Memory alloy controller's wire arrangement structure and memory alloy controller

Abstract

The utility model discloses a kind of memory alloy controller's wire arrangement structure and memory alloy controller, wire arrangement structure includes: wire arrangement part, wire arrangement part has multiple wire slots, wire slot is along first direction and penetrates wire arrangement part, wire slot has slot in one side in second direction, first direction and second direction intersect;Memory alloy wire, memory alloy wire is along first direction and is arranged in wire slot, and memory alloy wire has first connecting part and second connecting part, first connecting part is used to with the circuit board of memory alloy control electrical connection, second connecting part is used to with the valve core of memory alloy control connection;Shielding piece, shielding piece at least partially shields the slot of wire slot, to limit memory alloy wire in wire slot.According to the wire arrangement structure of the utility model embodiment, limit memory alloy wire in wire slot, effectively reduce the short-circuit risk of memory alloy wire, and memory alloy wire does not need to be frequently replaced, is conducive to improving the service life of memory alloy wire and memory alloy controller.

Description

Technical Field

[0001] This utility model relates to the field of shape memory alloy controller technology, and more specifically, to a wire management structure for a shape memory alloy controller and a shape memory alloy controller. Background Technology

[0002] In related technologies, with the long-term use of shape memory alloy controllers, the shape memory alloy wires may loosen, posing a risk of short circuits due to contact with other conductive components or contact between the shape memory alloy wires themselves. Therefore, the shape memory alloy wires need to be replaced and repaired frequently, which may even shorten the service life of the shape memory alloy controller. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a wire management structure for a shape memory alloy controller, which effectively reduces the risk of short circuits and tangles in the shape memory alloy wires.

[0004] The wire management structure of the memory alloy controller according to an embodiment of the present invention includes: a wire management component having multiple wire grooves, the wire grooves penetrating the wire management component along a first direction, and the wire grooves having an opening on one side in a second direction, the first direction intersecting the second direction; a memory alloy wire passing through the wire grooves along the first direction, and the memory alloy wire having a first connecting portion and a second connecting portion, the first connecting portion being used for electrical connection with the circuit board controlled by the memory alloy, and the second connecting portion being used for connection with the valve core controlled by the memory alloy; and a blocking component at least partially blocking the opening of the wire grooves to confine the memory alloy wire within the wire grooves.

[0005] According to the wire management structure of the memory alloy controller in this embodiment of the invention, the memory alloy wire is confined in the wire groove by the cooperation of the wire management component and the shielding component, which effectively reduces the short circuit risk of the memory alloy wire and eliminates the need for frequent replacement of the memory alloy wire, thus improving the service life of the memory alloy wire and the memory alloy controller.

[0006] In addition, the wire management structure of the memory alloy controller according to the above embodiments of the present invention may also have the following additional technical features: According to some embodiments of the present invention, a plurality of the wire grooves are arranged along a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other, wherein the shielding member is an integral piece and shields the openings of the plurality of wire grooves; or, the shielding member includes a plurality of plates, the plurality of plates are arranged at intervals along the first direction, and each plate shields the openings of the plurality of wire grooves.

[0007] According to some embodiments of the present invention, the cable management component includes a base and a plurality of partitions, the plurality of partitions being spaced apart along a third direction, the first direction, the second direction and the third direction being perpendicular to each other, the base connecting two adjacent partitions, the cable groove being formed between two adjacent partitions on the side of the base facing the shielding component, and the shielding component being connected to at least two partitions.

[0008] According to some embodiments of the present invention, the plurality of partitions include a first partition and a second partition, the length of the first partition along the first direction is less than the length of the second partition, the first connecting part is connected to the circuit board via a connecting terminal, the connecting terminal being located on one side of the first partition in the first direction and between the two second partitions; and / or, the first connecting part is connected to the circuit board via a connecting terminal, and in the first direction, the size of the shielding member is less than the distance between the connecting terminal and the valve core.

[0009] According to some embodiments of this utility model, the cable management component and the shielding component are snapped together, glued together, or heat-fused together.

[0010] According to some embodiments of the present invention, the cable management component is disposed on one side of the circuit board in the second direction, the groove opening of the cable channel faces away from the circuit board, and the shielding component is disposed on the side of the cable management component facing away from the circuit board.

[0011] According to some embodiments of the present invention, the cable management component has a groove formed on the side facing the circuit board, and the shielding component is connected to the bottom wall of the groove.

[0012] According to some embodiments of the present invention, the groove is provided with reinforcing ribs, and the connection between the shielding member and the bottom wall of the groove is located adjacent to the reinforcing ribs.

[0013] According to some embodiments of the present invention, the bottom wall of the groove is provided with heat dissipation holes, and the shielding member has a heat dissipation area communicating with the heat dissipation holes.

[0014] According to some embodiments of the present invention, the heat dissipation area includes a through hole provided in the shielding member, the through hole and the heat dissipation hole being disposed opposite to each other along the second direction; and / or, the shielding member includes a plurality of spaced plates, the heat dissipation area includes a gap between adjacent plates, and the heat dissipation hole and the heat dissipation area being disposed opposite to each other along the second direction.

[0015] According to some embodiments of the present invention, the cable management component is disposed on one side of the circuit board in the second direction, the groove of the cable channel faces the circuit board, and the circuit board is formed as the shielding component.

[0016] According to some embodiments of the present invention, the bottom wall of the groove is provided with heat dissipation holes.

[0017] According to some embodiments of this utility model, the cable management component and the shielding component are insulating components.

[0018] According to some embodiments of this utility model, there are multiple valve cores, which are arranged along a third direction perpendicular to the first direction. The shape memory alloy wires are arranged in a one-to-one correspondence with the valve cores. The two ends of the shape memory alloy wires are respectively formed as the first connecting portion and the middle portion is formed as the second connecting portion. The two first connecting portions are located at one end of the cable management component in the first direction, and the second connecting portion is located at the other end of the cable management component. The portion located between the second connecting portion and the corresponding two first connecting portions is respectively inserted into the two cable grooves.

[0019] The memory alloy controller according to an embodiment of the present invention includes a wire management structure according to an embodiment of the present invention.

[0020] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a top view of a shape memory alloy controller according to an embodiment of the present invention; Figure 2 This is a front view of a shape memory alloy controller according to an embodiment of the present invention; Figure 3 This is an exploded view of the shape memory alloy controller according to the first embodiment of the present invention; Figure 4 The memory alloy controller according to the first embodiment of this utility model is along Figure 1 A cross-sectional view along the direction indicated by line AA in the middle; Figure 5 The memory alloy controller according to the first embodiment of this utility model is along Figure 2 A cross-sectional view along the direction indicated by the middle BB line; Figure 6 This is an exploded view of the shape memory alloy controller according to the second embodiment of the present invention; Figure 7 The memory alloy controller according to the second embodiment of this utility model is along Figure 2 A cross-sectional view along the direction indicated by the middle BB line; Figure 8 The memory alloy controller according to the third embodiment of this utility model is along Figure 1 A cross-sectional view along the direction indicated by line AA in the middle.

[0022] Figure label: Memory alloy controller 100; 11 Circuit board; 12 Valve core; 13 Housing; 131 Heat dissipation vent; 14 Air nozzle; 15 Valve body; 16 Connecting terminal; Cable management component 21; cable channel 211; base 212; partition 213; groove 214; heat dissipation hole 215; reinforcing rib 216; clip hole 217; Shielding component 22; plate 221; heat dissipation area 222; clip 223; Shape memory alloy wire 30; First direction F1; Second direction F2; Third direction F3. Detailed Implementation

[0023] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0024] In the description of this utility model, it should be understood that the terms "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more. In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] The wiring structure of the memory alloy controller 100 according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0026] like Figures 1-8 As shown, the wire management structure of the memory alloy controller 100 according to an embodiment of the present invention includes a memory alloy wire 30, a wire management component 21, and a shielding component 22.

[0027] The shape memory alloy wire 30 has a first connecting part and a second connecting part. The first connecting part is used for electrical connection with the shape memory alloy controlled circuit board 11, and the second connecting part is used for connection with the shape memory alloy controlled valve core 12. The shape memory alloy wire 30 is powered on and off by the circuit board 11 to heat up or cool down the shape memory alloy wire 30, so that the shape memory alloy wire 30 switches between a tensioned state and a relaxed state, thereby controlling the opening or closing of the valve core 12.

[0028] Furthermore, the cable management component 21 has multiple cable grooves 211, which extend through the component 21 along a first direction F1. One side of each cable groove 211 has an opening in a second direction F2, where the first direction F1 intersects the second direction F2. Shape memory alloy wires 30 are threaded through the cable grooves 211 along the first direction F1. The multiple cable grooves 211 can separate different shape memory alloy wires 30, or separate different positions of the same shape memory alloy wire 30, making the wires more organized and reducing the risk of tangling and short circuits.

[0029] With prolonged use, the shape memory alloy wires in shape memory alloy controllers tend to loosen. In other words, the wires elongate when taut compared to their unused state, and conversely, they elongate when slack. This makes the wires more susceptible to slipping out of the wire slots, especially when slack, increasing the risk of slippage. There is also a risk of the wires coming into contact with other conductive components or short-circuiting with each other, and they are prone to tangling. Therefore, in related technologies, even if the loosening does not affect the switching between taut and slack states, the shape memory alloy wires need to be replaced after a short period of use to prevent short circuits or tangling.

[0030] In the embodiments of this application, such as Figures 3-8As shown, the cable management structure also includes a shielding member 22, which at least partially blocks the opening of the cable groove 211 to confine the shape memory alloy wire 30 within the groove 211. Even if the shape memory alloy wire 30 loosens due to long-term use, it is not easily pulled out of the groove 211 by the shielding member 22. The shape memory alloy wire 30 can be stably confined within the groove 211, reducing the risk of short circuits. Therefore, even if the shape memory alloy wire 30 becomes somewhat loose, it does not need to be replaced without affecting the switching between the tensioned and relaxed states. This improves the service life of the shape memory alloy controller 100 and reduces the risk of short circuits.

[0031] According to the wire management structure of the memory alloy controller 100 in this embodiment of the present invention, the memory alloy wire 30 is confined in the wire groove 211 by the cooperation of the wire management component 21 and the shielding component 22, which effectively reduces the short circuit risk of the memory alloy wire 30 and the memory alloy wire 30 does not need to be replaced frequently, which is conducive to improving the service life of the memory alloy wire 30 and the memory alloy controller 100.

[0032] In some embodiments of this utility model, such as Figure 3 and Figure 6 As shown, there are multiple valve cores 12, which are arranged along a third direction F3 perpendicular to the first direction F1. For example, the first direction F1, the second direction F2, and the third direction F3 are all perpendicular to each other. Shape memory alloy wires 30 are arranged in a one-to-one correspondence with the valve cores 12, so that the opening and closing states of the multiple valve cores 12 can be controlled by the multiple shape memory alloy wires 30 respectively. The corresponding multiple shape memory alloy wires 30 are arranged along the third direction F3, and multiple wire grooves 211 are arranged along the third direction F3.

[0033] The shape memory alloy wire 30 has two ends forming first connecting portions and a middle forming a second connecting portion. The two first connecting portions are located at one end of the cable management component 21 in the first direction F1, and the second connecting portion is located at the other end of the cable management component 21. Thus, the shape memory alloy wire 30 and the circuit board 11 can form a circuit to supply power to the shape memory alloy wire 30 through the circuit board 11; and when the shape memory alloy wire 30 elongates or shortens due to temperature changes, it can drive the valve core 12 to switch states.

[0034] In the same shape memory alloy wire 30, the portion located between the second connecting portion and the corresponding two first connecting portions is respectively threaded into two wire grooves 211. Thus, the wire organizer 21 can not only separate multiple shape memory alloy wires 30, but also separate different portions of the same shape memory alloy wire 30, thus better preventing the shape memory alloy wires 30 from becoming tangled.

[0035] In embodiments of this application, the blocking member 22 can block a portion of the opening of the wire groove 211, or it can completely block the opening of the wire groove 211. For example, in the first direction F1, the total extension length of the blocking member 22 can be less than or equal to the size of the opening of the wire groove 211; in the third direction F3, the length of the blocking member 22 can be less than, equal to, or greater than the size of the opening of the wire groove 211. In embodiments where the length of the blocking member 22 in the third direction F3 is less than the size of the opening of the wire groove 211, the difference between the size of the opening of the wire groove 211 and the length of the blocking member 22 is less than the diameter of the shape memory alloy wire 30.

[0036] In the embodiments of this application, the blocking member 22 can be, but is not limited to, a plate 221, a block, a rod, or other structures, as long as it can block the groove opening of the wire groove 211. Furthermore, the blocking member 22 can extend along one or a combination of straight lines, curves, and broken lines in the first direction F1 and the third direction F3; and the two ends of the blocking member 22 in the length direction can be arranged parallel to the first direction F1 or the third direction F3, or they can be arranged at an angle relative to the first direction F1 or the third direction F3.

[0037] The shielding member 22 according to some specific embodiments of the present invention is described below with reference to the accompanying drawings.

[0038] According to some embodiments of this utility model, multiple wire grooves 211 are arranged along a third direction F3, with the first direction F1, the second direction F2, and the third direction F3 being perpendicular to each other. In some embodiments, such as... Figures 3-5 As shown, the shielding member 22 is a single piece that shields the openings of multiple wire grooves 211. The structure of the shielding member 22 is simpler and it is easier to simplify the installation structure of the shielding member 22, making it easier to process and install.

[0039] In other embodiments, such as Figure 6 and Figure 7 As shown, the shielding member 22 includes multiple plates 221, which are spaced apart along the first direction F1. Each plate 221 shields the openings of multiple wire grooves 211. Therefore, the multiple plates 221 can shield the openings of the wire grooves 211 from multiple positions along the first direction F1, resulting in better prevention of the shape memory alloy wire 30 from detaching. Furthermore, the shielding member 22 uses higher-quality materials, which helps reduce weight and cost.

[0040] The cable management component 21 according to some embodiments of the present invention is described below with reference to the accompanying drawings.

[0041] According to some embodiments of this utility model, such as Figures 3-8As shown, the cable management component 21 includes a base 212 and a plurality of partitions 213. The partitions 213 are spaced apart along a third direction F3, with the first direction F1, the second direction F2, and the third direction F3 being perpendicular to each other. The base 212 connects two adjacent partitions 213, and a cable groove 211 is formed between two adjacent partitions 213 on the side of the base 212 facing the shielding component 22. It should be noted that the partitions 213 may be connected to the base 212 at their ends or in the middle of the second direction F2.

[0042] The separator 213 can separate multiple memory alloy wires 30 or separate different parts of the same memory alloy wire 30. The substrate 212 can separate the memory alloy wires 30 from the conductive structure of the circuit board 11, which can better prevent the memory alloy wires 30 from short-circuiting and getting tangled. In addition, the wire management component 21 has a simple structure and is easy to process and shape.

[0043] Furthermore, the shielding member 22 is connected to at least two partitions 213 to improve the connection stability between the shielding member 22 and the cable management member 21. For example, in some specific embodiments, the plurality of partitions 213 include first partitions and second partitions arranged alternately along a third direction F3, wherein the first partition is connected to the shielding member 22, and the second partition is not connected to the shielding member 22. The first partition and the shielding member 22 can be connected through one or more points, for example, by multiple snap-fits 223.

[0044] In some embodiments, such as Figure 3 and Figure 6 As shown, the plurality of partitions 213 include a first partition and a second partition, wherein the length of the first partition along the first direction F1 is less than the length of the second partition. The first connection is connected to the circuit board 11 via a connection terminal 16, which is located on one side of the first partition along the first direction F1 and between the two second partitions. Thus, adjacent connection terminals 16 can be separated by the second partitions, thereby reducing the risk of short circuits. Furthermore, the wire management component 21 can be used not only for separating the shape memory alloy wires 30 but also for separating the connection terminals 16, integrating functions and simplifying the structure of the shape memory alloy controller 100.

[0045] In some embodiments, the first connecting portion is connected to the circuit board 11 via the connecting terminal 16. In the first direction F1, the size of the shielding member 22 is smaller than the distance between the connecting terminal 16 and the valve core 12. Therefore, the shielding member 22 can be arranged between the connecting terminal 16 and the valve core 12, avoiding interference between the shielding member 22 and the connecting terminal 16 and the valve core 12, and reducing the material usage of the shielding member 22 to achieve weight reduction and cost reduction. For example, the length of the shielding member 22 in the first direction F1 can be equal to the length of the first partition portion.

[0046] It is worth noting that in embodiments where the shielding member 22 comprises multiple plates 221, the dimension of the shielding member 22 in the first direction F1 refers to the distance between the edges of two plates 221 at both ends of the plurality of plates 221 in the first direction F1. In embodiments where the shielding member 22 is a single piece, the dimension of the shielding member 22 in the first direction F1 refers to the distance between the edges of the two ends of the single piece in the first direction F1.

[0047] According to some embodiments of this utility model, the wire management component 21 and the shielding component 22 can be connected by snap-fitting, bonding or hot-melting, so that during the use of the memory alloy controller 100, the shielding component 22 can be stably maintained at the position of shielding the opening of the wire groove 211, and the effect of preventing the memory alloy wires 30 from getting tangled and short-circuiting is more reliable.

[0048] For example, in some embodiments, such as Figures 4-7 As shown, one of the cable management component 21 and the shielding component 22 may be provided with a buckle 223, and the other may be provided with a locking hole 217. The buckle 223 is engaged with the locking hole 217 to achieve the engagement of the cable management component 21 and the shielding component 22, and to facilitate disassembly and assembly. For example, the buckle 223 or the locking hole 217 may be provided in the partition portion 213 of the cable management component 21 (such as in the first partition portion).

[0049] In other embodiments, one of the cable management component 21 and the shielding component 22 may have a connecting post, and the other may have a connecting hole. The connecting post passes through the connecting hole and is connected by heat fusion, resulting in a more secure connection. For example, the connecting post or the connecting hole may be located in the partition portion 213 of the cable management component 21. In embodiments where the connecting post is located in the cable management component 21 and the connecting hole is located in the shielding component 22, when the connecting post passes through the connecting hole, the end of the connecting post can be exposed to facilitate the heat fusion connection operation.

[0050] In some other embodiments, such as Figure 8 As shown, the cable management component 21 and the shielding component 22 are connected by adhesive, making the connection operation more convenient.

[0051] In embodiments of this utility model, the arrangement of the cable management component 21 and the shielding component 22 can be flexibly configured according to actual conditions. For example, in some embodiments, such as Figures 3-7 As shown, the cable management component 21 is disposed on one side of the circuit board 11 in the second direction F2, the opening of the cable groove 211 faces away from the circuit board 11, and the shielding component 22 is disposed on the side of the cable management component 21 facing away from the circuit board 11. For example, the thickness direction of the circuit board 11 is parallel to the second direction F2.

[0052] Therefore, the wire management component 21 can not only be used to separate the shape memory alloy wires 30, but also to separate the shape memory alloy wires 30 from the conductive areas on the circuit board 11, thus better preventing short circuits of the shape memory alloy wires 30. Furthermore, during assembly, the wire management component 21 can be first installed on one side of the circuit board 11 in the second direction F2, at which point the opening of the wire groove 211 is open. Then, the shape memory alloy wires 30 are placed inside the wire groove 211, and the shielding component 22 is placed at the opening of the wire groove 211. This minimizes interference between the shape memory alloy wires 30 and the shielding component 22, making assembly more convenient.

[0053] In other embodiments, such as Figure 8 As shown, the cable management component 21 is disposed on one side of the circuit board 11 in the second direction F2, and the opening of the cable groove 211 faces the circuit board 11, with the circuit board 11 forming a shield 22. For example, non-conductive areas on the circuit board 11 can be shielded at the opening of the cable groove 211 to prevent the shape memory alloy wire 30 from being accidentally electrically connected to the conductive areas of the circuit board 11.

[0054] In other words, the circuit board 11 is not only used to turn the power on and off the shape memory alloy wire 30, but also to prevent the shape memory alloy wire 30 from coming out of the wire groove 211. There is no need to set up a separate shielding structure, which helps to reduce the number of parts, simplify the structure and reduce assembly steps.

[0055] In some embodiments of this utility model, such as Figures 3-7 As shown, a groove 214 is formed on the side of the cable management component 21 facing the circuit board 11. For example, in some embodiments, the partition portion 213 of the cable management component 21, such as the first partition portion, may have a groove 214 formed therein. Optionally, the groove 214 may be used to accommodate or avoid electronic components on the circuit board 11 to prevent interference between the cable management component 21 and the circuit board 11.

[0056] Furthermore, the shielding member 22 is connected to the bottom wall of the groove 214. The groove 214 can be used to avoid the connection structure between the shielding member 22 and the cable management member 21, making the connection more reliable. For example, the bottom wall of the groove 214 can be provided with a locking hole 217, and the buckle 223 on the shielding member 22 can pass through the locking hole 217 and partially extend into the groove 214 to achieve a reliable locking.

[0057] In some embodiments, such as Figure 4 and Figure 5 As shown, a reinforcing rib 216 is provided inside the groove 214, and the connection between the shielding member 22 and the bottom wall of the groove 214 is located near the reinforcing rib 216. The reinforcing rib 216 can improve the structure of the groove wall of the groove 214, so that the groove wall of the groove 214 is less likely to deform and be damaged during the connection between the shielding member 22 and the bottom wall of the groove 214, and during the use of the shape memory alloy controller 100.

[0058] For example Figure 5As shown, the groove 214 is provided with a plurality of reinforcing ribs 216, which are arranged at intervals along the first direction F1. The shielding member 22 is connected to the groove 214 by a buckle 223, which is arranged at intervals along the first direction F1, and the buckles 223 are arranged adjacent to the reinforcing ribs 216 in a one-to-one correspondence.

[0059] In some embodiments of this utility model, such as Figure 3 , Figures 5-7 As shown, the bottom wall of the groove 214 is provided with heat dissipation holes 215, and the shielding member 22 has a heat dissipation area 222 that communicates with the heat dissipation holes 215. The heat generated by the electronic components on the circuit board 11 inside the groove 214 can be dissipated outward through the heat dissipation holes 215 and the heat dissipation area 222, thereby achieving heat dissipation and preventing the electronic components from being damaged due to excessive temperature.

[0060] It is worth noting that, in the second direction F2, the heat dissipation hole 215 and the heat dissipation area 222 can be directly connected or not directly connected. For example, in some specific embodiments, the heat dissipation hole 215 and the heat dissipation area 222 are arranged offset perpendicular to the second direction F2. The surface of the bottom wall of the groove 214 facing the shielding member 22 is a convex arc surface. The heat dissipation hole 215 is located on the convex arc surface, so that the shielding member 22 will not block the heat dissipation hole 215. The hot air in the groove 214 can enter between the wire management member 21 and the shielding member 22 through the heat dissipation hole 215, and flow perpendicular to the second direction F2 to the heat dissipation area 222, and then dissipate heat through the heat dissipation area 222. In addition, the convex arc surface also facilitates the wiring of the shape memory alloy wire 30 into the wire groove 211, which is beneficial to improving assembly efficiency.

[0061] In some embodiments, such as Figure 3 and Figure 6 As shown, the heat dissipation area 222 includes a through hole provided in the shield 22. The through hole and the heat dissipation hole 215 are arranged opposite to each other along the second direction F2, so that the hot air diffused from the heat dissipation hole 215 can pass through the through hole more smoothly, which is beneficial to improving the heat dissipation efficiency.

[0062] In some embodiments where the shielding member 22 includes a plurality of spaced-apart plates 221, such as Figure 6 and Figure 7 As shown, the heat dissipation area 222 includes the gap between adjacent plates 221, and the heat dissipation holes 215 are arranged opposite to the heat dissipation area 222 along the second direction F2. This allows hot air diffused from the heat dissipation holes 215 to pass through the gap between the two plates 221, resulting in a larger flow area and higher heat dissipation efficiency.

[0063] In some embodiments where the slot opening of the wire groove 211 faces the circuit board 11, the bottom wall of the wire groove 211 may be provided with heat dissipation holes 215, so that the hot air generated by the operation of the memory alloy wire 30 or the operation of electronic components in the wire groove 211 can be diffused outward through the heat dissipation holes 215, preventing the temperature from being too high and affecting the normal state switching of the memory alloy wire 30 or affecting the service life of electronic components.

[0064] In some embodiments of this utility model, such as Figure 5 As shown, the memory alloy controller 100 also includes a housing 13, with a cable management structure located inside the housing 13. The housing 13 may be provided with a heat dissipation vent 131, through which hot air diffused by the heat dissipation holes 215 or the heat dissipation area 222 can diffuse to the outside of the housing 13, thereby improving the overall heat dissipation effect of the memory alloy controller 100.

[0065] According to some embodiments of this utility model, the cable management component 21 and the shielding component 22 are insulating components, such as plastic or rubber. Here, the cable management component 21 and the shielding component 22 may be covered with an insulating layer, or they may be made entirely of insulating material. This can prevent the shape memory alloy wire 30 from coming into contact with the cable management component 21 or the shielding component 22 and causing a short circuit.

[0066] The memory alloy controller 100 according to an embodiment of the present invention includes a cable management structure according to an embodiment of the present invention. Since the cable management structure of the memory alloy controller 100 according to an embodiment of the present invention has the aforementioned beneficial technical effects, the memory alloy controller 100 according to an embodiment of the present invention, through the cooperation of the cable management component 21 and the shielding component 22, confines the memory alloy wire 30 within the cable groove 211, effectively reducing the short-circuit risk of the memory alloy wire 30, and eliminating the need for frequent replacement of the memory alloy wire 30, thus improving the service life of both the memory alloy wire 30 and the memory alloy controller 100.

[0067] The following describes in detail a specific embodiment of the memory alloy controller 100 according to the present invention with reference to the accompanying drawings. It should be understood that the following description is merely illustrative and should not be construed as limiting the present invention.

[0068] like Figures 1-5 As shown, a memory alloy controller 100 according to a specific embodiment of the present invention includes a housing 13, a circuit board 11, a valve core 12, an air nozzle 14, a valve body 15, a connecting terminal 16, a cable management component 21, a shielding component 22, and a memory alloy wire 30.

[0069] The circuit board 11 is installed inside the housing 13. A cable management component 21 is located on one side of the circuit board 11 in the thickness direction. The cable management component 21 has multiple cable grooves 211 arranged along a third direction F3, with the openings of the cable grooves 211 facing away from the circuit board 11. A shielding component 22 covers the openings of the cable grooves 211. The two ends of the shape memory alloy wire 30 (i.e., the two first connecting portions) are located at the same end of the cable management component 21 in the first direction F1 and are electrically connected to the circuit board 11 via connecting terminals 16. The middle part of the shape memory alloy wire 30 (i.e., the second connecting portion) is located at the other end of the cable management component 21 in the first direction F1 and is connected to the valve core 12. The portion between the two first connecting portions and the second connecting portion is located within the two cable grooves 211. The valve core 12 is installed in the valve body 15, which has a flow path and is connected to an air nozzle 14.

[0070] Circuit board 11 can switch the power supply on and off of shape memory alloy wire 30, allowing it to switch between a tensioned and relaxed state. This, in turn, drives valve core 12 to operate, controlling the flow path within valve body 15 and thus the air nozzle 14. The shielding component 22 can shield the shape memory alloy wire 30 within wire groove 211 to prevent it from loosening and detaching from the groove over time, effectively reducing the risk of short circuits and tangling.

[0071] Furthermore, in the above embodiment, the shape memory alloy wire 30 is arranged on one side of the valve body 15 in the first direction F1, so that the length of the shape memory alloy wire 30 is not limited by the size of the valve body 15. The length of the shape memory alloy wire 30 can be flexibly set according to pneumatic requirements. For example, the length of the shape memory alloy wire 30 can be longer to meet the pneumatic requirements of a longer stroke. In addition, the shape memory alloy wire 30 is located outside the valve body 15, which is more conducive to heat dissipation of the shape memory alloy wire 30 and prevents the shape memory alloy wire 30 from being affected by the state switching due to excessively high ambient temperature.

[0072] Other configurations and operations of the memory alloy controller 100 according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0073] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0074] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wire management structure for a shape memory alloy controller, characterized in that, include: The cable management component (21) has a plurality of cable grooves (211), the cable grooves (211) passing through the cable management component (21) along a first direction (F1), and the cable grooves (211) having a slot on one side in a second direction (F2), the first direction (F1) intersecting the second direction (F2); A memory alloy wire (30) is inserted into the wire groove (211) along the first direction (F1), and the memory alloy wire (30) has a first connecting part and a second connecting part. The first connecting part is used to electrically connect with the circuit board (11) controlled by the memory alloy, and the second connecting part is used to connect with the valve core (12) controlled by the memory alloy. A shielding member (22) at least partially shields the opening of the groove (211) to confine the shape memory alloy wire (30) within the groove (211).

2. The wire management structure of the shape memory alloy controller according to claim 1, characterized in that, Multiple grooves (211) are arranged along a third direction (F3), wherein the first direction (F1), the second direction (F2), and the third direction (F3) are perpendicular to each other. The shielding member (22) is a single piece and shields the openings of multiple grooves (211); or, The shielding member (22) includes a plurality of plates (221) arranged at intervals along a first direction (F1), and each plate (221) shields the slots of a plurality of wire grooves (211).

3. The wire management structure of the shape memory alloy controller according to claim 1, characterized in that, The cable management component (21) includes a base (212) and a plurality of partitions (213). The plurality of partitions (213) are spaced apart along a third direction (F3). The first direction (F1), the second direction (F2), and the third direction (F3) are perpendicular to each other. The base (212) connects two adjacent partitions (213). The base (212) forms a cable groove (211) on the side facing the shielding component (22) and between two adjacent partitions (213). The shielding component (22) is connected to at least two partitions (213).

4. The wire management structure of the shape memory alloy controller according to claim 3, characterized in that, The plurality of partitions (213) include a first partition and a second partition, wherein the length of the first partition along the first direction (F1) is less than the length of the second partition, and the first connecting part is connected to the circuit board (11) via a connecting terminal (16), the connecting terminal (16) being located on one side of the first partition along the first direction (F1) and between the two second partitions; and / or, The first connection part is connected to the circuit board (11) via a connection terminal (16). In the first direction (F1), the size of the shield (22) is smaller than the distance between the connection terminal (16) and the valve core (12).

5. The wire management structure of the shape memory alloy controller according to claim 1, characterized in that, The cable management component (21) and the shielding component (22) are snapped together, glued together, or heat-fused together.

6. The wire arrangement structure of the shape memory alloy controller according to any one of claims 1-5, characterized in that, The cable management component (21) is located on one side of the circuit board (11) in the second direction (F2), the opening of the cable groove (211) faces away from the circuit board (11), and the shielding component (22) is located on the side of the cable management component (21) facing away from the circuit board (11).

7. The wire management structure of the shape memory alloy controller according to claim 6, characterized in that, The cable management component (21) has a groove (214) formed on the side facing the circuit board (11), and the shielding component (22) is connected to the bottom wall of the groove (214).

8. The wire management structure of the shape memory alloy controller according to claim 7, characterized in that, The groove (214) is provided with reinforcing ribs (216), and the connection between the shielding member (22) and the bottom wall of the groove (214) is located near the reinforcing ribs (216).

9. The wire management structure of the shape memory alloy controller according to claim 7, characterized in that, The groove (214) has a heat dissipation hole (215) on the bottom wall, and the shield (22) has a heat dissipation area (222) that communicates with the heat dissipation hole (215).

10. The wire management structure of the shape memory alloy controller according to claim 9, characterized in that, The heat dissipation area (222) includes a through hole provided in the shielding member (22), the through hole and the heat dissipation hole (215) being disposed opposite each other along the second direction (F2); and / or, The shielding member (22) includes a plurality of spaced plates (221), the heat dissipation area (222) includes a gap between adjacent plates (221), and the heat dissipation hole (215) is disposed opposite to the heat dissipation area (222) along the second direction (F2).

11. The wire arrangement structure of the shape memory alloy controller according to any one of claims 1-5, characterized in that, The cable management component (21) is located on one side of the circuit board (11) in the second direction (F2), the slot of the cable groove (211) faces the circuit board (11), and the circuit board (11) is formed as the shield (22).

12. The wire management structure of the shape memory alloy controller according to claim 11, characterized in that, The bottom wall of the groove (211) is provided with heat dissipation holes (215).

13. The wire management structure of the shape memory alloy controller according to claim 1, characterized in that, The cable management component (21) and the shielding component (22) are insulating components.

14. The wire management structure of the shape memory alloy controller according to claim 1, characterized in that, There are multiple valve cores (12), and the multiple valve cores (12) are arranged along a third direction (F3) perpendicular to the first direction (F1). The shape memory alloy wires (30) are arranged one-to-one with the valve cores (12). The two ends of the shape memory alloy wires (30) are respectively formed as the first connecting part and the middle part is formed as the second connecting part. The two first connecting parts are located at one end of the cable management component (21) in the first direction (F1), and the second connecting part is located at the other end of the cable management component (21). The portions located between the second connecting portion and the corresponding two first connecting portions are respectively inserted into the two wire grooves (211).

15. A shape memory alloy controller, characterized in that, The wire arrangement structure includes the shape memory alloy controller according to any one of claims 1-14.

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