Power module structure and motor controller

Abstract

The application provides a power module structure and a motor controller, and relates to the technical field of power modules. The power module structure comprises: a circuit substrate; a power terminal assembly installed on the circuit substrate, the power terminal assembly comprising a plurality of input power terminals and a plurality of output power terminals; a power chip assembly comprising a plurality of power chips, the input end of the power chip being connected to the corresponding input power terminal, and the output end of the power chip being connected to the corresponding output power terminal; a bus capacitor connected to the input power terminal; and an absorption capacitor assembly comprising a plurality of absorption capacitor mechanisms connected in parallel with the corresponding power chips. The power module structure can achieve the technical effect of improving stability.

Description

Technical Field

[0001] This application relates to the field of power module technology, and more specifically, to a power module structure and a motor controller. Background Technology

[0002] The power module includes power devices, NTC (Negative Temperature Coefficient) resistors, drive resistors, and other components. The power devices are used for the conversion between DC and AC power; the NTC resistors are used to detect problems in the module in real time and take protective measures in advance when the internal temperature is overheated; the drive resistors are used to drive the power chip to turn on and off.

[0003] In existing technologies, by connecting power devices to the bus capacitor, high-frequency interference signals in the AC power supply can be filtered out, providing a stable DC voltage input. It has a high energy absorption capacity and can temporarily store and absorb excess electrical energy when short circuits, overcurrents, or transient voltages occur, preventing damage to the main power supply and internal components of the controller. For the power module structure, planar gallium nitride power devices are generally used. The drain needs to be connected to DBC (Direct Copper Bond) through bonding wires to form a circuit. Parasitic inductance can cause voltage spikes (breaking down devices), and parasitic parameters can cause power supply fluctuations, which may eventually lead to module damage or system failure, resulting in poor stability. Utility Model Content

[0004] The purpose of this application is to provide a power module structure and a motor controller that can achieve the technical effect of improving stability.

[0005] In a first aspect, this application provides a power module structure, including: Circuit board; A power terminal assembly is mounted on the circuit board, and the power terminal assembly includes multiple input power terminals and multiple output power terminals; A power chip assembly includes multiple power chips, wherein the input terminal of each power chip is connected to a corresponding input power terminal, and the output terminal of each power chip is connected to a corresponding output power terminal. Bus capacitor, the bus capacitor being connected to the input power terminal; The absorption capacitor assembly includes multiple absorption capacitor mechanisms, which are connected in parallel with the corresponding power chip.

[0006] In the above implementation process, the power module structure installs an absorption capacitor on the circuit board and connects the absorption capacitor to the corresponding power chip. Thus, by adding an absorption capacitor to the power chip assembly, when there are instantaneous changes or pulses in the local output voltage or current, the absorption capacitor can absorb these transients and release them slowly, making the output voltage smoother and more stable, avoiding damage to the device, suppressing voltage spikes, and ensuring the safe and reliable operation of the module. Therefore, the power module structure can achieve the technical effect of improving stability.

[0007] Furthermore, the absorption capacitor mechanism includes at least one absorption capacitor, which is disposed at the input terminal of the power chip; if the absorption capacitor mechanism includes two or more absorption capacitors, the absorption capacitors are connected in parallel.

[0008] In the above implementation process, the absorption capacitors in the absorption capacitor mechanism can be used in parallel according to the power module structure. For example, 1, 2, 3... absorption capacitors can be connected in parallel. If multiple absorption capacitors are used in parallel, under the same operating conditions, the module with added absorption capacitors can use a smaller drive resistance compared to the module without added absorption capacitors. By coordinating to reduce the drive resistance, the optimal switching speed of the power chip can be achieved.

[0009] Furthermore, the power module structure also includes a source power line and a drain power line, which are mounted on the circuit board. The source power line is connected to the corresponding input power terminal and the source of the power chip, respectively, and the drain power line is connected to the corresponding input power terminal and the drain of the power chip, respectively.

[0010] In the above implementation process, the positive and negative terminals of the input power terminal are connected to the source and drain of the power chip respectively through the source power line and drain power line, thereby connecting the DC power supply to the power chip assembly.

[0011] Furthermore, the power module structure also includes a gate driving line, which is mounted on the circuit board and connected to the gate of the power chip.

[0012] In the above implementation process, by connecting the gate drive line to the gate of the power chip, a control signal can be input to the power chip, thereby controlling the switching state of the power chip.

[0013] Furthermore, the power module structure also includes a driving resistor, which is connected between the gate driving line and the gate of the power chip.

[0014] In the above implementation process, by setting a drive resistor connected to the gate of the power chip, the magnitude of the drive current can be adjusted, thereby suppressing gate oscillation and ringing, and controlling the switching speed of the power chip.

[0015] Furthermore, the power module structure also includes a housing, the circuit board is mounted on the housing, the input power terminal is located on one side of the housing, and the output power terminal is located on the other side of the housing.

[0016] In the above implementation process, the outer casing is matched and installed with the circuit board. The outer casing can achieve a sealing effect, effectively protecting the circuit board and various components and connection terminals installed on the circuit board. At the same time, the input power terminals and output power terminals are respectively set on both sides of the outer casing, separating the input lines and output lines, which can effectively reduce the failure probability of the power module structure.

[0017] Furthermore, the power module structure also includes a heat sink, which is mounted on the outer casing and is matched with the circuit board.

[0018] In the above implementation process, by setting a heat sink on the circuit board, the heat sink can dissipate heat from the circuit board when the power chip assembly is working, thereby reducing the temperature of the power chip assembly and avoiding excessive temperature of the power chip assembly, improving the durability of the power module structure and reducing the failure rate.

[0019] Furthermore, the power module structure also includes a thermistor, which is mounted on the circuit board.

[0020] In the above implementation process, the thermistor can detect the temperature of the circuit board, thereby monitoring the operating temperature of the power chip component and triggering an alarm when the operating temperature of the power chip component is too high, thus reducing the probability of device damage.

[0021] Furthermore, the circuit board is a copper-clad ceramic substrate.

[0022] In the above implementation process, copper-clad ceramic substrate, also known as direct copper-clad ceramic substrate, is a special type of circuit board. Its core structure is to directly bond copper layers to both (or one) sides of the ceramic material, thereby achieving a perfect combination of high insulation and high thermal conductivity.

[0023] Secondly, this application provides a motor controller, including the power module structure described in any one of the first aspects.

[0024] Other features and advantages disclosed in this application will be set forth in the following description, or some features and advantages may be inferred from the description or determined without doubt, or may be learned by practicing the above-described technology disclosed in this application.

[0025] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the power module structure provided in the embodiments of this application; Figure 2 This is a partially enlarged schematic diagram of the power module structure provided in an embodiment of this application.

[0028] Reference numerals: Circuit board 100; Power terminal assembly 200; Input power terminal 210; Output power terminal 220; Power chip assembly 300; 310 Power chip; Absorption capacitor assembly 400; Absorption capacitor mechanism 410; Source power line 510; Drain power line 520; Gate drive line 530; Drive resistor 540; Housing 600; Heat sink 700; Thermistor 800; Pin 900. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0030] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0031] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0032] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or a point connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0033] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0034] Generally, a power module includes components such as power devices, NTC (Negative Temperature Coefficient) resistors, and drive resistors. The power devices are used for the conversion between DC and AC power; the NTC resistors are used to detect problems in the module in real time and take protective measures in advance when the internal temperature is overheated; and the drive resistors are used to drive the power chip to turn on and off.

[0035] In existing technologies, using external power devices connected to the bus capacitor can filter high-frequency interference signals in the AC power supply and provide a stable DC voltage input. It has a high energy absorption capacity and can temporarily store and absorb excess electrical energy when short circuits, overcurrents, or transient voltages occur, preventing damage to the main power supply and internal components of the controller. For power module structures, planar gallium nitride power devices are generally used. The drain needs to be connected to the DBC (Direct Copper Bond) through bonding wires to form a circuit. Parasitic inductance can cause voltage spikes (breaking down devices), and parasitic parameters can cause power supply fluctuations, which may eventually lead to module damage or system failure. In addition, gallium nitride has a fast switching speed, and the bus capacitor is far from the power device, which may result in the device being damaged due to insufficient protection in a short period of time.

[0036] To address the aforementioned technical problems, this application provides a power module structure and a motor controller. The power module structure, by mounting an absorption capacitor on a circuit board and connecting the absorption capacitor to a corresponding power chip, allows for the absorption of transients and their slow release when local output voltage or current experiences instantaneous changes or pulses. This results in a smoother and more stable output voltage, preventing damage to devices, suppressing voltage spikes, and ensuring the safe and reliable operation of the module. Therefore, this power module structure achieves the technical effect of improved stability.

[0037] Please see Figure 1 , Figure 1 This is a schematic diagram of the power module structure provided in the embodiments of this application. Figure 2 This is a partially enlarged schematic diagram of the power module structure provided in an embodiment of this application; the power module structure includes: Circuit board 100; A power terminal assembly 200 is mounted on a circuit board 100. The power terminal assembly 200 includes a plurality of input power terminals 210 and a plurality of output power terminals 220. The power chip assembly 300 includes a plurality of power chips 310, the input terminal of the power chip 310 is connected to the corresponding input power terminal 210, and the output terminal of the power chip 310 is connected to the corresponding output power terminal 220. Bus capacitor, the bus capacitor is connected to the input power terminal; The absorption capacitor assembly 400 includes multiple absorption capacitor mechanisms 410, which are connected in parallel with the corresponding power chip 310.

[0038] For example, the circuit board 100 serves as the substrate of the power module structure. Various components and connection terminals in the power module structure are mounted on the circuit board 100, and circuit connections between them are realized. That is, the circuit board 100 provides mechanical support and electrical connection for various components and connection terminals in the power module structure.

[0039] For example, the power terminal assembly 200 includes a plurality of input power terminals 210 and a plurality of output power terminals 220; wherein, the input power terminals 210 are used to connect to an input DC power supply, and the input power terminals 210 are divided into positive and negative terminals (e.g., ...). Figure 1 The + / - symbols shown are connected to the positive and negative terminals of the input DC power supply, respectively. Optionally, the power module structure provided in this application embodiment takes a three-phase inverter circuit as an example. The power terminal assembly 200 includes three output power terminals 220, which respectively output the voltages of the U phase, V phase, and W phase.

[0040] For example, the power chip assembly 300 includes a plurality of power chips 310, which are connected to form a three-phase inverter circuit, that is, connected to form an inverter circuit including three bridge arms connected in parallel. Each bridge arm includes an upper switch and a lower switch connected in series, and each upper switch or each lower switch includes at least one power chip (when there are more than two power chips, the power chips are connected in parallel). The input terminal of the power chip 310 is connected to the corresponding input power terminal 210, which means that the two ends of the bridge arm in the three-phase inverter circuit are respectively connected to the positive and negative terminals of the DC input power supply; the output terminal of the power chip 310 is connected to the corresponding output power terminal 220, which means that the midpoint of the bridge arm in the three-phase inverter circuit (the connection midpoint between the upper and lower switches) is connected to the output power terminal 220 (e.g., U phase, V phase, or W phase). For example, the power chip 310 provided in the embodiments of this application may be a gallium nitride power chip, or a silicon carbide power chip, a gallium arsenide power chip, an indium phosphide power chip, etc. This is only an example and not a limitation. The power chip 310 provided in the embodiments of this application may be selected according to actual needs.

[0041] For example, the bus capacitor, also known as the DC link capacitor, is one or more large-capacity capacitors connected in parallel on the DC input side (input power terminal) of the power chip assembly 300. In the inverter circuit composed of the power chip assembly 300, the bus capacitor can buffer energy and solve the problem of bus voltage drop caused by load change. At the same time, the bus capacitor can filter ripple and switching noise in DC current. Moreover, the bus capacitor can also provide a low-impedance loop to solve the problem of voltage spikes and oscillations caused by switching action.

[0042] For example, the absorption capacitor assembly 400 includes a plurality of absorption capacitor mechanisms 410, which are connected in parallel with the corresponding power chip 310. By adding an absorption capacitor mechanism 410 to the input terminal side of the power chip assembly 300, voltage spikes in the power chip assembly 300 can be suppressed, ensuring the safe and reliable operation of the power module. Optionally, the absorption capacitor mechanism 410 can also be connected in parallel at the output terminal side (U, V, W phases) of the power chip assembly 300; For example, when there are instantaneous changes or pulses in the local output voltage or current, the absorption capacitor mechanism 410 absorbs these transients and releases them slowly, making the output voltage smoother and more stable, and avoiding damage to the device; at the same time, the absorption capacitor mechanism 410 is closer to the power device in the power chip assembly 300, and by cooperating with the adjustment of the drive resistor, the switching speed is improved.

[0043] The power module structure provided in this application embodiment installs an absorption capacitor mechanism 410 on the circuit board 100 and connects the absorption capacitor mechanism 410 and the corresponding power chip 310. Thus, by adding an absorption capacitor to the power chip assembly 300, when there are instantaneous changes or pulses in the local output voltage or current, the absorption capacitor can absorb these transients and release them slowly, making the output voltage smoother and more stable, avoiding damage to the device, suppressing voltage spikes, and ensuring the safe and reliable operation of the module. Therefore, this power module structure can achieve the technical effect of improving stability.

[0044] In some embodiments, the absorption capacitor mechanism 410 includes at least one absorption capacitor, which is disposed at the input terminal of the power chip 310; if the absorption capacitor mechanism 410 includes two or more absorption capacitors, the absorption capacitors are connected in parallel.

[0045] For example, the absorption capacitors in the absorption capacitor mechanism 410 can be used in parallel depending on the power module structure. For example, 1, 2, 3... absorption capacitors can be connected in parallel to reduce the driving resistance and thus achieve the optimal switching speed of the power chip 310.

[0046] In some embodiments, the power module structure further includes a source power line 510 and a drain power line 520, which are mounted on a circuit board. The source power line 510 is connected to the source of the corresponding input power terminal 210 and the power chip 310, respectively, and the drain power line 520 is connected to the drain of the corresponding input power terminal 220 and the power chip 310, respectively.

[0047] For example, the positive and negative terminals of the input power terminal 220 are connected to the source and drain of the power chip 310, respectively, through the source power line 510 and the drain power line 520, thereby connecting the DC power supply to the power chip assembly.

[0048] In some embodiments, the power module structure further includes a gate drive line 530, which is mounted on the circuit board 100 and connected to the gate of the power chip 310.

[0049] For example, by connecting the gate of the power chip 310 to the gate via the gate drive line 530, a control signal can be input to the power chip 310, thereby controlling the switching state of the power chip 310.

[0050] In some embodiments, the power module structure further includes a drive resistor 540, which is connected between the gate drive line 530 and the gate of the power chip 310.

[0051] For example, by setting a drive resistor 540 connected to the gate of the power chip 310, the magnitude of the drive current can be adjusted, thereby suppressing gate oscillation and ringing, and controlling the switching speed of the power chip 310.

[0052] In some embodiments, the power module structure further includes a housing 600, a circuit board 100 mounted on the housing 600, an input power terminal 210 disposed on one side of the housing 600, and an output power terminal 220 disposed on the other side of the housing 600.

[0053] For example, the housing 600 is matched and installed with the circuit board 100. The housing 600 can achieve a sealing effect, effectively protecting the circuit board 100 and various components and connection terminals installed on the circuit board 100. At the same time, the input power terminal 210 and the output power terminal 220 are respectively arranged on both sides of the housing 600, separating the input line and the output line, which can effectively reduce the failure probability of the power module structure.

[0054] In some embodiments, the power module structure further includes a heat sink 700, which is mounted on the housing 600 and is matched with the circuit board 100.

[0055] For example, by providing a heat sink 700 on the circuit board 100, the heat sink 700 can dissipate heat from the circuit board 100 when the power chip assembly 300 is working, thereby reducing the temperature of the power chip assembly 300 and preventing the power chip assembly 300 from overheating, thus improving the durability of the power module structure and reducing the failure rate.

[0056] In some embodiments, the power module structure also includes a thermistor 800, which is mounted on the circuit board 100.

[0057] For example, the thermistor 800 can detect the temperature of the circuit board 100, thereby monitoring the operating temperature of the power chip assembly 300 and triggering an alarm when the operating temperature of the power chip assembly 300 is too high, thus reducing the probability of device damage.

[0058] In some embodiments, the circuit board 100 is a copper-clad ceramic substrate.

[0059] For example, copper-clad ceramic substrates, also known as direct copper-clad ceramic substrates, are a special type of circuit board. The core structure involves directly bonding copper layers to both (or one) sides of the ceramic material, thereby achieving a perfect combination of high insulation and high thermal conductivity.

[0060] For example, copper-clad ceramic substrates have the following key advantages: Excellent thermal conductivity: Ceramic materials (especially aluminum nitride) have a much higher thermal conductivity than ordinary FR-4 fiberglass boards. They can quickly conduct away the large amounts of heat generated during circuit operation, preventing chips from being damaged by overheating. Thermal conductivity comparison: Aluminum nitride > Aluminum oxide > Ordinary PCB board; Thermal expansion coefficient matching the chip: The material (silicon) used in power semiconductor chips (such as IGBTs and SiC) also has a specific coefficient of thermal expansion. The coefficient of thermal expansion of the ceramic material used in DBC substrates is very close to that of silicon chips. This means that when the temperature changes drastically, the chip and the substrate expand and contract synchronously, thereby greatly reducing thermal stress and improving the reliability and lifespan of the product. High insulation strength and reliability: Ceramics are excellent insulators, providing high breakdown voltages to ensure the safe operation of high-voltage circuits. The copper layer and ceramic are bonded together via eutectic bonding, resulting in strong and stable adhesion that resists high temperatures and thermal shock. High current carrying capacity: The copper layer can be made quite thick (typically 100μm - 600μm), thus enabling it to carry very large currents.

[0061] Optionally, the power module structure also includes a pin 900, through which the circuit board 100 is connected to the driver board.

[0062] In some embodiments, this application provides a motor controller, including Figures 1 to 2 The power module structure is shown.

[0063] In some implementation scenarios, combined with Figures 1 to 2 The power module structure shown is illustrated in the following example of a specific implementation: The power module mainly consists of a main power terminal (input), drain power lines, source power lines, drive resistors, gate drive lines, pins, a plastic encapsulation shell, a main power terminal (output), a heat sink, an NTC resistor, a DBC substrate, a snubber capacitor, and a power chip. When DC current flows from the main power terminal (input) into the drain and out from the source, the gate controls the switching of the power device, converting DC to AC. The NTC resistor monitors the internal temperature of the module in real time; if it overheats, it executes the corresponding operation protection module. The pins connect to the drive board, receiving the corresponding signals to drive the power module. The heat sink dissipates heat from the power chip, serving a heat dissipation function. The snubber capacitor connects to the positive and negative terminals on the DBC. When there are instantaneous changes or pulses in the local output voltage or current, the capacitor absorbs these transients and releases them slowly, making the output voltage smoother and more stable, preventing damage to the device.

[0064] Optionally, the absorption capacitors can be placed at the positive and negative terminals of the input voltage, specifically at position 1: the positive and negative terminals of the DBC; position 2: the positive and negative terminals at the connection between the main power input terminal and the capacitor; and position 3: the positive and negative terminals at the connection between the main power input terminal and the DBC. The number of capacitors can be increased according to the actual application. This application is not only applicable to gallium nitride power modules but also to power device modules using IGBTs, SiCs, and other similar devices.

[0065] It should be understood that the phrases "in this embodiment," "in this application embodiment," or "as an optional implementation" throughout the specification mean that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of this application. Therefore, the phrases "in this embodiment," "in this application embodiment," or "as an optional implementation" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to this application.

[0066] In the various embodiments of this application, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0067] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims.

Claims

1. A power module structure, characterized in that, include: Circuit board; A power terminal assembly is mounted on the circuit board, and the power terminal assembly includes a plurality of input power terminals and a plurality of output power terminals; A power chip assembly includes multiple power chips, wherein the input terminal of each power chip is connected to a corresponding input power terminal, and the output terminal of each power chip is connected to a corresponding output power terminal. Bus capacitor, the bus capacitor being connected to the input power terminal; The absorption capacitor assembly includes multiple absorption capacitor mechanisms, which are connected in parallel with the corresponding power chip.

2. The power module structure according to claim 1, characterized in that, The absorption capacitor mechanism includes at least one absorption capacitor, which is disposed at the input terminal of the power chip; if the absorption capacitor mechanism includes two or more absorption capacitors, the absorption capacitors are connected in parallel.

3. The power module structure according to claim 1 or 2, characterized in that, The power module structure further includes a source power line and a drain power line, which are mounted on the circuit board. The source power line is connected to the corresponding input power terminal and the source of the power chip, respectively, and the drain power line is connected to the corresponding input power terminal and the drain of the power chip, respectively.

4. The power module structure according to claim 3, characterized in that, The power module structure also includes a gate driving line, which is mounted on the circuit board and connected to the gate of the power chip.

5. The power module structure according to claim 4, characterized in that, The power module structure also includes a driving resistor, which is connected between the gate driving line and the gate of the power chip.

6. The power module structure according to claim 1, characterized in that, The power module structure also includes a housing, the circuit board is mounted on the housing, the input power terminal is located on one side of the housing, and the output power terminal is located on the other side of the housing.

7. The power module structure according to claim 6, characterized in that, The power module structure also includes a heat sink, which is installed on the outer casing and matched with the circuit board.

8. The power module structure according to claim 1, characterized in that, The power module structure also includes a thermistor, which is mounted on the circuit board.

9. The power module structure according to claim 1, characterized in that, The circuit board is a copper-clad ceramic substrate.

10. A motor controller, characterized in that, Includes the power module structure described in any one of claims 1 to 9.

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