Gate drive board, three-level drive power component and frequency converter of driving power module

Abstract

The utility model discloses a gate pole drive board of drive power module, three level drive power assembly and frequency converter, wherein the gate pole drive board of drive power module includes bottom plate and at least one side plate set up on the bottom plate, and the bottom plate includes at least two peripheral circuits, and the side plate includes at least two digital control circuits, and the peripheral circuit and digital control circuit are electrically connected one to one, and form at least two gate pole drive circuits. The gate pole drive board of drive power module meets the application scene under low power, and the board design makes full use of the space, so that the gate pole drive board realizes the drive of the gate pole drive board of drive power module under the relatively small size, and the power density of the frequency converter core is increased to a certain extent. The three level drive power assembly based on the gate pole drive board not only guarantees the reliable application of three level topology, but also realizes the high power density assembly and the assembly fool-proof function of the frequency converter core, and reduces the assembly difficulty of the three level drive power assembly.

Description

Technical Field

[0001] This utility model relates to the field of frequency conversion technology, and in particular to a gate drive board for a drive power module, a three-level drive power component, and a frequency converter. Background Technology

[0002] A frequency converter is a power electronic device that can convert electrical energy into frequency and regulate its voltage. By controlling the switching of power semiconductor devices, it converts AC power of fixed frequency and voltage into electrical energy with flexibly adjustable frequency and voltage, thus precisely adapting to the operating requirements of different loads. Currently, most mining frequency converters (e.g., 3300V) adopt the I-NPC topology, which includes IGBT modules. Commonly used commercial IGBT modules are high-current modules, suitable for high-power applications but wasteful for low-power applications. Infineon's XHP packaged power modules (e.g., IGBT modules) can meet the needs of low-power field applications, but currently there are no dedicated gate driver boards on the market for driving XHP packaged power modules.

[0003] Meanwhile, since power modules are usually small in size, in order to ensure the reliable use of power modules in the I-NPC topology, the gate driver board must be set with a sufficiently large safety distance while keeping the driver board size as small as possible. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a gate drive board for driving power modules, a three-level drive power component and a frequency converter, to solve the problems that the size of the gate drive board on the market cannot meet the installation requirements of the power module, and that there is no gate drive board for power modules specifically designed for driving power modules.

[0005] The first aspect of this application provides a gate drive board for a driving power module, including a base plate and at least one side plate disposed on the base plate. The base plate includes at least two peripheral circuits, and the side plate includes at least two digital control circuits. The peripheral circuits and the digital control circuits are electrically connected one-to-one to form at least two gate drive circuits.

[0006] In some embodiments of this application, the number of side plates is one, the base plate includes two peripheral circuits, the side plate includes two digital control circuits, and the two digital control circuits are respectively disposed on both sides of the side plate.

[0007] In some embodiments of this application, the base plate includes two peripheral circuits, the side plate includes two digital control circuits, and the side plate includes two sub-boards, with the two digital control circuits respectively disposed on the two sub-boards.

[0008] In some embodiments of this application, the base plate is provided with multiple connector mounting areas, some or all of which are provided with fiber optic connectors, and the connector mounting areas without fiber optic connectors are hollowed out. The fiber optic connectors are electrically connected to the peripheral circuits on the base plate in a one-to-one correspondence.

[0009] In some embodiments of this application, the peripheral circuit includes a detection subunit, an active clamping subunit, a signal processing subunit, and a drive amplification subunit, all electrically connected to the digital control circuit. The detection subunit is used to detect the voltage between two preset electrodes of the power switching device in the power module. The active clamping subunit is used to suppress voltage spikes during the switching process of the power switching device in the power module. The signal processing subunit is used to process the signal between the fiber optic connector and the digital control circuit to realize signal transmission between the fiber optic connector and the digital control circuit. The drive amplification subunit is used to amplify the control signal output by the digital control circuit.

[0010] In some embodiments of this application, the base plate further includes a board-level connector, and the side plate is fixed to the board-level connector in a pluggable manner.

[0011] A second aspect of this application provides a three-level drive power component, including three star-connected single-phase bridge arms. Each single-phase bridge arm includes three electrically connected power module groups. Each power module group includes a gate drive board and a power module fixedly electrically connected to the gate drive board. The gate drive board is the gate drive board of the drive power module described above.

[0012] In some embodiments of this application, the power module includes IGBTs, each IGBT employing an IGBT module including an upper IGBT and a lower IGBT package. The emitter of the upper IGBT is connected to the collector of the lower IGBT. The gate driver board includes an upper gate driver circuit for driving the upper IGBT in the IGBT module and a lower gate driver circuit for driving the lower IGBT in the IGBT module.

[0013] In some embodiments of this application, the bottom plate of the gate drive board of the power module group includes an upper connector setting area corresponding to the upper bridge gate drive circuit and a lower connector setting area corresponding to the lower bridge gate drive circuit, and the three power module groups are arranged in a triangular pattern. In the power module group located in the lower left corner, an optical fiber connector is provided in the upper connector setting area of ​​the bottom plate of the gate driver board, and the lower connector setting area of ​​the bottom plate of the gate driver board is hollowed out. The optical fiber connector is electrically connected to the upper bridge gate driver circuit of the gate driver board. In the power module group located at the lower right, the lower connector setting area of ​​the bottom plate of the gate driver board is provided with an optical fiber connector, and the upper connector setting area of ​​the bottom plate of the gate driver board is hollowed out. The optical fiber connector is electrically connected to the lower bridge gate driver circuit of the gate driver board. In the power module group located above, fiber optic connectors are provided in both the upper connector setting area and the lower connector setting area of ​​the bottom plate of its gate driver board. The fiber optic connectors in the upper connector setting area are electrically connected to the upper bridge gate driver circuit, and the fiber optic connectors in the lower connector setting area are electrically connected to the lower bridge gate driver circuit.

[0014] A third aspect of this application provides a frequency converter including a three-level drive power component as described above.

[0015] Compared with the prior art, one or more embodiments of the above solutions may have the following advantages or beneficial effects: The gate drive board for the power module provided in this embodiment of the invention drives multiple power components within the power module by designing multiple gate drive circuits. It can also serve as a dedicated gate drive board for the power module, enabling its application in low-power scenarios. By distributing the gate drive circuits across at least two boards through a split-board design, space is fully utilized, allowing the gate drive board to drive the power module within a relatively small size. By incorporating fiber optic connectors in some or all connector areas within the gate drive circuit, gate drive boards meeting various driving requirements can be obtained. This also reduces the size of power components using this type of gate drive board, increasing the power density of the application device's chassis to some extent. The three-level drive power component using the gate drive board for the power module ensures reliable application of the three-level topology while enabling high-power-density assembly of the inverter chassis and providing error-proofing during assembly, thus reducing the assembly difficulty of the three-level drive power component.

[0016] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention may be realized and obtained by means of the structures particularly pointed out in the description, claims, and drawings. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used in conjunction with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 The diagram shown is a structural schematic of the gate drive board of the drive power module described in an embodiment of this application.

[0018] Figure 2 The diagram shown is a schematic of a gate driver board for a drive power module described in an embodiment of this application, which includes two digital control circuits.

[0019] Figure 3 The diagram shown is another structural schematic of the gate driver board of the drive power module described in this application embodiment, which includes two digital control circuits.

[0020] Figure 4 The diagram shown is a structural schematic of the gate drive board of the drive power module described in an embodiment of this application.

[0021] Figure 5 The diagram shown is a structural schematic of the three-level drive power component described in an embodiment of this application.

[0022] Figure 6 The diagram shown is a structural schematic of the power module component in the three-level drive power component described in this application embodiment.

[0023] Figure 7 The diagram shown is a schematic representation of the topology of the three-level drive power component described in the embodiments of this application.

[0024] Figure 8 The diagram shown is a schematic of a single-phase topology in a three-level drive power component according to an embodiment of this application.

[0025] Specific element symbol explanations: 100-Base plate, 101-Detection subunit, 102-Active clamping subunit, 103-Signal processing subunit, 104-Drive amplification subunit, 105-Power input terminal, 106-Fiber optic connector, 107-IGBT gate interface, 108-Connector setting area, 200-Side plate, 201-Digital control circuit, 202-Sub-board, 300-Peripheral circuit, 400-Gate drive circuit, 500-Power module group. Detailed Implementation

[0026] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0027] It should be noted that when a component is referred to as being "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0029] Variable frequency drives (VFDs) can be applied to various fields such as industrial production, mining, rail transportation, and new energy power generation. In particular, in mining machinery and equipment, VFDs of medium and high voltage levels such as 3300V provide key power control support for the efficient operation of core equipment such as scraper conveyors and hoists, directly affecting the production efficiency and operational safety of mining operations.

[0030] In the current development of frequency converter technology, power density, as a core indicator for measuring equipment integration and space utilization, is increasingly in demand for improvement. However, the power module and gate driver board designs used in existing medium and high voltage frequency converters (such as 3300V mining frequency converters) have significant limitations in terms of adaptability and space optimization. On the one hand, commonly used commercial IGBT (Insulated Gate Bipolar Transistor) modules are mostly high-current specifications, which can meet the needs of high-power scenarios, but in low-power applications, they are prone to device performance redundancy and cost waste. Infineon's XHP packaged modules can meet the field applications under low power conditions, but there is currently no corresponding gate driver board. On the other hand, as a key component for controlling the switching of IGBTs, the circuit layout of the gate driver board must simultaneously meet the high-voltage safety distance requirements and the module installation space limitations. The assembly and combination of traditional driver boards and IGBT modules often occupy a large amount of core space, making it difficult to flexibly adjust the space occupation according to actual application needs, thus restricting the improvement of frequency converter power density and failing to fully adapt to application scenarios such as mines where there are strict limitations on equipment size and installation space.

[0031] Based on this, this application improves the gate drive board, three-level drive power component and frequency converter of the drive power module in the related technology.

[0032] refer to Figure 1As shown, the gate drive board of the drive power module in this embodiment includes a base plate 100 and at least one side plate 200. The side plate 200 is fixed to the base plate 100 via a board-level connector. Specifically, the board-level connector can be configured as a pin header and a female header, in which case the side plate 200 is vertically fixed to the base plate 100 via a pluggable connection. Alternatively, the side plate 200 can also be fixed to the base plate 100 via other types of board-level connectors; this application does not impose any limitations on this method.

[0033] The base plate 100 includes at least two peripheral circuits 300, and the side plate 200 includes at least two digital control circuits 201. The peripheral circuits 300 and digital control circuits 201 are electrically connected in a one-to-one correspondence. A set of electrically connected peripheral circuits 300 and digital control circuits 201 forms a gate drive circuit 400, which drives a power element in the power module. Therefore, multiple peripheral circuits 300 and multiple digital control circuits 201 form multiple gate drive circuits 400 on the gate drive board.

[0034] In this embodiment, the driving circuit is distributed on the base plate and the side plate. The stacked structure of the base plate and the side plate transfers the driving circuit, which originally needed to be spread on the plane, to a vertical distribution. Without affecting the normal driving function of the driving circuit, the planar size of the gate driver board is significantly compressed, making the overall structure of the device module using this type of gate driver board more compact, thereby achieving the effect of reducing space and increasing the power density of the mechanism.

[0035] In one embodiment, reference is made to Figure 2 As shown, the number of side plates 200 can be set to one. The base plate 100 is provided with two peripheral circuits 300, and the side plate 200 includes two digital control circuits 201. In this case, the two digital control circuits 201 can be respectively set on the two sides of the side plate 200. The two peripheral circuits 300 and the two digital control circuits 201 are connected one by one to form two gate drive circuits 400. Further, the digital control circuits 201 and the peripheral circuits 300 are connected through board-level connectors or other electrical connection devices. One application of the gate drive board of this embodiment for driving the power module is to drive an XHP packaged IGBT module. Since the XHP packaged IGBT module is a half-bridge structure, that is, it only contains the IGBTs of the upper and lower bridge arms, the two gate drive circuits 400 can drive the IGBTs of the upper and lower bridge arms in the XHP packaged IGBT module respectively.

[0036] In one embodiment, reference is made to Figure 3As shown, the side plate 200 may include two sub-boards 202, the base plate 100 includes two peripheral circuits 300, and the side plate 200 includes two digital control circuits 201. The two digital control circuits 201 are respectively disposed on the two sub-boards 202. The two peripheral circuits 300 and the two digital control circuits 201 are connected one-to-one to form two gate drive circuits 400. Further, the digital control circuits 201 and the peripheral circuits 300 are connected through board-level connectors or other electrical connection devices. One application of the gate drive board of this embodiment for driving the power module is to drive an XHP packaged IGBT module. Since the XHP packaged IGBT module is a half-bridge structure, that is, it only contains the upper and lower bridge arms of the IGBT, the two gate drive circuits 400 can drive the upper and lower bridge arms of the IGBT in the XHP packaged IGBT module respectively.

[0037] The above embodiment achieves precise driving of a power module containing two power switching devices through the design of two independent gate drive circuits 400. For example, it can accurately drive the upper and lower bridge arm IGBTs in an XHP packaged IGBT module, meeting its field application requirements in low-power scenarios. Simultaneously, the split-board design separates the drive circuit onto two boards. This arrangement not only efficiently utilizes installation space, allowing the drive board to complete the power module driving function within a small size constraint, but also improves the power density of the inverter chassis to a certain extent when used in an inverter.

[0038] Furthermore, the digital control circuit 201 includes a digital driver chip and peripheral auxiliary circuits for the digital driver chip. A CPLD can be used as the digital driver chip, ensuring the power module driving function and fault protection function while also realizing data acquisition and communication, meeting the development trend of the big data era. The peripheral auxiliary circuits of the digital driver chip include clock generation circuits and signal conditioning circuits. The digital driver chip can also be configured as an FPGA to provide data processing, communication, and fault detection functions during the power module driving process. The digital control circuit 201 may also include a memory to realize data storage or data uploading functions, meeting the future development trend of the big data era.

[0039] refer to Figure 4As shown, the peripheral circuit 300 specifically includes a detection subunit 101, an active clamping subunit 102, a signal processing subunit 103, and a drive amplification subunit 104, all connected to the digital control circuit 201. The detection subunit 101 detects the voltage between two preset electrodes of the power switching device within the power module; for example, when the power module is an XHP packaged IGBT module, the detection subunit 101 detects the voltage across the collector C and emitter E of the IGBT device in the IGBT module. The active clamping subunit 102 suppresses voltage spikes during the switching process of the power switching device in the power module. The signal processing subunit 103 processes the signal between the fiber optic connector 106 and the digital control circuit 201, enabling signal transmission between them. The gate drive circuit 400 also includes an IGBT gate interface mounted on the base plate. The drive amplification subunit 104 is connected to the IGBT gate interface and is used to amplify the control signal output by the digital control circuit 201 and output it to the IGBT gate interface so that its output meets the electrical signal required for the switching control of the power devices in the power module. Meanwhile, the peripheral circuit 300 may also include other functional subunits, which are not subject to any fixed limitations here.

[0040] refer to Figure 4 As shown, the gate drive circuit 400 also includes a power input terminal 105 disposed on the base plate 100. The power input terminal 105 is connected to the signal processing subunit 103 and the digital control circuit 201 respectively. The external low-voltage power supply provides the working voltage to the signal processing subunit 103 and the digital control circuit 201 through this port.

[0041] The base plate 100 includes multiple connector mounting areas 108, each corresponding one-to-one with a peripheral circuit 300. The connector mounting areas 108 are used to mount fiber optic connectors 106. Specifically, in this embodiment, fiber optic connectors 106 can be mounted in some or all of the connector mounting areas 108. Connector mounting areas 108 without fiber optic connectors 106 are in a hollow state (i.e., no devices are mounted there). The mounted fiber optic connectors 106 and the peripheral circuits 300 on the base plate 100 are electrically connected in a one-to-one correspondence. Since the gate drive board is connected to the external control system via fiber optic connectors 106, and the external control system transmits switching signals to the gate drive board through the fiber optic connectors 106 to control the opening and closing of the switching elements, if no fiber optic connector 106 is mounted in a connector mounting area 108, it means that the power devices in the corresponding drive power module cannot operate.

[0042] The connector area 108 on the base plate is cut out. On the one hand, this reduces the area occupied by interfaces and devices on the edge of the board by removing invalid fiber optic connectors, allowing adjacent driver boards to be arranged more closely, thereby shortening the module spacing, reducing the overall lateral size of the core, and achieving high density and compactness of the structure. On the other hand, if a driver board is mistakenly installed in the wrong position during assembly, the fiber optic connector corresponding to the cut-out area cannot mate with the adjacent module and will physically interfere with the adjacent board devices, thus preventing incorrect installation and forming a natural error-proof constraint mechanism, effectively improving the reliability and consistency of assembly.

[0043] In one embodiment, when the power module is a power module type containing two power devices, the provision of fiber optic connectors 106 in some or all of the connector setting areas 108 indicates that this embodiment can provide three types of gate driver boards. For example, a gate driver board that provides fiber optic connectors 106 only in the first connector setting area 108 of the base plate 100 so that the gate driver board can only drive the first power device in the power module; a gate driver board that provides fiber optic connectors 106 only in the second connector setting area 108 of the base plate 100 so that the gate driver board can only drive the second power device in the power module; and a gate driver board that provides fiber optic connectors 106 in both connector setting areas 108 of the base plate 100 so that the gate driver board can drive both power devices in the power module. For example, when the power module is an XHP packaged IGBT module, embodiments of this application can provide gate driver board types including gate driver boards that drive only the upper IGBT in the IGBT module, gate driver boards that drive only the lower IGBT in the IGBT module, and gate driver boards that drive both the upper and lower IGBTs in the IGBT module. When constructing a three-level driven power component or other reasonable components, the operator can select the appropriate type of gate driver board based on the actual situation.

[0044] The gate driver board of the power module in this application embodiment drives the power module by designing multiple sets of gate driver circuits 400 to meet the field application requirements in low-power scenarios. The split-board design divides the gate driver circuits 400 into two sub-boards, efficiently utilizing installation space and allowing the driver board to complete the power module driving function under small size constraints. By flexibly configuring fiber optic connectors 106 in the gate driver circuits 400, various types of gate driver boards can be formed to adapt to different driving scenario requirements. The gate driver board of the aforementioned power module ensures reliable application in I-NPC topologies. For example, the gate driver board of the power module designed in this application can be applied to a 3300V three-level mining frequency converter, and can also be used with other suitable devices.

[0045] To better implement the gate driver board of the drive power module in any of the above embodiments, this application embodiment also provides a three-level drive power component based on the gate driver board of the drive power module described above. (Reference) Figure 5 As shown, the three-level drive power component includes three star-connected single-phase bridge arms. The three single-phase bridge arms have identical structures, and each single-phase bridge arm includes three electrically connected power module groups 500. The connection of the three single-phase bridge arms constitutes the three-level drive power component. For example, when the IGBTs in the power module group 500 are all XHP packaged IGBT modules, the star connection of the three single-phase bridge arms forms an I-NPC topology.

[0046] The following description uses I-NPC as an example to illustrate a three-level drive power component. In this case, power module group 500 is an IGBT module group. Each IGBT module group includes a power module and a gate driver board mounted on the power module for driving it. The gate driver board is used to drive the IGBTs on the power module. The gate driver board is the same as the gate driver board used in any of the above embodiments for driving the power module.

[0047] Furthermore, each power module includes an IGBT, and each IGBT adopts an IGBT module including an upper bridge arm IGBT and a lower bridge arm IGBT package. That is, each IGBT is an IGBT module using an XHP package, and each XHP packaged IGBT module includes an upper bridge arm IGBT and a lower bridge arm IGBT. The emitter of the upper bridge arm IGBT is connected to the collector of the lower bridge arm IGBT. The gate driver board includes an upper bridge gate drive circuit 400 for driving the upper bridge arm IGBT in the IGBT module and a lower bridge gate drive circuit 400 for driving the lower bridge arm IGBT in the IGBT module.

[0048] refer to Figure 7 and Figure 8As shown, each phase (i.e., a single-phase bridge arm) in the I-NPC topology includes four IGBTs (T1, T2, T3, and T4) and two diodes (D1 and D2). IGBT-T1 and diode-D1 can be housed in one power module M1, diode-D2 and IGBT-T4 in one power module M2, and IGBT-T2 and IGBT-T3 in one power module M3. Assuming that power modules M1 and M2 are external IGBT modules, and power module M3 is an internal IGBT module, and that each IGBT is an XHP packaged IGBT module (i.e., IGBT-T1, IGBT-T2, IGBT-T3, and IGBT-T4 are all XHP packaged IGBTs),... Each packaged IGBT module includes an upper IGBT and a lower IGBT (i.e., IGBT-T1 is an IGBT module with one upper IGBT and one lower IGBT, IGBT-T2 is an IGBT module with one upper IGBT and one lower IGBT, IGBT-T3 is an IGBT module with one upper IGBT and one lower IGBT, and IGBT-T4 is an IGBT module with one upper IGBT and one lower IGBT). Therefore, when the power module uses a gate drive board to drive the power module, one IGBT in each external transistor module in the I-NPC topology will not work. Specifically, the lower IGBT in power module M1 will not work, and the upper IGBT in power module M2 will not work.

[0049] Based on this, refer to Figure 6As shown, to achieve the I-NPC topology function, the three power module groups need to be configured differently. For example, the gate driver board base plate 100 of the power module group 500 includes an upper connector setting area 108 corresponding to the upper bridge gate driver circuit 400 and a lower connector setting area 108 corresponding to the lower bridge gate driver circuit 400. When the three power modules are arranged in a triangular pattern, the three power module groups can meet the following settings: In the power module group 500 located in the lower left corner, the upper connector setting area 108 of its gate driver board base plate 100 is equipped with a fiber optic connector 106, and the lower connector setting area 108 of its gate driver board base plate 100 is hollowed out. The fiber optic connector 106 in this power module group 500 is electrically connected to the upper bridge gate driver circuit 400 of the gate driver board, so that this power module group only drives the upper bridge arm IGBT in the IGBT module. In the power module group 500 located in the lower right corner, the lower connector setting area 108 of the gate driver board's base plate 100 is provided with an optical fiber connector 106, while the upper connector setting area 108 of the gate driver board's base plate 100 is hollowed out. The optical fiber connector 106 in this power module group 500 is electrically connected to the lower bridge gate driver circuit 400 of the gate driver board, so that only the lower bridge arm IGBT in the IGBT module is driven in this power module group. In the power module group 500 located in the upper corner, both the upper connector setting area 108 and the lower connector setting area 108 of the gate driver board's base plate 100 are provided with optical fiber connectors 106. The optical fiber connector 106 in the upper connector setting area 108 is electrically connected to the upper bridge gate driver circuit 400, and the optical fiber connector 106 in the lower connector setting area 108 is electrically connected to the lower bridge gate driver circuit 400, so that both the upper bridge arm IGBT and the lower bridge arm IGBT in the IGBT module are driven in this power module group.

[0050] Furthermore, when the gate driver boards of three power modules in the three power module groups adopt Figure 7 and Figure 8 In the context of power modules M1, M2, and M3, where the gate driver board installed on power module M1 is B1, on power module M2 is B2, and on power module M3 is B3, it follows that: since D1 in power module M1 only functions as a diode, and the lower-bridge IGBT in power module M1 does not need to operate, the fiber optic connector 106 controlling it on gate driver board B1 is also unnecessary. Figure 6 The fiber optic connector 106 at position OP5 is no longer needed; it can be cut out on the gate driver board B1. Similarly, since D2 in power module M2 only functions as a diode, and the upper-bridge IGBT in power module M2 does not need to operate, the fiber optic connector 106 controlling it on the gate driver board B2 is also unnecessary. Figure 6The fiber optic connector 106 at position OP6 is no longer needed; it can be cut out on the gate driver board B1. Since both IGBTs in the power module M3 need to operate, the fiber optic connectors 106 on the gate driver board B3 need to be soldered.

[0051] This results in three gate driver board specifications. Gate driver board B1 has a cutout at position OP5, gate driver board B2 has a cutout at position OP6, and gate driver board B3 is not cutout. Cutting out positions OP5 and OP6 reduces the distance between power modules M1 and M2, thus reducing the overall size of the chassis. Furthermore, using different specifications of gate driver boards reduces the likelihood of incorrect installation. For example, if gate driver board B3 is installed in position B1, the fiber optic connector 106 at position OP5 will interfere with components on the right-hand gate driver board B2 and cannot connect the fiber optic head. Conversely, if gate driver board B3 is installed in position B2, the fiber optic connector 106 at position OP6 will interfere with components on the left-hand gate driver board B1 and cannot connect the fiber optic head. This gate driver board assembly method provides a foolproof design and reduces assembly difficulty. Furthermore, the gate driver boards in the three IGBT module groups have different materials, and the gate driver board structures in the three power module groups are also different. This setting ensures that there will be no errors when installing the gate driver board on the gate driver board of the power module.

[0052] Final Reference Figure 8 As shown, the three power modules in the three power module groups are connected as follows: Power module M1, which operates only with the upper IGBT, and power module M2, which operates only with the lower IGBT, are connected in series between the positive and negative levels of the DC bus. The input terminal of power module M1, which operates only with the upper IGBT, is connected to the positive level of the DC bus, and the output terminal of power module M2, which operates only with the lower IGBT, is connected to the negative level of the DC bus. Power module M3, which operates with both the upper and lower IGBTs, has its input terminal connected to the AC output terminal of power module M1, which operates only with the upper IGBT. The output terminal of power module M3, which operates with both the upper and lower IGBTs, is connected to the AC output terminal of power module M2, which operates only with the lower IGBT. The output terminal of power module M1, which operates only with the upper IGBT, is connected to the neutral level of the DC bus. This connection method forms the single-phase topology in the I-NPC topology.

[0053] In this application embodiment, the above-described gate drive board can also be combined with other types of power modules to form other types of power module groups, and no fixed limitation is imposed on it here.

[0054] The three-level drive power component of this application embodiment can be applied to frequency converters. While ensuring the reliable application of the three-level topology, it also realizes high power density assembly of the frequency converter core and assembly error prevention function, reducing assembly difficulty.

[0055] To better implement the three-level drive power component in any of the above embodiments, this application also provides a frequency converter based on the three-level drive power component described above. The frequency converter includes the three-level drive power component as described above.

[0056] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0057] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0058] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0059] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the utility model, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0060] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A gate driver board for a power driving module, characterized in that, It includes a base plate and at least one side plate disposed on the base plate. The base plate includes at least two peripheral circuits, and the side plate includes at least two digital control circuits. The peripheral circuits and the digital control circuits are electrically connected in a one-to-one correspondence to form at least two gate drive circuits.

2. The gate driver board of the drive power module according to claim 1, characterized in that, The number of side plates is one, the base plate includes two peripheral circuits, the side plate includes two digital control circuits, and the two digital control circuits are respectively disposed on both sides of the side plate.

3. The gate driver board of the drive power module according to claim 1, characterized in that, The base plate includes two peripheral circuits, the side plate includes two digital control circuits, and the side plate includes two sub-boards, with the two digital control circuits respectively disposed on the two sub-boards.

4. The gate driver board of the drive power module according to claim 1, characterized in that, The base plate is provided with multiple connector mounting areas. Some or all of the connector mounting areas are provided with fiber optic connectors. The connector mounting areas without fiber optic connectors are hollowed out. The fiber optic connectors are electrically connected to the peripheral circuits on the base plate one by one.

5. The gate driver board of the drive power module according to claim 4, characterized in that, The peripheral circuit includes a detection subunit, an active clamping subunit, a signal processing subunit, and a drive amplification subunit, all electrically connected to the digital control circuit. The detection subunit is used to detect the voltage between two preset electrodes of the power switching device in the power module. The active clamping subunit is used to suppress voltage spikes during the switching process of the power switching device in the power module. The signal processing subunit is used to process the signal between the fiber optic connector and the digital control circuit to realize signal transmission between the fiber optic connector and the digital control circuit. The drive amplification subunit is used to amplify the control signal output by the digital control circuit.

6. The gate driver board of the drive power module according to claim 1, characterized in that, The base plate also includes a board-level connector, and the side plate is fixed to the board-level connector in a pluggable manner.

7. A three-level drive power component, characterized in that, The device includes three star-connected single-phase bridge arms, each single-phase bridge arm comprising three electrically connected power module groups. Each power module group includes a gate drive board and power modules fixedly electrically connected to the gate drive board. The gate drive board is the gate drive board for driving power modules as described in any one of claims 1-6.

8. The three-level drive power component according to claim 7, characterized in that, The power module includes IGBTs, each IGBT employing an IGBT module comprising an upper IGBT and a lower IGBT package. The emitter of the upper IGBT is connected to the collector of the lower IGBT. The gate driver board includes an upper gate drive circuit for driving the upper IGBT in the IGBT module and a lower gate drive circuit for driving the lower IGBT in the IGBT module.

9. The three-level drive power component according to claim 8, characterized in that, The bottom plate of the gate drive board of the power module group includes an upper connector setting area corresponding to the upper bridge gate drive circuit and a lower connector setting area corresponding to the lower bridge gate drive circuit, and the three power module groups are arranged in a triangular pattern. In the power module group located in the lower left corner, an optical fiber connector is provided in the upper connector setting area of ​​the bottom plate of the gate driver board, and the lower connector setting area of ​​the bottom plate of the gate driver board is hollowed out. The optical fiber connector is electrically connected to the upper bridge gate driver circuit of the gate driver board. In the power module group located at the lower right, the lower connector setting area of ​​the bottom plate of the gate driver board is provided with an optical fiber connector, and the upper connector setting area of ​​the bottom plate of the gate driver board is hollowed out. The optical fiber connector is electrically connected to the lower bridge gate driver circuit of the gate driver board. In the power module group located above, fiber optic connectors are provided in both the upper connector setting area and the lower connector setting area of ​​the bottom plate of its gate driver board. The fiber optic connectors in the upper connector setting area are electrically connected to the upper bridge gate driver circuit, and the fiber optic connectors in the lower connector setting area are electrically connected to the lower bridge gate driver circuit.

10. A frequency converter, characterized in that, Includes the three-level drive power component as described in any one of claims 7-9.

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