An inverter circuit structure, an inverter device, and a motor controller

Abstract

The application provides an inverter circuit structure, an inverter device and a motor controller, and relates to the technical field of motors. The inverter circuit structure comprises: a bus capacitor assembly comprising a first bus capacitor and a second bus capacitor connected in series; a power module comprising a chopper circuit and an inverter circuit; the chopper circuit comprises a first half-bridge circuit and a second half-bridge circuit, the first half-bridge circuit and the second half-bridge circuit are connected, the first bus capacitor is connected to the first half-bridge circuit, the second bus capacitor is connected to the second half-bridge circuit, and the midpoint of the first bus capacitor and the second bus capacitor is connected to the midpoint of the first half-bridge circuit and the second half-bridge circuit; one end of the inverter circuit is connected to the first half-bridge circuit, and the other end of the inverter circuit is connected to the second half-bridge circuit. The inverter circuit structure can achieve the technical effects of reducing cost and prolonging service life.

Description

Technical Field

[0001] This application relates to the field of motor technology, and more specifically, to an inverter circuit structure, an inverter device, and a motor controller. Background Technology

[0002] Currently, the most widely used motor controller in the industrial electric drive field is still the three-phase two-level motor controller, which can realize the conversion of DC to AC. In this controller, the DC bus capacitor is directly connected in parallel across the DC input terminals, and the voltage across the capacitor is always equal to the DC bus voltage, resulting in a single and fixed voltage stress. However, for the three-phase two-level motor controller, the two-level capacitor directly bears the entire DC bus voltage, leading to high voltage stress and higher capacitor cost. Furthermore, due to the high peak value of the ripple voltage the capacitor withstands, it generates significant heat, resulting in a short lifespan. Utility Model Content

[0003] The purpose of this application is to provide an inverter circuit structure, an inverter device, and a motor controller, which can achieve the technical effects of reducing costs and increasing service life.

[0004] In a first aspect, this application provides an inverter circuit structure, including: The bus capacitor assembly includes a first bus capacitor and a second bus capacitor connected in series. The power module includes a chopper circuit and an inverter circuit; the chopper circuit includes a first half-bridge circuit and a second half-bridge circuit, the first half-bridge circuit and the second half-bridge circuit are connected, a first bus capacitor is connected to the first half-bridge circuit, a second bus capacitor is connected to the second half-bridge circuit, and the midpoint of the first bus capacitor and the second bus capacitor is connected to the midpoint of the first half-bridge circuit and the second half-bridge circuit; one end of the inverter circuit is connected to the first half-bridge circuit, and the other end of the inverter circuit is connected to the second half-bridge circuit.

[0005] In the above implementation process, by using two series-connected bus capacitors, the voltage stress of a single bus capacitor is reduced by 50%, and the cost of using the capacitor is lower than that of a two-level inverter circuit using only one bus capacitor. Moreover, by connecting the first bus capacitor to the first half-bridge circuit and the second bus capacitor to the second half-bridge circuit, and connecting the midpoint of the first bus capacitor and the second bus capacitor to the midpoint of the first half-bridge circuit and the second half-bridge circuit, a three-level bus capacitor is constructed, which can reduce the voltage jump amplitude and the ripple peak value, reduce the impact on the capacitor, generate less heat, and extend the service life. Thus, this inverter circuit structure can achieve the technical effects of reducing costs and increasing service life.

[0006] Furthermore, the capacitance value of the first bus capacitor is the same as that of the second bus capacitor.

[0007] In the above implementation process, a DC bus capacitor is formed by connecting two first bus capacitors and second bus capacitors with equal capacitance values ​​in series. This can reduce the voltage stress of a single bus capacitor by 50%, thereby reducing the cost of using the bus.

[0008] Furthermore, the first half-bridge circuit includes a first switching device and a second switching device, which are connected in series, and one end of the inverter circuit is connected to the midpoint between the first switching device and the second switching device.

[0009] In the above implementation process, one end of the inverter circuit is connected to the midpoint of the first and second switching devices, thereby adjusting the average voltage output to the inverter circuit through the switching operations of the first and second switching devices.

[0010] Furthermore, the second half-bridge circuit includes a third switching device and a fourth switching device, which are connected in series, and the other end of the inverter circuit is connected to the midpoint between the third switching device and the fourth switching device.

[0011] In the above implementation process, the other end of the inverter circuit is connected to the midpoint between the third and fourth switching devices, so that the average voltage output to the inverter circuit can be adjusted by switching the third and fourth switching devices on and off.

[0012] In a second aspect, this application provides an inverter device, including a capacitor housing, an integrated circuit board, a capacitor connection assembly, and the inverter circuit structure described in any one of the first aspects; The bus capacitor assembly is mounted on the capacitor housing, the power module is mounted on the integrated circuit board, and the capacitor housing and the integrated circuit board are matched and configured. The capacitor connection assembly includes an input connection assembly and an output connection assembly. The bus capacitor assembly is connected to the input power supply through the input connection assembly, and the bus capacitor assembly is connected to the power module through the output connection assembly.

[0013] In the above implementation process, the first bus capacitor and the second bus capacitor in the bus capacitor assembly are both installed in an insulated capacitor housing, and the power module is installed on the integrated circuit board, which can separate the bus capacitor assembly and the power module. The bus capacitor assembly is then connected to the input power supply and the power module through the input connection component and the output connection component in the capacitor connection assembly, respectively, making the structure safe and reliable.

[0014] Furthermore, the input connection component includes an input busbar positive terminal connector and an input busbar negative terminal connector. The busbar capacitor assembly is connected to the positive terminal of the input power supply through the input busbar positive terminal connector, and the busbar capacitor assembly is connected to the negative terminal of the input power supply through the input busbar negative terminal connector.

[0015] In the above implementation process, the positive terminal connector and the negative terminal connector of the input busbar are respectively connected to the positive and negative terminals of the input power supply.

[0016] Furthermore, the output connection component includes an output busbar positive terminal connector, an output busbar zero terminal connector, and an output busbar negative terminal connector. The bus capacitor assembly is connected to the first half-bridge circuit of the chopper circuit through the output busbar positive terminal connector. The bus capacitor assembly is connected between the first half-bridge circuit and the second half-bridge circuit of the chopper circuit through the output busbar zero terminal connector. The bus capacitor assembly is connected to the second half-bridge circuit of the chopper circuit through the output busbar negative terminal connector.

[0017] In the above implementation process, the output busbar positive terminal connector, the output busbar zero terminal connector, and the output busbar negative terminal connector are respectively connected to the first half-bridge circuit, between the first half-bridge circuit and the second half-bridge circuit, and to the second half-bridge circuit.

[0018] Furthermore, the inverter device also includes a heat sink, which is disposed between the capacitor housing and the integrated circuit board.

[0019] In the above implementation process, the heat sink is placed between the capacitor housing and the integrated circuit board. The heat sink can be used to dissipate heat from the bus capacitor assembly, reduce the capacitor temperature, and further improve the capacitor's service life.

[0020] Furthermore, the first bus capacitor includes a plurality of first capacitor cells connected in parallel, the second bus capacitor includes a plurality of second capacitor cells connected in parallel, and the bus capacitor assembly further includes a connecting copper busbar, through which the first bus capacitor and the second bus capacitor are connected.

[0021] In the above implementation process, both the first bus capacitor and the second bus capacitor are composed of multiple capacitor cores connected in parallel, which can effectively reduce the equivalent series resistance, thereby reducing heat generation and improving efficiency. The first bus capacitor and the second bus capacitor are then connected in series through a connecting copper bus.

[0022] Thirdly, this application provides a motor controller including the inverter device described in any of the second aspects.

[0023] Other features and advantages disclosed in this application will be set forth in the following description, or some features and advantages may be inferred from the description or determined without doubt, or may be learned by practicing the above-described technology disclosed in this application.

[0024] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A circuit diagram of the inverter circuit structure provided in the embodiments of this application; Figure 2 This is a schematic diagram of the inverter device provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the capacitor housing and capacitor connection assembly provided in the embodiments of this application; Figure 4 Another structural schematic diagram of the capacitor housing and capacitor connection assembly provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of the capacitor connection assembly and the bus capacitor assembly provided in the embodiments of this application. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0028] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0029] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0030] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or a point connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0031] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0032] Generally, the most widely used motor controller in the industrial electric drive field is still the three-phase two-level motor controller, which realizes the conversion of DC to AC. The DC bus capacitor is directly connected in parallel across the DC input terminals, and the voltage across the capacitor is always equal to the DC bus voltage, resulting in a single and fixed voltage stress. Existing three-phase two-level motor controllers have the following objective disadvantages: Two-level capacitors directly bear the full DC bus voltage, resulting in high voltage stress and high cost. Capacitors can withstand high peak ripple voltage, generate a lot of heat, and have a short lifespan. To address the aforementioned technical problems, this application provides an inverter circuit structure, an inverter device, and a motor controller. This inverter circuit structure uses two series-connected bus capacitors to provide instantaneous high current and stable DC bus voltage, reducing the voltage stress on a single bus capacitor by 50%. The cost of using this capacitor is lower than that of a two-level inverter circuit using only one bus capacitor. Furthermore, by connecting the first bus capacitor to the first half-bridge circuit and the second bus capacitor to the second half-bridge circuit, with the midpoint of the first and second bus capacitors connected to the midpoint of the first and second half-bridge circuits, a three-level bus capacitor configuration is constructed. This reduces voltage jump amplitude and ripple peak value, minimizes impact on the capacitors, generates less heat, and extends service life. Therefore, this inverter circuit structure achieves the technical effects of cost reduction and increased service life.

[0033] Please see Figure 1 , Figure 1 This is a circuit diagram of the inverter circuit structure provided in an embodiment of this application; the inverter circuit structure includes: The bus capacitor assembly includes a first bus capacitor Cdc1 and a second bus capacitor Cdc2 connected in series. The power module includes a chopper circuit and an inverter circuit. The chopper circuit includes a first half-bridge circuit 101 and a second half-bridge circuit 102, which are connected together. A first bus capacitor Cdc1 is connected to the first half-bridge circuit 101, and a second bus capacitor Cdc2 is connected to the second half-bridge circuit 102. The midpoint between the first bus capacitor Cdc1 and the second bus capacitor Cdc2 is connected to the midpoint between the first half-bridge circuit 101 and the second half-bridge circuit 102. One end of the inverter circuit 200 is connected to the first half-bridge circuit 101, and the other end of the inverter circuit 200 is connected to the second half-bridge circuit 102.

[0034] For example, the bus capacitor assembly includes two first bus capacitors Cdc1 and second bus capacitors Cdc2 connected in series. By sharing the voltage stress through the first bus capacitors Cdc1 and second bus capacitors Cdc2, each bus capacitor only needs to bear half of the DC bus voltage, thereby reducing the voltage stress on a single bus capacitor. Compared with an inverter circuit that uses only one bus capacitor, the bus capacitor assembly of this application embodiment can use capacitors with lower voltage tolerance parameters, thereby effectively reducing the cost of capacitor usage.

[0035] For example, the bus capacitor assembly uses two DC-side first bus capacitors Cdc1 and second bus capacitors Cdc2 to divide the voltage, and the two DC-side first bus capacitors Cdc1 and second bus capacitors Cdc2 serve as DC-side energy storage, respectively connected to one half-bridge of the chopper circuit, that is, the two half-bridge circuits 101 and 102 are connected in series to form the front-end chopper circuit. A chopper circuit is a power electronic circuit that converts a fixed direct current into a variable direct current. It can change the average voltage output to the load by controlling the switching devices, thereby efficiently regulating DC power.

[0036] For example, the midpoint of the first bus capacitor Cdc1 and the second bus capacitor Cdc2 is connected to the midpoint of the first half-bridge circuit 101 and the second half-bridge circuit 102, so that the bus capacitor assembly can form a three-level output: positive output P, ​​zero-level output O, and negative output N; thus, by connecting the first bus capacitor Cdc1 and the second bus capacitor Cdc2 in series, in conjunction with the chopper circuit, a zero-level output is added to realize a three-level structure, which can reduce the voltage jump amplitude, reduce the ripple peak value, reduce the impact on the capacitor, and have a longer life and less heat generation.

[0037] The inverter circuit structure provided in this application reduces the voltage stress of a single bus capacitor by 50% by using two series-connected bus capacitors, resulting in lower capacitor usage costs compared to a two-level inverter circuit using only one bus capacitor. Furthermore, by connecting the first bus capacitor Cdc1 to the first half-bridge circuit 101 and the second bus capacitor Cdc2 to the second half-bridge circuit 102, with the midpoint of the first bus capacitor Cdc1 and the second bus capacitor Cdc2 connected to the midpoint of the first half-bridge circuit 101 and the second half-bridge circuit 102, a three-level bus capacitor configuration is constructed. This reduces voltage jump amplitude and ripple peak value, minimizes impact on the capacitors, generates less heat, and extends service life. Therefore, this inverter circuit structure achieves the technical effects of cost reduction and increased service life.

[0038] In some implementations, the capacitance of the first bus capacitor Cdc1 is the same as that of the second bus capacitor Cdc2.

[0039] For example, a DC bus capacitor is formed by connecting two first bus capacitors Cdc1 and second bus capacitors Cdc2 with equal capacitance values ​​in series. This can reduce the voltage stress of a single bus capacitor by 50%, thereby reducing the cost of using the bus.

[0040] In some embodiments, the first half-bridge circuit 101 includes a first switching device T1 and a second switching device T2 connected in series, and one end of the inverter circuit 200 is connected to the midpoint between the first switching device T1 and the second switching device T2.

[0041] For example, one end of the inverter circuit 200 is connected to the midpoint of the first switching device T1 and the second switching device T2, so that the average voltage output to the inverter circuit 200 can be adjusted by switching the first switching device T1 and the second switching device T2 on and off.

[0042] In some embodiments, the second half-bridge circuit 102 includes a third switching device T3 and a fourth switching device T4 connected in series, and the other end of the inverter circuit 200 is connected to the midpoint between the third switching device T3 and the fourth switching device T4.

[0043] For example, the other end of the inverter circuit 200 is connected to the midpoint between the third switching device T3 and the fourth switching device T4, thereby adjusting the average voltage output to the inverter circuit 200 by switching the third switching device T3 and the fourth switching device T4 on and off.

[0044] In some implementations, the inverter circuit 200 includes multiple switching devices (T5, T6...T10), which perform "on" and "off" actions at high frequency to "simulate" the waveform of alternating current; wherein, the A, B, and C terminals of the inverter circuit 200 output to the motor, realizing the connection between the inverter circuit and the motor.

[0045] For example, the switching devices of the first half-bridge circuit 101, the second half-bridge circuit 102 and the inverter circuit are all connected in parallel with freewheeling diodes (D1, D2...D10) to provide a freewheeling circuit for the inductive load (winding) of the motor; when the switching device is turned off, the energy stored in the motor winding needs to be released, and the current will flow back to the power supply or neutral point through this diode.

[0046] For example, the bus capacitor assembly is connected to the input power supply Vdc, thereby enabling the inverter circuit structure to access the power supply; wherein the input power supply Vdc is a DC input power supply.

[0047] For example, the midpoint of the first switching device T1 and the second switching device T2 is Mbp, and the midpoint of the third switching device T3 and the fourth switching device T4 is Mbn. An intermediate busbar is formed between the midpoints Mbp and Mbn.

[0048] In some implementation scenarios, the switching devices in the chopper circuit and inverter circuit can be insulated gate bipolar transistors, field-effect transistors, etc., which are only examples and not limitations.

[0049] Please see Figures 2 to 5 , Figure 2 This is a schematic diagram of the inverter device provided in the embodiments of this application. Figure 3 This is a schematic diagram of the structure of the capacitor housing and capacitor connection assembly provided in the embodiments of this application. Figure 4 This is another structural schematic diagram of the capacitor housing and capacitor connection assembly provided in an embodiment of this application. Figure 5 This is a schematic diagram of the structure of the capacitor connection assembly and the bus capacitor assembly provided in the embodiments of this application.

[0050] The inverter device includes a capacitor housing 310, an integrated circuit board 320, a capacitor connection assembly 330, and... Figure 1 The inverter circuit structure shown is shown. The bus capacitor assembly is installed in the capacitor housing 310, and the power module is installed in the integrated circuit board 320. The capacitor housing 310 and the integrated circuit board 320 are matched and configured. The capacitor connection assembly 330 includes an input connection assembly 331 and an output connection assembly 332. The bus capacitor assembly is connected to the input power supply through the input connection assembly 331, and the bus capacitor assembly is connected to the power module through the output connection assembly 332.

[0051] For example, in the bus capacitor assembly, the first bus capacitor Cdc1 and the second bus capacitor Cdc2 are both installed in the insulated capacitor housing 310, and the power module is installed on the integrated circuit board 320, which can separate the bus capacitor assembly and the power module. The bus capacitor assembly is then connected to the input power supply and the power module through the input connection component 331 and the output connection component 332 in the capacitor connection component 330, respectively, making the structure safe and reliable.

[0052] In some embodiments, the input connection component 331 includes an input busbar positive terminal connector 3311 and an input busbar negative terminal connector 3312. The busbar capacitor assembly is connected to the positive terminal of the input power supply through the input busbar positive terminal connector 3311, and the busbar capacitor assembly is connected to the negative terminal of the input power supply through the input busbar negative terminal connector 3312.

[0053] For example, the input busbar positive terminal connector 3311 and the input busbar negative terminal connector 3312 are respectively connected to the positive and negative terminals of the input power supply.

[0054] In some embodiments, the output connection component 332 includes an output busbar positive terminal connector 3321, an output busbar zero terminal connector 3322, and an output busbar negative terminal connector 3323. The bus capacitor component is connected to the first half-bridge circuit 101 of the chopper circuit through the output busbar positive terminal connector 3321. The bus capacitor component is connected between the first half-bridge circuit 101 and the second half-bridge circuit 102 of the chopper circuit through the output busbar zero terminal connector 3322. The bus capacitor component is connected to the second half-bridge circuit 102 of the chopper circuit through the output busbar negative terminal connector 3323.

[0055] For example, by setting the output busbar positive terminal connector 3321, the output busbar zero terminal connector 3322, and the output busbar negative terminal connector 3323, they are respectively connected to the first half-bridge circuit 101, between the first half-bridge circuit 101 and the second half-bridge circuit 102, and to the second half-bridge circuit 102.

[0056] In some embodiments, the inverter device further includes a heat sink 340 disposed between the capacitor housing 310 and the integrated circuit board 320.

[0057] For example, by placing a heat sink 340 between the capacitor housing 310 and the integrated circuit board 320, the heat sink 340 can be used to dissipate heat from the bus capacitor assembly, reduce the capacitor temperature, and further improve the service life of the capacitor.

[0058] In some embodiments, the first bus capacitor Cdc1 includes a plurality of first capacitor cores 351 connected in parallel, the second bus capacitor Cdc2 includes a plurality of second capacitor cores 352 connected in parallel, and the bus capacitor assembly further includes a connecting copper busbar 360, wherein the first bus capacitor Cdc1 and the second bus capacitor Cdc2 are connected by the connecting copper busbar 360.

[0059] For example, the first bus capacitor Cdc1 and the second bus capacitor Cdc2 are both composed of multiple capacitor cores connected in parallel, which can effectively reduce the equivalent series resistance, thereby reducing heat generation and improving efficiency. The first bus capacitor Cdc1 and the second bus capacitor Cdc2 are then connected in series through a copper busbar 360.

[0060] In some embodiments, this application provides a motor controller, including... Figures 2 to 5 The inverter device shown.

[0061] For example, the inverter circuit structure provided in this application embodiment is a three-level inverter circuit. Its three-level topology requires a set of bus capacitors. This set of bus capacitors uses two DC-side bus capacitors of equal capacitance: the first bus capacitor Cdc1 and the second bus capacitor Cdc2, to perform a voltage divider. The two DC-side bus capacitors, acting as DC-side energy storage, are each connected to a half-bridge. The two half-bridges are connected in series to form the front-end chopper circuit. The circuit topology is as follows: Figure 1 As shown; In some implementation scenarios, the inverter device provided in this application embodiment has the following specific implementation examples; 1. The external metal heat sink of the capacitor is used for capacitor heat dissipation; 2. A temperature sensor 370 is installed to monitor the capacitor temperature and realize the overheat protection of the capacitor; 3. A three-level capacitor consists of two capacitors connected in series, each capacitor is composed of four capacitor cores connected in parallel, and the two capacitors are connected together by a copper busbar. 4. Compared to a two-level capacitor, it has an additional copper busbar for midpoint voltage output (zero level); 5. PBT plastic parts and PET insulating paper are used for insulation between the positive, negative and midpoint voltage poles.

[0062] By way of example, the inverter circuit structure, inverter device, and motor controller provided in the embodiments of this application have at least the following beneficial effects: 1. The bus capacitor consists of two capacitors connected in series, which reduces the voltage stress of a single capacitor by 50% (Vdc / 2) and reduces the cost. 2. The addition of a zero level to the three-level circuit reduces voltage jump amplitude, lowers ripple peak value, reduces impact on capacitors, resulting in longer lifespan and less heat generation; 3. Supports higher switching frequencies: The low voltage stress and low ripple characteristics of three-level capacitors make them compatible with high-frequency switching devices (such as silicon carbide, gallium nitride, etc.): Two-level capacitors, because they withstand full voltage, are more susceptible to the effects of parasitic inductance / capacitance at high frequencies, which can easily generate voltage spikes; the low voltage stress of three-level capacitors reduces the risk of high-frequency voltage spikes. Optionally, the mounting points of the input connection component 331 and the output connection component 332 can be one or more; for example, the mounting points of the zero voltage busbar (output busbar zero-level connector 3322) can be designed to be one or more, which is only an example and not a limitation. For example, the inverter circuit structure, inverter device and motor controller provided in the embodiments of this application can be applied to power scenarios involving DC to AC conversion, such as photovoltaic power generation and energy storage.

[0063] It should be understood that the phrases "in this embodiment," "in this application embodiment," or "as an optional implementation" throughout the specification mean that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of this application. Therefore, the phrases "in this embodiment," "in this application embodiment," or "as an optional implementation" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to this application.

[0064] In the various embodiments of this application, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0065] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims.

Claims

1. An inverter circuit structure, characterized in that, include: The bus capacitor assembly includes a first bus capacitor and a second bus capacitor connected in series. The power module includes a chopper circuit and an inverter circuit; the chopper circuit includes a first half-bridge circuit and a second half-bridge circuit, the first half-bridge circuit and the second half-bridge circuit are connected, a first bus capacitor is connected to the first half-bridge circuit, a second bus capacitor is connected to the second half-bridge circuit, and the midpoint of the first bus capacitor and the second bus capacitor is connected to the midpoint of the first half-bridge circuit and the second half-bridge circuit; one end of the inverter circuit is connected to the first half-bridge circuit, and the other end of the inverter circuit is connected to the second half-bridge circuit.

2. The inverter circuit structure according to claim 1, characterized in that, The capacitance value of the first bus capacitor is the same as that of the second bus capacitor.

3. The inverter circuit structure according to claim 1 or 2, characterized in that, The first half-bridge circuit includes a first switching device and a second switching device, which are connected in series. One end of the inverter circuit is connected to the midpoint between the first switching device and the second switching device.

4. The inverter circuit structure according to claim 1 or 2, characterized in that, The second half-bridge circuit includes a third switching device and a fourth switching device, which are connected in series. The other end of the inverter circuit is connected to the midpoint between the third and fourth switching devices.

5. An inverter device, characterized in that, Includes a capacitor housing, an integrated circuit board, a capacitor connection assembly, and the inverter circuit structure according to any one of claims 1 to 4; The bus capacitor assembly is mounted on the capacitor housing, the power module is mounted on the integrated circuit board, and the capacitor housing and the integrated circuit board are matched and configured. The capacitor connection assembly includes an input connection assembly and an output connection assembly. The bus capacitor assembly is connected to the input power supply through the input connection assembly, and the bus capacitor assembly is connected to the power module through the output connection assembly.

6. The inverter device according to claim 5, characterized in that, The input connection component includes an input busbar positive terminal connector and an input busbar negative terminal connector. The busbar capacitor component is connected to the positive terminal of the input power supply through the input busbar positive terminal connector, and the busbar capacitor component is connected to the negative terminal of the input power supply through the input busbar negative terminal connector.

7. The inverter device according to claim 5 or 6, characterized in that, The output connection assembly includes an output busbar positive terminal connector, an output busbar zero terminal connector, and an output busbar negative terminal connector. The bus capacitor assembly is connected to the first half-bridge circuit of the chopper circuit through the output busbar positive terminal connector. The bus capacitor assembly is connected between the first half-bridge circuit and the second half-bridge circuit of the chopper circuit through the output busbar zero terminal connector. The bus capacitor assembly is connected to the second half-bridge circuit of the chopper circuit through the output busbar negative terminal connector.

8. The inverter device according to claim 5, characterized in that, The inverter device also includes a heat sink, which is disposed between the capacitor housing and the integrated circuit board.

9. The inverter device according to claim 5, characterized in that, The first bus capacitor includes multiple first capacitor cells connected in parallel, the second bus capacitor includes multiple second capacitor cells connected in parallel, and the bus capacitor assembly further includes a connecting copper busbar, through which the first bus capacitor and the second bus capacitor are connected.

10. A motor controller, characterized in that, Including the inverter device as described in any one of claims 5 to 9.

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