crystal can be transferred to heat sink via heat-conducting adhesive layer, compared with wrapping indium foil outside crystal, heat-conducting adhesive layer can be obtained after coating glue liquid outside crystal and solidifying, the processing requirement of crystal and heat sink is lower, and crystal can be prevented from being damaged by pressing;Groove is equipped in heat sink and is communicated with socket, excess glue liquid can flow along groove before solidification, reduce the risk brought by coating operation, heat-conducting adhesive layer can fill the air gap between crystal and heat sink after solidification, to effectively reduce heat transfer resistance.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to a laser crystal fixing structure, a laser, and laser processing equipment. Background Technology

[0002] Solid-state lasers are lasers that use laser crystals as the working medium. Laser light is generated by activating the laser crystal. During operation, the laser crystal generates a lot of heat. If the heat cannot be dissipated, the temperature of the laser crystal will continue to rise, which will lead to damage to optical performance and affect the beam quality.

[0003] In the existing technology, one method is to directly transfer the heat of the laser crystal to the heat sink. However, due to processing errors, there will be air gaps between the laser crystal and the heat sink, resulting in high heat transfer resistance. Another method is to wrap the laser crystal with indium foil and then press it into the heat sink. This method requires high processing standards for both the crystal and the heat sink, and the crystal is easily damaged during pressing, which is time-consuming and labor-intensive.

[0004] Therefore, there is an urgent need to provide a laser crystal fixing structure, a laser, and laser processing equipment to solve the problems of high heat transfer resistance caused by air gaps between the existing crystal and heat sink, and the high processing requirements and easy damage to the crystal caused by wrapping indium foil. Utility Model Content

[0005] The purpose of this invention is to provide a laser crystal fixing structure, a laser, and a laser processing equipment to solve the problems of high heat transfer resistance caused by air gaps between the existing crystal and the heat sink, and the high processing requirements and easy damage to the crystal caused by wrapping indium foil.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] This utility model provides a laser crystal fixing structure, including a crystal and a heat sink structure. The heat sink structure includes at least two heat sinks, which are fixed together or multiple heat sinks are fixed together in sequence, and all the heat sinks form a slot.

[0008] The crystal is disposed in the slot, and the outer periphery of the crystal is wrapped with a thermally conductive adhesive layer and connected to the slot wall through the thermally conductive adhesive layer. The heat of the crystal can be transferred to the heat sink through the thermally conductive adhesive layer.

[0009] The heat sink structure is provided with a groove communicating with the slot. The groove is provided at the junction of one of the heat sinks or two adjacent heat sinks. The groove can be used to accommodate the excess adhesive formed by the thermally conductive adhesive layer when the heat sink structure fixes the crystal.

[0010] As an optional technical solution for laser crystal fixing structure, the heat sink is provided with at least three, one of which is the main heat sink and the remaining heat sinks are all secondary heat sinks. The main heat sink has an intersecting bearing positioning surface and a first positioning surface. The groove is provided at the intersection of the bearing positioning surface and the first positioning surface. The portion of the bearing positioning surface and the first positioning surface close to the intersection serves as part of the groove wall of the slot.

[0011] As an optional technical solution for laser crystal fixing structure, two auxiliary heat sinks are provided, and the portion of the bearing positioning surface and the first positioning surface away from the intersection is fitted and positioned with one of the auxiliary heat sinks.

[0012] As an optional technical solution for laser crystal fixing structure, the two auxiliary heat sinks are a first auxiliary heat sink and a second auxiliary heat sink. The first auxiliary heat sink is attached to the bearing positioning surface and has a second positioning surface opposite to the first positioning surface. The second auxiliary heat sink is attached to the first positioning surface and has a third positioning surface opposite to the bearing positioning surface. Both the second positioning surface and the third positioning surface serve as part of the slot wall of the slot.

[0013] As an alternative technical solution for laser crystal fixing structure, it also includes a first locking member, wherein the first auxiliary heat sink is fixed to the main heat sink and attached to the bearing positioning surface by at least two first locking members.

[0014] As an alternative technical solution for laser crystal fixing structure, it also includes a second locking member, wherein the second auxiliary heat sink is fixed to the main heat sink and attached to the first positioning surface by at least two second locking members.

[0015] As an optional technical solution for laser crystal fixing structure, the main heat sink is provided with a receiving groove on the side away from the second auxiliary heat sink, one end of the second locking member is placed in the receiving groove, and the other end of the second locking member passes through the main heat sink and is threadedly connected to the second auxiliary heat sink.

[0016] As an optional technical solution for laser crystal fixing structure, one of the heat sinks of the heat sink structure is provided with an oblong hole, the length direction of which is the same as the extension direction of the slot, and the oblong hole is used for a third locking member to pass through and fix it to the cooling assembly of the laser.

[0017] This invention provides a laser, including a cooling assembly and the aforementioned laser crystal fixing structure, wherein the crystal is fixed to the cooling assembly by at least one of the aforementioned heat sinks.

[0018] This utility model provides a laser processing device, including the laser described above.

[0019] Beneficial effects:

[0020] This utility model provides a laser crystal fixing structure, including a crystal and a heat sink structure. The heat sink structure includes at least two heat sinks, which are fixed together or multiple heat sinks are fixed together sequentially, and all heat sinks form a slot. The crystal is disposed in the slot, and its outer periphery is wrapped with a thermally conductive adhesive layer and connected to the slot wall through the thermally conductive adhesive layer. The heat of the crystal can be transferred to the heat sink through the thermally conductive adhesive layer. The heat sink structure has a groove communicating with the slot. The groove is disposed at one of the heat sinks or at the joint of two adjacent heat sinks. The groove can be used to accommodate the excess adhesive formed by the thermally conductive adhesive layer when the heat sink structure fixes the crystal. At least two heat sinks are connected and fixed together to form a slot. A thermally conductive adhesive layer is wrapped around the crystal before it is placed into the slot. The heat of the crystal is transferred to the heat sink through the thermally conductive adhesive layer. Compared with wrapping the crystal with indium foil, the thermally conductive adhesive layer can be obtained by applying adhesive to the crystal and then curing it. This reduces the processing requirements for the crystal and the heat sink and can prevent the crystal from being damaged by pressing. The heat sink has a groove that communicates with the slot. Before curing, excess adhesive can flow out along the groove, reducing the risk of adhesive application. After curing, the thermally conductive adhesive layer can fill the air gap between the crystal and the heat sink, thereby effectively reducing the heat transfer resistance.

[0021] This invention provides a laser, including a cooling assembly and the aforementioned laser crystal fixing structure, wherein the crystal is fixed to the cooling assembly by at least one heat sink. Using the aforementioned laser crystal fixing structure, the heat transfer resistance is relatively low.

[0022] This utility model provides a laser processing device, including the aforementioned laser, which has good heat dissipation efficiency and operational stability. Attached Figure Description

[0023] Figure 1 This is a first-view structural schematic diagram of the laser crystal fixing structure provided in this embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the laser crystal fixing structure provided in an embodiment of the present invention from a second perspective.

[0025] Figure 3 This is a partially exploded view of the laser crystal fixing structure provided in this embodiment of the present invention;

[0026] Figure 4 This is a third-view structural schematic diagram of the laser crystal fixing structure provided in this embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of a laser crystal fixing structure with two heat sinks provided in an embodiment of the present invention.

[0028] In the picture:

[0029] 10. Crystal;

[0030] 20. Heat sink structure; 201. Slot; 202. Groove; 203. Waist-shaped hole; 21. Main heat sink; 211. Bearing positioning surface; 212. First positioning surface; 213. Receiving groove; 22. First auxiliary heat sink; 221. Second positioning surface; 23. Second auxiliary heat sink; 231. Third positioning surface; 24. Third auxiliary heat sink;

[0031] 31. First locking element; 32. Second locking element; 33. Third locking element. Detailed Implementation

[0032] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0033] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0036] like Figures 1 to 4 As shown, this embodiment provides a laser crystal fixing structure, a laser, and a laser processing device. The laser processing device includes a laser, which includes a cooling component and a laser crystal fixing structure. The crystal 10 is fixed to the cooling component by at least one heat sink. The laser crystal fixing structure includes a crystal 10 and a heat sink structure 20. The heat sink structure 20 includes at least two heat sinks, which are fixed together or multiple heat sinks are fixed together sequentially, and all heat sinks form a slot 201. The crystal 10 is disposed in the slot 201, and the outer periphery of the crystal 10 is wrapped with a thermally conductive adhesive layer and connected to the slot wall of the slot 201 through the thermally conductive adhesive layer. The heat of the crystal 10 can be transferred to the heat sink through the thermally conductive adhesive layer. The heat sink structure 20 is provided with a groove 202 communicating with the slot 201. The groove 202 is disposed at one of the heat sinks or at the joint of two adjacent heat sinks. The groove 202 can be used to accommodate the excess adhesive formed by the thermally conductive adhesive layer when the heat sink structure 20 fixes the crystal 10.

[0037] At least two heat sinks are butt-fitted and fixed to form a slot 201. A thermally conductive adhesive layer is wrapped around the crystal 10 before it is placed into the slot 201. The heat from the crystal 10 can be transferred to the heat sink via the thermally conductive adhesive layer. Compared with wrapping the crystal 10 with indium foil, the thermally conductive adhesive layer can be obtained by simply applying adhesive to the crystal 10 and then curing it. This reduces the processing requirements for the crystal 10 and the heat sink and prevents damage to the crystal 10 from pressure. The heat sink has a groove 202 that communicates with the slot 201. Excess adhesive before curing can flow out along the groove 202, reducing the risk of adhesive application. After curing, the thermally conductive adhesive layer can fill the air gap between the crystal 10 and the heat sink, thereby effectively reducing the heat transfer resistance. The thermally conductive adhesive layer includes, but is not limited to, silver paste.

[0038] Optionally, at least three heat sinks are provided, one of which is a main heat sink 21, and the remaining heat sinks are all auxiliary heat sinks. The main heat sink 21 has intersecting bearing positioning surface 211 and first positioning surface 212. The groove 202 is provided at the intersection of the bearing positioning surface 211 and the first positioning surface 212. The portion of the bearing positioning surface 211 and the first positioning surface 212 close to the intersection serves as part of the groove wall of the slot 201.

[0039] Using at least three heat sinks to wrap and fix the crystal 10 can improve the uniformity of crystal 10 fixation and structural stability, reduce local thermal stress of crystal 10, and better ensure beam quality. One of the heat sinks is the main heat sink 21, which uses the bearing positioning surface 211 and the first positioning surface 212 to achieve double contact with the two sides of crystal 10, which can effectively suppress the displacement of crystal 10 caused by thermal expansion and ensure the accuracy of crystal 10 position. The groove 202 is set at the intersection of bearing positioning surface 211 and first positioning surface 212, which can reduce stress concentration at the intersection and allow excess adhesive to flow out, avoiding excess adhesive accumulation.

[0040] In this embodiment, there are three heat sinks 3, one of which is the main heat sink 21, and the remaining two are auxiliary heat sinks. The portion of the bearing positioning surface 211 and the first positioning surface 212 away from the intersection is fitted and positioned with one of the auxiliary heat sinks. The auxiliary heat sinks are fitted and positioned with the portion of the bearing positioning surface 211 and the first positioning surface 212 away from the intersection to ensure the accuracy of the relative position between the auxiliary heat sinks and the main heat sink 21.

[0041] Specifically, the two auxiliary heat sinks are a first auxiliary heat sink 22 and a second auxiliary heat sink 23. The first auxiliary heat sink 22 is attached to the bearing positioning surface 211 and has a second positioning surface 221 opposite to the first positioning surface 212. The second auxiliary heat sink 23 is attached to the first positioning surface 212 and has a third positioning surface 231 opposite to the bearing positioning surface 211. Both the second positioning surface 221 and the third positioning surface 231 serve as part of the slot wall of the slot 201.

[0042] A first auxiliary heat sink 22 and a second auxiliary heat sink 23 are designed and fixed to the main heat sink 21. The first auxiliary heat sink 22 is attached to the bearing positioning surface 211, and the second auxiliary heat sink 23 is attached to the first positioning surface 212. At this time, part of the bearing positioning surface 211, part of the first positioning surface 212, the second positioning surface 221, and the third positioning surface 231 form a slot 201. The main heat sink 21, the first auxiliary heat sink 22, and the second auxiliary heat sink 23 are arranged in different directions of the crystal 10, so that the heat on the crystal 10 is more evenly transferred to each heat sink.

[0043] See Figure 5 In some embodiments, two heat sinks are provided. One heat sink is a main heat sink 21 with a groove 202, and the other heat sink is a third auxiliary heat sink 24. Both the crystal 10 and the third auxiliary heat sink 24 are fixed to the main heat sink 21. Using two heat sinks simplifies the structure, reduces material usage and processing steps, and lowers costs. Taking a rectangular cross-section of the crystal 10 as an example, both heat sinks are L-shaped, forming a square-like shape. Each heat sink is connected to two adjacent sides of the crystal 10 through a thermally conductive adhesive layer.

[0044] In this embodiment, the main heat sink 21 includes a base portion, a support portion, and a side positioning portion that are stacked and connected in sequence. The cross-sectional area of ​​the support portion is larger than the cross-sectional area of ​​the side positioning portion, so that the top of the support portion forms a support positioning surface 211. A first positioning surface 212 is provided on one side of the side positioning portion. The support positioning surface 211, the first positioning surface 212, the second positioning surface 221, and the third positioning surface 231 are all planar. The support positioning surface 211 and the third positioning surface 231 are parallel and spaced apart. The first positioning surface 212 and the second positioning surface 221 are parallel and spaced apart. The support positioning surface 211 and the first positioning surface 212 are perpendicular.

[0045] In this embodiment, the X direction is the length direction of the main heat sink 21, the Y direction is the width direction of the main heat sink 21, and the Z direction is the height direction of the main heat sink 21. The X, Y, and Z directions are perpendicular to each other.

[0046] See Figure 2 The laser crystal fixing structure also includes a first locking member 31, and the first auxiliary heat sink 22 is fixed to the main heat sink 21 by at least two first locking members 31 and is attached to the bearing positioning surface 211.

[0047] At least two first locking elements 31 are used to fix the first auxiliary heat sink 22 to the main heat sink 21 and to fit against the bearing positioning surface 211. The fixation is firm and the force is more even, which can prevent the first auxiliary heat sink 22 from shifting relative to the main heat sink 21.

[0048] In this embodiment, the first locking member 31 extends along the Z direction, and two first locking members 31 are spaced apart along the Y direction; the first locking member 31 is a screw.

[0049] Optionally, the laser crystal fixing structure further includes a second locking member 32, and the second auxiliary heat sink 23 is fixed to the main heat sink 21 and attached to the first positioning surface 212 by at least two second locking members 32.

[0050] At least two second locking elements 32 are used to fix the second auxiliary heat sink 23 to the main heat sink 21 and to fit against the first positioning surface 212. The fixation is firm and the force is more even, which can prevent the second auxiliary heat sink 23 from shifting relative to the main heat sink 21.

[0051] Optionally, a receiving groove 213 is provided on the side of the main heat sink 21 away from the second auxiliary heat sink 23. One end of the second locking member 32 is placed in the receiving groove 213, and the other end of the second locking member 32 passes through the main heat sink 21 and is threadedly connected to the second auxiliary heat sink 23. The receiving groove 213 is provided on the side of the main heat sink 21 away from the second auxiliary heat sink 23. The receiving groove 213 can accommodate the end of the second locking member 32, preventing the second locking member 32 from protruding outward. The structure is compact, thereby reducing interference with other components.

[0052] In this embodiment, the second locking member 32 extends along the X direction, and two second locking members 32 are spaced apart along the Z direction; the second locking member 32 is a screw.

[0053] Optionally, one of the heat sinks in the heat sink structure 20 is provided with a waist-shaped hole 203. The length direction of the waist-shaped hole 203 is the same as the extension direction of the slot 201. The waist-shaped hole 203 is used for the third locking member 33 to pass through and be fixed to the cooling assembly of the laser. With the waist-shaped hole 203 provided on the heat sink, one end of the third locking member 33 abuts against the heat sink, and the other end of the third locking member 33 passes through the waist-shaped hole 203 and is fixed to the cooling assembly. The length direction of the waist-shaped hole 203 allows for a certain degree of positional adjustment, has thermal expansion compensation capability, and avoids connection failure due to thermal expansion.

[0054] In this embodiment, the cross-sectional area of ​​the base portion of the main heat sink 21 is larger than that of the support portion. Both ends of the base portion protrude outward from the support portion in the X direction. Both ends of the base portion in the X direction are provided with waist-shaped holes 203. The slot 201 extends along the Y direction, and the length direction of the waist-shaped holes 203 is also in the Y direction. The cooling assembly of the laser includes a water-cooled plate. The crystal 10 is disposed on the main heat sink 21. The main heat sink 21 is fixed to the water-cooled plate by two third locking members 33.

[0055] The laser crystal fixing structure provided in this embodiment involves coating the crystal 10 with silver paste. To prevent the silver paste from overflowing and contaminating the light-transmitting surface of the crystal 10, a 0.5mm chamfer is designed at the intersection of the bearing positioning surface 211 and the first positioning surface 212 of the main heat sink 21 to form a groove 202, allowing excess paste to flow out along the chamfer and reducing the risk of misoperation during paste application. The crystal 10 is placed on the main heat sink 21, and the first auxiliary heat sink 22 and the second auxiliary heat sink 23 are fixed to the main heat sink 21 by corresponding locking components. The main heat sink 21, the first auxiliary heat sink 22, and the second auxiliary heat sink 23 form a slot 201. The crystal 10 is fixed in the slot 201 and contacts the slot wall of the slot 201 through the silver paste. The laser crystal fixing structure is placed in a high-temperature chamber and heated to 110°C for 1 hour to complete the heating and curing of the silver paste. After curing, the silver paste can replace the air gap and reduce the heat transfer resistance. Experiments have shown that, with a 25°C water-cooled plate at the bottom, the laser crystal fixing structure of this application can maintain the temperature of the laser crystal at around 55°C at the target output power of the laser. However, when indium foil is used, the temperature of the laser crystal reaches 70°C when the output power of the laser reaches 2 / 3 of the target output power.

[0056] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A laser crystal fixing structure, characterized in that, It includes a crystal (10) and a heat sink structure (20), wherein the heat sink structure (20) includes at least two heat sinks, the two heat sinks are fixed together or the multiple heat sinks are fixed together in sequence, and all the heat sinks form a slot (201). The crystal (10) is disposed in the slot (201). The outer periphery of the crystal (10) is wrapped with a thermally conductive adhesive layer and connected to the slot wall (201) through the thermally conductive adhesive layer. The heat of the crystal (10) can be transferred to the heat sink through the thermally conductive adhesive layer. The heat sink structure (20) is provided with a groove (202) communicating with the slot (201). The groove (202) is provided at one of the heat sinks or at the joint of two adjacent heat sinks. The groove (202) can be used to accommodate the overflow of the thermally conductive adhesive layer formed when the heat sink structure (20) fixes the crystal (10).

2. The laser crystal fixing structure according to claim 1, characterized in that, The heat sink is provided with at least three, one of which is the main heat sink (21), and the remaining heat sinks are all auxiliary heat sinks. The main heat sink (21) has an intersecting bearing positioning surface (211) and a first positioning surface (212). The groove (202) is provided at the intersection of the bearing positioning surface (211) and the first positioning surface (212). The portion of the bearing positioning surface (211) and the first positioning surface (212) close to the intersection serves as part of the groove wall of the slot (201).

3. The laser crystal fixing structure according to claim 2, characterized in that, Two auxiliary heat sinks are provided, and the portions of the bearing positioning surface (211) and the first positioning surface (212) away from the intersection are both fitted and positioned with one of the auxiliary heat sinks.

4. The laser crystal fixing structure according to claim 3, characterized in that, The two auxiliary heat sinks are a first auxiliary heat sink (22) and a second auxiliary heat sink (23). The first auxiliary heat sink (22) is attached to the bearing positioning surface (211) and has a second positioning surface (221) opposite to the first positioning surface (212). The second auxiliary heat sink (23) is attached to the first positioning surface (212) and has a third positioning surface (231) opposite to the bearing positioning surface (211). The second positioning surface (221) and the third positioning surface (231) both serve as part of the groove wall of the slot (201).

5. The laser crystal fixing structure according to claim 4, characterized in that, It also includes a first locking element (31), wherein the first auxiliary heat sink (22) is fixed to the main heat sink (21) by at least two of the first locking elements (31) and is attached to the bearing positioning surface (211).

6. The laser crystal fixing structure according to claim 4, characterized in that, It also includes a second locking element (32), the second auxiliary heat sink (23) being fixed to the main heat sink (21) by at least two of the second locking elements (32) and fitting against the first positioning surface (212).

7. The laser crystal fixing structure according to claim 6, characterized in that, The main heat sink (21) has a receiving groove (213) on the side away from the second auxiliary heat sink (23). One end of the second locking member (32) is placed in the receiving groove (213), and the other end of the second locking member (32) passes through the main heat sink (21) and is threadedly connected to the second auxiliary heat sink (23).

8. The laser crystal fixing structure according to claim 1, characterized in that, One of the heat sinks of the heat sink structure (20) is provided with a waist-shaped hole (203), the length direction of which is the same as the extension direction of the slot (201), and the waist-shaped hole (203) is used for the third locking member (33) to pass through and be fixed on the cooling assembly of the laser.

9. A laser, characterized in that, It includes a cooling assembly and a laser crystal fixing structure as described in any one of claims 1-8, wherein the crystal (10) is fixed to the cooling assembly by at least one of the heat sinks.

10. A laser processing equipment, characterized in that, Including the laser as described in claim 9.

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