A high-power-density high-reliability vehicle-mounted DCDC converter structure

Abstract

The utility model relates to the field of power electronics, provide a kind of high power density high reliability vehicle-mounted DCDC converter structure, including at least one multilayer board level independent unit, multilayer board level independent unit includes the aluminum substrate, capacitor board and power board sequentially stacked along vertical direction;Aluminum substrate is connected with external radiator, MOS tube, power inductance and diode are attached thereon;The capacitor board is fixed above aluminum substrate by straight pin parallel, and first predetermined interval is kept between aluminum substrate;Power board is fixed above capacitor board parallel, and second predetermined interval is kept between capacitor board;Power board is provided with busbar and drive board installation area, two parallelly arranged drive boards are vertically inserted in drive board installation area.The scheme solves the three major pain points of low space utilization, heat dissipation path dispersion and poor module expandability of existing products through space planning, and realizes the balance of high power density and heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of power electronics technology, specifically to a high power density and high reliability vehicle-mounted DC-DC converter structure. Background Technology

[0002] In recent years, my country's new energy vehicle industry has maintained rapid and sustained development, and its industrial scale and technological strength have entered the ranks of the world's leading sectors. Building on large-scale application, new energy vehicles are gradually shifting from scale-driven to technology-led development, with intelligentization, internationalization, and key technological innovation becoming the three core directions driving high-quality industrial development. Hydrogen energy, as an important component of the clean energy system, has seen its various links in the industrial chain usher in broad development prospects under the dual impetus of policy support and technological breakthroughs. In hydrogen fuel cell vehicles, the DC / DC converter, as a key component of the electronic control system, has seen its market size continuously expand with the promotion of hydrogen fuel cell vehicles, while also facing higher requirements in technological iteration.

[0003] DC / DC converters are crucial power conversion devices in new energy vehicles. Their main function is to convert the unstable DC power output from fuel cells into a stable, adjustable DC voltage to meet the various needs of the drive motor or intermediate circuits. Through boost or buck-boost control, DC / DC converters can effectively suppress voltage drops in fuel cells caused by load changes, working in conjunction with the fuel cell to form the vehicle's power supply and charge the auxiliary battery. By dynamically adjusting the duty cycle through real-time control strategies, DC / DC converters can achieve optimal matching between the fuel cell output power and the vehicle's load requirements, thereby reducing efficiency losses caused by power fluctuations. Their performance directly affects the energy efficiency and integration level of the entire power system. With market development, their application scenarios are constantly expanding, including transportation, heavy-duty truck freight, long-distance logistics, buses, sanitation vehicles, and shared electric vehicles.

[0004] However, existing DC / DC converters still have certain limitations in structural design. Currently, mainstream products generally adopt a planar distributed layout, where key components such as power devices, transformers, and control circuits are laid out horizontally. This structure has the following main drawbacks: First, it has low space utilization and generally low power density, making it difficult to meet the installation requirements of miniaturized devices such as hydrogen fuel cell vehicles and drones; second, the heat dissipation paths are dispersed, and the heat generated by power devices cannot be centrally dissipated, easily leading to localized overheating and device damage; third, it has poor modular scalability, requiring a complete redesign of the overall layout to increase or decrease power, resulting in high adaptation costs. Therefore, to address the shortcomings of current DC / DC converters in terms of structural integration, heat dissipation performance, and modular scalability, there is an urgent need to design a new structure with high power density, efficient thermal management, and flexible scalability to support the development of hydrogen fuel cell systems. Utility Model Content

[0005] To address the problems existing in the background technology, this utility model proposes a high power density and high reliability vehicle-mounted DC-DC converter structure. Through precise space planning, it solves the three major pain points mentioned in the background technology: low space utilization, dispersed heat dissipation paths, and poor module scalability, and achieves a balance between high power density and heat dissipation efficiency.

[0006] To achieve the above objectives, the present invention adopts the following solution: A high power density and high reliability vehicle-mounted DC-DC converter structure includes at least one multi-layer board-level independent unit, wherein the multi-layer board-level independent unit includes an aluminum substrate, a capacitor board and a power board stacked sequentially in a vertical direction; The aluminum substrate is connected to an external heat sink, on which MOSFETs, power inductors, and diodes are mounted. The capacitor board is fixed parallel to the aluminum substrate by soldering pins, maintaining a first predetermined distance from the aluminum substrate. The power board is fixed parallel to the capacitor board, maintaining a second predetermined distance from the capacitor board. The power board is provided with a busbar and a driver board mounting area. The busbar is soldered to the power board by bending copper bars. Two driver boards are vertically inserted in the driver board mounting area, arranged in parallel, maintaining a third predetermined distance between the two driver boards.

[0007] Optionally, it also includes a control board, which is vertically inserted into the end of the power board in the width direction. The width of the control board is smaller than the width of the power board, and an insulating gap is left between the bottom of the control board and the aluminum substrate.

[0008] Optionally, a heat dissipation gap is provided between the control board and the drive board, and the components on the control board and the drive board are arranged in a three-dimensional staggered manner.

[0009] Optionally, there are multiple multi-layer board-level independent units, and the multiple multi-layer board-level independent units are spliced ​​together in the horizontal direction.

[0010] Optionally, the first predetermined spacing is 3mm, the second predetermined spacing is 6mm, and the third predetermined spacing is 15mm.

[0011] Optionally, the power inductor is mounted on one end of the aluminum substrate, the MOSFET is located below the capacitor plate, and the diode is located between the power inductor and the MOSFET; both the capacitor plate and the power plate are provided with clearance space at the position corresponding to one end of the power inductor.

[0012] Optionally, the power circuit of the power board is connected to the low-impedance aluminum substrate via a high-current terminal, and the control circuit of the control board is connected to the signal of the aluminum substrate via a pin.

[0013] Optionally, high-voltage capacitors are distributed on both sides of the power board, and the driver board mounting area is located in the middle region of the power board.

[0014] Optionally, support columns are provided between the power board and the capacitor board, and between the capacitor board and the aluminum substrate, and the overall structure is fixed by fasteners.

[0015] The beneficial effects of this invention are as follows: First, in this embodiment, the functional circuit boards, aluminum substrate, capacitor board, power board, and driver board are stacked vertically, greatly reducing the planar area occupied. Compared with the traditional planar distributed layout, the power density is improved. In this embodiment, the aluminum substrate serves as the heat dissipation and structural mounting base, with high-power devices such as MOSFETs, power inductors, and diodes directly mounted on its surface. Heat can be conducted to the external heat sink through the shortest path, effectively controlling the operating temperature of the core heat-generating components (MOSFETs and power inductors), avoiding localized overheating, and improving the reliability and lifespan of the system.

[0016] Furthermore, these multi-layered board-level independent units, through the combined action of welded pins, support columns, and fasteners, form a stable integrated structure with enhanced resistance to vibration and shock. Additionally, power rating scaling can be achieved simply by increasing or decreasing the number of independent units, without redesigning the entire converter structure. Attached Figure Description

[0017] Figure 1 This is a side view of the converter structure in an embodiment of the present invention. Figure 1 ; Figure 2 This is a side view of the converter structure according to an embodiment of the present invention. Figure 2 ; Figure 3 This is a schematic diagram of the assembly of multi-layer board-level independent units in an embodiment of this utility model.

[0018] The following are the labels in the diagram: 1. Aluminum substrate; 2. Capacitor board; 3. Power board; 4. MOSFET; 5. Power inductor; 6. Diode; 7. Busbar; 8. Driver board; 9. Control board; 10. Insulation gap; 11. Heat dissipation gap; 12. High current terminal; 13. High voltage capacitor; 14. Support post; 15. Straight pin; 16. Bent pin. Detailed Implementation

[0019] To make this utility model clearer and more understandable, the following description, in conjunction with the accompanying drawings and embodiments, provides an optional detailed explanation of this utility model. It should be understood that the given embodiments are merely one implementation method and do not represent all embodiments.

[0020] Example Combination Figures 1-3This embodiment provides a high power density and high reliability vehicle-mounted DC-DC converter structure, including at least one multi-layer board-level independent unit, wherein the multi-layer board-level independent unit includes an aluminum substrate 1, a capacitor board 2 and a power board 3 stacked sequentially in the vertical direction; The aluminum substrate 1 is connected to an external heat sink, and a MOSFET 4, a power inductor 5, and a diode 6 are mounted on it. The capacitor plate 2 is fixed parallel to the aluminum substrate 1 via through-hole pins 15 to achieve low-impedance electrical connection, forming an intermediate functional layer, and maintaining a first predetermined distance from the aluminum substrate 1. The power plate 3 is fixed parallel to the capacitor plate 2, maintaining a second predetermined distance from the capacitor plate 2. The power plate 3 is provided with a busbar 7, auxiliary capacitors, other power circuit components, and a driver board 8 mounting area, forming the core power transmission unit of the module. The busbar 7 is welded to the power plate 3 by bending copper busbars. Two driver boards 8 are vertically inserted in the driver board 8 mounting area, and the two driver boards 8 maintain a third predetermined distance from each other. Furthermore, high-voltage capacitors 13 are distributed on both sides of the power plate 3, and the driver board 8 mounting area is located in the middle area of ​​the power plate 3 to reduce the influence of electromagnetic interference on the driver board 8 signal, thereby improving the stability and reliability of drive control.

[0021] In this embodiment, the functional circuit boards, aluminum substrate 1, capacitor board 2, power board 3, and driver board 8 are stacked vertically, greatly reducing the planar area occupied. Compared with the traditional planar distributed layout, the power density is improved. In this embodiment, the aluminum substrate 1 serves as the heat dissipation and structural mounting base. High-power devices such as MOSFET 4, power inductor 5, and diode 6 are directly mounted on its surface. Heat can be conducted to the external heat sink through the shortest path, effectively controlling the operating temperature of the core heat-generating components (MOSFET 4 and power inductor 5), avoiding local overheating, and improving the reliability and lifespan of the system. The aluminum substrate 1 is responsible for heat dissipation of the main power devices, and the second predetermined spacing between capacitor board 2 and power board 3 forms a heat dissipation channel to assist in interlayer heat dissipation. This avoids the problem of needing overall potting compound to assist in heat dissipation of power board 3 or capacitor board 2 in the prior art, and reduces the weight of the converter structure itself.

[0022] Furthermore, the power inductor 5 is mounted on one end of the aluminum substrate 1. Both the capacitor plate 2 and the power plate 3 have clearance spaces corresponding to the position of the power inductor 5, forming a "device-space" correspondence. This ensures the integrity of the inductor's heat dissipation path and avoids interference with other board components. For a reasonable spatial layout, the MOSFET 4 is located below the capacitor plate 2, and the diode 6 is located between the power inductor 5 and the MOSFET 4.

[0023] Furthermore, multiple multi-layer board-level independent units can be set according to the total power of the converter. These multiple multi-layer board-level independent units are spliced ​​together horizontally. Specifically, the aluminum substrate 1 and capacitor board 2 adopt a modular design. This modular design supports adding or removing units as needed: reducing multi-layer board-level independent units in low-power scenarios; adding multi-layer board-level independent units in high-power scenarios, requiring only the splicing of standard units without redesigning the substrate structure, quickly adapting to the power requirements of different scenarios, and balancing space utilization and scenario compatibility. Figure 3 This embodiment provides an assembly diagram of three independent units.

[0024] Specifically, as a preferred embodiment, the first predetermined spacing is 3mm, the second predetermined spacing is 6mm, and the third predetermined spacing is 15mm. The setting of these three predetermined spacings enables layered heat dissipation of the converter structure. Furthermore, to ensure a constant vertical distance between the main structures, support columns 14 are provided between the power board 3 and the capacitor board 2, and between the capacitor board 2 and the aluminum substrate 1. These support columns are secured to the overall structure using fasteners such as screws, preventing assembly errors from affecting electrical performance and the heat dissipation gap 11, and improving conductivity and heat dissipation capabilities.

[0025] Specifically, it also includes a control board 9, which is vertically inserted into the end of the power board 3 in the width direction. The width of the control board 9 is slightly smaller than the width of the power board 3, forming a stepped layout. An insulating gap 10 is left between the bottom of the control board 9 and the aluminum substrate 1 to facilitate heat dissipation in the internal space enclosed by the control board 9 and the aluminum substrate 1.

[0026] Furthermore, the drive board 8 and control board 9, as control command units of the converter structure, are mechanically fixed and electrically connected to the power board 3 through the bent pin 16, so that the components on the drive board 8, control board 9 and power board 3 maintain a safe distance and there is no space interference problem, maximizing the use of the internal vertical space of the module and improving the overall structural compactness.

[0027] Furthermore, the components (such as transformers, inductors, connectors, etc.) on the control board 9 and drive board 8 are arranged in a three-dimensional staggered pattern. This three-dimensional spatial planning avoids mechanical interference and achieves a compact layout. For example, the common-mode inductor on the control board 9 and the vertical electrolytic capacitor on the drive board 8 are spatially staggered. Preferably, a 2mm heat dissipation gap 11 is maintained between the control board 9 and the drive board 8.

[0028] Specifically, the power circuit of the power board 3 is connected to the aluminum substrate 1 with low impedance via a high-current terminal 12. This helps to conduct some of the heat generated on the power board 3 to the aluminum substrate 1 through the high-current terminal 12, and finally dissipate it through an external heat sink, thus improving the heat dissipation conditions of the power circuit. The control circuit of the control board 9 is connected to the aluminum substrate 1 via a pin, providing a short and direct signal path and shortening the drive circuit.

[0029] In summary, this embodiment achieves the best balance between high power density, high reliability, and flexible scalability through a vertical stacking structure, modular independent units, and integrated heat dissipation design, thus solving the three major pain points mentioned in the background art: low space utilization, dispersed heat dissipation paths, and poor module scalability of existing products.

[0030] The specific embodiments of this utility model have been described in detail above with reference to the figures, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this utility model, and these variations still fall within the protection scope of this utility model.

Claims

1. A high power density and high reliability vehicle-mounted DC-DC converter structure, characterized in that: It includes at least one multi-layer board-level independent unit, which includes an aluminum substrate (1), a capacitor board (2) and a power board (3) stacked sequentially in a vertical direction. The aluminum substrate (1) is connected to an external heat sink, on which a MOSFET (4), a power inductor (5), and a diode (6) are mounted. The capacitor plate (2) is fixed above the aluminum substrate (1) in parallel by a through-hole pin (15) and maintains a first predetermined distance from the aluminum substrate (1). The power plate (3) is fixed above the capacitor plate (2) in parallel and maintains a second predetermined distance from the capacitor plate (2). The power plate (3) is provided with a busbar (7) and a driver board mounting area. The busbar (7) is welded to the power plate (3) by a bent copper busbar. Two driver boards (8) are vertically inserted in the driver board mounting area and are arranged in parallel. The two driver boards (8) maintain a third predetermined distance from each other.

2. The high power density and high reliability vehicle-mounted DC-DC converter structure according to claim 1, characterized in that: It also includes a control board (9), which is vertically inserted into the end of the power board (3) in the width direction. The width of the control board (9) is smaller than the width of the power board (3). An insulating gap (10) is left between the bottom of the control board (9) and the aluminum substrate (1).

3. The high power density and high reliability vehicle-mounted DC-DC converter structure according to claim 2, characterized in that: A heat dissipation gap (11) is provided between the control board (9) and the drive board (8), and the components on the control board (9) and the drive board (8) are arranged in a three-dimensional staggered manner.

4. The high power density and high reliability vehicle-mounted DC-DC converter structure according to claim 1, characterized in that: The multi-layer board-level independent unit is multiple, and the multiple multi-layer board-level independent units are spliced ​​together in the horizontal direction.

5. The high power density and high reliability vehicle-mounted DC-DC converter structure according to claim 1, characterized in that: The first predetermined spacing is 3mm, the second predetermined spacing is 6mm, and the third predetermined spacing is 15mm.

6. The high power density and high reliability vehicle-mounted DC-DC converter structure according to claim 1, characterized in that: The power inductor (5) is mounted on one end of the aluminum substrate (1), the MOS transistor (4) is located below the capacitor plate (2), and the diode (6) is located between the power inductor (5) and the MOS transistor (4); the capacitor plate (2) and the power plate (3) are provided with clearance space at the position corresponding to one end of the power inductor (5).

7. The high power density and high reliability vehicle-mounted DC-DC converter structure according to claim 2, characterized in that: The power circuit of the power board (3) is connected to the aluminum substrate (1) with low impedance through the high current terminal (12), and the control circuit of the control board (9) is connected to the aluminum substrate (1) through the pin.

8. The high power density and high reliability vehicle-mounted DC-DC converter structure according to claim 1, characterized in that: High voltage capacitors (13) are distributed on both sides of the power board (3), and the drive board mounting area is located in the middle area of ​​the power board (3).

9. The high power density and high reliability vehicle-mounted DC-DC converter structure according to claim 1, characterized in that: Support columns (14) are provided between the power board (3) and the capacitor board (2), and between the capacitor board (2) and the aluminum substrate (1), and the overall structure is fixed by fasteners.

Images