VR backlight module power supply redundancy power supply component

Abstract

The utility model discloses VR backlight module power supply redundancy power supply subassembly relates to VR display technical technical field. This VR backlight module power supply redundancy power supply subassembly passes through the combination design of AI control board and magnetic attraction interface seat, on one hand can real -time monitoring main power module load state, realizes the quick incorporation of miniature redundancy module under high load scene, avoids the fluctuation or interruption of VR backlight brightness caused by single power overload, on the other hand, the plug -in protocol conversion module on main interface board prestore multiple brand VR power supply protocol, need not whole disassembly device, solved the pain point that traditional component needs to customize development adaptation interface, through the shock attenuation protection of the main power module of the elastic soft pad of box bottom core, effectively absorbs the vibration when device operation or removal, reduces interface loose failure rate, at the same time, the closed -loop liquid cooling system that micro -cold head, hose, heat dissipation row constitute, cooperate the real -time monitoring of temperature sensor and the intelligent control of AI control board, compared with traditional air -cooled heat dissipation efficiency improves.

Description

Technical Field

[0001] This utility model relates to the field of VR display technology, and in particular to a redundant power supply component for VR backlight modules. Background Technology

[0002] With the rapid popularization of virtual reality technology, VR headsets, as core interactive devices, directly determine the user experience through their display effects and operational stability. Backlight modules, as a crucial component of VR display systems, place stringent demands on the reliability, stability, and adaptability of their power supply. As VR devices iterate towards higher resolutions and higher refresh rates, the power requirements of backlight modules have significantly increased. The peak power consumption of a single module has risen from the traditional 5W to over 15W. Furthermore, in high-frequency load scenarios such as full-white screen displays and dynamic scene rendering, the power supply current fluctuation can reach 30%. Power outages or voltage instability will directly lead to screen flickering, sudden drops in brightness, or even device shutdown, severely impacting the user's immersion experience.

[0003] Currently, although redundant power supply components for VR backlight modules have achieved basic redundancy, there are still technical bottlenecks in practical applications: insufficient redundancy response and compatibility. Traditional components mostly adopt a fixed 2n redundancy architecture, with dual power supply modules working in parallel for a long time. This not only results in serious energy waste under light loads, but also the activation of redundant modules depends on hardware triggering, with response times generally exceeding 20ms, making it difficult to cope with the instantaneous peak load of VR devices. At the same time, the power supply protocols and interface specifications of backlight modules of different brands of VR devices vary significantly. Components need to be customized for a single brand, and cross-brand adaptation requires the replacement of the entire interface board, with an adaptation cycle of up to 4 weeks and high maintenance costs.

[0004] The VR headset suffers from significant stability and heat dissipation deficiencies. Most VR headsets are designed for portability, with limited space for component installation. Traditional redundant components are not optimized for vibration environments, and the main power module is directly fixed to the metal casing. Vibrations caused by device movement or user actions can easily lead to loose power interfaces and desoldering of capacitor pins. Furthermore, the high-power power module has difficulty dissipating heat in a confined space, and the core temperature often exceeds 85°C, causing power devices to reduce their frequency, resulting in a 10%-15% reduction in power supply capacity, creating a vicious cycle of high temperature, frequency reduction, and insufficient power consumption.

[0005] The structural design and energy efficiency are at odds. To ensure heat dissipation, traditional components often use large air-cooling systems, which take up space inside the headset. Moreover, the noise generated by the fan running for a long time disrupts the user's immersive experience. At the same time, the power distribution between the redundant module and the main power module relies on simple hardware circuits and cannot dynamically adjust the output power according to the load. In low-load scenarios, the redundant module is still in standby mode, consuming an extra 2-3W of power, which contradicts the development requirements of long battery life for VR devices.

[0006] Furthermore, with the widespread adoption of new power devices such as GaN (Gallium Nitride), the structural design of traditional components has failed to adapt to the characteristics of these new devices. While GaN devices can reduce size by 40% and increase efficiency by 5%, they have higher requirements for heat dissipation paths and electromagnetic shielding. Traditional PCB layouts and metal casings can easily lead to excessive electromagnetic interference from GaN devices, affecting the stability of the backlight module's driving signal. Therefore, developing a redundant power supply component for VR backlight modules that combines fast redundant response, cross-brand compatibility, low power consumption and high efficiency, and compatibility with new devices has become the key to breaking through current technological bottlenecks and promoting the upgrade of VR display systems. Utility Model Content

[0007] The purpose of this invention is to at least solve one of the technical problems existing in the prior art by providing a redundant power supply component for VR backlight modules, which can solve the above problems.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a redundant power supply component for a VR backlight module, including a housing, a soft pad fixedly connected to the bottom of the housing, and a main power module fixedly connected to the soft pad;

[0009] A support plate is provided above the main power module. The support plate is fixedly connected to the inner wall of the box. A temperature sensor is fixedly connected to the lower surface of the support plate. The temperature sensor is positioned facing the main power module. An AI control board is provided on the upper surface of the support plate.

[0010] Magnetic interface seats are fixedly connected to the inner walls of the box on both sides of the bracket plate, and each magnetic interface seat can be detachably equipped with a miniature redundant module.

[0011] A heat dissipation radiator is fixedly connected to the inner wall of the box above the support plate. The heat dissipation radiator has several heat dissipation holes. A miniature liquid cooling pump is fixedly connected to the inner wall of the box on the left side of the heat dissipation radiator. A flexible hose is fixedly connected to the miniature liquid cooling pump. A miniature cold head is provided on the main power module. The miniature cold head is connected to the miniature liquid cooling pump through the flexible hose, and the other end of the flexible hose is fixedly connected to and connected to the heat dissipation radiator.

[0012] A main interface board is provided on one side of the enclosure. The main interface board is equipped with a protocol conversion module and multiple interfaces for power supply and data transmission. An axial fan is fixedly connected to the outer side of the enclosure corresponding to the main interface board.

[0013] Preferably, the soft pad is made of elastic rubber material, and the soft pad completely covers the bottom projection area of ​​the main power module.

[0014] Preferably, the magnetic interface base is provided with a gold-plated conductive spring, and the back of the miniature redundant module is provided with a permanent magnet adapted to the magnetic interface base. The miniature redundant module is attracted and fixed to the magnetic interface base by the permanent magnet, and is electrically connected to the AI ​​control board by the conductive spring.

[0015] Preferably, the heat dissipation holes are distributed in a matrix on the heat dissipation radiator, and the heat dissipation radiator is integrally formed from aluminum alloy.

[0016] Preferably, the hose is a high-temperature resistant silicone tube, and quick-release sealing joints are provided at the connection points between the hose and the micro liquid cooling pump, the heat sink, and the micro cold head.

[0017] Preferably, the temperature sensor is a high-precision digital thermistor, which is electrically connected to the AI ​​control board via an I2C bus, and the distance between the temperature sensor and the main power module is 1-2mm.

[0018] Preferably, the protocol conversion module adopts a pluggable structure and is connected to the main interface board, and the protocol conversion module pre-stores power supply protocol programs for at least two mainstream VR devices.

[0019] Preferably, the axial fan's air outlet direction is towards the heat sink, and the axial fan is electrically connected to the AI ​​control board via a PWM signal line, enabling speed adjustment.

[0020] Preferably, the interface includes a USB interface, a Type-C interface, an HDMI interface, and a customized backlight driver interface, and each interface is electrically connected to the AI ​​control board via an FPC cable.

[0021] Compared with the prior art, the beneficial effects of this utility model are:

[0022] (1) The redundant power supply component of the VR backlight module, through the combination design of AI control board and magnetic interface socket, can monitor the load status of main power module in real time, realize the rapid integration of micro redundant modules in high load scenarios, form a stable N+1 redundant architecture, and avoid VR backlight brightness fluctuation or interruption caused by single power supply overload; on the other hand, the pluggable protocol conversion module on the main interface board is pre-stored with multiple brand VR power supply protocols, and can be adapted to different models such as Meta and Pico by changing the module, without the need for overall disassembly of the device, solving the pain point of traditional components requiring customized development of adaptation interfaces, shortening the adaptation cycle, and greatly improving the flexibility of use.

[0023] (2) The redundant power supply component of the VR backlight module provides shock absorption protection for the core main power module through the elastic soft pad at the bottom of the box, effectively absorbing the vibration during the operation or movement of the device and reducing the failure rate of loose interfaces; at the same time, the closed-loop liquid cooling system composed of miniature cold head, hose, and heat sink, combined with the real-time monitoring of temperature sensor and the intelligent control of AI control board, can stably control the core temperature of the main power module and the miniature redundant module within 70℃, which is more efficient than traditional air cooling; and the axial fan and miniature liquid cooling pump are started and stopped as needed. In low load scenarios, only the main power module works independently and the redundant module is in sleep mode. The overall energy consumption is lower than the traditional 2n redundancy solution, which takes into account the dual requirements of VR device for power supply stability and long battery life. Attached Figure Description

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0025] Figure 1 This is an isometric schematic diagram of the redundant power supply component for the VR backlight module of this utility model;

[0026] Figure 2 This is a cross-sectional schematic diagram of the redundant power supply component for the VR backlight module of this utility model.

[0027] Figure 3 This is a right-side view of the redundant power supply component for the VR backlight module of this utility model.

[0028] Figure 4 This is a cross-sectional schematic diagram of the redundant power supply component for the VR backlight module of this utility model.

[0029] Reference numerals: 1. Cabinet; 2. Pad; 3. Main power module; 4. Bracket plate; 5. Temperature sensor; 6. AI control board; 7. Magnetic interface socket; 8. Miniature redundant module; 9. Heat sink; 10. Heat dissipation hole; 11. Miniature liquid cooling pump; 12. Flexible hose; 13. Miniature cold head; 14. Main interface board; 15. Protocol conversion module; 16. Interface; 17. Axial fan. Detailed Implementation

[0030] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0031] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] In the description of this utility model, terms such as greater than, less than, and exceeding are understood to exclude the stated number, while terms such as above, below, and within are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the quantity or sequence of the indicated technical features.

[0033] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0034] Please see Figure 1-4 This utility model provides a technical solution: a redundant power supply component for a VR backlight module, including a housing 1, a soft pad 2 fixedly connected to the bottom of the housing 1, a main power module 3 fixedly connected to the soft pad 2, a support plate 4 on the main power module 3, a temperature sensor 5 fixedly connected to the bottom of the support plate 4, an AI control board 6 on the support plate 4, and magnetic interface seats 7 fixedly connected to the inner walls of the housing 1 on both sides of the support plate 4, and miniature redundant modules 8 on the magnetic interface seats 7.

[0035] The enclosure 1 serves as an external protective frame, providing a closed protective space for all internal components to prevent external dust, moisture intrusion, and electromagnetic interference.

[0036] The soft pad 2 at the bottom of the box 1 absorbs the vibration generated during operation or movement through the elastic deformation absorption device, forming shock absorption protection for the main power module 3 fixed above, preventing the main power interface from becoming loose or internal components from being damaged by vibration, and ensuring the initial stability of the core power supply components.

[0037] The bracket plate 4 is fixedly connected to the inner wall of the box 1;

[0038] The temperature sensor 5 fixed under the bracket plate 4 monitors the core temperature of the main power module 3 in real time and transmits the temperature data to the AI ​​control board 6. At the same time, the self-diagnostic chip built into the micro redundancy module 8 feeds back parameters such as module voltage ripple and capacitor health to the AI ​​control board 6 through the magnetic interface 7. When the temperature of the main power module 3 exceeds 65°C or the temperature of the micro redundancy module 8 exceeds 70°C, the AI ​​control board 6 immediately starts the heat dissipation system.

[0039] A heat dissipation radiator 9 is fixedly connected to the inner wall of the box 1 above the support plate 4. The heat dissipation radiator 9 is provided with heat dissipation holes 10. A miniature liquid cooling pump 11 is fixedly connected to the inner wall of the box 1 on the left side of the heat dissipation radiator 9. A flexible hose 12 is fixedly connected to the miniature liquid cooling pump 11. A miniature cold head 13 is provided on the main power module 3. The miniature cold head 13 and the miniature liquid cooling pump 11 are connected through the flexible hose 12.

[0040] The micro liquid cooling pump 11 above the bracket plate 4 operates. The micro liquid cooling pump 11 drives the coolant circulation through the hose 12. The coolant flows out from the micro liquid cooling pump 11 and is delivered to the micro cold head 13 on the main power module 3 through the hose 12. After absorbing the heat of the chip, it flows back to the heat sink 9 through the hose 12.

[0041] The two ends of the flexible hose 12 are fixedly connected to the heat sink 9 and the miniature liquid cooling pump 11, respectively.

[0042] A main interface board 14 is provided on one side of the enclosure 1. A protocol conversion module 15 is provided on the main interface board 14. Multiple interfaces 16 are provided on the main interface board 14. An axial fan 17 is fixedly connected to the outside of the main interface board 14 on the enclosure 1.

[0043] Working principle: Before the device is started, the enclosure 1 serves as an external protective frame, providing a closed protective space for all internal components to prevent external dust, moisture and electromagnetic interference from entering; the soft pad 2 at the bottom of the enclosure 1 absorbs the vibration generated during operation or movement through elastic deformation, forming shock absorption protection for the main power module 3 fixed above, preventing vibration from causing the main power interface to loosen or internal components to be damaged, and ensuring the initial stability of the core power supply components.

[0044] After the power supply process is initiated, the external power supply is first connected through interface 16 of the main interface board 14 on one side of the enclosure 1. After preliminary rectification by the main interface board 14, the power is transmitted to the AI ​​control board 6 on the bracket board 4. As the core of system control, the AI ​​control board 6 prioritizes the allocation of power to the main power module 3. Under normal conditions, the main power module 3 independently supplies power to the VR backlight module, outputting a stable voltage through interface 16 to meet the load requirements of the VR device in normal display scenarios. When the VR device enters a high-load scenario, the AI ​​control board 6 automatically triggers the miniature redundant modules 8 on the magnetic interface seats 7 on both sides of the inner wall of the enclosure 1 through real-time monitoring of the current load data. The miniature redundant modules 8 achieve rapid electrical connection with the AI ​​control board 6 through the spring contacts of the magnetic interface seats 7. The miniature redundant modules 8 are integrated into the power supply circuit within 5ms, cooperating with the main power module 3 to supply power, forming an N+1 redundancy architecture. This avoids power outages caused by single power supply overload and ensures stable and fluctuation-free brightness of the VR backlight module.

[0045] During the control and adjustment process, the temperature sensor 5 fixed below the bracket plate 4 monitors the core temperature of the main power module 3 in real time and transmits the temperature data to the AI ​​control board 6. Simultaneously, the self-diagnostic chip built into the micro-redundant module 8 feeds back parameters such as module voltage ripple and capacitor health to the AI ​​control board 6 via the magnetic interface 7. When the temperature of the main power module 3 exceeds 65℃ or the temperature of the micro-redundant module 8 exceeds 70℃, the AI ​​control board 6 immediately activates the cooling system: on one hand, it controls the operation of the micro liquid cooling pump 11 above the bracket plate 4. The micro liquid cooling pump 11 drives the coolant circulation through the hose 12. The coolant flows out from the micro liquid cooling pump 11 and is delivered to the main power module 3 via the hose 12. The miniature cold head 13 on block 3 absorbs the heat from the chip and then flows back to the heat sink 9 through the hose 12. The heat dissipation holes 10 on the heat sink 9 increase the contact area with the air. Together with the axial fan 17 on the outside of the housing 1, the AI ​​control board 6 synchronously triggers the fan to start. The fan speed increases with the temperature, accelerating the air convection of heat on the surface of the heat sink 9. After the coolant temperature drops below 45°C, it flows back to the miniature liquid cooling pump 11, forming a closed-loop heat dissipation. On the other hand, the small amount of heat generated by the miniature redundant module 8 is conducted to the inner wall of the housing 1 through the magnetic interface seat 7 and is indirectly carried away by the airflow of the heat sink 9, ensuring that the temperature of all high-power components is stable below 70°C and avoiding overheating that leads to performance throttling.

[0046] In the interface adaptation and output stage, the protocol conversion module 15 on the main interface board 14 plays a key role: it has a built-in power supply protocol chip that is compatible with mainstream VR brands, which can automatically identify the model of the connected VR device, convert the power output from the main power supply / micro redundant module 8 into voltage signals and control protocols that meet the requirements of the VR backlight module, and then transmit them to the VR backlight module through the interface 16 of the main interface board 14, realizing a seamless connection between external power supply, internal processing and precise output. If it is necessary to adapt to a new brand of VR device, only the protocol conversion module 15 needs to be replaced, which greatly improves the compatibility of the components and the convenience of later maintenance.

[0047] Throughout the entire operation, the AI ​​control board 6 remains in a core scheduling position. By dynamically adjusting the number of power supply modules, controlling the heat dissipation power in real time, and automatically adapting to external protocols, it achieves coordinated optimization of power supply reliability, energy efficiency ratio, and adaptability. This ensures the stable operation of the VR backlight module in complex scenarios, while also reducing overall energy consumption by activating redundant modules on demand and starting and stopping the heat dissipation system on demand, thus meeting the long battery life and high stability requirements of VR devices.

[0048] Structural Description:

[0049] The enclosure 1 serves as the external protective and load-bearing frame for the entire component, housing all internal components such as the soft pad 2, main power module 3, and bracket plate 4. It provides a closed protective space for the internal components, effectively blocking external dust and moisture from entering, while also playing an electromagnetic shielding role to prevent external electromagnetic interference from affecting the normal operation of the internal components and ensuring the overall operational stability of the component.

[0050] The soft pad 2 is fixedly connected to the bottom of the box 1, and the main power module 3 is fixedly connected to the top, providing support and shock absorption protection for the main power module 3. Through its own elastic deformation, it can absorb the vibration generated when the device is running or moving, preventing the vibration from causing the interface of the main power module 3 to loosen or the internal components to be damaged, ensuring the initial stability of the core power supply components, and reducing the risk of failure caused by vibration.

[0051] The main power module 3 is fixed on the soft pad 2 and located in the bottom area of ​​the cabinet 1. A bracket plate 4 is set on top of it, and a miniature cold head 13 is installed on it. Under normal conditions, it independently supplies power to the VR backlight module and outputs a stable voltage. As the core power supply component, it is located in a relatively stable bottom position inside the cabinet 1. With the shock absorption of the soft pad 2, it can reduce the impact of external factors on the stability of power supply. The space reserved above is convenient for installing the bracket plate 4 and related control components. The setting of the miniature cold head 13 provides a basis for its heat dissipation and ensures stable power supply performance.

[0052] The bracket plate 4 is fixedly connected to the inner wall of the enclosure 1 and is located above the main power module 3. The temperature sensor 5 is fixed on the lower surface and the AI ​​control board 6 is set on the upper surface. The magnetic interface seats 7 on both sides corresponding to the inner wall of the enclosure 1 provide a mounting carrier for the temperature sensor 5 and the AI ​​control board 6 and help fix the relative position of the magnetic interface seats 7. By fixing it to the inner wall of the enclosure 1, a stable middle support structure is formed, and the control components and the bottom power supply components are arranged in layers to avoid space congestion and mutual interference caused by the concentrated stacking of components. At the same time, the reasonable position design makes it easy for the temperature sensor 5 to monitor the temperature of the main power module 3, and also facilitates the signal and power transmission between the AI ​​control board 6 and the miniature redundant modules 8 on both sides.

[0053] Temperature sensor 5 is fixed on the lower surface of bracket plate 4 and faces the main power module 3. It monitors the core temperature of the main power module 3 in real time and transmits the data to AI control board 6. The close-fitting position of the main power module 3 can accurately capture its temperature changes, providing an accurate basis for AI control board 6 to start the heat dissipation system, avoiding overheating of the main power module 3 due to untimely temperature monitoring, ensuring its power supply performance, and preventing performance degradation or damage caused by overheating.

[0054] The AI ​​control board 6 is located on the upper surface of the bracket board 4 and has signal or power connections with the main power module 3, the miniature redundant module 8, the temperature sensor 5, the miniature liquid cooling pump 11, the axial fan 17, and the main interface board 14. As the core of the system control, it is responsible for power distribution, triggering of redundant modules, regulation of the heat dissipation system, and data interaction with the interface board. Located in the core position of the middle layer of the component, it facilitates data transmission and command sending with the components above, below, left, and right. It can quickly respond to feedback information from various components and realize intelligent regulation of the entire process, including power supply, heat dissipation, and interface adaptation, to ensure efficient and stable operation of the component.

[0055] The magnetic interface base 7 is fixedly connected to the inner wall of the housing 1 on both sides of the bracket plate 4. The miniature redundant module 8 is set on it, providing an installation interface and electrical connection channel for the miniature redundant module 8. The magnetic design facilitates the quick installation and removal of the miniature redundant module 8 without complicated tools, saving maintenance time. At the same time, the built-in conductive spring ensures a stable electrical connection between the miniature redundant module 8 and the AI ​​control board 6, ensuring the signal and power transmission efficiency during redundant power supply, and enabling the miniature redundant module 8 to quickly join the power supply circuit within 5ms.

[0056] The miniature redundant module 8 is mounted on the magnetic interface 7 and is electrically connected to the AI ​​control board 6 through the spring contacts of the magnetic interface 7. When the VR device enters a high-load scenario, it works in conjunction with the main power module 3 to form an N+1 redundant architecture. It can be activated as needed and does not work under normal conditions to reduce energy consumption. The magnetic installation facilitates future maintenance and replacement, and the fast response speed can avoid power interruption caused by single power supply overload, ensuring stable brightness of the VR backlight module without fluctuations.

[0057] The heat sink 9 is fixed to the inner wall of the housing 1 above the bracket plate 4. It is provided with heat dissipation holes 10 and connected to the micro liquid cooling pump 11 through the hose 12. It receives the coolant that has absorbed heat delivered by the micro liquid cooling pump 11 and dissipates heat through the heat dissipation holes 10. Located on the upper layer of the components, it forms a reasonable heat dissipation path with the high-power main power module 3 and the micro redundant module 8. The design of the heat dissipation holes 10 increases the contact area with the air, which can dissipate the heat in the coolant more efficiently. Combined with the axial fan 17, it further improves the heat dissipation effect and ensures the effectiveness of coolant circulation and heat dissipation.

[0058] The heat dissipation holes 10 are opened on the heat sink 9 and are reasonably distributed to increase the contact area between the heat sink 9 and the air to accelerate heat dissipation. This can effectively improve the heat dissipation efficiency of the heat sink 9, so that the coolant that has absorbed the heat of the main power module 3 can be quickly cooled to below 45°C when flowing through the heat sink 9. This ensures that the circulating heat dissipation system can continuously and stably remove the heat from the core components and avoid overheating of the components.

[0059] The miniature liquid cooling pump 11 is fixed to the inner wall of the housing 1 on the left side of the heat sink 9. One end is connected to the miniature cold head 13 through a hose 12, and the other end is connected to the heat sink 9 through a hose 12. It drives the coolant to circulate between the miniature cold head 13, the hose 12, and the heat sink 9. Its compact size is suitable for the limited space inside the housing 1. Its power output can ensure the continuous circulation of coolant and ensure that the heat absorbed by the miniature cold head 13 is transferred to the heat sink 9 in time, forming an efficient closed-loop heat dissipation, cooling the high-power components and maintaining their normal operating temperature.

[0060] The two ends of the flexible hose 12 are fixedly connected to the heat sink 9 and the miniature liquid cooling pump 11, respectively, and connect the miniature cold head 13 and the miniature liquid cooling pump 11, serving as a channel for coolant circulation and transporting coolant; it has good flexibility, can adapt to the position layout of various components in the housing 1, flexibly connect the miniature liquid cooling pump 11, the miniature cold head 13 and the heat sink 9, ensuring smooth coolant circulation path, and also has certain high temperature resistance and corrosion resistance, ensuring the reliability and service life of the circulation system;

[0061] The miniature cold head 13 is mounted on the main power module 3 and connected to the miniature liquid cooling pump 11 via a flexible hose 12. It fits closely to the main power module 3 and absorbs the heat generated during its operation, transferring the heat to the flowing coolant. This close-fitting installation method allows for direct and efficient absorption of heat from the core heat-generating components, providing a basis for the coolant to carry away the heat, preventing the main power module 3 from overheating due to heat accumulation, and ensuring its power supply stability and service life.

[0062] The main interface board 14 is located on one side of the enclosure 1, and a protocol conversion module 15 and multiple interfaces 16 are set on it. An axial fan 17 is fixed on the outer side of the enclosure 1. It serves as the core interface carrier for external power supply input, VR backlight module power supply output and protocol conversion. Located on one side of the enclosure 1, it is convenient for external power supply to be connected through the interface 16, and it is also convenient to connect with the VR backlight module to realize power supply output. At the same time, the integrated protocol conversion module 15 simplifies the interface adaptation structure. The corresponding setting of the outer axial fan 17 can assist the main interface board 14 and the nearby heat sink 9 in heat dissipation, ensuring the stable operation of the interface board.

[0063] The protocol conversion module 15 is set on the main interface board 14. It has a built-in power supply protocol chip that is compatible with mainstream VR brands. It automatically identifies the model of the connected VR device and converts the power output from the main power supply / micro redundant module 8 into voltage signals and control protocols that meet the requirements of the VR backlight module. The pluggable design allows the component to be quickly adapted to different brands of VR devices without the need for overall component modification. This greatly improves the compatibility of the component and the convenience of later maintenance, and reduces the cost and cycle of adapting to new devices.

[0064] Interface 16 is set on the main interface board 14. There are multiple interfaces of different types, which realize the access of external power supply and the power and data transmission between the components and the VR backlight module. The setting of multiple interfaces of different types can meet the connection needs of different external devices, improve the versatility of the components, and at the same time, the clear functional partition makes the connection clearer, reduces the risk of wiring errors, and ensures the stability and reliability of power and data transmission.

[0065] The axial fan 17 is fixed on the outside of the main interface board 14 on the cabinet 1, facing the heat sink 9, to accelerate the air convection on the surface of the heat sink 9 to help the heat sink 9 dissipate heat; the position near the heat sink 9 is designed to directly act on the heat sink 9, and quickly remove the heat from the surface of the heat sink 9 by accelerating the air flow, thereby improving the heat dissipation efficiency of the heat sink 9. Together with the liquid cooling system, it ensures that the temperature of the core components is kept below 70°C, avoiding overheating and performance throttling. Moreover, its external installation method does not occupy the internal space of the cabinet 1 and does not affect the layout of the internal components.

[0066] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A redundant power supply assembly for a VR backlight module, comprising a housing (1), characterized in that: A soft pad (2) is fixedly connected to the bottom of the box (1), and a main power module (3) is fixedly connected to the soft pad (2); A support plate (4) is provided above the main power module (3). The support plate (4) is fixedly connected to the inner wall of the box (1). A temperature sensor (5) is fixedly connected to the lower surface of the support plate (4). The temperature sensor (5) is set facing the main power module (3). An AI control board (6) is provided on the upper surface of the support plate (4). Magnetic interface seats (7) are fixedly connected to the inner walls of the box (1) on both sides of the bracket plate (4), and each magnetic interface seat (7) can be detachably equipped with a miniature redundant module (8); A heat dissipation radiator (9) is fixedly connected to the inner wall of the box (1) above the support plate (4). A plurality of heat dissipation holes (10) are opened on the heat dissipation radiator (9). A miniature liquid cooling pump (11) is fixedly connected to the inner wall of the box (1) on the left side of the heat dissipation radiator (9). A flexible hose (12) is fixedly connected to the miniature liquid cooling pump (11). A miniature cold head (13) is provided on the main power module (3). The miniature cold head (13) is connected to the miniature liquid cooling pump (11) through the flexible hose (12). The other end of the flexible hose (12) is fixedly connected to and connected to the heat dissipation radiator (9). A main interface board (14) is provided on one side of the enclosure (1). A protocol conversion module (15) is provided on the main interface board (14). A plurality of interfaces (16) for power supply and data transmission are also provided on the main interface board (14). An axial flow fan (17) is fixedly connected to the outer side of the enclosure (1) corresponding to the main interface board (14).

2. The redundant power supply component for the VR backlight module according to claim 1, characterized in that: The pad (2) is made of elastic rubber and completely covers the bottom projection area of ​​the main power module (3).

3. The redundant power supply component for the VR backlight module according to claim 1, characterized in that: The magnetic interface base (7) is provided with a gold-plated conductive spring. The back of the miniature redundant module (8) is provided with a permanent magnet that is compatible with the magnetic interface base (7). The miniature redundant module (8) is attracted and fixed to the magnetic interface base (7) by the permanent magnet, and is electrically connected to the AI ​​control board (6) by the conductive spring.

4. The redundant power supply component for the VR backlight module according to claim 1, characterized in that: The heat dissipation holes (10) are distributed in a matrix on the heat dissipation vent (9), and the heat dissipation vent (9) is integrally formed from aluminum alloy.

5. The redundant power supply component for the VR backlight module according to claim 1, characterized in that: The hose (12) is a high-temperature resistant silicone tube, and quick-release sealing joints are provided at the connection points of the hose (12) with the micro liquid cooling pump (11), the heat sink (9), and the micro cold head (13).

6. The redundant power supply component for the VR backlight module according to claim 1, characterized in that: The temperature sensor (5) is a high-precision digital thermistor, which is electrically connected to the AI ​​control board (6) via an I2C bus, and the distance between the temperature sensor (5) and the main power module (3) is 1-2 mm.

7. The redundant power supply component for the VR backlight module according to claim 1, characterized in that: The protocol conversion module (15) is connected to the main interface board (14) using a plug-in structure. The protocol conversion module (15) has pre-stored power supply protocol programs for at least two mainstream VR devices.

8. The redundant power supply component for the VR backlight module according to claim 1, characterized in that: The axial fan (17) is directed towards the heat sink (9), and the axial fan (17) is electrically connected to the AI ​​control board (6) via a PWM signal line, which enables speed adjustment.

9. The redundant power supply component for the VR backlight module according to claim 1, characterized in that: The interface (16) includes a USB, a Type-C interface, an HDMI interface and a customized backlight driver interface, and each interface (16) is electrically connected to the AI ​​control board (6) via an FPC cable.

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