A filter package structure and a filter

Abstract

The utility model relates to a semiconductor technical field discloses a kind of filter packaging structure and filter, comprising: circuit substrate, upper surface is provided with at least one target pad;The circuit substrate inside is provided with ground layer;At least one ground capacitor, located the upper surface or inside of the circuit substrate;One end of the ground capacitor is connected to the ground layer, the other end is connected to the target pad;Filter main body, located the upper surface of the circuit substrate;The filter main body includes multiple resonators;Wherein, at least one resonator in the filter main body is connected to target pad.The utility model can effectively optimize the impedance characteristic of filter, convergence characteristic, out-of-band rejection characteristic, and the influence to passband insertion loss is very small, and will not additionally increase the insertion loss of passband.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a filter packaging structure and a filter. Background Technology

[0002] When filters or duplexers are used in actual customer applications or integrated into modules, the impedance characteristics, convergence characteristics, or out-of-band rejection of the filters or duplexers may change due to changes in the circuit board or substrate.

[0003] In related technologies, the solution is to reserve Pi-type or T-type matching circuits at the input and output ports of the filter or multiplexer, and adjust the characteristics of the filter or multiplexer by adjusting the inductor and capacitor values ​​of the external matching circuits. However, in some cases, impedance characteristics, convergence characteristics, or out-of-band rejection characteristics are difficult to optimize well through external matching circuits. That is, the optimization effect of external matching circuits is limited, and the additional external matching circuits will also increase the insertion loss in the passband.

[0004] Therefore, a solution is needed to effectively optimize the impedance characteristics, convergence characteristics, or out-of-band rejection of filters / multiplexers without increasing the insertion loss in the passband. Utility Model Content

[0005] This invention provides a filter packaging structure and a filter to solve the problem in related technologies where the impedance characteristics, convergence characteristics, or out-of-band rejection characteristics of filters / multiplexers cannot be effectively optimized through external matching circuits, and the additional external matching circuits also increase the insertion loss in the passband.

[0006] In a first aspect, this utility model provides a filter packaging structure, comprising: The circuit board has at least one target pad on its upper surface; a ground layer is provided inside the circuit board. At least one grounding capacitor is located on the upper surface or inside of the circuit board; one end of the grounding capacitor is connected to the ground layer and the other end is connected to the target pad. A filter body is located on the upper surface of a circuit board; the filter body includes multiple resonators; wherein at least one resonator in the filter body is connected to a target pad.

[0007] The filter packaging structure provided by this utility model connects at least one resonator in the filter body to a grounding capacitor via a target pad, and then to the grounding layer. This allows some of the resonators in the filter to be grounded after passing through a grounding capacitor on the surface or inside the circuit board, which can effectively optimize the filter's impedance characteristics, convergence characteristics, and out-of-band rejection characteristics. At the same time, compared with conventional external matching circuits, this solution, by grounding some of the resonators through a grounding capacitor, has a very small impact on the passband insertion loss and does not add extra insertion loss to the passband, thereby improving the filter's filtering performance and reliability.

[0008] In one alternative implementation, the grounding capacitor is located on the upper surface of the circuit board. The grounding capacitor is a surface-mount capacitor; the grounding capacitor is mounted on the upper surface of the circuit board. The upper surface of the circuit board is also provided with a first capacitor pad and a second capacitor pad; one end of the grounding capacitor is connected to and fixed to the first capacitor pad, and the other end is connected to and fixed to the second capacitor pad.

[0009] The filter packaging structure provided by this utility model allows the grounding capacitor to be mounted on the circuit board through the first capacitor pad and the second capacitor pad. The number and position of the grounding capacitor can be adjusted according to the requirements, which improves the flexibility of the packaging structure. At the same time, the surface-mount capacitor is easy to replace.

[0010] In one alternative embodiment, a plurality of substrate wirings are provided on the upper surface of the circuit board. The first capacitor pad is connected to the target pad via substrate wiring; the second capacitor pad is connected to the ground plane via conductive vias.

[0011] The filter packaging structure provided by this utility model has a first capacitor pad connected to a target pad through substrate wiring; and a second capacitor pad connected to a ground layer through conductive vias. By pre-setting conductive vias and substrate wiring in the circuit board, the number and position of the target pads can be flexibly designed, and the number and position of the resonator grounded after passing through the ground capacitor can be adjusted according to the requirements.

[0012] In one alternative implementation, the grounding capacitor is located inside the circuit board. The first end of the grounding capacitor is connected to the grounding layer through a conductive layer located inside the circuit board, and the other end is connected to the target pad through a conductive via.

[0013] The filter packaging structure provided by this utility model can improve the reliability of the grounding capacitor by embedding the grounding capacitor in the circuit board, and at the same time simplify the filter packaging process and improve the integration of the filter packaging structure.

[0014] In one optional embodiment, the upper surface of the circuit board is further provided with a plurality of grounding pads; the plurality of grounding pads are respectively connected to the grounding layer; Part of the resonator in the filter body is connected to the ground pad.

[0015] The filter packaging structure provided by this utility model has at least one resonator in the filter body connected to the target pad and grounded through a grounding capacitor, while the remaining resonators are directly grounded through the grounding pad. This can optimize the filter's impedance characteristics, convergence characteristics, and out-of-band rejection characteristics while ensuring the filter's performance and structural reliability. In addition, by controlling the number and position of the resonators connected to the target pad, the filter's impedance characteristics, convergence characteristics, and out-of-band rejection characteristics can be flexibly adjusted.

[0016] In one optional implementation, the filter body includes at least one TX filter and at least one RX filter; the at least one TX filter and at least one RX filter are connected in parallel to form a multiplexer; The TX filter includes multiple resonators; at least one resonator in the TX filter is connected to the target pad.

[0017] The filter packaging structure provided by this utility model can effectively optimize the impedance characteristics, convergence characteristics, and out-of-band rejection characteristics of the multiplexer by connecting at least one resonator of the TX filter in the multiplexer structure to a grounding capacitor and then grounding it through a target pad. At the same time, it has little impact on the passband insertion loss of the multiplexer and will not add extra insertion loss to the passband, thereby improving the filtering performance and reliability of the multiplexer.

[0018] In one optional implementation, the filter body includes a TX filter and an RX filter; the TX filter and the RX filter are connected in parallel to form a duplexer; The TX filter includes at least three parallel resonators, and the RX filter includes at least three parallel resonators; At least one of the parallel resonators in the TX filter is connected to the target pad; the remaining parallel resonators are connected to the ground pad.

[0019] The filter packaging structure provided by this utility model can effectively optimize the impedance characteristics, convergence characteristics, and out-of-band rejection characteristics of the multiplexer by connecting at least one parallel resonator of the TX filter in the duplexer structure to a grounding capacitor and then grounding it through a target pad. At the same time, it has little impact on the passband insertion loss of the duplexer and will not add extra insertion loss to the passband, thereby improving the filtering performance and reliability of the duplexer.

[0020] In one alternative implementation, the lower surface of the filter body is provided with an RX pin, a TX pin, and an antenna pin. The antenna pin connects to the antenna end of the duplexer; the RX pin connects to the receiver end of the RX filter; the TX pin connects to the transmitter end of the TX filter. The upper surface of the circuit board is also provided with RX pads, TX pads and antenna pads, which are respectively connected to the RX pin, TX pin and antenna pin.

[0021] The filter packaging structure provided by this utility model, by connecting the RX pad, TX pad and antenna pad on the circuit board to the RX pin, TX pin and antenna pin of the duplexer respectively, can effectively improve the reliability and stability of the duplexer while optimizing the impedance characteristics, convergence characteristics and out-of-band rejection characteristics.

[0022] In one optional implementation, the lower surface of the filter body is provided with a plurality of ground pins and at least one target pin; the target pin is correspondingly connected to a target pad. Multiple grounding pins are connected to multiple grounding pads respectively.

[0023] Secondly, this utility model provides a filter, including the filter packaging structure described in the first aspect above. Attached Figure Description

[0024] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0025] Figure 1 This is a structural diagram of a duplexer packaging structure based on related technologies; Figure 2 This is a schematic diagram of a filter packaging structure according to an embodiment of the present utility model; Figure 3 This is a schematic diagram of the circuit board structure in a filter packaging structure according to an embodiment of the present utility model; Figure 4 This is a schematic diagram of another filter packaging structure according to an embodiment of the present utility model; Figure 5 This is a schematic diagram of the structure of a duplexer in a filter packaging structure according to an embodiment of the present utility model; Figure 6 The frequency-impedance curves are based on the duplexer packaging structures of Embodiment 1 and Comparative Example 1 in this utility model. Figure 7It is the impedance Smith chart corresponding to the duplexer packaging structure of Embodiment 1 in this utility model; Figure 8 This is a comparison diagram of the transmission curves of the passband corresponding to the duplexer packaging structure of Embodiment 1 and Comparative Example 1 in this utility model. Figure 9 This is a comparison diagram of the out-of-band suppression curves corresponding to the duplexer packaging structures of Embodiment 1 and Comparative Example 1 in this utility model.

[0026] Figure label: 1. Substrate; 2. Duplexer; 3. Peripheral matching circuit; 4. Peripheral matching circuit; 5. Peripheral matching circuit; 10. Circuit board; 11. Target pad; 12. Ground pad; 13. Antenna pad; 14. TX pad; 15. RX pad; 16. First capacitor pad; 17. Second capacitor pad; 18. Board wiring; 20. Filter body; 201. TX filter; 202. RX filter; 21. Antenna end; 22. Transmitter end; 23. Receiver end; 24. Parallel resonator; 25. Series resonator; 30. Ground capacitor. Detailed Implementation

[0027] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0028] In the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of this utility model. Various structural schematic diagrams according to embodiments of this utility model are shown in the accompanying drawings. These drawings are not to scale, and some details are enlarged for clarity, and some details may be omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate in practice due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed. In the context of this utility model, when a layer / element is referred to as being "on" another layer / element, the layer / element may be directly on the other layer / element, or there may be an intermediate layer / element between them. Additionally, if a layer / element is "on" another layer / element in one orientation, then when the orientation is reversed, the layer / element may be "below" the other layer / element.

[0029] When filters or duplexers are used in actual customer applications or integrated into modules, the impedance characteristics, convergence characteristics, or out-of-band rejection of the filters or duplexers may change due to changes in the circuit board or substrate.

[0030] In related technologies, the solution is to reserve Pi-type or T-type matching circuits at the input and output ports of the filter or multiplexer, and adjust the characteristics of the filter or multiplexer by adjusting the inductor and capacitance values ​​of the matching circuits. For example, Figure 1 The conventional duplexer packaging structure shown includes a duplexer 2 packaged on substrate 1, with peripheral matching circuits 3, 4, and 5 disposed at the three ports of the duplexer. Peripheral matching circuit 3 connects to the antenna end of the duplexer, where the four vertically arranged pads represent series connection, and the two horizontally arranged pads represent parallel connection on the wiring between the antenna end and the duplexer (which can be connected to capacitors or inductors). Peripheral matching circuit 4 connects to the TX end (transmitter) of the duplexer, where the four horizontally arranged pads represent series connection, and the two sets of vertically arranged pads are in parallel connection. Peripheral matching circuit 5 connects to the RX end (receiver) of the duplexer, with the series-parallel connection method being the same as that of peripheral matching circuit 4.

[0031] However, in this package structure, the impedance characteristics, convergence characteristics, or out-of-band rejection characteristics are difficult to optimize through the external matching circuit. That is, the optimization effect of the external matching circuit is limited, and the additional external matching circuit will also increase the insertion loss in the passband.

[0032] Therefore, a solution is needed to effectively optimize the impedance characteristics, convergence characteristics, or out-of-band rejection of filters / multiplexers without increasing the insertion loss in the passband.

[0033] like Figure 2 and Figure 3 As shown, this embodiment provides a filter packaging structure, including: The circuit board 10 has at least one target pad 11 on its upper surface; a ground layer is provided inside the circuit board 10. At least one grounding capacitor 30 is located on the upper surface or inside the circuit board 10; one end of the grounding capacitor 30 is connected to the ground layer and the other end is connected to the target pad 11. The filter body 20 is located on the upper surface of the circuit board 10; the filter body 20 includes a plurality of resonators; wherein at least one of the resonators in the filter body 20 is connected to the target pad 11.

[0034] Figure 2The diagram is for illustrative purposes only. To clearly show the location of the pads, the filter body 20 is made semi-transparent. In the actual structure, the filter body 20 is opaque, and after the filter body 20 is placed on the upper surface of the circuit board 10, the pads on the circuit board 10 are not visible.

[0035] The filter packaging structure provided by this utility model connects at least one resonator in the filter body 20 to the grounding capacitor 30 via the target pad 11, and then to the grounding layer. This allows some of the resonators of the filter to be grounded after passing through the grounding capacitor 30 on the surface or inside the circuit board 10. This effectively optimizes the impedance characteristics, convergence characteristics, and out-of-band rejection characteristics of the filter. At the same time, compared with conventional peripheral matching circuits, this solution, by grounding some of the resonators through the grounding capacitor 30, has a very small impact on the passband insertion loss and does not add extra insertion loss to the passband, thereby improving the filtering performance and reliability of the filter.

[0036] In some alternative implementations, such as Figure 2 and Figure 3 As shown, the grounding capacitor 30 is located on the upper surface of the circuit board 10; The grounding capacitor 30 is a surface mount capacitor; the grounding capacitor 30 is mounted on the upper surface of the circuit board 10. The upper surface of the circuit board 10 is also provided with a first capacitor pad 16 and a second capacitor pad 17; one end of the grounding capacitor 30 is connected to and fixed to the first capacitor pad 16, and the other end is connected to and fixed to the second capacitor pad 17.

[0037] The filter packaging structure provided by this utility model allows the grounding capacitor 30 to be mounted on the circuit board 10 via the first capacitor pad 16 and the second capacitor pad 17. The number and position of the grounding capacitor 30 can be adjusted according to requirements, improving the flexibility of the packaging structure. At the same time, the surface-mount capacitor is easy to replace.

[0038] In some alternative implementations, such as Figure 3 As shown, a plurality of substrate wirings 18 are provided on the upper surface of the circuit board 10. The first capacitor pad 16 is connected to the target pad 11 through the substrate wiring 18; the second capacitor pad 17 is connected to the ground layer through a conductive via.

[0039] The filter packaging structure provided by this utility model has a first capacitor pad 16 connected to a target pad 11 via a substrate wiring 18; and a second capacitor pad 17 connected to a ground layer via a conductive via. By pre-setting conductive vias and substrate wiring 18 in the circuit board 10, the number and position of the target pad 11 can be flexibly designed, and the number and position of the resonator grounded after passing through the grounding capacitor 30 can be adjusted according to the requirements of the filter performance.

[0040] In some alternative implementations, such as Figure 4 As shown, the grounding capacitor 30 is located inside the circuit board 10; The first end of the grounding capacitor 30 is connected to the grounding layer through a conductive layer located inside the circuit board 10, and the other end is connected to the target pad 11 through a conductive via.

[0041] The filter packaging structure provided by this utility model can improve the reliability of the grounding capacitor 30 by embedding the grounding capacitor 30 in the circuit board 10, and at the same time simplify the filter packaging process and improve the integration of the filter packaging structure.

[0042] In some alternative implementations, such as Figure 2 and Figure 3 As shown, a plurality of grounding pads 12 are also provided on the upper surface of the circuit board 10; the plurality of grounding pads 12 are respectively connected to the grounding layer; Part of the resonator in the filter body 20 is connected to the ground pad 12.

[0043] The filter packaging structure provided by this utility model has at least one resonator in the filter body 20 connected to the target pad 11 and grounded through the grounding capacitor 30, while the remaining resonators are directly grounded through the grounding pad 12. This can optimize the filter's impedance characteristics, convergence characteristics, and out-of-band rejection characteristics while ensuring the filter's performance and structural reliability. In addition, by controlling the number and position of the resonators connected to the target pad 11, the filter's impedance characteristics, convergence characteristics, and out-of-band rejection characteristics can be flexibly adjusted.

[0044] In some alternative implementations, such as Figure 5 As shown, the filter body 20 includes at least one TX filter 201 and at least one RX filter 202; the at least one TX filter 201 and at least one RX filter 202 are connected in parallel to form a multiplexer; The TX filter 201 includes multiple resonators; at least one resonator in the TX filter 201 is connected to the target pad 11.

[0045] The filter packaging structure provided by this utility model connects at least one resonator of the TX filter 201 in the multiplexer structure to the grounding capacitor 30 via the target pad 11 and then to the ground. This can effectively optimize the impedance characteristics, convergence characteristics, and out-of-band rejection characteristics of the multiplexer. At the same time, it has little impact on the passband insertion loss of the multiplexer and will not increase the passband insertion loss, thereby improving the filtering performance and reliability of the multiplexer.

[0046] In some alternative implementations, such as Figure 5As shown, the filter body 20 includes a TX filter 201 and an RX filter 202; the TX filter 201 and the RX filter 202 are connected in parallel to form a duplexer; The TX filter 201 includes at least three parallel resonators 24, and the RX filter 202 includes at least three parallel resonators 24. At least one of the parallel resonators 24 in the TX filter 201 is connected to the target pad 11; the remaining parallel resonators 24 are connected to the ground pad 12.

[0047] In specific implementations, the number of parallel resonators 24 in the TX filter 201 is three or more; the number of parallel resonators 24 in the RX filter 202 is three or more. In a specific example, such as... Figure 5 As shown, the TX filter 201 includes four parallel resonators 24, and the RX filter 202 includes three parallel resonators 24.

[0048] The filter packaging structure provided by this utility model can effectively optimize the impedance characteristics, convergence characteristics, and out-of-band rejection characteristics of the multiplexer by connecting at least one parallel resonator of the TX filter 201 in the duplexer structure to the grounding capacitor 30 through the target pad 11 and then to the ground. At the same time, it has little impact on the passband insertion loss of the duplexer and will not increase the passband insertion loss, thereby improving the filtering performance and reliability of the duplexer.

[0049] In some alternative implementations, such as Figure 5 As shown, the TX filter 201 also includes at least three series resonators 25, and the RX filter 202 also includes at least three series resonators 25.

[0050] In some alternative implementations, such as Figure 2 and Figure 5 As shown, the lower surface of the filter body 20 is provided with RX pin, TX pin and antenna pin; The antenna pin is connected to the antenna terminal 21 of the duplexer; the RX pin is connected to the receiving terminal of the RX filter 202; and the TX pin is connected to the transmitting terminal of the TX filter 201. The upper surface of the circuit board 10 is also provided with RX pad 15, TX pad 14 and antenna pad 13, which are respectively connected to the RX pin, TX pin and antenna pin.

[0051] In practice, the antenna end 21 of the duplexer is connected to the antenna pad 13 via the antenna pin, the receiver end 23 of the duplexer is connected to the RX pad 15 via the RX pin, and the transmitter end 22 of the duplexer is connected to the TX pad 14 via the TX pin.

[0052] The filter packaging structure provided by this utility model, by connecting the RX pad 15, TX pad 14 and antenna pad 13 on the circuit board 10 to the RX pin, TX pin and antenna pin of the duplexer respectively, can effectively improve the reliability and stability of the duplexer while optimizing the impedance characteristics, convergence characteristics and out-of-band rejection characteristics of the duplexer.

[0053] In some optional embodiments, the lower surface of the filter body 20 is provided with a plurality of ground pins and at least one target pin; the target pin is correspondingly connected to the target pad 11; Multiple grounding pins are connected to multiple grounding pads 12 respectively.

[0054] In some alternative implementations, the capacitance value of the grounding capacitor 30 can be adjusted as needed.

[0055] The filter packaging structure provided by this utility model can adjust the out-of-band rejection characteristics of the filter by adjusting the capacitance value of the grounding capacitor 30 connected to the target pad 11.

[0056] To verify the effectiveness of the filter packaging structure provided by this utility model, this application provides Example 1 and Comparative Example 1, taking a duplexer as an example. Example 1 is the packaging structure of the duplexer provided by this utility model; Comparative Example 1 is the packaging structure of a duplexer containing an external matching circuit in the related art.

[0057] In Comparative Example 1, such as Figure 1 As shown, the duplexer package structure includes a substrate 1, a duplexer 2, and peripheral matching circuits 3, 4, and 5. Peripheral matching circuit 3 connects to the antenna end of the duplexer, where the four vertically arranged pads represent series connection, and the two horizontally arranged pads represent parallel connection on the wiring between the antenna end and the duplexer (which can connect to capacitors or inductors). Peripheral matching circuit 4 connects to the TX end (transmitter) of the duplexer, where the four horizontally arranged pads represent series connection, and the two sets of vertically arranged pads are in parallel connection. Peripheral matching circuit 5 connects to the RX end (transmitter) of the duplexer, with the series-parallel connection method being the same as that of peripheral matching circuit 4.

[0058] In Example 1, as Figure 2 As shown, the duplexer package structure includes a circuit board 10, a filter body 20, and a grounding capacitor 30, wherein the filter body 20 is a duplexer. A ground layer is disposed inside the circuit board 10, and the upper surface of the circuit board 10 is provided with a target pad 11, multiple ground pads 12, an antenna pad 13, an RX pad 15, a TX pad 14, a first capacitor pad 16, a second capacitor pad 17, and substrate wiring 18. The circuit board 10 also contains conductive vias and conductive layers. Figure 5As shown, the filter body 20 includes a TX filter 201 and an RX filter 202; the TX filter 201 and RX filter 202 are connected in parallel to form a duplexer; the TX filter 201 includes four parallel resonators 24, and the RX filter 202 includes three parallel resonators 24; at least one parallel resonator 24 in the TX filter 201 is connected to the target pad 11; the remaining parallel resonators 24 are connected to the ground pad 12. Simultaneously, the antenna end 21 of the duplexer is connected to the antenna pad 13, the receiver end 23 is connected to the RX pad 15, and the transmitter end 22 is connected to the TX pad 14.

[0059] To verify the effectiveness of both, various tests were conducted on the packaging structures of Example 1 and Comparative Example 1.

[0060] Figure 6 The graphs show the frequency-impedance curves for the duplexer package structures of Example 1 and Comparative Example 1, where the solid line represents Comparative Example 1 and the dashed line represents Example 1. It can be seen that the impedance and convergence characteristics of the dashed line are significantly better than those of the solid line. Therefore, it can be concluded that, compared to Comparative Example 1, the structure of Example 1 can effectively improve the convergence and impedance characteristics of the filter.

[0061] Figure 7 The Smith chart for the impedance of the duplexer package structure in Example 1 shows that the solid line forms a semi-enclosed shape, and the dashed line is inside the solid line, which further proves that Example 1 has a good convergence effect.

[0062] Figure 8 This is a comparison graph showing the passband transmission curves of the duplexer packaging structures of Example 1 and Comparative Example 1, where the solid line represents Comparative Example 1 and the dashed line represents Example 1. It can be seen that near 2.64 GHz, the insertion loss of the solid line is greater than that of the dashed line, while the dashed line has a lower insertion loss compared to the solid line. Therefore, it can be demonstrated that the structure of Example 1 can improve the passband insertion loss of the filter compared to Comparative Example 1.

[0063] Figure 9 This is a comparison chart of the out-of-band rejection curves for the duplexer packaging structures of Example 1 and Comparative Example 1, where the solid line represents Comparative Example 1 and the dashed line represents Example 1. It can be seen that the out-of-band rejection characteristics of the dashed line are significantly better than those of the solid line. Therefore, it can be concluded that, compared to Comparative Example 1, the structure of Example 1 can effectively improve the out-of-band rejection characteristics of the filter.

[0064] Therefore, through Figure 8 and Figure 9 This demonstrates that, in Example 1, by adjusting the capacitance value of the grounding capacitor 30 connected to the target pad 11, the out-of-band suppression characteristics can be adjusted, with minimal impact on the passband.

[0065] This utility model also provides a filter, including the above-described filter packaging structure.

[0066] In the description of this specification, the terms "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, those skilled in the art can combine and integrate the different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0067] The above description does not provide detailed explanations of the technical aspects of each layer's patterning, etching, etc. However, those skilled in the art should understand that various technical means can be used to form layers and regions of the desired shape. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0068] The above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described above, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention. The protection scope of the present invention is determined by the scope of the appended claims.

Claims

1. A filter packaging structure, characterized in that, include: The circuit board has at least one target pad on its upper surface; a ground layer is provided inside the circuit board. At least one grounding capacitor is located on the upper surface or inside of the circuit board; one end of the grounding capacitor is connected to the ground layer, and the other end is connected to the target pad. A filter body is located on the upper surface of the circuit board; the filter body includes a plurality of resonators; wherein at least one resonator in the filter body is connected to a target pad.

2. The filter packaging structure according to claim 1, characterized in that, The grounding capacitor is located on the upper surface of the circuit board; The grounding capacitor is a surface-mount capacitor; the grounding capacitor is mounted on the upper surface of the circuit board. The upper surface of the circuit board is also provided with a first capacitor pad and a second capacitor pad; one end of the grounding capacitor is connected to and fixed to the first capacitor pad, and the other end is connected to and fixed to the second capacitor pad.

3. The filter packaging structure according to claim 2, characterized in that, The upper surface of the circuit board is provided with multiple board wirings. The first capacitor pad is connected to the target pad via substrate wiring; the second capacitor pad is connected to the ground layer via conductive vias.

4. The filter packaging structure according to claim 1, characterized in that, The grounding capacitor is located inside the circuit board. The first end of the grounding capacitor is connected to the grounding layer through a conductive layer located inside the circuit board, and the other end is connected to the target pad through a conductive via.

5. The filter packaging structure according to claim 1, characterized in that, The upper surface of the circuit board is also provided with a plurality of grounding pads; the plurality of grounding pads are respectively connected to the grounding layer; A portion of the resonator in the filter body is connected to the grounding pad.

6. The filter packaging structure according to claim 5, characterized in that, The filter body includes at least one TX filter and at least one RX filter; the at least one TX filter and at least one RX filter are connected in parallel to form a multiplexer; The TX filter includes multiple resonators; at least one resonator of the TX filter is connected to the target pad.

7. The filter packaging structure according to claim 6, characterized in that, The filter body includes a TX filter and an RX filter; the TX filter and the RX filter are connected in parallel to form a duplexer; The TX filter includes at least three parallel resonators, and the RX filter includes at least three parallel resonators; At least one of the parallel resonators in the TX filter is connected to the target pad; the remaining parallel resonators are correspondingly connected to the ground pad.

8. The filter packaging structure according to claim 7, characterized in that, The lower surface of the filter body is provided with RX pin, TX pin and antenna pin; The antenna pin is connected to the antenna end of the duplexer; the RX pin is connected to the receiver end of the RX filter; the TX pin is connected to the transmitter end of the TX filter. The upper surface of the circuit board is also provided with RX pads, TX pads and antenna pads, which are respectively connected to the RX pin, the TX pin and the antenna pin.

9. The filter packaging structure according to claim 2, characterized in that, The lower surface of the filter body is provided with multiple ground pins and at least one target pin; the target pin is correspondingly connected to the target pad; The grounding pins are respectively connected to the grounding pads.

10. A filter, characterized in that, Includes the filter packaging structure as described in any one of claims 1 to 9.

Images