A large spot laser

CN224908782UActive Publication Date: 2026-10-27SHENZHEN VIVLASER TECH CO LTD
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Patent Information

Application Number
CN202522673359.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-17
Publication Date
2026-10-27
Estimated Expiration
2035-12-17

AI Technical Summary

Technical Problem

然而,该技术方案存在难以规避的核心缺陷:激光光束的能量总量相对固定,在经扩束镜放大光斑面积的过程中,能量会随光斑覆盖范围的扩大而均匀分散,导致单位面积内的光斑能量密度大幅衰减,这一问题不仅会造成加工效率显著降低、加工效果不达预期,严重时甚至因能量不足导致加工过程无法正常推进

Benefits of technology

[0015]本申请的有益效果为:本实用新型方案通过多模组阵列排布+边缘弱光区重合补能的创新设计,既突破了传统单光源扩束导致的能量密度衰减问题,在不依赖提升驱动电流的前提下实现了大光斑输出,又有效规避了多光源直接拼接产生的光斑缝隙与能量不均缺陷,最终获得能量密度均匀、尺寸可灵活拓展的大光斑;同时,方案采用模块化结构设计,组件选型与排布逻辑简单,无需复杂的光学矫正或功率补偿系统,降低了设备制造成本与调试难度,能广泛适配工业加工、材料处理等对大光斑均匀性和能量密度有严格要求的应用场景。

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Abstract

The application discloses a large-spot laser, comprising at least two groups of parallel and same-direction laser modules, each of the laser modules comprising: a laser light source; and an expander lens group arranged on the light-emitting side of the laser light source; wherein, during operation, the light spot projected on a working surface by each of the laser modules comprises a central uniform area and an edge weak light area surrounding the periphery of the central uniform area, the adjacent edge weak light areas are overlapped, and the energy density of the overlapped area is similar to that of the central uniform area, thereby forming a uniform large-spot. The application breaks through the energy density attenuation problem caused by the traditional single light source expansion, realizes the large-spot output without relying on the improvement of the driving current, effectively avoids the light spot gap and the energy unevenness defect caused by the direct splicing of multiple light sources, and finally obtains a large-spot with uniform energy density and flexible size expansion.
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Description

Technical Field

[0001] This application relates to the technical field of lasers, and more particularly to a large-spot laser. Background Technology

[0002] In core applications of semiconductor lasers, such as industrial processing and material handling, large-size and uniformly energetic laser spots are crucial for ensuring processing quality and efficiency. Traditional techniques for achieving large spot sizes primarily rely on a single laser source combined with a beam expander assembly to directly amplify the original spot size using optical beam expansion principles. However, this approach suffers from a significant, unavoidable flaw: the total energy of the laser beam is relatively fixed. During the beam expansion process, the energy disperses uniformly as the spot coverage expands, leading to a substantial decrease in energy density per unit area. This not only significantly reduces processing efficiency and results in suboptimal processing quality but can also, in severe cases, halt the entire processing process due to insufficient energy.

[0003] To compensate for the energy loss caused by beam expansion, existing technologies typically increase the output power by increasing the driving current of the laser source. However, due to the physical characteristics of semiconductor laser chips, heat dissipation limits, and device lifespan, the potential for increasing the driving current is strictly limited, and it is impossible to compensate for the energy loss caused by beam expansion indefinitely. This constraint directly results in a narrow adjustable range of spot size in traditional solutions. It is difficult to meet the diverse size requirements for large spots in different scenarios, and due to the contradictory relationship between energy density and spot size, it is impossible to balance spot uniformity and effective working efficiency. This severely restricts the application expansion of semiconductor lasers in medium and large workpiece processing, wide-area processing, and other scenarios. Utility Model Content

[0004] The purpose of this utility model embodiment is to provide a large spot laser that can solve the above-mentioned problems existing in related technologies.

[0005] To achieve the above objectives, this application adopts the following technical solution: A large-spot laser includes at least two sets of parallel and co-oriented laser modules, each laser module comprising: Laser source; A beam expander assembly is disposed on the light-emitting side of the laser source; During operation, the light spot projected by each laser module onto the working surface includes a central uniform area and an edge weak light area surrounding the central uniform area. Adjacent edge weak light areas overlap, and the energy density of the overlapping area is similar to that of the central uniform area, forming a uniform large light spot.

[0006] Optionally, the beam expander group includes a transverse beam expander, and multiple sets of the laser modules are arranged along the transverse axis.

[0007] Optionally, the beam expander group includes a longitudinal beam expander, and multiple sets of the laser modules are arranged along the longitudinal axis.

[0008] Optionally, the beam expander group includes a transverse beam expander and a longitudinal beam expander, and multiple sets of the laser modules are arranged in an array along the transverse and longitudinal directions.

[0009] Optionally, the normal distance between the transverse beam expander and the longitudinal beam expander is adjustable.

[0010] Optionally, the normal distance between the beam expander group and the laser source can be adjusted.

[0011] Optionally, the distance between the laser module and the working surface is adjustable.

[0012] Optionally, a mounting frame is included, which is provided with multiple mounting parts, each of which mounts a group of laser modules, so that the laser modules remain relatively stable.

[0013] Optionally, the spacing between the mounting portions can be adjusted along the horizontal and / or vertical axes.

[0014] Optionally, the laser source is a semiconductor laser.

[0015] The beneficial effects of this application are as follows: This utility model solution, through the innovative design of multi-module array arrangement + edge weak light area overlap and energy supplementation, not only breaks through the energy density attenuation problem caused by traditional single light source beam expansion, but also achieves large light spot output without relying on increasing the driving current. It also effectively avoids the defects of light spot gaps and energy unevenness caused by direct splicing of multiple light sources, and finally obtains a large light spot with uniform energy density and flexible size expansion. At the same time, the solution adopts a modular structure design, the component selection and arrangement logic is simple, and there is no need for complex optical correction or power compensation systems, which reduces the equipment manufacturing cost and debugging difficulty. It can be widely adapted to industrial processing, material processing and other application scenarios with strict requirements for large light spot uniformity and energy density. Attached Figure Description

[0016] The present application will now be described in further detail with reference to the accompanying drawings and embodiments.

[0017] Figure 1 This is a schematic diagram of the structure of the large-spot laser described in the embodiments of this application; Figure 2 This is a schematic diagram of the large-spot laser described in the embodiments of this application during operation; Figure 3 This is a schematic diagram of a light spot projected by the laser module according to an embodiment of this application; Figure 4This is a schematic diagram of a large light spot formed by the projection of multiple laser modules described in the embodiments of this application.

[0018] In the picture: 1. Laser source; 2. Beam expander group; 21. Horizontal beam expander; 22. Vertical beam expander; a. Central uniform region; b. Edge weak light region; c. Overlapping region. Detailed Implementation

[0019] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0022] In core applications of semiconductor lasers, such as industrial processing and material handling, large-size and uniformly energetic laser spots are crucial for ensuring processing quality and efficiency. Traditional techniques for achieving large spot sizes primarily rely on a single laser source combined with a beam expander assembly to directly amplify the original spot size using optical beam expansion principles. However, this approach suffers from a significant, unavoidable flaw: the total energy of the laser beam is relatively fixed. During the beam expansion process, the energy disperses uniformly as the spot coverage expands, leading to a substantial decrease in energy density per unit area. This not only significantly reduces processing efficiency and results in suboptimal processing quality but can also, in severe cases, halt the entire processing process due to insufficient energy.

[0023] To compensate for the energy loss caused by beam expansion, existing technologies typically increase the output power by increasing the driving current of the laser source. However, due to the physical characteristics of semiconductor laser chips, heat dissipation limits, and device lifespan, the potential for increasing the driving current is strictly limited, and it is impossible to compensate for the energy loss caused by beam expansion indefinitely. This constraint directly results in a narrow adjustable range of spot size in traditional solutions. It is difficult to meet the diverse size requirements for large spots in different scenarios, and due to the contradictory relationship between energy density and spot size, it is impossible to balance spot uniformity and effective working efficiency. This severely restricts the application expansion of semiconductor lasers in medium and large workpiece processing, wide-area processing, and other scenarios.

[0024] To address the above technical problems, embodiments of this application provide a large-spot laser, comprising at least two sets of parallel and unidirectionally arranged laser modules, each laser module comprising: Laser source 1; Beam expander group 2 is disposed on the light-emitting side of the laser source 1; During operation, each laser module projects a light spot onto the working surface, which includes a central uniform region a and an edge weak light region b surrounding the central uniform region a. Adjacent edge weak light regions b overlap, and the energy density of the overlapping region c is similar to that of the central uniform region a, forming a uniform large light spot.

[0025] The laser consists of at least two sets of laser modules. Each set of laser modules meets the requirements of parallel and unidirectional arrangement. Parallel arrangement ensures that the beam propagation paths of each set of modules do not cross or interfere with each other, while unidirectional arrangement ensures that all beams can be accurately projected onto the same working surface, providing a basis for subsequent spot stitching.

[0026] Each module includes a laser source 1 (the core light-emitting element that provides the original laser beam) and a beam expander group 2 (located on the light-emitting side of the laser source 1, which undertakes the function of beam expansion). The core function of the beam expander group 2 is to change the propagation angle of the original beam and expand the coverage of a single spot on the working surface.

[0027] The core principle of this solution is to utilize the energy superposition effect of the weak light region b at the edge of the light spot to solve the problem of uniformity and seamlessness in multi-module splicing. The specific principle is as follows: Single-module beam shaping: The original beam emitted by the laser source 1 (usually a Gaussian beam with high intensity at the center and low intensity at the edge) is expanded by the beam expander group 2 to form a beam structure of "central uniform region a + edge weak light region b" on the working surface. The central uniform region a has high energy uniformity and high energy density; the edge weak light region b is a natural transition area at the edge of the beam after expansion, with relatively low energy density. Multi-module light spot splicing logic: By arranging modules in parallel and unidirectional directions, the light spots projected by adjacent modules can overlap at the edge weak light area b on the working surface. Since the energy density of a single edge weak light area b is insufficient, the energy of two adjacent edge weak light areas b will be superimposed after they overlap. The key to achieving uniformity is that the solution uses the coordinated control of optical parameters (the beam expansion factor of the beam expander group 2 and the module spacing) and arrangement parameters (module parallelism and consistency of light output direction) to make the superimposed energy density of the overlapping area just close to the energy density of the central uniform area a. This ultimately eliminates the weak light defects at the edge of a single spot and the gaps / energy breaks in the splicing of multiple spots, forming a large spot with overall uniformity.

[0028] The proposed solution utilizes an innovative design that combines multi-module array arrangement with overlapping energy replenishment in the weak light region at the edge. This overcomes the energy density attenuation problem caused by traditional single-source beam expansion, achieving large beam output without relying on increasing the drive current. It also effectively avoids the beam gaps and energy unevenness defects caused by direct splicing of multiple sources, ultimately obtaining a large beam with uniform energy density and flexible scalability. Furthermore, the solution adopts a modular structure design, simplifying component selection and arrangement logic. It eliminates the need for complex optical correction or power compensation systems, reducing equipment manufacturing costs and debugging difficulty. This solution is widely adaptable to industrial processing, material handling, and other applications with strict requirements for large beam uniformity and energy density.

[0029] In one embodiment, the beam expander group 2 includes a transverse beam expander 21, and multiple sets of the laser modules are arranged along the transverse axis.

[0030] In this embodiment, the beam expander group 2 specifically includes a transverse beam expander 21. The core function of this beam expander is to expand the beam emitted by the laser source 1 only in the transverse direction without changing the beam's propagation range in the longitudinal direction, thus achieving directional beam expansion and control. Multiple laser modules are arranged in an array along the transverse direction to ensure that the beam spot after transverse beam expansion can be accurately projected onto the same working surface in the transverse direction.

[0031] Adjacent laser modules arranged along the horizontal axis have their beams expanded along the horizontal axis and their beams approach each other along the horizontal axis of the working surface, so that the weak light regions b at the edges of the adjacent beams on both sides of the horizontal axis coincide (the overlap distance can be adjusted by the module spacing and the beam expansion factor). After the weak light regions b at the edges of the adjacent beams coincide, the superimposed energy density is similar to the energy density of the uniform central region a of each group of beams, thus forming a continuous, seamless, and uniformly energetic elongated beam in the horizontal axis direction. The horizontal length of this beam can be flexibly expanded by increasing the number of laser modules.

[0032] In this embodiment, the combination of directional beam expansion and directional arrangement simplifies the optical debugging process. Only the module spacing and beam expansion factor in the horizontal axis direction need to be adjusted to accurately control the lateral size of the large spot. This makes it suitable for specific scenarios such as wide-format horizontal processing and long strip workpiece processing, thus improving the flexibility of the solution in adapting to different scenarios.

[0033] In one embodiment, the beam expander group 2 includes a longitudinal beam expander 22, and multiple sets of the laser modules are arranged along the longitudinal axis.

[0034] In this embodiment, the beam expander group 2 specifically includes a longitudinal beam expander 22. This beam expander only expands the beam emitted by the laser source 1 along the longitudinal axis, without changing the beam's propagation width along the transverse axis, thus achieving directional magnification of the beam in the longitudinal dimension. Multiple laser modules are arranged in an array along the longitudinal axis to ensure that the beam spots after longitudinal beam expansion can be precisely converged along the longitudinal axis of the same working surface, providing structural assurance for beam spot splicing in the longitudinal direction.

[0035] In this embodiment, the directional beam expansion design simplifies the optical debugging process. Only the parameter optimization in the longitudinal direction of the focus is required to accurately control the longitudinal size of the large spot, which is suitable for specific scenarios such as long-format longitudinal processing and columnar workpiece processing, further improving the overall scenario adaptability and practicality of the solution.

[0036] In one embodiment, the beam expander group 2 includes a transverse beam expander 21 and a longitudinal beam expander 22, and multiple sets of the laser modules are arranged in an array along the transverse and longitudinal directions.

[0037] The beam expander group 2 includes both a horizontal beam expander 21 and a vertical beam expander 22, which are arranged sequentially along the propagation path of the laser beam. The horizontal beam expander 21 is responsible for directional beam expansion along the horizontal axis, while the vertical beam expander 22 is responsible for directional beam expansion along the vertical axis. Their combined action achieves beam amplification in both the horizontal and vertical dimensions, overcoming the limitations of single-direction beam expansion. Multiple laser modules are arranged in a bidirectional array to ensure that the beam spots after bidirectional beam expansion can be precisely spliced ​​in both directions on the same working surface. This embodiment achieves efficient shaping of large planar light spots. It avoids the significant energy attenuation caused by traditional single-source bidirectional beam expansion, and obtains large planar light spots without increasing the driving current. It also completely solves the problems of gaps and energy unevenness in the light spots of multi-source two-dimensional splicing.

[0038] In addition, the special energy distribution of the central composite point (the four edge weak light areas b overlap) can be adapted to different processing needs such as composite heating, while the two-dimensional array design of the module supports the flexible expansion of the horizontal and vertical dimensions of the light spot by increasing or decreasing the number of modules, adapting to a wider range of industrial processing scenarios.

[0039] In one embodiment, the normal distance between the transverse beam expander 21 and the longitudinal beam expander 22 is adjustable.

[0040] The beam expander assembly 2 includes a horizontal axis beam expander 21 and a vertical axis beam expander 22. The normal distance between them (i.e., the axial distance along the beam propagation direction) can be flexibly adjusted through a preset adjustment mechanism (such as a sliding guide rail, a threaded adjustment seat, a precision displacement stage, etc.). During the adjustment process, the optical axes of the two beam expanders remain coaxial with the laser beam propagation direction. Each module's beam expander assembly 2 is independently equipped with the aforementioned adjustable-distance horizontal axis beam expander 21 and vertical axis beam expander 22, supporting single-module or multi-module synchronous adjustment to adapt to the parameter requirements of different splicing scenarios. The adjustment mechanism can have scale markings or positioning locking functions to ensure the accuracy and stability of the normal distance adjustment and avoid a decrease in beam splicing accuracy due to distance offset during operation.

[0041] Specifically, the normal distance between the transverse beam expander 21 and the longitudinal beam expander 22 is directly related to the propagation path length of the beam between the two mirrors. When the distance increases, the beam has already undergone more complete transverse diffusion through the transverse beam expander 21 before reaching the longitudinal beam expander 22. After subsequent beam expansion by the longitudinal beam expander 22, the size ratio of the spot in both the transverse and longitudinal directions, the range of the weak light region b at the edge, and the energy distribution will adaptively change. Conversely, when the distance decreases, the beam expansion synergy in both the transverse and longitudinal directions will be adjusted accordingly. In practical applications, the normal distance between the two mirrors can be adjusted according to parameters such as the target large spot size requirements, working surface distance, and laser module array density. Through dynamic adjustment of the normal distance, the spot splicing deviation caused by module processing errors, assembly deviations, or changes in application scenarios can be offset, ensuring that a seamless, energy-uniform two-dimensional planar large spot can be formed under different working conditions.

[0042] This embodiment not only solves the limitation that fixed-spacing beam expanders are difficult to adapt to different spot sizes and different working surface distances, but also allows for flexible optimization of the beam expansion ratio and edge energy distribution through precise adjustment, ensuring the uniformity and stability of the large spot after splicing. Furthermore, it is compatible with diverse needs such as adjusting the module array density and switching processing scenarios, reducing the stringent requirements on module processing accuracy and assembly accuracy, and improving the fault tolerance and service life of the equipment.

[0043] In one embodiment, the normal distance between the beam expander group 2 and the laser source 1 is adjustable.

[0044] The normal distance (i.e., optical axis distance) between the beam expander group 2 (which can be a single horizontal axis beam expander 21, a single vertical axis beam expander 22, or a combination of horizontal axis beam expander 21 and vertical axis beam expander 22, depending on the scenario) and the corresponding laser source 1 along the beam propagation direction is adjustable. Adjustment is achieved through a preset precision adjustment mechanism, such as a sliding guide rail assembly, a threaded fine-tuning seat, or an electric displacement stage. During adjustment, the optical axis of the beam expander group 2 must be kept coaxial with the output axis of the laser source 1 to avoid beam deflection.

[0045] The original Gaussian beam emitted by laser source 1 has a beam cross-section size and divergence angle when it reaches beam expander group 2, which are directly related to the normal distance between the two. When the distance increases, the original beam has already naturally propagated a distance before entering beam expander group 2, the beam cross-section is slightly enlarged and the divergence state is more stable. After being expanded by beam expander group 2, the central uniform region a of the formed spot is wider and the energy gradient of the edge weak light region b is gentler. When the distance decreases, the original beam is incident on beam expander group 2 in a more concentrated state. After the beam is expanded, the energy density of the central uniform region a of the spot is more concentrated and the range of the edge weak light region b is relatively smaller. In practical applications, the normal spacing can be adjusted according to the size of the target large spot, the energy uniformity requirements, and parameters such as the array density and working surface distance of the laser module. For example, if it is necessary to expand the coverage of a single module spot to adapt to sparse array splicing, the spacing can be increased to moderately expand the range of the weak light area b at the edge of the expanded spot, making it easier for adjacent spots to fully overlap. If it is necessary to increase the energy density of the uniform area a at the center of the spot, or to adapt to the precise splicing of dense arrays, the spacing can be reduced to make the weak light area b at the edge of the spot narrower, avoiding excessive energy superposition in the overlapping area c, which would lead to excessively high local energy. This embodiment not only solves the limitations of fixed-spacing designs that are difficult to adapt to different spot sizes, working surface distances, and array densities, but also dynamically optimizes the range of the central uniform region (a) and the energy gradient of the edge weak light region (b) of the spot through precise adjustment. This ensures that the energy density of the overlapping region (c) remains consistent with the central region when multiple modules are spliced, significantly improving the uniformity and stability of large spots. Furthermore, it is compatible with the processing errors and assembly deviations of laser modules. Spot deviations can be corrected by adjusting the spacing of individual modules, reducing the stringent requirements for module manufacturing precision and improving the mass production feasibility and service life of the equipment.

[0046] In one embodiment, the distance between the laser module and the working surface is adjustable.

[0047] The relative distance between the laser module and the working surface is adjustable. The adjustment is achieved through a preset displacement adjustment mechanism, such as a lifting platform, a translation guide rail, or a precision telescopic bracket. During the adjustment process, the array arrangement of all laser modules (parallel or unidirectional) must remain unchanged, and the relative position of the beam expander group 2 and the laser source 1 (or the adjusted parameters if it is an adjustable structure) must remain stable to ensure that the beam propagation direction always accurately points to the working surface.

[0048] The beam of laser source 1, after being expanded by beam expander group 2, will naturally diverge as the distance increases during propagation. The distance between the working surface and the light source directly determines the actual coverage size of the single-module light spot. When the distance increases, the horizontal and vertical dimensions of the single-module light spot on the working surface expand simultaneously, and the range of the weak light area b at the edge also extends accordingly. When the distance decreases, the light spot size shrinks, the range of the weak light area b at the edge narrows, but the energy density of the uniform area a at the center remains relatively stable.

[0049] Based on the core splicing principle of the solution, the beam overlap parameters must be matched synchronously during distance adjustment to ensure that uniformity is not affected. When the distance between the light source and the working surface is increased, the beam size of a single module expands, and the overlap distance of the weak light area b at the edge of the beam of the adjacent module on the working surface will naturally increase. Through the pre-set energy distribution data (such as the energy gradient curve of the weak light area b at the edge), it can be ensured that the energy density of the overlapping area c after superposition is still close to that of the central uniform area a, ultimately forming a larger uniform beam. When the distance between the two is reduced, the beam size shrinks, and the overlap distance of the weak light area b at the edge decreases synchronously. Similarly, the energy density consistency between the overlapping area c and the central area can be maintained through the energy distribution characteristics of the beam itself, achieving the output of a small uniform beam. For the modules of the horizontal and vertical bidirectional array, the beam size of the horizontal and vertical beams changes synchronously during distance adjustment, and the position of the central composite point always remains at the geometric center of the combined beam. Its energy density is positively correlated with the distance change, which can still meet the differentiated heating requirements.

[0050] In this embodiment, the light spot size can be flexibly expanded and contracted, adapting to the processing needs of workpieces of different sizes without the need for complex optical parameter reconstruction (such as rapid switching between small-scale high-precision processing and large-scale wide-area processing). Furthermore, through the synergistic effect of natural light spot divergence and edge overlap energy replenishment, the energy uniformity of spliced ​​light spots at different distances can be ensured, avoiding the problem of "light spot distortion and uneven energy caused by distance changes" in fixed-distance schemes.

[0051] In one embodiment, a mounting frame is included, the mounting frame having multiple mounting parts, each mounting part mounting a group of laser modules, so that the laser modules maintain relative stability.

[0052] The mounting bracket serves as the supporting foundation for the laser module. It can be integrally formed or modularly assembled from rigid materials (such as aluminum alloy, stainless steel, etc.) and has sufficient structural strength to resist deformation caused by vibration, external forces, etc. Each laser module has an independent mounting part on the mounting bracket. The structure of the mounting part is precisely matched with the outer dimensions and assembly interface of the laser module (such as slot type, bolt fixing type, positioning pin type, etc.) to ensure that the position of each module is fixed after installation.

[0053] This embodiment not only solves the problems of positional offset and uneven spacing that easily occur when multiple modules are directly arranged, but also ensures the array accuracy required for spot splicing through rigid installation, avoids energy density imbalance in overlapping areas c due to module displacement, and ensures long-term stability of large spot uniformity; it also simplifies the assembly process of laser modules, and the standardized design of the installation part can realize rapid positioning and installation of modules, reduce the error and difficulty of manual assembly, and improve production efficiency.

[0054] In one embodiment, the spacing between the mounting portions is adjustable along the horizontal and / or vertical axes.

[0055] The mounting bracket is equipped with a spacing adjustment mechanism, supporting individual adjustment along the horizontal and vertical axes, or simultaneous adjustment in both directions. The adjustment mechanism can employ structures such as sliding grooves with locking bolts, precision lead screw slides, and graduated positioning slides to ensure smooth adjustment and precise positioning. Each mounting part has independent adjustment freedom, allowing for individual adjustment of the spacing between a specific mounting part and adjacent mounting parts based on the target spot size and overlap distance requirements. It can also simultaneously adjust the spacing of all mounting parts in the same direction (e.g., when in a horizontal array, the spacing of all mounting parts in the horizontal axis direction can be adjusted as a whole).

[0056] The spacing of the mounting parts directly determines the array density of the laser module, which in turn affects the overlap state of the light spots of adjacent modules. Specifically, when the spacing of the mounting parts is adjusted along the horizontal axis, the horizontal overlap distance X of the light spots of adjacent modules will change: if the spacing decreases, the overlap distance X increases, and the energy superposition in the overlapping area is more sufficient; if the spacing increases, the overlap distance X decreases, avoiding excessive energy superposition. Similarly, adjusting the spacing of the mounting parts in the vertical direction will directly affect the vertical overlap distance Y.

[0057] This embodiment, through its adjustable mounting spacing design, overcomes the limitation of fixed-spacing mounting frames being unable to accommodate splicing large light spots of different sizes. Simple spacing adjustment dynamically matches the overlap distances X and Y, enabling diverse light spot formation from narrow to wide, and from strip to planar shapes without replacing core optical components. It also compensates for splicing accuracy issues caused by laser module processing errors and light spot shape deviations. Precise spacing adjustment ensures that the energy density of the overlapping area c remains consistent with the central area, improving the stability of large light spot uniformity. Furthermore, the adjustment mechanism is easy to operate and precisely positioned, requiring no complex optical debugging experience to optimize parameters, lowering the barrier to entry for the equipment. The rigid structure of the mounting frame still ensures the long-term stability of the module array, balancing the needs of flexible adjustment and stable operation. This further expands the application range of the solution in various scenarios such as industrial processing and material handling, enhancing the practical value and market competitiveness of the equipment.

[0058] In one embodiment, the laser source 1 is a semiconductor laser.

[0059] The laser source 1 is specifically a semiconductor laser, which is the core light-emitting component of the laser module. It has the characteristics of small size, low power consumption, fast response speed and strong wavelength adaptability. It can be directly integrated into the laser module and form a compact modular structure with the beam expander group 2 (horizontal axis beam expander 21, vertical axis beam expander 22 or a combination thereof).

[0060] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and other orientations or positional relationships are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no special meaning.

[0061] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0062] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0063] The technical principles of this application have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this application without inventive effort, and these embodiments will all fall within the scope of protection of this application.

Claims

1. A large-spot laser, characterized in that, It includes at least two sets of parallel and oriented laser modules, each laser module comprising: Laser source (1); A beam expander assembly (2) is disposed on the light-emitting side of the laser source (1); During operation, each laser module projects a light spot onto the working surface, which includes a central uniform region (a) and an edge weak light region (b) surrounding the central uniform region (a). Adjacent edge weak light regions (b) overlap, and the energy density of the overlapping region (c) is similar to that of the central uniform region (a), forming a uniform large light spot.

2. The large-spot laser according to claim 1, characterized in that, The beam expander group (2) includes a transverse beam expander (21), and multiple sets of the laser modules are arranged along the transverse axis.

3. The large-spot laser according to claim 1, characterized in that, The beam expander group (2) includes a longitudinal beam expander (22), and multiple sets of the laser modules are arranged along the longitudinal axis.

4. The large-spot laser according to claim 1, characterized in that, The beam expander group (2) includes a horizontal beam expander (21) and a vertical beam expander (22), and multiple sets of the laser modules are arranged in an array along the horizontal and vertical axes.

5. The large-spot laser according to claim 4, characterized in that, The normal distance between the horizontal beam expander (21) and the vertical beam expander (22) is adjustable.

6. The large-spot laser according to any one of claims 1-5, characterized in that, The normal distance between the beam expander group (2) and the laser source (1) is adjustable.

7. The large-spot laser according to any one of claims 1-5, characterized in that, The distance between the laser module and the working surface is adjustable.

8. The large-spot laser according to claim 1, characterized in that, The system includes a mounting frame with multiple mounting sections, each of which mounts a set of laser modules, ensuring relative stability among the laser modules.

9. The large-spot laser according to claim 8, characterized in that, The spacing between the mounting portions is adjustable along the horizontal and / or vertical axes.

10. The large-spot laser according to claim 1, characterized in that, The laser source (1) is a semiconductor laser.