A novel structure power module with current detection function

Abstract

The utility model relates to a novel structure power module with current detection function, including shell assembly and install to the PCB board in shell assembly, install current sensor on the PCB board, wherein: current sensor is no magnetic core current sensor, reflow soldering is to the PCB board, is used for detecting current. Shell assembly includes lining, and the chip is welded or sintered on the lining. This power module can realize the current detection function simply under the premise of not changing module appearance size through the installation with the PCB of no magnetic core current sensor.

Description

Technical Field

[0001] This utility model relates to the field of power semiconductor technology, and in particular to a novel structural power module with current detection function. Background Technology

[0002] As a core component of power electronic systems, the packaging technology of power modules directly affects the power density, reliability, and cost of the entire system. Among them, the Economule 3 (ED3) package, a classic three-phase bridge power module, is widely used in medium-to-high power applications such as commercial vehicle main drives, industrial motor drives, photovoltaic inverters, and wind power generation due to its excellent electrical performance and mechanical strength. Inverters built with ED3 modules can efficiently convert DC to AC to drive motors; conversely, they can also be configured as rectifiers to convert AC to DC.

[0003] However, accurate detection of the AC output current is becoming a significant technical challenge within this packaging architecture. Traditional solutions for current monitoring and system protection mainly fall into two categories: one is to install a Hall current sensor externally to the module. While this method is relatively common, the separate sensor not only significantly increases the system's material cost and overall size, but also reduces the system's integration due to additional wiring, magnetic shielding, and mounting structures, contradicting the current trend towards miniaturization and lightweighting of power electronic devices.

[0004] Secondly, the shunt resistor is integrated inside the module. While this improves integration to some extent, high-power shunt resistors are physically large, occupying valuable usable area on the module substrate (DBC). This directly encroaches on the area originally used for mounting IGBTs or SiC / GaN power chips, resulting in a reduction in the module's maximum current carrying capacity and output power density. Simultaneously, the heat generated by the high current may place an additional burden on the module's internal thermal management.

[0005] Therefore, there is an urgent need for a new type of power module with current detection function to solve the above problems. Utility Model Content

[0006] The present invention aims to provide a novel structural power module with current detection function to overcome the shortcomings of the prior art. The technical problem to be solved by the present invention is achieved through the following technical solution.

[0007] According to a first aspect of this application, a novel structural power module with current detection function is provided, comprising a housing assembly and a PCB board mounted in the housing assembly, wherein a current sensor is mounted on the PCB board, wherein: The current sensor is a coreless current sensor, which is reflow soldered onto the PCB board for detecting current. The housing assembly includes a liner on which chips are welded or sintered.

[0008] Preferably, the current sensor is mounted on the front side of the PCB board, and a signal pin is arranged on the back side of the PCB board, with the signal pin protruding from the housing assembly for outputting a signal.

[0009] Preferably, the liner comprises two pieces, and the power circuit and signal circuit are connected by a binding wire.

[0010] Preferably, the housing assembly includes a base plate, a liner, a housing, and a top cover. The housing is an intermediate frame that forms an installation space with the base plate and the top cover. The liner is welded to the base plate. The current sensor and the PCB board are mounted on the housing and located in the installation space.

[0011] Preferably, a power terminal is provided at one end of the housing, and the current sensor is installed at the end of the mounting space near the power terminal.

[0012] Preferably, the installation space is filled with potting compound.

[0013] Preferably, the binding wire is a copper wire or an aluminum wire.

[0014] According to one embodiment of this application, the novel power module with current detection function has the following advantages: 1. It uses a coreless current sensor to directly detect the magnetic field of the conductor, with no saturation limit, and supports ultra-high current measurement (up to thousands of amperes). 2. Ultra-thin and compact: Eliminating the bulky magnetic core reduces the volume by more than 50%; 3. Lossless measurement: It does not interfere with the main current path and has no I²R loss problem of Shunt; 4. The chip has a built-in magnetic field shielding layer to reduce crosstalk from nearby wires; 5. Coreless current sensors can be soldered onto PCBs, and the PCBs can be integrated into the housing, eliminating the need to occupy valuable substrate space while achieving the purpose of measuring current values. Attached Figure Description

[0015] Figure 1 This is a structural schematic diagram of the novel power module with current detection function of this application; Figure 2 yes Figure 1 Schematic diagram of the structure of the medium current sensor; Figure 3 yes Figure 2A schematic diagram showing the installation position of the medium current sensor in the housing. Detailed Implementation

[0016] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0017] It should be noted that the above detailed descriptions are exemplary and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0018] like Figures 1 to 3 As shown, a novel power module with current detection function in one embodiment of this application achieves current detection function simply by mounting a PCB with a coreless current sensor without changing the module's external dimensions. Finally, the current signal is transmitted to the outside via signal pins on the PCB. The specific structure is as follows: The assembly includes a housing assembly and a PCB board 200 mounted therein, wherein a current sensor 210 is mounted on the PCB board 200, wherein: The housing assembly includes a base plate 120, a liner plate 130, a housing 100, and a top cover 110. The housing 100 is an intermediate frame that forms an installation space with the base plate 120 and the top cover 110. The PCB board 200 and the current sensor 210 are installed in the installation space and fixed to the inside of the housing 100. The installation space is filled with potting compound.

[0019] The chip 131 is a power chip 131, and several of them are soldered to the substrate 130. The substrate 130 includes two pieces, and the power circuit and signal circuit are connected by a bonding wire 132, which is a copper wire or an aluminum wire.

[0020] The current sensor 210 is a coreless current sensor that is reflow soldered onto the PCB board 200 for detecting current.

[0021] In this embodiment, the current sensor 210 is mounted on the front side of the PCB board 200, and a signal pin 220 is arranged on the back side of the PCB board 200. The signal pin 220 is exposed on the housing assembly for outputting signals.

[0022] A power terminal 101 is provided at one end of the housing 100, and the current sensor 210 is installed at one end of the installation space near the power terminal 101.

[0023] The manufacturing steps for the novel power module with current detection function described above are as follows: Step 1. Chip connection to the substrate: Apply solder paste, sintered silver, sintered copper, and TLPs diffusion solder to the substrate. The process includes soldering, silver sintering, copper sintering, and TLPs diffusion soldering. This achieves the connection between the chip and the substrate. Step 2. PCB fabrication: A coreless current sensor is placed on the front side of the PCB, and 6 signal pins are placed on the back side, which are connected by reflow soldering. Step 3. Housing Preparation: Using an injection-molded housing, place the PCBA current sensor face down into the opening of the housing's AC copper busbar. Simultaneously, two posts on the housing pass through two holes on the PCBA board. Use a hot-melt method to melt the protruding portions of the posts onto the PCBA board, forming mushroom heads, and then fix the PCBA board to the housing. Step 4. Welding the lining plates to the base plate: The two lining plates are connected to the base plate by welding; Step 5. Wire bonding: Bonding wires are applied to the backing plate using ultrasonic welding. This completes the connection of the power circuit and signal circuit. Step 6. Ultrasonic welding of power terminals: The power terminals are connected to the backing plate by ultrasonic welding. This establishes the connection between the power circuit and the external environment.

[0024] Step 7. Pour in the potting compound and put on the top cover to complete the process.

[0025] The coreless current sensor used in this application employs anisotropic magnetoresistive (AMR) technology and has the following advantages: 1. No risk of magnetic core saturation: Traditional closed-loop Hall effect sensors rely on magnetic core magnetization, which can easily lead to core saturation (e.g., ferrite cores have a saturation magnetic field of approximately 0.3T) under high current (e.g., >200A) or DC components. Infineon's solution directly detects the magnetic field of a conductor, has no saturation limitations, and supports ultra-high current measurements (up to several thousand amperes). 2. Ultra-thin and compact: Eliminating the bulky magnetic core reduces the volume by more than 50%; 3. Lossless measurement: It does not interfere with the main current path and has no I²R loss problem of Shunt; 4. Integrated shielding technology: The chip has a built-in magnetic field shielding layer to reduce crosstalk between adjacent wires; 5. Coreless current sensors can be soldered onto a PCB, which can then be integrated into the housing, eliminating the need for valuable substrate space while still achieving current measurement. The signal output is obtained via a signal pin soldered to the PCB.

[0026] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0027] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0028] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.

[0029] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, such as rotated 90 degrees or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0030] In the detailed description above, reference has been made to the accompanying drawings, which form part of this document. In the drawings, similar symbols typically identify similar parts unless the context otherwise indicates otherwise. The illustrated embodiments described in the detailed specification, drawings, and claims are not intended to be limiting. Other embodiments may be used and other changes may be made without departing from the spirit or scope of the subject matter presented herein.

[0031] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A novel structural power module with current detection function, characterized in that, Includes a housing assembly and a PCB board mounted in the housing assembly, wherein a current sensor is mounted on the PCB board, wherein: The current sensor is a coreless current sensor, which is reflow soldered onto the PCB board for detecting current. The housing assembly includes a liner on which chips are welded or sintered.

2. The novel structural power module with current detection function according to claim 1, characterized in that, The current sensor is mounted on the front side of the PCB board, and a signal pin is arranged on the back side of the PCB board. The signal pin protrudes from the housing assembly for outputting signals.

3. The novel power module with current detection function according to claim 1, characterized in that, The liner consists of two pieces, and the power circuit and signal circuit are connected by a binding wire.

4. The novel power module with current detection function according to claim 1, characterized in that, The housing assembly includes a base plate, a liner, a housing, and a top cover. The housing is an intermediate frame that forms an installation space with the base plate and the top cover. The liner is welded to the base plate. The current sensor and the PCB board are mounted on the housing and located in the installation space.

5. The novel structural power module with current detection function according to claim 4, characterized in that, The housing is provided with a power terminal at one end, and the current sensor is installed in the mounting space near the power terminal.

6. The novel structural power module with current detection function according to claim 4, characterized in that, The installation space is filled with potting compound.

7. The novel structural power module with current detection function according to claim 3, characterized in that, The binding wire is made of copper or aluminum.

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